CN107367791B - A kind of multichannel EML integrated package and its AWG production method - Google Patents
A kind of multichannel EML integrated package and its AWG production method Download PDFInfo
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- CN107367791B CN107367791B CN201710773967.7A CN201710773967A CN107367791B CN 107367791 B CN107367791 B CN 107367791B CN 201710773967 A CN201710773967 A CN 201710773967A CN 107367791 B CN107367791 B CN 107367791B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
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Abstract
The present invention relates to optical module technical field, a kind of multichannel EML integrated package and its AWG production method are provided.Component includes shell, temperature monitoring circuit and integral type TEC, and hot face and two independent huyashi-chuuka (cold chinese-style noodles) including cobasis plate, the carrying one of the first huyashi-chuuka (cold chinese-style noodles) is heat sink, it is heat sink on be provided with Laser emission chip；Second huyashi-chuuka (cold chinese-style noodles) carries an AWG, and the entering light face of AWG is etched with lens array, and optical signal waveguide section is provided with the first groove after convergence is used for transmission in AWG, and SOA chip is provided in the first groove；Hot face is fixed on the inner wall of shell.Multichannel EML integrated package provided by the invention, not only by using integral type TEC, the laser side TEC and AWG side TEC of conventional separating making is fabricated to the integral type TEC in heat together face, to ensure that the coupling accuracy between laser and AWG, and the purpose of passive coupling may be implemented.
Description
[technical field]
The present invention relates to optical module technical fields, more particularly to a kind of multichannel EML integrated package and its production side AWG
Method.
[background technique]
In Modern Communication System, as the capacity that system is transmitted is increasing, requirement of the package of optical device to rate is got over
Come higher, while the transmission range of device is also required increasingly to grow.Especially in high speed encapsulation field, directly modulation semiconductor
Laser (Directly Modulated Semiconductor Laser, write a Chinese character in simplified form are as follows: DML) gradually overcomes the influence of chirp,
Modulation rate is higher and higher, and the laser assembly of DML modulation has lower cost advantage, to 10km and its following transmission range
Market play decisive action.And using the laser assembly performance of external modulation structure excellent, cost is also higher, it is necessary to aim at 10Km
Above market, so the single chip integrated Electroabsorption Modulated Laser of long distance transmission (Electro absorption
Modulated Laser, writes a Chinese character in simplified form are as follows: EML) integrated package has the very big market space.
Currently used for the system of long distance transmission, mostly use multichannel EML integrated package along with one packaged greatly
The mode of semiconductor optical amplifier (Semiconductor Optical Amplifier, write a Chinese character in simplified form are as follows: SOA) component carries out, and such as schemes
Shown in 1, the system bulk that this mode erects is big, and power consumption is high, and cost is also high.In addition to this, EML component is with SOA component
Between connected using optical fiber, be applied in system and need disk fine, not only complex process, insertion loss are big, be also easy to happen folding it is fine,
Phenomena such as disconnected fine, influence yield rate.
As shown in Fig. 2, for the structural schematic diagram of another existing multichannel EML integrated package, wherein since it is used
TEC structure be independent two elements (as shown in TEC1 and TEC2 in figure), therefore, the error on Z axis is unable to control
To within 20um, as shown in Fig. 2, between laser and AWG must by separate lenses, by it is active to optical alignment in a manner of complete
Optical path between laser, separate lenses and AWG couples.This implementation not only brings the low efficiency of processing and manufacturing,
It needs additionally to configure the separate lenses and causes the raising of cost.
[summary of the invention]
The technical problem to be solved by the present invention is to the complexity of EML integrated package processing technology in the prior art, needing to use has
Source could complete laser to light mode and AWG is coupled；It is then that device architecture is multiple for the EML integrated package comprising SOA structure
It is miscellaneous, the problems such as series-mode frame causes EML integrated package size of devices larger.
The present invention adopts the following technical scheme:
The present invention provides a kind of multichannel EML integrated packages, including shell 1 and integral type TEC2, wherein the one
Formula TEC2 include a cobasis plate hot face 21 and two independent huyashi-chuuka (cold chinese-style noodles),
The first huyashi-chuuka (cold chinese-style noodles) 22 in described two huyashi-chuuka (cold chinese-style noodles) structures carries one heat sink 4, is provided with Laser emission core on described heat sink 4
Piece 5 and the first thermistor 3；
The second huyashi-chuuka (cold chinese-style noodles) 23 in described two huyashi-chuuka (cold chinese-style noodles) structures carries an AWG6, and the entering light face of the AWG6 is etched with lens array
Column 9, optical signal waveguide section is provided with the first groove 31 after convergence is used for transmission in the AWG6, is arranged in first groove 31
There is SOA chip 7；Wherein, the second thermistor 8 is additionally provided on the AWG6；
First thermistor 3, the second thermistor 8, the first huyashi-chuuka (cold chinese-style noodles) 22 the first heat in the hot face 21 of substrate together
The first circuit that face region 24 is constituted, the second huyashi-chuuka (cold chinese-style noodles) 23 and the second hot face region 25 in the hot face 21 of substrate constituted the
Secondary circuit is separately connected temperature monitoring circuit；
The hot face 21 is fixed on the inner wall of shell 1.
Preferably, on the AWG6, and it is located at production near first groove 31 and has the second groove 32, described the
Two thermistors 8 are arranged in second groove 32；Wherein, the depth of second groove 32 makes after completing face-down bonding
The thermoinduction region of the second thermistor 8 and the waveguide of AWG6 be located in same level.
Preferably, it is used for transmission optical signal waveguide section after converging in the AWG6, and is located at the light out of the first groove 31
Surface side is provided with lens 10.
Preferably, the first huyashi-chuuka (cold chinese-style noodles) on the hot face 21 of the cobasis plate and the second huyashi-chuuka (cold chinese-style noodles) surface height difference are less than
20um。
Preferably, described heat sink 4 be aluminium nitride ALN.
Second aspect, the present invention also provides the production method of AWG in multichannel EML integrated package a kind of, the bases AWG6
Has complete optical waveguide structure on plate, the production method includes:
First layer exposure mask is made on the entering light face of AWG6 base plate, and carries out first round corrosion；Wherein, first layer exposure mask
Figure be each lens centre in corresponding lens array 9 round spot；
After completing the first round corrosion of preset time, second layer exposure mask is made on the entering light face of AWG6, and carry out the
Two wheel corrosion；Lens array 9 is obtained after successively carrying out n wheel corrosion；Wherein, in the figure of each layer of exposure mask round spot diameter
Increase with being incremented by for the number of plies.
Preferably, the production method further includes the speed of growth for controlling mask thicknesses and the entering light face of AWG6 base plate
Corrosion rate in corrosive liquid, so that the speed of the two meets preset ratio；The then production method further include:
The thickness and corrosion depth for making each layer of exposure mask are completed referring to the preset ratio, so that completing each round
Lens array 9 after corrosion can be showed by current mask figure according to the preset ratio.
Preferably, the first groove 31 and 32 mask pattern of the second groove are made, and etches first groove 31 and the
Two grooves 32；Wherein, first groove 31, which is located in the AWG6, is used for transmission after convergence in optical signal waveguide section；Described
Two grooves 32 are located near first groove 31, and the depth of second groove 32 makes after completing face-down bonding
The thermoinduction region of second thermistor 8 and the waveguide of AWG6 are located in same level.
Preferably, it is the method and step of corresponding lens array 9 according to the figure for making the first layer exposure mask, completes first
The light-emitting surface side of groove 31 is provided with the production of lens 10.
Preferably, there are conductive metal layer, the conductive metal in first groove 31 and the production of 32 bottom of the second groove
Layer is to deposit MOCVD after the mask layer of production conductive metal layer pattern by Metallo-Organic Chemical Vapor and complete.
The third aspect, the present invention also provides the production method of AWG in multichannel EML integrated package a kind of, the production
Method includes:
AWG material of main part is grown in wafer；
When the AWG host thickness of growth reaches preset lens array and is located at the lower edge position of the AWG, open
The mask pattern of lens array on beginning layer-by-layer preparation AWG；Wherein, on the AWG lens array mask pattern according to from greatly to
It is small, but the variable area given rule of lens cross-section from small to large successively makes；
The mask pattern of lens array on the layer-by-layer preparation AWG, specifically includes:
In the AWG material of main part growth for having made respective layer each time, the mask pattern of equivalent layer is removed, and start newly
The production and the growth of AWG material of main part of one layer of mask pattern, the growth until completing lens array.
Preferably, the method also includes:
When the AWG host thickness of growth reaches preset optical waveguide region, suspend the life of AWG material of main part
It is long, and make the first mask pattern of optical waveguide；Wherein, lens array is made on the first mask pattern boundary of optical waveguide and AWG
The region of column differs pre-determined distance, also, the non-occluded area of the first mask pattern is optical waveguiding region to be grown；
After having grown optical waveguide, the first mask pattern is removed；And restore the exposure mask figure of lens array on layer-by-layer preparation AWG
The process of shape and the growth of AWG material of main part.
Preferably, the method also includes:
When the AWG host thickness of growth covers preset optical waveguide region, suspend the life of AWG material of main part
It is long, and make the second mask pattern of optical waveguide；Wherein, lens array is made on the second mask pattern boundary of optical waveguide and AWG
The region of column differs pre-determined distance；
Under the auxiliary of second mask pattern, corrode out for growing optical waveguiding region, and carry out optical waveguide material
Growth；
After having grown optical waveguide, the second mask pattern is removed；And restore the exposure mask figure of lens array on layer-by-layer preparation AWG
The process of shape and the growth of AWG material of main part.
Preferably, after having grown lens array and AWG material of main part, the method also includes:
The first groove and the second groove mask pattern are made, and etches first groove and the second groove；Wherein, institute
It states the first groove and is located in the AWG and be used for transmission after convergence in optical signal waveguide section；Second groove is located at described first
Near groove, and the depth of second groove makes the thermoinduction region for completing the second thermistor after face-down bonding
Waveguide with AWG is located in same level.
Preferably, the light-emitting surface side of first groove is provided with lens, then the method also includes:
The AWG host thickness of growth reach preset first groove be located at the AWG lower edge position and/or
When lens are located at the lower edge position of the AWG in first groove, start upper first groove of layer-by-layer preparation AWG and/or first recessed
The mask pattern of lens in slot；Also, in the AWG material of main part growth for having made respective layer each time, remove covering for equivalent layer
Film pattern, and start the production of one layer of new mask pattern and the growth of AWG material of main part, until complete the first groove and/or
The growth of lens.
Compared with prior art, the beneficial effects of the present invention are:
Multichannel EML integrated package provided by the invention, not only by using integral type TEC, by conventional separating making
Laser side TEC and AWG/SOA side TEC is fabricated to the integral type TEC in heat together face, to ensure that between laser and AWG
Coupling accuracy, and the purpose of passive coupling may be implemented.It compares and needs to borrow the mode of coupled lens in the prior art, save
About cost of manufacture and processing efficiency.
On the other hand, the present invention will need optical fiber two also by way of making the first groove in AWG in the prior art
The company device of section is completed directly by the face-down bonding SOA on the first groove of AWG, and using integral type TEC mode is shared
The control of respective temperature, realizes the raising in control efficiency and the reduction of production cost.
[Detailed description of the invention]
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of functional module framework schematic diagram of EML integrated package in the prior art provided by the invention；
Fig. 2 is a kind of structural schematic diagram of EML integrated package in the prior art provided by the invention；
Fig. 3 is a kind of structural schematic diagram of EML integrated package provided in an embodiment of the present invention；
Fig. 4 is a kind of functional module framework schematic diagram of EML integrated package provided in an embodiment of the present invention；
Fig. 5 is AWG structural schematic diagram in a kind of EML integrated package provided in an embodiment of the present invention；
Fig. 6 is the manufacturing method of AWG in a kind of EML integrated package provided in an embodiment of the present invention；
Fig. 7 is the manufacturing method of AWG in a kind of EML integrated package provided in an embodiment of the present invention；
Fig. 8 is the manufacturing method of AWG in another kind EML integrated package provided in an embodiment of the present invention；
Fig. 9 is the manufacturing method of AWG in a kind of EML integrated package provided in an embodiment of the present invention.
[specific embodiment]
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In the description of the present invention, term "inner", "outside", " longitudinal direction ", " transverse direction ", "upper", "lower", "top", "bottom" etc. refer to
The orientation or positional relationship shown be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention rather than
It is required that the present invention must be constructed and operated in a specific orientation, therefore it is not construed as limitation of the present invention.
In addition, as long as technical characteristic involved in the various embodiments of the present invention described below is each other not
Constituting conflict can be combined with each other.
The present invention is used SOA chip with EML integrated chip encapsulating structure together and production method, not only make be
System volume greatly reduces, and cost substantially reduces, and the power consumption of whole system is effectively reduced.
In addition, the present invention is used existing independent TEC structure, EML group is completed by the integral type TEC in a heat together face
The processing and fabricating of part, so that the error precision between laser and AWG is improved, so as to by active coupling in the prior art
Conjunction is converted to passive coupling, improves the processing efficiency of EML component.
Next it will illustrate that we are bright by specific several embodiments and how to realize above-mentioned technical proposal.
Embodiment 1:
The embodiment of the present invention 1 provides a kind of multichannel EML integrated package, as shown in figure 3, including shell 1 and integral type
TEC2, wherein hot face 21 that the integral type TEC2 includes a cobasis plate and two independent huyashi-chuuka (cold chinese-style noodles) structures are (including in Fig. 3
The 23 of 22 and mark of mark).
The first huyashi-chuuka (cold chinese-style noodles) 22 in described two huyashi-chuuka (cold chinese-style noodles) structures carries one heat sink 4, and Laser emission chip is arranged on described heat sink 4
5 and first thermistor 3.
The second huyashi-chuuka (cold chinese-style noodles) 23 in described two huyashi-chuuka (cold chinese-style noodles) structures carries an AWG6, and the entering light face of the AWG6 is etched with lens array
Column 9, optical signal waveguide section is provided with the first groove 31 after convergence is used for transmission in the AWG6, is arranged in first groove 31
There is SOA chip 7；Wherein, the second thermistor 8 is additionally provided on the AWG6.
First thermistor 3, the second thermistor 8, the first huyashi-chuuka (cold chinese-style noodles) 22 the first heat in the hot face 21 of substrate together
The first circuit that face region 24 is constituted, the second huyashi-chuuka (cold chinese-style noodles) 23 and the second hot face region 25 in the hot face 21 of substrate constituted the
Secondary circuit is separately connected temperature monitoring circuit.
Wherein, what the first circuit and second servo loop showed can be has two pairs of electrodes on hot face, wherein first
Electrode is used to provide driving current to the first circuit that the first huyashi-chuuka (cold chinese-style noodles) 22 and the first hot face region 24 are constituted；And second pair of electrode
Second servo loop for constituting to the second huyashi-chuuka (cold chinese-style noodles) 23 and the second hot face region 25 provides driving current.And the temperature monitoring circuit
What it is in component internal performance can be exactly the patch type conducting wire made or for conventional conducting wire, for when in use with it is external
It works after device for monitoring temperature connection.
The hot face 21 is fixed on the inner wall of shell 1.
Multichannel EML integrated package provided in an embodiment of the present invention, not only by using integral type TEC, by conventional separation
The laser side TEC and AWG/SOA side TEC of production is fabricated to the integral type TEC in heat together face, to ensure that laser and AWG
Between coupling accuracy, and the purpose of passive coupling may be implemented.It compares and needs to borrow coupled lens in the prior art
Mode has saved cost of manufacture and processing efficiency.
As shown in figure 4, for by the improved module rack composition corresponding to structure shown in Fig. 3 of the embodiment of the present invention, phase
Compare module rack composition in the prior art as shown in Figure 1, the setting of SOA is more closed in the framework that the embodiment of the present invention is proposed
Reason, integrated level are higher.
On the other hand, the embodiment of the present invention will need in the prior art also by way of making the first groove in AWG
The company device of two section of optical fiber is directly by the face-down bonding SOA chip 7 on the first groove of AWG, and uses and share integral type
TEC mode completes the control of respective temperature, realizes the raising in control efficiency and the reduction of production cost.
In conjunction with the embodiment of the present invention, due to SOA chip 7 be by it is a kind of it is Embedded in a manner of be produced in AWG6, compare
Compared with the prior art, the region that ambient temperature suffered by SOA chip 7 influences in the embodiment of the present invention only leaves a top surface, and
Other five faces can obtain more efficient TEC control effect all in the opposite area of space closed on of AWG6, for
The stability and bandwidth characteristic of the amplifying operation of laser signal have biggish promotion.Therefore, the embodiment of the present invention is mentioned
This embedded SOA structure out, there is also a kind of preferred implementations for the setting of corresponding thermistor, specifically,
Production has the second groove 32 on the AWG6, and near first groove 31, and second thermistor 8 is arranged
In second groove 32；Wherein, the depth of second groove 32 to complete the second thermistor 8 after face-down bonding
Thermoinduction region and the waveguide of AWG6 be located in same level.
In order to further increase coupling efficiency between AWG6 and SOA chip 7, as shown in figure 5, there are a kind of preferred realities
Show scheme, optical signal waveguide section after converging is used for transmission in the AWG6, and the light-emitting surface side for being located at the first groove 31 is arranged
There are lens 10.In embodiments of the present invention, the lens 10 can be independent lens are embedded on AWG6 be located at it is first recessed
The light-emitting surface side of slot 31, is also possible to make to obtain by photoetching corrosion that (embodiment of the present invention 2 and embodiment 3 will be specifically unfolded
How description makes).
In embodiments of the present invention, made structure according to an embodiment of the present invention, can reach positioned at the cobasis plate
Hot face 21 on the first huyashi-chuuka (cold chinese-style noodles) and the second huyashi-chuuka (cold chinese-style noodles) surface height difference be less than 20um.
In embodiments of the present invention, described heat sink 4 aluminium nitride ALN material is preferably used.
Embodiment 2:
Emphasis of the embodiment of the present invention is for AWG6 in a kind of multichannel EML integrated package proposed in embodiment 1
Production method gives expansion description, and AWG6 used in the embodiment of the present invention is to have had been provided on AWG6 base plate completely
Optical waveguide structure, as shown in fig. 6, the production method includes:
In step 201, first layer exposure mask is made on the entering light face of AWG6 base plate, and carries out first round corrosion.
Wherein, the figure of first layer exposure mask is the round spot of each lens centre in corresponding lens array 9.
In step 202, after completing the first round corrosion of preset time, the second layer is made on the entering light face of AWG6 and is covered
Film, and carry out the second wheel corrosion.
In step 203, lens array 9 is obtained after successively carrying out n wheel corrosion；Wherein, circle in the figure of each layer of exposure mask
The diameter of spot increases with being incremented by for the number of plies.Wherein, n is natural number.
It can make the method for lens arrangement in AWG6 entering light wheat flour the embodiment of the invention provides a kind of, principle is to look for first
The center of each optical waveguide on quasi- AWG6 entering light face, and mask pattern is made on the center of its each optical waveguide, the exposure mask figure
It is discrete that shape according to the mirror surface radian size of lens and the smooth degree of radian is designed to some column path lengths, but on the whole
Show the circle of path length continuity.The lens arrangement completed by the embodiment of the present invention is pressed similar to by lens body structure
According to the structure after being cut into one by one at equal intervals, assembled.
It should be pointed out that AWG6 with lens arrangement that the embodiment of the present invention is proposed and being arranged in the prior art
Separate lenses between laser and AWG6 have the difference of essence.Firstly, lens in the prior art are needed based on active test
On the basis of, the coupling between laser, lens and AWG6 waveguide could be completed, and implementation has been relied in the embodiment of the present invention
Integral type TEC in example 1 solves the problems, such as the coupling accuracy being located on Z axis between laser and AWG6, has been able to solving
Certainly on the Z axis after precision problem, the coupling under passive environment between laser and AWG6 is realized.Secondly, in the prior art
Mirror is to converge to laser signal in the optical waveguide on AWG6 using principle, and therefore, the setting angles and positions of lens are all
There is high requirement, and the lens in the embodiment of the present invention are directly to be produced in the optical waveguide in AWG6 entering light face, therefore,
Effect is to give certain error space to the level angle and/or vertical height of the setting of laser, i.e., for reducing integrated
The difficulty of processing of component, and show as improving yield rate to a certain extent.
During the embodiment of the present invention is realized, the system of the lens can be usually completed by temporal calculating
Make, still, for the ease of in the operation and manufacturing process in manufacturing process control on precision and production method new
Degree is continued to use in lens sizes, the embodiment of the invention also provides a kind of preferred control improvement plans.Specifically, described
Production method further includes the corrosion speed in corrosive liquid in the speed of growth for controlling mask thicknesses and the entering light face of AWG6 base plate
Degree, so that the speed of the two meets preset ratio；The then production method further include:
The thickness and corrosion depth for making each layer of exposure mask are completed referring to the preset ratio, so that completing each round
Lens array 9 after corrosion can be showed by current mask figure according to the preset ratio.
As complete AWG6 structure used in an embodiment of the present invention, in addition to step described in above-mentioned steps 201-203
Outside, as shown in fig. 7, the embodiment of the invention also includes:
In step 204, the first groove 31 and 32 mask pattern of the second groove are made, and etches first groove 31
With the second groove 32.
Wherein, first groove 31, which is located in the AWG6, is used for transmission after convergence in optical signal waveguide section；Described
Two grooves 32 are located near first groove 31, and the depth of second groove 32 makes after completing face-down bonding
The thermoinduction region of second thermistor 8 and the waveguide of AWG6 are located in same level.
For also production has on the light-emitting surface of first groove 31 involved in preferred embodiment in embodiment 1
Mirror, then in embodiments of the present invention, the execution sequencing between the step 201-203 and step 204 is not strictly to limit
Fixed.Such as: when making the design requirement of lens on completing the light-emitting surface to the first groove 31, it can also be and first made step
After the first groove 31 and the second groove 32 in rapid 204, the saturating of AWG6 entering light face is then completed by step 201-203 respectively
Lens production in mirror production and the first groove 31.
In embodiments of the present invention, due to the SOA chip 7 and thermistor advocate it is complete by the way of face-down bonding
At therefore, also having there is and completed by spun gold bonding wire or by leading for the power supply of the SOA chip 7 and thermistor
Metal layer (such as the conductive metal layer is to pass through Organometallic Chemistry after the mask layer of production conductive metal layer pattern
Be vapor-deposited (Metal Organic Chemical Vapor Deposition, write a Chinese character in simplified form are as follows: MOCVD) completion) it realizes.Two kinds
Mode belongs in the protection scope of the embodiment of the present invention.
Embodiment 3:
Emphasis of the embodiment of the present invention is for AWG6 in a kind of multichannel EML integrated package proposed in embodiment 1
Production method gives expansion description, and lens are started from after the optical waveguide structure that completed in the embodiment that compares 2, this
The production method that inventive embodiments are proposed just is introduced during wafer processing and fabricating AWG6, that is, passes through a kind of growth
Mode obtains lens array, and not obtains lens array by way of corrosion as described in Example 2, as shown in figure 8, institute
Stating production method includes:
In step 301, AWG material of main part is grown in wafer；
In step 302, reach under preset lens array is located at the AWG6 in the AWG host thickness of growth
When marginal position, start the mask pattern of lens array on layer-by-layer preparation AWG.
Wherein, the mask pattern of lens array is according to from big to small on the AWG, and lens cross-section from small to large
Variable area given rule successively makes.The changing rule meets under upright state, the rule of the cross section leukorrhagia variation of lens.
Wherein, the mask pattern for starting lens array on layer-by-layer preparation AWG, specifically includes:
In step 303, in the AWG material of main part growth for having made respective layer each time, the exposure mask figure of equivalent layer is removed
Shape, and start the production of one layer of new mask pattern and the growth of AWG material of main part, the growth until completing lens array.
If in view of production has lens knot in 31 structure of the first groove, 32 structure of the second groove and the first groove 31
Structure, then as shown in figure 9, the step 302 can be performed as again:
In step 3021, determines the thickness of the AWG material of main part layer where the exposure mask currently to be made, judge in the thickness
Whether need to generate under degree in the lens arrangement in 31 structure of the first groove, 32 structure of the second groove and the first groove 31
One or more object.
In step 3022, if desired, then corresponding mask pattern is being made, by the exposure mask figure of object every under respective thickness
Shape is produced in AWG main body, and grows the AWG material of main part of respective thickness.
Lens arrangement in above-mentioned first groove, 31 structure, 32 structure of the second groove and the first groove 31, there are independent need
Want growth phase (such as: the depth of the first groove 31 compares lens array, the second groove 32, lens in the first groove 31
Depth will be big, and therefore, the meeting for involving the need for production mask pattern at first is the inclined bottom section of the first groove 31), there is also
It is multiple at the same carry out growth phase (such as: be located at optical waveguide where horizontal zone, usual first groove, 31 knot on the horizontal plane
Structure, 32 structure of the second groove, lens array, the lens arrangement in the first groove 31 all can partially be covered, and therefore, make at this time
Mask pattern include aforementioned four structure the graphics feature under respective thickness).
Aforesaid way is the equal of realizing that first is recessed by the control of the growth district during growth AWG material of main part
The completion of slot 31, the second groove 32, lens arrangement in the first groove 31.And in practical implementation method, in addition to above by
Growth pattern obtains outside first groove 31 and the second groove 32 after exposure mask, and the embodiment of the invention also provides another kinds to realize
Mode, specifically:
32 mask pattern of the first groove 31 and the second groove is made, and etches first groove 31 and the second groove
32；Wherein, first groove 31, which is located in the AWG6, is used for transmission after convergence in optical signal waveguide section；Second groove
32 are located near first groove 31, and the depth of second groove 32 to complete the second heat after face-down bonding
The thermoinduction region of quick resistance 8 and the waveguide of AWG6 are located in same level.
Before comparing by growth pattern after exposure mask, latter simplify mask fabrication processes, i.e., will need repeatedly raw
At the mask pattern in 32 region of the first groove 31 and the second groove, final stage is focused on and has only passed through a mask corrosion completion
First groove 31 and the second groove 32.However, there is also the deficiencies of its own for the latter's mode, i.e., it is recessed can not effectively to make first
Lens in slot 31.Therefore, recessed in conjunction with the first groove 31 of the embodiment of the present invention and above two production, the second groove 32 and first
The method of lens in slot 31, there is also a kind of optional implementations, i.e., for lens in the first groove 31 and the first groove 31
Production grown after above-mentioned exposure mask by the way of complete, and for the second groove 32 production then use exposure mask post-etching side
Formula is completed, as a result, can in summary two ways advantage so that production and processing efficiency greatly improves.
Growth for optical waveguiding region involved in the embodiment of the present invention also provides two kinds of optional implementations,
It is specifically described as follows:
Mode one:
When the AWG host thickness of growth reaches preset optical waveguide region, suspend the life of AWG material of main part
It is long, and make the first mask pattern of optical waveguide；Wherein, lens array is made on the first mask pattern boundary of optical waveguide and AWG
The region of column differs pre-determined distance, also, the non-occluded area of the first mask pattern is optical waveguiding region to be grown；
After having grown optical waveguide, the first mask pattern is removed；And restore the exposure mask figure of lens array on layer-by-layer preparation AWG
The process of shape and the growth of AWG material of main part.
Mode two:
When the AWG host thickness of growth covers preset optical waveguide region, suspend the life of AWG material of main part
It is long, and make the second mask pattern of optical waveguide；Wherein, lens array is made on the second mask pattern boundary of optical waveguide and AWG
The region of column differs pre-determined distance；
Under the auxiliary of second mask pattern, corrode out for growing optical waveguiding region, and carry out optical waveguide material
Growth；
After having grown optical waveguide, the second mask pattern is removed；And restore the exposure mask figure of lens array on layer-by-layer preparation AWG
The process of shape and the growth of AWG material of main part.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (5)
1. a kind of multichannel EML integrated package, which is characterized in that including shell (1) and integral type TEC (2), wherein described one
Body formula TEC (2) include a cobasis plate hot face (21) and two independent huyashi-chuuka (cold chinese-style noodles),
The first huyashi-chuuka (cold chinese-style noodles) (22) in described two huyashi-chuuka (cold chinese-style noodles) structures carries one heat sink (4), is provided with Laser emission on heat sink (4)
Chip (5) and the first thermistor (3)；
The second huyashi-chuuka (cold chinese-style noodles) (23) in described two huyashi-chuuka (cold chinese-style noodles) structures carries an AWG (6), and the entering light face of the AWG (6) is etched with lens
Array (9), optical signal waveguide section is provided with the first groove (31) after convergence is used for transmission in the AWG (6), first groove
(31) SOA chip (7) are provided in；Wherein, the second thermistor (8) are additionally provided on the AWG (6)；
First thermistor (3), the second thermistor (8), the first huyashi-chuuka (cold chinese-style noodles) (22) together in the hot face (21) of substrate
The first circuit that one hot face region (24) is constituted, the second huyashi-chuuka (cold chinese-style noodles) (23) the second hot face region in the hot face (21) of substrate together
(25) second servo loop constituted is separately connected temperature monitoring circuit；
The hot face (21) of the cobasis plate is fixed on the inner wall of shell (1).
2. multichannel EML integrated package according to claim 1, which is characterized in that on the AWG (6), and be located at institute
Stating production near the first groove (31) has the second groove (32), and second thermistor (8) is arranged in second groove
(32) in；Wherein, the depth of second groove (32) makes the thermoinduction for completing the second thermistor (8) after face-down bonding
The waveguide of region and AWG (6) is located in same level.
3. multichannel EML integrated package according to claim 2, which is characterized in that be used for transmission remittance in the AWG (6)
Optical signal waveguide section after poly-, and the light-emitting surface side for being located at the first groove (31) is provided with lens (10).
4. multichannel EML integrated package according to claim 1 to 3, which is characterized in that positioned at the cobasis plate
The first huyashi-chuuka (cold chinese-style noodles) and the second huyashi-chuuka (cold chinese-style noodles) surface height difference on hot face (21) are less than 20um.
5. multichannel EML integrated package according to claim 1 to 3, which is characterized in that described heat sink (4) are nitridation
Aluminium ALN.
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| CN113805289B (en) * | 2021-09-16 | 2023-01-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| US6729143B1 (en) * | 2002-09-19 | 2004-05-04 | Nortel Networks Limited | Thermo-electric cooler for use in an optical assembly |
| CN201061077Y (en) * | 2007-07-13 | 2008-05-14 | 昂纳明达数字显示技术（深圳）有限公司 | High-power single tube pumped laser |
| KR100910979B1 (en) * | 2007-07-27 | 2009-08-05 | (주)켐옵틱스 | Tunable Laser Module Based on Polymer Waveguides |
| CN101494356A (en) * | 2009-03-02 | 2009-07-29 | 大连艾科科技开发有限公司 | Two-body type base semiconductor laser |
| EP2664037A4 (en) * | 2011-01-13 | 2017-11-22 | IPG Photonics Corporation | Compact single frequency laser |
| CN103926663B (en) * | 2014-04-25 | 2015-09-16 | 武汉光迅科技股份有限公司 | A kind of multi wave length illuminating source and low-cost production's method thereof |
| WO2016011002A1 (en) * | 2014-07-14 | 2016-01-21 | Biond Photonics Inc. | 3d photonic integration with light coupling elements |
| CN104570236B (en) * | 2014-11-27 | 2017-01-25 | 武汉电信器件有限公司 | High-speed butterfly-shaped packaging optical emitter component |
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