M435712 五、新型說明： 【新型所屬之技術領域】 本創作係涉及一種晶圓殘膠清除裝置，特別是指 T壓轉動方式清除並擦栻晶圓表面殘膠之創新型態 利用 設計 【先前 按 於曰常 機等電 ，而1C 科技電 以 成圖樣 面研磨 表面的 加以士刀 程。 但 人員必 晶圓表 加人力 晶圓殘 使晶圓 圓殘膠 有 與設言十 除殘膠 審慎評 技術】 ’在科 生活中 子產品 半導體 子產品 往，一 之表面 之際， 同時， 除，並 ’當晶 須手拿 面之殘 成本、 膠係即 受到損 之方式 鑑於此 經·驗， 所耗費 估後， 技發達的 已是相當 ，該類電 的材料來 ’故晶圓 般在晶圓 處理程序 此時操作 將超出於 進行後續 圓完成上 工具（刀 膠’如此 影響晶圓 可能產生 傷專問題 仍有相當 ，創作人 針對上述 之工時以 終得一確 現代社 普遍， 子產品 源就是 代工產 前製加 ’當晶 人員係 晶圓外 研磨、 述力口工 片）， 不但耗 生產加 殘膠未 點，因 大的改 本於多 之目標 及之裝 具實用 會中， 例如手 内部皆 晶圓， 業遂亦 工流程 圓表面 預先將 圍之保 捲曲去 高科技 機、主 裝設並 為了能 快速蓬 t係必 研磨完 保護膠 護膠帶 除保護 電子產品 機板、數 佈滿1C半 夠因應各 勃發展。 須通過研 成並欲進 帶貼附於 沿著晶圓 膠帶等加 流程後，傳 再以徒手方 費刮除殘膠 工速度，且 完全清除或 此’習知慣 良突破空間 年從事相關 ，以提供節 置為目的， 性之本創作 統方式係為 式來刮除殘 之工時，進 以徒手方式 刮除力道過 用之徒手清 存在。 產品之製造 省人力方式 並於詳加設 使用 位相 導體 式rij 磨形 行背 晶圓 外圍 工流 操作 留於 而増 刮除 大而 除晶 開發 來刮 計與 M435712 【新型内容】 本創作之主要目的，私 •其所欲解決之問題點，： = 圓殘膠清 改良突破，·該晶圓殘膠清除穿置° I在之問題 裏加工作業時所附著殘留之背膠. 月除日日a表 本創作解決問題之技術 係包括-裝置主體，該裝置主俨：：在於該清p 間的基板以及底座所共構 二：框架、組設於* 間界定开> 出古 成’，、中§亥基板與框架戸 J介叱形成有一内部空間 >、礼朱戸 之晶圓，且該内部空間係與出，^工間係吨夠容置名 態之—翻掀式遮罩所罩蓋^ 、，且5又於框架頂部呈可番 、轉動之狀態並L 2 下壓轉動構件… 壓轉動構件包括“、斑d置：該翻掀式遮罩， 旋轉軸-端之旋轉組件旋轉軸、紅 動作，其中牛達成同步旋轉或作向下伯 整軸向高度位置；殘膠清除椹杜調1。卩而魂夠沿旋輜 離以及傾斜角度之狀態組設於：壓=整與晶圓相 部，並能夠與該旋轉組件呈同件的卿 -刮刀組置’又該殘膠清除構件係包招 面的殘膠：晶圓置放部，呈可除並擦拭盖M435712 V. New Description: [New Technology Field] This creation relates to a wafer residual glue removal device, especially the innovative design of the T-pressure rotation method to remove and wipe the surface residue of the wafer. Yu Yu is always on the same machine, and 1C Technology uses a pattern to grind the surface of the knife. However, the personnel must have the wafer table plus the human wafer residue to make the wafer round residual glue and the ten-point removal of the residual glue to carefully evaluate the technology] 'In the life of the sub-product semiconductor sub-products, on the surface, at the same time, except And 'when the whisker handles the cost of the residual, the glue is damaged. In view of this experience, after the cost is estimated, the technology is developed, and the material of this kind is like the wafer. The wafer processing program will now go beyond the tool for performing the subsequent round completion (the knife rubber 'so that the wafer may cause damage to the specific problem is still quite the same, the creator is aiming at the above-mentioned working hours to be true. The source of the product is the OEM pre-production system plus 'When the crystal personnel are outside the wafer, and the force is the mouth piece), not only the production of residual glue, but also the target of the large-scale modification and practical equipment. In the middle of the hand, for example, the inside of the hand is wafer, and the round surface of the industrial process is pre-wrapped to the high-tech machine, the main assembly, and in order to be able to quickly clean the protective tape. Protection of electronic products, the number of boards, the number of full 1C half enough to respond to the development of each. It must be researched and intended to be attached to the process of adding tape along the wafer tape, and then scrape the speed of the residual glue at a bare-handed cost, and completely remove it or this is a customary breakthrough space year. For the purpose of providing festivals, the basic method of sexuality is to eliminate the labor time of the disabled, and to eliminate the use of hands-on force by hand. The manufacturing of the product is labor-saving and the use of phase-conductor-type rij grinding-shaped back-wafer peripheral flow operation is left behind and the large-scale de-crystal development is used to scrape the meter and M435712. [New content] The main content of this creation Purpose, private • The problem to be solved: = The breakthrough of the round residual glue clearing, · The removal of the residual glue of the wafer ° I in the problem of the residual adhesive attached during the processing operation. a table to solve the problem of the technical system includes - the main body of the device, the main body of the device: in the clear p between the substrate and the base co-construction two: frame, set between * defined open > Goucheng ', The middle § hai substrate and the frame 叱J form an internal space>, the ritual Zhu Xi's wafer, and the internal space is connected with the ^, the work space is enough to accommodate the name - flip-type mask The cover ^, and 5 are again in a state of being rotatable and rotatable at the top of the frame and L 2 pressing the rotating member... The pressing rotating member includes ", the spot d: the flip-type mask, the rotation axis - the rotation of the end The component rotates the axis and the red action, in which the cow reaches a synchronous rotation or Downward alignment of the axial height position; residual glue removal 椹 duo adjustment 1. The state of the soul is separated from the rotation angle and the angle of inclination is set to: pressure = integral with the wafer phase, and can be presented with the rotating component The same piece of the Qing-scraper set 'and the residual glue removal component is the residual glue of the face: the wafer placement part, which can be removed and wiped off
置主體之基板預定位置處，型態設置' 主體之基板盥a 如七'日日圓放置，其中II 角度調整部二圓置”底端相對位置處並設有多盡 氣壓吸附捫敕：：使晶圓放置狀態呈可調整角度之出 夠提供邱設Γ裝置主體框架之-側端， 固定晶圓或釋玫之狀態； 7該曰曰圓置放部呈。 可改Ϊΐ:::蜀特設計，使本創作對照先前技術而1 “由㈣人員以徒手方式刮除殘留於晶圓」 &裝置 与加以 7於前 裝置 架之 側之 處理 掀狀 下壓 該下 設於 該旋 移之 軸調 對距 件底 晶圓 至少 圓表 該裝 裝置 晶圓 態； 並能 吸附 ，俾 面之 4 殘膠，所產 除等問題點 令該晶圓放 轉動構件的 之殘膠清除 膠，達到有 及提升清除 能夠調整與 件呈同步調 位置，達到 用效益。 生耗費 ’本創 置狀態 手輪來 構件能 效降低 晶圓殘 晶圓之 整狀態 均勻清 工時、增加 作即是先將 獲得固定， T動該旋轉 夠同時刮除 清除晶圓殘 滕之便利性 相對距離與 ，進而能夠 除、擦拭晶 人力成 晶圓放 同時利 組件， 並擦栻 膠之 ’且由 傾斜角 增加操 圓表面 本以及 置於該 用下壓 令設於 晶圓表 時、降 於該殘 度，同 作人員 殘膠未完全清 晶圓置放部， 並旋轉該下壓 旋轉組件底部 面、邊緣之殘 低人力成本以 膠清除構件係 時能與旋轉組 可調整之角度 功效與產業實 【實施方式 請參閱 之較佳實施 上並不受此 夠清除晶圓 該晶圓殘膠 一裝置 基板12以及 側之間界定 置待處理之 頂部呈可翻 其中， 鐵任其中一 ] 第1至 例，惟 結構之 06表面 清除裝 主體10 底座13 形成有 晶圓06 掀狀態 該樞架 種型態 5圖所示， 此等實施例 限制。所述 於前製加工 置係包括： ’係包括框 係本創作晶 僅供說明之 晶圓殘膠清 作業時所附 架11、組設 ’其中該基 内部空間14，該内部 ’且該内部空間14係藉 翻掀式遮罩15所罩 態係可為鋁 所共構而成 之 11之架構型 者0 圓殘膠清除裝置 用，在專利申請 除裝置係藉以能 著殘留之背膠， 於框架.11之間的 板12與框架11内 空間14係能夠容 由組設於框架11 蓋遮蔽； 擠型、飯金、角 下壓轉動構件20 ’呈可下壓、轉動之狀態並藉由一固 定座21設置於該翻掀式遮罩15 (請配合參考第1 、2圖所 示），該下壓轉動構件20包括手輪22、與該手輪22相連接 之旋轉軸23、組設於旋轉軸23 —端之旋轉組件24，該手輪 5 M435712 22係為凸出該翻掀式遮罩15外側之型態’且該旋轉軸23 ^翻掀式遮罩15外側朝向内側延伸，當翻掀式遮罩15呈 皇'遠内部空間Η之狀態時，該旋轉軸23以及設於旋轉軸 _端的旋轉組件24係位於晶圓置放部60上方（如第2圖 不）’其中該旋轉組件24係包括旋轉座241以及組設於 =座241底部之固定盤2幻共構而成；藉由轉動或下壓 r 帶動該旋轉組件24，&夠使該旋轉k件24達成同 或作向下位移之動作；且其中，該手輪22與固定座 呈日並《又有一復位彈簧％，以使該手輪2於釋放下壓之 攀里時能夠自動回復原位； 此外’該旋轉組件24並藉由一調整部25而能夠沿旋 23。周正轴向兩度位置’本實施例之調整部乃係為連通 疑轉組件24的旋轉座24ι内、外側之别槽型態（請配合 考第4、5圖所示）’並藉由螺检27迫緊或釋放該調整 25 ’而使紋轉座241能夠迫緊固定於旋轉軸幻或呈可調 狀態沿該旋轉軸23的軸向移動調整； 殘膠清除構件30 ’呈可調整與晶圓〇6相對距離以及 斜角度之狀態組設於下壓轉動構件2〇的旋轉組件24底部 鲁並能夠與該旋轉組件24呈同步旋轉、向下位移抵靠晶圓 表面或.調整軸向高度位置，該殘膠清除構件3〇係包括： 至少一到刀組40 ’係藉以能夠刮除晶圓06表面的 • 膠； 清潔彳祭栻組件5〇 ’間隔設置於刮刀組4〇之一側， 以能夠擦拭晶圓06所刮除之殘滕； 晶圓置放部60 ’呈可拆卸、組裝型態設置於該裝置 體10之基板12預定位置處，藉以提供晶圓〇6放置，其中 裝置主體10之基板12與晶圓置放部60底端相對位置處並 有多數晶圓角度調整部61，藉以使晶圓〇6放置狀態呈可 整角度之狀態，請配合參考第1 、10圖所示，本實施例 晶圓角度s周整部61係為配合止付螺絲63之調整型態，藉 係 罩 23 所 旋 手 步 21 力 轉 該 參 部 整 傾 06 殘 藉 主 該 -d-n. δ又 調 之 由 6 調整該止付螺絲63以推 改變該晶圓置玫部60與 氣壓吸附調整組件 側端，並能夠提供該晶 调整組件70係包括開關 錶頭73共構而成，該開 控制該晶圓置故部60底 關控制闊71所設轉鈕74 圓06或釋放狀態，其中 置放部60氣壓吸附強弱 顯示於該真空錶頭73 ; 制元件結構為習知技術 部結構及動作狀態不再 藉此’操作人員俾 體10基板12所設之晶圓 7〇令晶圓06放置狀態獲 裝置主體10的内部空間 轉組件24與殘膠清除構 度調整至定位，俾可利 手輪22來帶動該旋轉址 膠清除構件30能夠同時 膠，而達到有效降低清 圓06殘膠之便利性。 抵該晶圓置放部60的底^，而能夠 晶圓06之傾斜角度 70，設置於裝置主體 圓置放部60 —吸附力 控制閥71、氣壓調整 關控制間71係藉由氣 端所設氣壓接頭62， 而能切換該晶圓置放 3亥氣壓調整閥72係能 程度’且所調整之壓 前述所揭之開關控制 ，故在此對於該等氣 加以贅述。 可將待處理之晶圓06 f放部60，藉由氣壓 得固定，並將翻掀式 14 ’並先將該下壓轉 件30與晶圓06之相對 用下壓並旋轉該下壓 牛24 令设於旋轉組 刮除並擦栻晶圓06表 除晶圓06殘膠之工時 10框架 ，該氣 閥72以 壓管75 藉由調 部60呈 夠調控 力數值 閥71等 壓控制 放置於 吸附調 遮罩15 動構件 距離及 轉動構 件24底 面、邊 ，提升 11之一 壓吸附 及真空 連接並 整該開 吸附晶 5亥晶圓 係對應 氣壓控 元件内 裝置主 整組件 遮蓋該 20之旋 傾斜角 件20的 部之殘 緣之殘 清除晶 請配合4至7圖所示 構件41、組設於角度調整 ，藉由轉動該角度調整構 座組件42沿旋轉軸43橫向 晶圓06表面之旋擺倾斜角 其中*該角度調整才菁 設有微調整部44，如第4 °亥刮刀組40係包括一角度★周整 構件41底部之刀座組件42所構成 件41所設旋轉軸43 ’而能夠使刀 移動’進而改變該刀座組件42與 度（此處請參考第6圖）； 件41頂部與該旋轉組件24之間並 圖所示，本實施例之微調整部44 7 M435712 係為螺孔型態，並配合微調螺絲441以穿設通過該微調整 部44，藉由調整該微調螺絲441來推抵該角度調整構件41 頂部，藉以能夠調整組設於角度調整構件41底部之刀座組 件42與晶圓06表面之相對距離與傾斜角度；前述微調整部 44以螺孔型態配合微調螺絲441為較佳，但不限定於此種 型態； . 此外，該刀座組件42頂部並設有刀座調整部45 (此處 請參考第7圖所示），該刀座調整部45係包括至少二螺孔 '46以及對位組設於螺孔46之調整螺絲47，亦同樣藉由調整 •該調整螺絲47而能夠改變該刀座組件42與晶圓06表面之相 對距離與傾斜角度，本實施例僅表示調整該刀座組件42與 晶圓06表面相對距離，當對該調整螺絲施以不同之調整距 離時，即可改變該刀座組件42與晶圓06表面之傾斜角度。 請配合8、9圖所示，該清潔擦拭組件50係包括至少 一清潔布輪51、組設於清潔布輪5】二端之鎖緊手調輪52以 及穿設通過該清潔布輪51與鎖緊手調輪52内側之連桿53共 構而成，該連桿53並藉由一調整座54組設於旋轉組件24底 部； 其中，該清潔布輪51表面係包覆有無塵布或其他材質 胃之布料（圖號省略），當該無塵布包覆於清潔布輪51表面 時，係先將無塵布二端塞入該清潔布輪51之相對二端，並 藉由鎖緊手調輪52加以鎖迫緊壓，以使該無塵布之包覆狀 態獲得固定，同時令該清潔布輪51具有擦拭之功能，前述 之清潔布輪51包覆無塵布等動作狀態，本實施例未表示； 且其中，該調整座54頂部與旋轉組件24之間並設有布 輪調整部55 (此處請參考第8圖所示），該布輪調整部55 係包括多數布輪調整孔56以及對位組設於布輪調整孔56之 布輪調整螺絲57，藉由調整該布輪調整螺絲57來推抵該調 整座54頂部，而能夠調整該清潔布輪51與晶圓06表面之相 對距離與傾斜角度，如第9圖所示，係為調整該清潔布輪 8 31與晶圓06表面相對距祕 絲57施以不同二哗之實施例’當對於該布 表面之傾斜角度^ ，即能改變該清潔布輪51 請配合參考第1 、ι〇 為配合止付螺絲63 圖所示，該晶圓角度調 絲63來推抵該晶圓態’崎藉由調整 置放部6〇與晶圓06之傾；：的底端，巾能夠改變 放部60之調整狀緣） 角度（本實施例未表示 功效說明： 本創：功效增進之事實如下. 本創作所揭Γ a圓& . 放部能夠提供晶圓放、膠凊除裝置」主要藉由 時藉由下壓轉動構件盥殘：：i可調整其傾斜 栻晶圓表面、邊緣之殘^膠1除構件而能夠同時 對照【先前技術】而a >，藉此獨特創新設計， K刮除殘留於晶圓：面善習知由操作人 人力成本以及殘膠未完^殘膠，所產生耗費工 :曰圓放置於該晶圓置放部問題點，本創作 組：，令設於旋轉構件的手輪來帶 it;圓表面、邊緣A殘；構件能夠 ’工時、降低人力成本 $到有效降低清 倾粗ΐ於該殘膠清除構件係ϊ i Γ清除晶圓殘膠 掛：5度’同時能與旋轉•且：；5周整與晶圓之相 ^〇操作人員可調整之角声位同步調整狀態， 圓表面殘膠之功效與產二ϋ，達到均勾清除 &系實用效益。 上述實施例所揭示去 ::過特定的術語進行說二巧說明本創-之專利範圍’·熟悉此項技術領；之：二限定 备可在 輪調整螺 與晶圓06 整部61係 該止付螺 令該晶圓 該晶圓置 該晶圓置 角度，同 刮除並擦 使本創作 貝以徒手 時、增加 即是先將 得固定， 動該旋轉 同時到除 除晶圓殘 之便利性 對距離與 進而能夠 、擦拭晶 ，且文中 斤型創作 篆本創作 9 M435712 M435712 【圖式簡單說明】 第 1 圖 本 創 作 晶 圓 殘 第 2 圖 本 創 作 翻 掀 式 第 3 圖 本 創 作 下 壓 轉 第 4 圖 本 創 作 下 壓 轉 件 立 體 圖 〇 第 5 圖 本 創 作 下 壓 轉 第 6 圖 本 創 作 調 整 該 之 動 作 狀 態 示 第 7 圖 本 創 作 刀 座 組 第 8 圖 本 創 作 清 潔 擦 第 9 圖 本 創 作 清 潔 擦 第 10 圖 本 創作 晶 圓 置 施 例 圖 〇 清除裝置整體之立體圖。 罩翻掀動作狀態示意圖。 構件之操作狀態示意圖。 構件與殘膠清除構件之結構零组 構件之調整狀態動作示意圖。 f調整構件以改變刀座組件位置 圖。 之調整狀態動作示意圖。 組件之結構零組件立體圖。 =之調整狀態動作示意圖。 π底部設有曰曰曰目肖度調整部之實 【主要元件符號說明】 晶圓 框架 I底座 翻掀式遮罩 固定座 • 旋轉軸 旋轉座 調整部 螺栓 到刀組 刀座組件 微調整部 刀座調整部 調整螺絲 裝置主體 1基板 ^ q 12 d 内部空間 j乙 ^ 下壓轉動構件 2 3 1 手輪 。 〇 2 2 05 旋轉組件 41 固定盤 n cz 2 4 復位彈簧 2 β 7 殘膠清除構件 3 〇 〇 角度調整構件 4 ^ 旋轉軸 4 4 3 4 微調螺絲 ^ ^ cz 4 4 b 螺孔 Λ 7 * 4 4 6 清潔擦栻組件 5 η M435712 清 潔 布 輪 5 1 鎖 緊 丁 調 輪 5 2 連 桿 5 3 調 整 座 5 4 布 輪 調 整 部 5 5 布 輪 調 整 孔 5 6 布 輪 調 整 螺絲 5 7 晶 圓 置 放 部 6 0 晶 圓 角 度 調整部 6 1 氣 壓 接 頭 6 2 止 付 螺 絲 6 3 氣 壓 吸 附 調整組件 7 0 開 關 控 制 閥 7 1 氣 壓 調 整 閥 7 2 真 空 錶 頭 7 3 轉 7 4 氣 壓 管 7 5At a predetermined position of the substrate of the main body, the type setting 'substrate 盥a is placed as a seven-day yen, wherein the second angle adjusting portion is two rounded" at the bottom end relative position and is provided with multi-pressure adsorption 扪敕:: The wafer is placed at an adjustable angle to provide a side end of the main frame of the device, and the state of the wafer is fixed or released. 7 The rounded portion is provided. Designed to make this creation against the prior art 1 "by (4) personnel scraping the residual wafer on the wafer" and the device is placed on the side of the front device frame and pressed down to the spin The axial adjustment of the wafer at the bottom of the wafer is at least rounded to the wafer state of the device; and the adhesive can be adsorbed, and the residual glue of the crucible is removed, and the problem is that the wafer is placed on the rotating component to remove the glue. The lifting and lifting can adjust the position of the parts in synchronization with the parts to achieve the benefit. The cost of the operation is 'this state of the state handwheel to the component energy efficiency to reduce the whole state of the wafer residual wafer. Even when the cleaning is completed, the increase will be fixed first, and the rotation will be enough to scrape off the convenience of removing the wafer. The relative distance between the two, and the ability to remove and wipe the crystal into a wafer, and to clean the component, and rub the rubber, and increase the rounded surface by the tilt angle, and when the lower press is placed on the wafer table, Declining to the residual degree, the same adhesive residue is not completely clearing the wafer placement portion, and rotating the bottom surface of the pressing rotary assembly and the residual labor cost of the edge to adjust the angle of the component to the rotating group Efficacy and industry implementation [implementation of the implementation method is not necessary to remove the wafer. The wafer residue is a device substrate 12 and the top side of the device is defined and can be turned over. 1 to the example, except that the structure of the surface cleaning apparatus main body 10 of the structure is formed with the wafer 06 掀 state, the pivot type 5 is shown in the figure, and these embodiments are limited. The prefabrication processing system includes: 'The system includes a frame system. The crystal is only used for the description of the wafer residue cleaning operation. The frame 11 is assembled, wherein the base internal space 14, the interior 'and the interior The space 14 is made up of a flip-type mask 15 which can be used for the construction of the aluminum. The round-shaped glue removal device is used for the purpose of the patent application. The plate 12 between the frame 11 and the space 14 in the frame 11 can be shielded by the cover provided in the frame 11; the extruded type, the meal gold, and the angular pressing member 20' can be pressed and rotated. Provided by a fixing seat 21 on the flip-type mask 15 (please refer to the first and second figures), the pressing member 20 includes a hand wheel 22, a rotating shaft 23 connected to the hand wheel 22, a rotating assembly 24 disposed at the end of the rotating shaft 23, the hand wheel 5 M435712 22 is formed to protrude from the outer side of the flip-type mask 15 and the rotating shaft 23 is turned outwardly toward the inner side Extending, when the flip-type mask 15 is in the state of the emperor's far inner space, the rotating shaft 23 is set to rotate The rotating component 24 of the _ end is located above the wafer placing portion 60 (as shown in FIG. 2). The rotating component 24 includes a rotating base 241 and a fixed disk 2 assembled at the bottom of the 座 241. Rotating or pressing r to drive the rotating assembly 24, & to enable the rotating k-piece 24 to achieve the same or downward displacement action; and wherein the hand wheel 22 and the fixed seat are in the same day and "have a return spring %, so that the hand wheel 2 can automatically return to the original position when releasing the lower press; in addition, the rotating assembly 24 can be rotated along the second portion by an adjusting portion 25. The circumferential positive axial position is 'the adjustment portion of the present embodiment is connected to the inner and outer slots of the rotating base 24i of the suspected rotating assembly 24 (please refer to the fourth and fifth figures) and is snail The check 27 is pressed or released to adjust the adjustment 25' so that the groove 241 can be tightly fixed to the rotation axis or in an adjustable state along the axial movement of the rotation shaft 23; the residue removal member 30' is adjustable and The relative distance of the wafer crucible 6 and the state of the oblique angle are set at the bottom of the rotating component 24 of the pressing member 2, and can be rotated synchronously with the rotating component 24, downwardly displaced against the wafer surface or adjusted axially. In the height position, the residual glue removing member 3 includes: at least one to the knife set 40' by means of a glue capable of scraping off the surface of the wafer 06; the cleaning 彳 栻 component 5〇' is disposed at one of the scraper groups 4' On the side, the wafer placement portion 60' can be wiped at a predetermined position on the substrate 12 of the device body 10 in a detachable and assembled state, thereby providing the wafer cassette 6 to be placed. The substrate 12 of the device body 10 is opposite to the bottom end of the wafer placement portion 60. A plurality of wafer angle adjusting portions 61 are disposed, so that the wafer cassette 6 is placed in a state of being negligible. Please refer to FIGS. 1 and 10 for the wafer angle s circumference of the embodiment. In order to cooperate with the adjustment type of the stop screw 63, the rotation of the step 23 by the cover 23 is used to turn the pedestal. The retraction of the detachment is 06. The dn. δ is adjusted by 6 to adjust the stop screw 63 to push the change. The wafer clamping portion 60 and the air pressure adsorption adjusting component side end, and the crystal adjusting component 70 is configured to include a switch head 73, and the opening control unit of the wafer detecting unit 60 is controlled by 71 The knob 74 is provided in the circle 06 or in the released state, wherein the pressure-adsorbing strength of the placing portion 60 is displayed on the vacuum head 73. The structure of the component is a conventional technical structure and the operating state is no longer used by the operator's body 10 substrate 12 The wafer 7 is placed so that the wafer 06 is placed in the state where the internal space rotating assembly 24 of the apparatus main body 10 and the residual rubber removal structure are adjusted to the position, and the hand wheel 22 is driven to drive the rotary glue removing member 30 simultaneously. Glue, and achieve effective reduction of the round 06 residual glue Lee sex. The bottom surface of the wafer placement portion 60 is provided, and the inclination angle 70 of the wafer 06 can be set in the apparatus main body circular placement portion 60 - the adsorption force control valve 71 and the air pressure adjustment control interval 71 are connected by the gas end The gas pressure connector 62 is provided, and the wafer can be switched to the level 3 of the gas pressure regulating valve 72, and the adjusted switch is controlled by the pressure. Therefore, the gas is described here. The wafer 60 to be processed 60 can be fixed by the air pressure, and the flip type 14' is first pressed and the opposite of the lower pressing member 30 and the wafer 06 is pressed and rotated. 24 is arranged in the rotating group to scrape and wipe the wafer 06 to remove the working time 10 frame of the wafer 06 residual glue, the gas valve 72 is controlled by the pressure regulating tube 75 by the regulating portion 60. Placed in the adsorption mask 15 and the bottom of the rotating member 24, the bottom of the rotating member 24, the lifting 11 one of the pressure adsorption and vacuum connection and the entire adsorption of the crystal 5 ha wafer system corresponding to the internal components of the air pressure control device cover the 20 The residual edge of the portion of the slanting angle member 20 is matched with the member 41 shown in FIGS. 4 to 7 and assembled at an angle adjustment. By rotating the angle adjusting the yoke assembly 42 along the rotating shaft 43 to the lateral wafer 06 The slanting angle of the surface of the surface is provided with a fine adjustment portion 44. For example, the 4th shovel blade 40 includes an angle ★ the rotation of the member 41 formed by the holder assembly 42 at the bottom of the peripheral member 41 The shaft 43' can move the knife' to change the seat assembly 42 and degree (refer to FIG. 6 here); between the top of the member 41 and the rotating component 24, as shown in the figure, the micro-adjusting portion 44 7 M435712 of the embodiment is a screw hole type, and is matched with the fine adjustment screw 441. By the fine adjustment portion 44, the top of the angle adjusting member 41 is pushed by adjusting the fine adjustment screw 441, so that the relative distance and inclination of the holder assembly 42 assembled to the bottom of the angle adjusting member 41 and the surface of the wafer 06 can be adjusted. The angle of the fine adjustment portion 44 is preferably in the form of a screw hole with the fine adjustment screw 441, but is not limited to this type. In addition, the top of the holder assembly 42 is provided with a holder adjustment portion 45 (here Referring to FIG. 7 , the holder adjusting portion 45 includes at least two screw holes '46 and an adjusting screw 47 disposed on the screw hole 46. The same can be changed by adjusting the adjusting screw 47. The relative distance between the holder assembly 42 and the surface of the wafer 06 and the angle of inclination. This embodiment only indicates that the relative distance between the holder assembly 42 and the surface of the wafer 06 is adjusted. When different adjustment distances are applied to the adjustment screw, Changing the seat assembly 42 and the surface of the wafer 06 slope. As shown in FIG. 8 and FIG. 9 , the cleaning wiper assembly 50 includes at least one cleaning cloth wheel 51 , a locking hand wheel 52 disposed at the two ends of the cleaning cloth wheel 5 , and a driving device 51 through the cleaning cloth wheel 51 . The connecting rods 53 on the inner side of the locking hand wheel 52 are co-constructed. The connecting rods 53 are assembled on the bottom of the rotating assembly 24 by an adjusting seat 54. The surface of the cleaning cloth wheel 51 is covered with a clean cloth or The other material of the stomach fabric (the figure number is omitted), when the dust-free cloth is coated on the surface of the cleaning cloth wheel 51, the two ends of the clean cloth are first inserted into the opposite ends of the cleaning cloth wheel 51, and by the lock The tightening wheel 52 is locked and pressed to fix the covering state of the dust-free cloth, and at the same time, the cleaning cloth wheel 51 has a wiping function, and the cleaning cloth wheel 51 is covered with a dust-free cloth and the like. The present embodiment is not shown; and wherein the top of the adjusting base 54 and the rotating assembly 24 are provided with a cloth adjusting portion 55 (refer to FIG. 8 here), the cloth adjusting portion 55 includes a majority a cloth wheel adjusting hole 56 and a cloth wheel adjusting screw 57 disposed on the cloth wheel adjusting hole 56 by adjusting the cloth wheel adjusting The whole screw 57 is pushed against the top of the adjusting seat 54, and the relative distance and inclination angle of the cleaning cloth wheel 51 and the surface of the wafer 06 can be adjusted. As shown in FIG. 9, the cleaning cloth wheel 8 31 and the crystal are adjusted. The embodiment of the round 06 surface is different from the secret wire 57. When the angle of inclination of the cloth surface is ^, the cleaning cloth wheel 51 can be changed. Please refer to the reference number 1, ι〇 for the stop screw 63. As shown, the wafer angled wire 63 is pushed against the wafer state 'Saki' by adjusting the placement portion 6〇 and the wafer 06; the bottom end, the towel can change the adjustment edge of the placement portion 60) Angle (This example does not show the efficacy description: This creation: the fact that the effect is improved is as follows. The creation of this circle is a circle & The release unit can provide the wafer release and the glue removal device." Rotating member :::i can be adjusted to tilt the surface of the wafer, the edge of the residual glue 1 can be compared with the [previous technology] a >, with this unique innovative design, K scraping residual on the wafer : The good knowledge of the operator is the cost of the operator and the residual glue Work: The circle is placed at the problem of the wafer placement part. The creative group: Let the handwheel provided on the rotating member bring it; the round surface and the edge A are disabled; the component can 'work hours and reduce the labor cost$ to Effectively reduce the roughing and roughing of the residue removal component system ϊ i Γ Clear the residual adhesive of the wafer: 5 degrees 'At the same time, it can rotate with and: 5 weeks and the wafer can be adjusted by the operator Synchronous adjustment of the sound level, the effect of the round surface residual glue and the production of the second, to achieve the clearing & the utility of the utility. The above embodiment reveals:: The specific term is used to describe the scope of the patent '·Familiar with this technology; the second: the second can be adjusted in the wheel and the wafer 06 the whole 61 series of the stop screw to make the wafer the wafer to set the angle of the wafer, the same scrape and wipe When the creation is freehand, the increase is first fixed, and the rotation is simultaneously removed to remove the convenience of the wafer, and the distance and the ability to wipe the crystal, and the creation of the text in the text 9 M435712 M435712 Simple description] Figure 1 The second picture of the creation of the translation type of the third picture of the creation of the pressure under the fourth picture of the creation of the pressure of the three-dimensional picture of the pressure piece 〇 the fifth picture of the creation under the pressure of the sixth picture of the creation of the adjustment of the action state shown the seventh picture Creating a Knife Set Figure 8 Creating a Clean Wipe Figure 9 Creating a Clean Wipe Figure 10 is a perspective view of the overall creation of the wafer. Schematic diagram of the hood turning action state. Schematic diagram of the operating state of the component. Schematic diagram of the adjustment state of the structural zero component of the component and the residual glue removal component. fAdjust the member to change the position of the seat assembly. Schematic diagram of the adjustment state action. A perspective view of the structural components of the component. = The schematic diagram of the adjustment state action. The bottom of the π is provided with the eyepiece adjustment section. [Main component symbol description] Wafer frame I base flip-type mask mount • Rotary shaft rotary seat adjustment bolt to the knife set tool holder micro adjustment part knife Seat adjustment part adjustment screw device main body 1 substrate ^ q 12 d Internal space j B ^ Press the rotating member 2 3 1 Handwheel. 〇2 2 05 Rotating unit 41 Fixed plate n cz 2 4 Return spring 2 β 7 Residue removal member 3 〇〇 Angle adjustment member 4 ^ Rotary shaft 4 4 3 4 Fine adjustment screw ^ ^ cz 4 4 b Screw hole Λ 7 * 4 4 6 Cleaning wiper assembly 5 η M435712 Cleaning cloth wheel 5 1 Locking twisting wheel 5 2 Connecting rod 5 3 Adjusting seat 5 4 Fabric adjusting part 5 5 Fabric adjusting hole 5 6 Fabric adjusting screw 5 7 Wafer placement Release part 6 0 Wafer angle adjustment part 6 1 Air pressure joint 6 2 Stop screw 6 3 Air pressure adsorption adjustment unit 7 0 Switch control valve 7 1 Air pressure adjustment valve 7 2 Vacuum head 7 3 Turn 7 4 Air tube 7 5
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