CN107365960B - Evaporation source detection system and detection method, evaporated device - Google Patents
Evaporation source detection system and detection method, evaporated device Download PDFInfo
- Publication number
- CN107365960B CN107365960B CN201610326878.3A CN201610326878A CN107365960B CN 107365960 B CN107365960 B CN 107365960B CN 201610326878 A CN201610326878 A CN 201610326878A CN 107365960 B CN107365960 B CN 107365960B
- Authority
- CN
- China
- Prior art keywords
- evaporation source
- crucible
- source detection
- temperature
- vapor deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides a kind of evaporation source detection system and detection methods, evaporated device, are related to field of display technology, the thickness uniformity for improving vapor deposition to the vapor deposition film layer on substrate.The evaporation source detection system includes: the mass sensor being set to above the nozzle of evaporation source, the quality of evaporation material that the mass sensor is sprayed for detecting the nozzle as corresponding to the mass sensor before being deposited and is attached on the mass sensor；The spray nozzle clogging degree analyzing unit connecting with the mass sensor, the quality for the evaporation material that the spray nozzle clogging degree analyzing unit is obtained according to detection, analyzes chocking-up degree corresponding to the mass sensor.Above-mentioned evaporated device is used for evaporation material vapor deposition to substrate.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of evaporation source detection system and detection method, vapor deposition to set
It is standby.
Background technique
OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) display device is a kind of mainstream
Display device, with low in energy consumption, fast response time, working range is wide, be easily achieved Flexible Displays, light and shade ratio is prominent and high
Many advantages, such as color of image quality.
OLED display generally includes color blocking layer, which includes R (red), G (green) and three kinds of colors of B (blue)
Resistance forms RGB color resistance and generally uses evaporation process.Vapor deposition process are as follows: evaporation source is placed in the vacuum chamber of evaporated device, it will
Substrate is set to the top of evaporation source, and the evaporation source includes crucible, and having heaters is arranged outside crucible, is equipped with and steams inside crucible
Material is plated, cover board is provided with above crucible, cover board, which is equipped with multiple nozzles, makes the steaming in crucible by heater heating crucible
Plating material is evaporated from each nozzle, is attached to the surface filming of substrate.
But above-mentioned vapor deposition process has the following problems: during vapor deposition, each nozzle is easy to attachment evaporation material,
During being deposited for a long time, the evaporation material being attached on nozzle can be more and more, the vapor deposition for causing nozzle to spray
Material is reduced, and the quality of the evaporation material as accompanying by each nozzle is different, causes the vapor deposition material sprayed from different spray nozzles
The amount of material is also different, so as to cause vapor deposition to the in uneven thickness of the film on substrate.
Summary of the invention
The purpose of the present invention is to provide a kind of evaporation source detection system and detection methods, evaporated device, for improving
The thickness uniformity of the film on substrate is deposited.
In order to achieve the above objectives, the present invention adopts the following technical scheme:
The first aspect of the present invention provides a kind of evaporation source detection system, and the evaporation source detection system includes: setting
Mass sensor above the nozzle of evaporation source, a nozzle correspond at least one described mass sensor, and the quality passes
Sensor, which is used to detect the nozzle as corresponding to the mass sensor before being deposited, to be sprayed and is attached to the mass sensor
Evaporation material quality；The spray nozzle clogging degree analyzing unit being connect with the mass sensor, the spray nozzle clogging degree
The quality for the evaporation material that analytical unit is obtained according to detection, analyzes the chocking-up degree of nozzle corresponding to the mass sensor.
In evaporation source detection system provided by the present invention, as nozzle chocking-up degree and be attached to corresponding to the nozzle
Mass sensor on evaporation material quality be in inverse relation, therefore can by mass sensor detect be attached to itself
Evaporation material quality, the quality analysis of evaporation material then obtained using spray nozzle clogging degree analyzing unit according to detection
The chocking-up degree of respective nozzle, in order to which the degree of congestion of the nozzle obtained according to analysis handles respective nozzle, for example,
Nozzle is cleaned or is replaced.As it can be seen that technical solution provided by the present invention can find in time and handle chocking-up degree
Biggish nozzle, thus guarantee the amount for the evaporation material that during vapor deposition nozzle corresponding to each region of substrate sprays it is identical or
It is essentially identical, avoid due to different spray nozzles chocking-up degree it is inconsistent caused by the non-uniform problem of vapor deposition thicknesses of layers, mention
The high uniformity of vapor deposition thicknesses of layers.
The second aspect of the present invention provides a kind of evaporation source detection method, the evaporation source detection method include: into
The quality for the evaporation material that detection is sprayed by the nozzle of evaporation source before row vapor deposition；According to the quality that detection obtains, determine corresponding
The chocking-up degree of nozzle.
Evaporation source detection system provided by the beneficial effect and the first aspect of the present invention of above-mentioned evaporation source detection method
Beneficial effect it is identical, details are not described herein again.
The third aspect of the present invention provides a kind of evaporated device, including vacuum chamber, and is set to the vacuum chamber
Internal evaporation source, the evaporated device further include above-mentioned evaporation source detection system, and the evaporation source detection system is used for institute
Evaporation source is stated to be detected.
Evaporation source detection system provided by the beneficial effect and the first aspect of the present invention of above-mentioned evaporated device it is beneficial
Effect is identical, and details are not described herein again.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, required use in being described below to embodiment
Attached drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this
For the those of ordinary skill of field, without creative efforts, it can also be obtained according to these attached drawings others
Attached drawing.
Fig. 1 is the structural schematic diagram of evaporated device in the embodiment of the present invention one；
Fig. 2 is the structural schematic diagram of the evaporation source of evaporated device in the embodiment of the present invention one；
Fig. 3 is the structural schematic diagram one of evaporation source detection system provided by the embodiment of the present invention one；
Fig. 4 is the structural schematic diagram two of evaporation source detection system provided by the embodiment of the present invention one；
Fig. 5 is the structural schematic diagram three of evaporation source detection system provided by the embodiment of the present invention one；
Fig. 6 is the structural schematic diagram four of evaporation source detection system provided by the embodiment of the present invention one；
Fig. 7 is the structural schematic diagram five of evaporation source detection system provided by the embodiment of the present invention one；
Fig. 8 is the structural schematic diagram six of evaporation source detection system provided by the embodiment of the present invention one；
Fig. 9 is the structural schematic diagram seven of evaporation source detection system provided by the embodiment of the present invention one；
Figure 10 is the structural schematic diagram eight of evaporation source detection system provided by the embodiment of the present invention one；
Figure 11 is the structural schematic diagram nine of evaporation source detection system provided by the embodiment of the present invention one.
Description of symbols:
1- organic evaporating chamber；2- evaporation of metal chamber；
3- load device；4- loads locking device；
5- crucible；6- nozzle；
7- heater；8- coldplate；
9- thermocouple；10- pressure-measuring device；
11- mass sensor；13- laser scanner；
14- evaporation source；15- residual gas analyzer；
16- evaporation material；17- cover board；
18- electricity feedthrough；19- strainer；
20- vacuum chamber；21- resistance meter；
22- thermometer.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, implement below in conjunction with the present invention
Attached drawing in example, technical scheme in the embodiment of the invention is clearly and completely described.Obviously, described embodiment
Only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, the common skill in this field
Art personnel all other embodiment obtained without creative labor belongs to the model that the present invention protects
It encloses.
Evaporation source detection system provided in an embodiment of the present invention mainly detects the evaporation source having the following structure, such as
Shown in FIG. 1 to FIG. 2, which includes crucible 5 and cover board, and cover board is located at 5 top of crucible, for covering to crucible 5；
It is provided with multiple nozzles 6 on cover board, evaporation material when vapor deposition in crucible is evaporated from each nozzle 6 on cover board, is attached to
The surface filming of substrate.
Embodiment one
As shown in FIG. 1 to 3, present embodiments provide a kind of evaporation source detection system, for above-mentioned evaporation source 14 into
Row detection, which includes: mass sensor 11 and spray nozzle clogging degree analyzing unit；Wherein, mass sensitivity
Device 11 is mounted on the top of nozzle 6, and a nozzle corresponds at least one mass sensor 11, and mass sensor 11 is for being deposited
The quality of evaporation material that preceding detection nozzle as corresponding to the mass sensor is sprayed and is attached on the mass sensor；Spray
Mouth chocking-up degree analytical unit is connect with mass sensor 11, and spray nozzle clogging degree analyzing unit is used for according to mass sensor 11
The quality for detecting obtained evaporation material, analyzes the chocking-up degree of nozzle corresponding to the mass sensor.Specifically, due to
The quality of the evaporation material on mass sensor 11 and the chocking-up degree of nozzle 6 corresponding to the mass sensor are attached at anti-
Than, therefore the blocking of respective nozzle 6 can be measured by measuring the quality for the evaporation material being attached on mass sensor 11
Degree, for example, showing that the chocking-up degree of corresponding nozzle 6 is more serious if the quality for the evaporation material that detection obtains is smaller.
Before being deposited, sprays and adhere to by the detection of mass sensor 11 nozzle as corresponding to the mass sensor
The quality of evaporation material on the mass sensor, and the evaporation material that detection is obtained using spray nozzle clogging degree analyzing unit
Quality analyzed, determine respective nozzle 6 chocking-up degree, so as to according to the chocking-up degree of nozzle 6 to respective nozzle 6 carry out
The processing such as cleaning, replacement, thus ensure that the evaporation material that nozzle 6 corresponding to substrate each region sprays amount is identical or base
This is identical, and the uniformity being deposited in this way to the thicknesses of layers of substrate is also guaranteed.In each nozzle 6 in compared with the prior art
The technical solution being deposited in the case that chocking-up degree is inconsistent, technical solution provided by the present invention due to understanding in time
The stopping state of each nozzle 6 makes it possible to handle respective nozzle 6 in time, to ensure that vapor deposition to substrate
The uniformity of thicknesses of layers.
It should be noted that " chocking-up degree " mentioned in the present embodiment follows the vapor deposition on mass sensor 11
The variation of the amount of material and change, the two is inversely.That is, the evaporation material being attached on mass sensor 11
Amount is fewer, and " chocking-up degree " of respective nozzle is bigger；The amount for being attached to the evaporation material of mass sensor 11 is more, respective nozzle
" chocking-up degree " it is smaller.
The scheme of the quality of the evaporation material of nozzle 6 is attached to based on the detection of above-mentioned mass sensor 11, it is real for convenience
When understand nozzle 6 chocking-up degree, avoid the damage due to mass sensor 11 and interrupt to the evaporation material for being attached to nozzle 6
Quality detection, it is preferred that as shown in figure 3, at least one mass sensor can be correspondingly arranged in the top of each nozzle 6
11.Mass sensor 11 forms quartz crystal microbalance (Quartz Crystal Microbalance, abbreviation in the present embodiment
QCM), the shape of quartz crystal microbalance can be to be round or linear, specifically can be identical as the shape of evaporation source.
The quality that obtained film layer is deposited is not only related with the chocking-up degree of nozzle when vapor deposition, also and in crucible when vapor deposition
Temperature and pressure, the relating to parameters such as clean-up performance in vacuum chamber, therefore, in order to further improve above-mentioned evaporation source detection system
The performance of system, the present invention make evaporation source detection system on the basis of evaporation source detection system provided by the above embodiment
It is further improved, specific as follows:
As shown in figure 4, evaporation source detection system provided by the present embodiment may also include crucible temperature regulation unit and more
A thermocouple 9.Multiple thermocouples 9 are arranged in a one-to-one correspondence with each nozzle 6, and each thermocouple 9 is inserted into crucible by corresponding nozzle 6
Inside 5, thermocouple 9 before being deposited for detecting the temperature of 5 interior zone of crucible below corresponding nozzle 6.Crucible temperature
Regulation unit is connect with multiple thermocouples 9, and crucible temperature regulates and controls under unit corresponding nozzle according to detected by multiple thermocouples 9
The temperature of the crucible interior zone of side, regulates and controls the temperature inside crucible 5, keeps the temperature of 5 inside each region of crucible equal
Reach temperature required for vapor deposition, guarantees the temperature uniformity of each region before vapor deposition inside crucible 5, avoid due to earthenware
The temperature of 5 inside each region of crucible is inconsistent, and the amount for the evaporation material for causing the different zones from crucible 5 to evaporate is inconsistent,
And then influence the thickness uniformity being deposited to the film layer on substrate.
It is not only critically important to the regulation of 5 internal temperature of crucible before being deposited, to the tune of the pressure of 5 interior zone of crucible
Control is also extremely important, if the pressure of 5 inside each region of crucible is inconsistent, it will cause evaporate from the different zones of crucible 5
The amount of evaporation material out is different, to influence to be deposited the thickness uniformity of the film layer on substrate.Therefore, as shown in figure 5,
Multiple pressure-measuring devices 10 can be set in the top of each nozzle 6 correspondingly, pressure-measuring device 10 is used for before being deposited
Detect the pressure of 5 interior zone of crucible of 6 lower section of corresponding nozzle.It is corresponding, what setting was connect with multiple pressure-measuring devices 10
Pressure controlling unit, pressure controlling unit is inside the crucible of each 6 lower section of nozzle according to detected by multiple pressure-measuring devices 10
Areal pressure regulates and controls the pressure inside crucible 5, reaches the pressure of 5 inside each region of crucible required for vapor deposition
Pressure.
During vapor deposition, with the extension of evaporation time, the external dimensions of crucible also can be with reduction, therefore passes through inspection
The variation for surveying the external dimensions of crucible, can analyze the deformation extent for obtaining crucible, to be analyzed according to the deformation extent of crucible
The service life of crucible out, to be maintained or replaced in time to the biggish crucible of deformation extent.The change of crucible in order to obtain
Shape degree.As shown in fig. 6, it is optional, laser scanner 13 can be installed in the inside of vacuum chamber, which is used for
The external dimensions of crucible 5 during scanning vapor deposition.It is corresponding, the crucible deformation analysis list connecting with laser scanner 13 is set
Member, crucible deformation analysis unit are used to obtain the external dimensions that laser scanner 13 scans, and according to the outside scanned
The deformation extent of dimension analysis crucible 5, specifically, when the external dimensions for the crucible 5 that scanning obtains is compared to earthenware when being not used
When the reduction amount of the external dimensions of crucible 5 exceeds the threshold value of reduction amount, then show that the deformation extent of crucible 5 is larger.Preferably, in order to
The deformation extent for monitoring crucible 5 in time, can be such that laser scanner 13 is periodically scanned to the external dimensions of crucible 5.
As shown in fig. 7, during vapor deposition, it may occur that the intrinsic bonding state of evaporation material ruptures, and is formed other
Bonding state, or the phenomenon that crystallize into other materials, this phenomenon is known as the denaturation of evaporation material.Evaporation material is denaturalized not
Vacuum chamber 20 can be only polluted, and vapor deposition can be made to be contaminated to film layer on substrate.In order to avoid the above problem, need
Judge whether the evaporation material volatilized out of evaporation source 14 is denaturalized, in order to determine whether replacement vapor deposition according to judging result
Material.Optionally, residual gas analyzer 15 can be installed in vacuum chamber 20, residual gas analyzer 15 is for detecting vapor deposition
Gas component in vacuum chamber 20 in the process, and judge that the evaporation material volatilized out of evaporation source 14 is according to gas component
No denaturation.
As shown in figure 8, during vapor deposition, it is easy to attachment evaporation material 16 on cover board 17, evaporation material 16 is excessive
Accumulation can pollute cover board 17, and then be easy to cause the pollution of the nozzle 6 on cover board 17, indirectly influence vapor deposition
Film quality on to substrate.For this problem, electric feedthrough 18 can be installed in the side of cover board 17, electric feedthrough 18 and cover board are clear
Clean degree analyzing unit connection, cover board clean-up performance analytical unit are used to detect the resistance value of vapor deposition process cover plate 17, and root
According to the clean-up performance of resistance value analysis cover board 17, specifically, set if detecting that the resistance value of cover board 17 is more than or less than
Threshold value, then need to cover board 17 carry out cleaning.
As shown in figure 9, can preferably install filter in vacuum chamber 20 to detect the clean-up performance in vacuum chamber 20
Net 19, the preferred mountable inside in vacuum chamber 20 of strainer 19, the upper end of strainer 19 is equipped with opening, disperse during vapor deposition
Evaporation material particle to strainer 19 is fallen into strainer 19 by the opening of 19 upper end of strainer, and partial size is greater than 19 grid ruler of strainer
Very little evaporation material particle can stay in strainer 19, by measurement strainer 19 institute collected evaporation material particle size with/
Or quantity, it can judge the clean-up performance inside vacuum chamber 20.Specifically, if collected evaporation material particle grain
Diameter is greater than the threshold value of setting, shows that the clean-up performance of vacuum chamber 20 is lower, then can vacuum chamber 20 be cleared up or be safeguarded.
In addition, different evaporation materials require also to be different to the clean-up performance of vacuum chamber 20, need to adjust the hole of strainer 19 at this time
Diameter size, to guarantee that the clean-up performance in vacuum chamber 20 reaches different evaporation materials to the clean-up performance of vacuum chamber 20 not
With requirement.And set 19 quantity of strainer is not limited to one, in order to preferably collect disperse in vacuum chamber 20
Multiple strainers 19 can be arranged in the different location inside vacuum chamber 20 in the evaporation material particle of different zones.
In order to detect the clean-up performance in vacuum chamber 20, preferably optical scanner can be installed inside vacuum chamber 20
Instrument, optical scanner are used to scan the internal environment of vacuum chamber 20 during vapor deposition, and generate associated picture, the image recording
There are the size information and distribution situation information of evaporation material particle of the disperse inside vacuum chamber 20.Correspondingly, setting and light
The vacuum chamber clean-up performance analytical unit of scanner connection is learned, the vacuum chamber clean-up performance analytical unit is for obtaining vapor deposition
The size information and distribution situation information of material granule, and according to the size information of evaporation material particle and distribution situation information point
Analyse the clean-up performance inside vacuum chamber.Specifically, showing true if the partial size of evaporation material particle is greater than the threshold value of setting
Clean-up performance decline inside plenum chamber 20, needs that vacuum chamber 20 is cleared up or safeguarded at this time, is required with meeting vapor deposition；If
The distribution density of evaporation material particle is greater than the threshold value of setting, then shows the clean-up performance decline inside vacuum chamber 20, at this time
Vacuum chamber 20 need to be cleared up or be safeguarded, be required with meeting vapor deposition.
The temperature of evaporation source is not only influenced by above-mentioned crucible temperature, also will receive adding positioned at the outside of crucible wall
The influence of hot device.For example, it is non-constant to will cause being heated for crucible if the temperature fluctuation of heater is larger during vapor deposition, this
Sample not only influences the evaporation rate of the evaporation material inside crucible, causes the film quality being deposited on substrate poor, but also meeting
The service life of heater and crucible is caused to decline.Based on this thought, need to detect the temperature variations of heater, and by
During vapor deposition, the temperature of heater can be increased with the raising of the resistance value of heater, when the resistance value of heater
After stablizing in a certain range, the temperature of heater can also be stablized in a certain range, therefore pass through the resistance of detection heater
Value changes the temperature variations that heater just can be obtained, and then can make to heat by the regulation of the resistance value to heater
The temperature of device is stablized in a certain range.As shown in Figure 10, it is preferred that resistance meter 21 can be installed in one end of heater 7,
Resistance meter 21 is used to detect the resistance value of heater 7 during vapor deposition, and obtains the variation feelings of the resistance value of heater 7
Condition.Correspondingly, the heater resistance regulation unit that setting is connect with resistance meter 21, heater resistance regulation unit is for obtaining
Resistance meter 21 is taken to detect the situation of change of obtained resistance value, and according to the situation of change of resistance value to the electricity of heater 7
Resistance is regulated and controled, and keeps the resistance value of heater 7 in a certain range, so that the temperature of heater 7 be made to be maintained at certain model
In enclosing.
The temperature of evaporation source is not only influenced by above-mentioned crucible temperature, also will receive positioned at the cold of the outside of crucible bottom
But the influence of plate.Based on this thought, as shown in figure 11, in order to avoid the change dramatically of the temperature of coldplate 8 causes evaporation source
The variation of temperature, so cause evaporation source service life reduce the problem of, it is preferred that thermometer 22 can be installed on coldplate 8,
Thermometer 22 is used to detect the temperature of the coldplate 8 during vapor deposition.Correspondingly, the coldplate temperature that setting is connect with thermometer 22
Degree regulation unit, coldplate temperature regulation unit are used to obtain temperature detected by thermometer 22, and according to temperature to cooling
The temperature of plate 8 is regulated and controled, and so that the temperature of coldplate 8 is reached temperature required for vapor deposition, and keep constant or substantially constant, with
8 temperature change dramatically of coldplate is damaged caused by evaporation source and is preferably minimized.
Embodiment two
A kind of evaporation source detection method is present embodiments provided, which is suitable for the evaporation of embodiment one
Source detection system, as shown in Figures 1 to 3, the evaporation source detection method include: using mass sensor 11 to carry out that preceding detection is deposited
The quality of evaporation material that the nozzle as corresponding to the mass sensor is sprayed and is attached on the mass sensor；Utilize nozzle
The quality for the evaporation material that chocking-up degree analytical unit is obtained according to detection, analyzes nozzle 6 corresponding to the mass sensor
Chocking-up degree.
The nozzle 6 as corresponding to the quality of evaporation material being attached on mass sensor 11 and the mass sensor
Chocking-up degree is in inverse ratio, therefore can be by analyzing the Quality estimation of the evaporation material quality being attached on mass sensor 11
The degree of congestion of nozzle 6 corresponding to sensor, so that the nozzle 6 more serious to degree of congestion is cleaned or replaced etc.
Reason guarantees that the amount of the evaporation material sprayed during vapor deposition from each nozzle 6 is consistent, to guarantee the film being deposited on substrate
Thickness degree uniformity.
As shown in figure 4, evaporation source detection method provided in this embodiment further include: using thermocouple 9 before being deposited
Detect the temperature of 5 interior zone of crucible of each 6 lower section of nozzle；The temperature obtained using crucible temperature regulation unit according to detection
Temperature inside crucible 5 is regulated and controled, the temperature of 5 inside each region of crucible is made to reach temperature required for vapor deposition.
Due to being regulated and controled before being deposited to the temperature of crucible 5, the crucible 5 during vapor deposition ensure that
The temperature of internal each region reaches temperature required for vapor deposition, optimizes evaporation process.
As shown in figure 5, evaporation source detection method provided in this embodiment further include: steamed using pressure-measuring device 10
The pressure of crucible interior zone before plating below each nozzle of detection；The pressure pair obtained using pressure controlling unit according to detection
Pressure in crucible is regulated and controled, and the pressure of each region inside crucible is made to reach pressure required for vapor deposition.
Due to being regulated and controled before being deposited to the pressure of crucible, ensure that during vapor deposition in crucible
The pressure of portion each region reaches pressure required for vapor deposition, optimizes evaporation process.
As shown in fig. 6, evaporation source detection method provided in this embodiment further include: using laser scanner in vapor deposition process
The external dimensions of middle scanning crucible 5；Utilize the change for the external dimensions analysis crucible 5 that crucible deformation analysis unit is obtained according to scanning
Shape degree.
By being detected during vapor deposition to the external dimensions of crucible 5, changed according to the external dimensions of crucible 5 come pre-
The deformation extent of crucible 5 is surveyed, so that crucible 5 more serious to deformation extent in time is safeguarded or replaced.
As shown in fig. 7, evaporation source detection method provided in this embodiment further include: be deposited using residual gas analyzer
The gas component in vacuum chamber 20 is detected in the process, judges to volatilize out of evaporation source 14 according to the gas component that detection obtains
Evaporation material whether be denaturalized.
By the gas component of evaporation material of the analysis disperse in vacuum chamber 20, judge to volatilize out of evaporation source 14
Evaporation material whether be denaturalized, in order to determined whether according to judging result replace evaporation material.
As shown in figure 8, evaporation source detection method provided in this embodiment further include: utilize cover board clean-up performance analytical unit
The resistance value that cover board is detected during vapor deposition, according to the clean-up performance for the resistance value analysis cover board that detection obtains.
By measuring the resistance value of cover board 17 during vapor deposition, the clean-up performance of cover board 17 is analyzed using resistance value, with
Convenient for cover board 17 is cleared up or is safeguarded in time.
As shown in figure 9, evaporation source detection method further include: be greater than or equal to using partial size during the acquisition vapor deposition of strainer 19
The evaporation material particle of setting value, so as to according to cleaning journey inside collected evaporation material grading analysis vacuum chamber 20
Degree.
By utilizing strainer 19 to acquire the evaporation material particle that partial size is greater than or equal to setting value, judgement during vapor deposition
Clean-up performance in vacuum chamber 20, in order to which vacuum chamber 20 is cleared up or safeguarded in time.
Evaporation source detection method provided in this embodiment further include: scan vacuum during vapor deposition using optical scanner
The internal environment of chamber, and associated picture is generated, which has evaporation material of the disperse inside the vacuum chamber
The size information and distribution situation information of grain；Using vacuum chamber clean-up performance analytical unit according to the vapor deposition inside vacuum chamber
The size information and the clean-up performance inside distribution situation information analysis vacuum chamber of material granule.
By scanning the internal environment of vacuum chamber during vapor deposition, record has vapor deposition of the disperse inside vacuum chamber
The size information and distribution situation information of material granule, judge the indoor clean-up performance of vacuum chamber, in order in time to vacuum chamber
It is cleared up or is safeguarded in room.
As shown in Figure 10, evaporation source detection method provided in this embodiment further include: be deposited using resistance meter
The resistance value of testing heater 7 in journey, obtains the situation of change of 7 resistance value of heater；Regulate and control unit root using heater resistance
According to the resistance value of the situation of change regulation heater 7 of obtained resistance value, the resistance value of heater 7 is made to be maintained at a certain range
Within.
By regulating and controlling the resistance value of heater 7 during vapor deposition, guarantee that the resistance value of heater 7 is kept constant or substantially
Constant, guarantee crucible heating temperature is kept constant or substantially constant, while guaranteeing that the evaporation rate of evaporation material is maintained at certain model
In enclosing.
As shown in figure 11, evaporation source detection method provided in this embodiment further include: using thermometer during vapor deposition
Detect the temperature of coldplate 8；It is adjusted using coldplate temperature regulation unit according to temperature of the temperature detected to coldplate 8
Control makes the temperature of coldplate 8 reach temperature required for vapor deposition.
By detecting the temperature of coldplate 8 during vapor deposition, and the temperature of coldplate 8 is regulated and controled, to guarantee
The temperature of coldplate 8 reaches temperature required for vapor deposition, for evaporation source provides constant or substantially invariable cooling temperature.
Embodiment three
A kind of evaporated device is present embodiments provided, which includes vacuum chamber, is set to inside vacuum chamber
Evaporation source, and the evaporation source detection system as described in embodiment one, which is used to carry out evaporation source
Detection, so that the component for being included to evaporation source or vacuum chamber according to testing result safeguarded accordingly, replace, regulate and control
Operation achievees the purpose that optimize evaporation process.
The foregoing is merely a specific embodiment of the invention, but scope of protection of the present invention is not limited thereto, any
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by those familiar with the art, all answers
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be with the scope of protection of the claims
It is quasi-.
Claims (21)
1. a kind of evaporation source detection system, which is characterized in that the evaporation source detection system includes:
The mass sensor being set to above the nozzle of evaporation source, a nozzle correspond at least one described mass sensor, institute
Mass sensor is stated to spray for detecting the nozzle as corresponding to the mass sensor before being deposited and be attached to the quality
The quality of evaporation material on sensor；
The spray nozzle clogging degree analyzing unit connecting with the mass sensor, the spray nozzle clogging degree analyzing unit is according to institute
The quality for stating the evaporation material that mass sensor detects analyzes the blocking journey of nozzle corresponding to the mass sensor
Degree；
The evaporation source detection system further include: be mounted on the indoor residual gas analysis of same vacuum chamber with the evaporation source
Instrument, the indoor gas component of vacuum chamber during the residual gas analyzer is deposited for detection, and according to described true
The indoor gas component of cavity judges whether the evaporation material volatilized out of described evaporation source is denaturalized.
2. evaporation source detection system according to claim 1, which is characterized in that the top of each nozzle of the evaporation source
It is correspondingly arranged at least one described mass sensor.
3. evaporation source detection system according to claim 1 or 2, which is characterized in that the mass sensor composition quartz
Crystal microbalance.
4. evaporation source detection system according to claim 1, which is characterized in that the evaporation source detection system further include:
The multiple thermocouples being arranged in a one-to-one correspondence with each nozzle of the evaporation source, each thermocouple pass through corresponding nozzle
It is inserted into inside the crucible of the evaporation source, the thermocouple is used to detect before being deposited in the crucible below corresponding nozzle
The temperature in portion region；
The crucible temperature regulation unit connecting with the multiple thermocouple, the crucible temperature regulation unit are used for according to the heat
The temperature of crucible interior zone below each nozzle detected by galvanic couple, regulates and controls the temperature inside the crucible, makes
The temperature of each region reaches temperature required for vapor deposition inside the crucible.
5. evaporation source detection system according to claim 1, which is characterized in that the evaporation source detection system further include:
The multiple pressure-measuring devices being set to above each nozzle of the evaporation source correspondingly, the pressure-measuring device are used for
The pressure of the crucible interior zone below corresponding nozzle is detected before being deposited；
The pressure controlling unit connecting with the multiple pressure-measuring device, the pressure controlling unit are used to be surveyed according to the pressure
The pressure for measuring the crucible interior zone below each nozzle detected by instrument, regulates and controls the pressure inside the crucible, makes
The pressure of each region reaches pressure required for vapor deposition inside the crucible.
6. evaporation source detection system according to claim 1, which is characterized in that the evaporation source detection system further include:
The laser scanner being mounted on outside vacuum chamber locating for the evaporation source, the laser scanner were deposited for scanning
The external dimensions of the crucible of evaporation source in journey；
The crucible deformation analysis unit connecting with the laser scanner, the crucible deformation analysis unit are used to be swashed according to described
Photoscanner scans the external dimensions of crucible, analyzes the deformation extent of the crucible.
7. evaporation source detection system according to claim 1, which is characterized in that the evaporation source detection system further include:
It is mounted on the electric feedthrough of the cover board side of the evaporation source；
The cover board clean-up performance analytical unit connecting with the electric feedthrough, the cover board clean-up performance analytical unit are steamed for detecting
The resistance value of cover board described in plating process analyzes the clean-up performance of the cover board.
8. evaporation source detection system according to claim 1, which is characterized in that the evaporation source detection system further include:
It is mounted on the indoor strainer of same vacuum chamber with the evaporation source, the strainer is greater than or waits for partial size during acquiring vapor deposition
In the evaporation material particle of setting value.
9. evaporation source detection system according to claim 1, which is characterized in that the evaporation source detection system further include:
It is mounted on the indoor optical scanner of same vacuum chamber with the evaporation source, the optical scanner was deposited for scanning
The internal environment of vacuum chamber described in journey, generating includes that disperse is believed in the partial size of the indoor evaporation material particle of the vacuum chamber
The image of breath and distribution situation information；
The vacuum chamber clean-up performance analytical unit connecting with the optical scanner, the vacuum chamber clean-up performance analysis are single
Member analyzes the indoor clean-up performance of the vacuum chamber according to optical scanner image generated.
10. evaporation source detection system according to claim 1, which is characterized in that the evaporation source detection system further include:
The resistance meter being connected with the heater of the evaporation source, the resistance meter are described in the process for detecting vapor deposition
The resistance value of heater, and obtain the situation of change of the heater resistance value；
The heater resistance regulation unit connecting with the resistance meter, the heater resistance regulation unit add according to described
The situation of change of resistance value detected by hot device regulates and controls the resistance of the heater, makes the resistance of the heater
It is maintained within a certain range.
11. evaporation source detection system according to claim 1, which is characterized in that the evaporation source detection system further include:
The thermometer being connected with the coldplate of the evaporation source, the thermometer is for detecting coldplate during vapor deposition
Temperature；
The coldplate temperature regulation unit connecting with the thermometer, the coldplate temperature regulation unit is according to the thermometer
The temperature of detected coldplate regulates and controls the temperature of the coldplate, and the temperature of the coldplate is made to reach vapor deposition
Required temperature.
12. a kind of evaporation source detection method, which is characterized in that the evaporation source detection method includes:
The quality of the evaporation material sprayed by the nozzle of evaporation source is detected before being deposited；
According to the quality that detection obtains, the chocking-up degree of respective nozzle is determined；
The evaporation source detection method further include: the indoor gas group of vacuum chamber locating for evaporation source is detected during vapor deposition
Point, judge whether the evaporation material volatilized out of evaporation source is denaturalized according to the gas component detected.
13. evaporation source detection method according to claim 12, which is characterized in that the evaporation source detection method is also wrapped
It includes:
The temperature of the crucible interior zone in evaporation source below each nozzle is detected before being deposited；
The temperature inside the crucible is regulated and controled according to the temperature that detection obtains, makes the temperature of each region inside the crucible
Degree reaches temperature required for vapor deposition.
14. evaporation source detection method according to claim 12, which is characterized in that the evaporation source detection method is also wrapped
It includes:
The pressure of the crucible interior zone in evaporation source below each nozzle is detected before being deposited；
The pressure inside the crucible is regulated and controled according to the pressure that detection obtains, makes the pressure of each region inside the crucible
Power reaches pressure required for vapor deposition.
15. evaporation source detection method according to claim 12, which is characterized in that the evaporation source detection method is also wrapped
It includes:
The external dimensions of the crucible of evaporation source is scanned during vapor deposition；
The external dimensions of the crucible obtained according to scanning analyzes the deformation extent of the crucible.
16. evaporation source detection method according to claim 12, which is characterized in that the evaporation source detection method is also wrapped
It includes: detecting the resistance value of the cover board of evaporation source during vapor deposition, the clear of the cover board is analyzed according to the resistance value that detection obtains
Clean degree.
17. evaporation source detection method according to claim 12, which is characterized in that the evaporation source detection method is also wrapped
Include: partial size is greater than or equal to the evaporation material particle of setting value during acquisition vapor deposition, so as to according to the collected vapor deposition material of institute
Expect the indoor clean-up performance of vacuum chamber locating for grading analysis evaporation source.
18. evaporation source detection method according to claim 12, which is characterized in that the evaporation source detection method is also wrapped
It includes:
The internal environment that vacuum chamber locating for evaporation source is scanned during vapor deposition, generating includes disperse in the vacuum chamber
The size information of interior evaporation material particle and the image of distribution situation information；
According to the indoor clean-up performance of vacuum chamber described in the image analysis for retouching instrument generation.
19. evaporation source detection method according to claim 12, which is characterized in that the evaporation source detection method is also wrapped
It includes:
The resistance value that the heater of evaporation source is detected during vapor deposition, obtains the situation of change of the resistance value of the heater；
The situation of change of the resistance value obtained according to detection regulates and controls the resistance value of the heater, makes the resistance value of the heater
It is maintained within a certain range.
20. evaporation source detection method according to claim 12, which is characterized in that the evaporation source detection method is also wrapped
It includes:
The temperature of the coldplate of evaporation source is detected during vapor deposition；
The temperature of the coldplate is regulated and controled according to the temperature that detection obtains, the temperature of the coldplate is made to reach vapor deposition institute
The temperature needed.
21. a kind of evaporated device, including vacuum chamber, and it is set to the evaporation source inside the vacuum chamber, which is characterized in that
The evaporated device further includes evaporation source detection system as claimed in any one of claims 1 to 11, the evaporation source detection system
System is for detecting the evaporation source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610326878.3A CN107365960B (en) | 2016-05-13 | 2016-05-13 | Evaporation source detection system and detection method, evaporated device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610326878.3A CN107365960B (en) | 2016-05-13 | 2016-05-13 | Evaporation source detection system and detection method, evaporated device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107365960A CN107365960A (en) | 2017-11-21 |
| CN107365960B true CN107365960B (en) | 2019-04-30 |
Family
ID=60303726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610326878.3A Active CN107365960B (en) | 2016-05-13 | 2016-05-13 | Evaporation source detection system and detection method, evaporated device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107365960B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107955936A (en) * | 2017-12-28 | 2018-04-24 | 深圳市华星光电半导体显示技术有限公司 | Evaporation source and evaporated device |
| CN109868452B (en) * | 2019-03-19 | 2021-01-01 | 武汉华星光电半导体显示技术有限公司 | Cooling plate and vacuum evaporation device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1714287A (en) * | 2002-11-26 | 2005-12-28 | 东京毅力科创株式会社 | Plasma processing system and method |
| KR20100118314A (en) * | 2009-04-28 | 2010-11-05 | 주식회사 선익시스템 | Vacuum evaporation apparatus and vacuum evaporation method |
| CN101962750A (en) * | 2009-07-24 | 2011-02-02 | 株式会社日立高新技术 | Vacuum deposition method and device thereof |
| CN203741404U (en) * | 2014-03-11 | 2014-07-30 | 京东方科技集团股份有限公司 | Evaporation equipment having function of detecting residual gas |
| CN103966553A (en) * | 2013-01-30 | 2014-08-06 | 三星显示有限公司 | Thin film evaporation device and thin film evaporation method using same |
| CN105112856A (en) * | 2015-04-30 | 2015-12-02 | 京东方科技集团股份有限公司 | Evaporation source, evaporation device and evaporation method |
-
2016
- 2016-05-13 CN CN201610326878.3A patent/CN107365960B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1714287A (en) * | 2002-11-26 | 2005-12-28 | 东京毅力科创株式会社 | Plasma processing system and method |
| KR20100118314A (en) * | 2009-04-28 | 2010-11-05 | 주식회사 선익시스템 | Vacuum evaporation apparatus and vacuum evaporation method |
| CN101962750A (en) * | 2009-07-24 | 2011-02-02 | 株式会社日立高新技术 | Vacuum deposition method and device thereof |
| CN103966553A (en) * | 2013-01-30 | 2014-08-06 | 三星显示有限公司 | Thin film evaporation device and thin film evaporation method using same |
| CN203741404U (en) * | 2014-03-11 | 2014-07-30 | 京东方科技集团股份有限公司 | Evaporation equipment having function of detecting residual gas |
| CN105112856A (en) * | 2015-04-30 | 2015-12-02 | 京东方科技集团股份有限公司 | Evaporation source, evaporation device and evaporation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107365960A (en) | 2017-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107365960B (en) | Evaporation source detection system and detection method, evaporated device | |
| KR101210035B1 (en) | Vacuum evaporation coating method and device thereof | |
| JP5949252B2 (en) | Sample preparation apparatus and sample preparation method for MALDI | |
| DE112011103266T5 (en) | Etch-resistant coating on sensor wafers for in situ measurements | |
| JP2007502519A (en) | Sensor array for measuring plasma characteristics in plasma process environments | |
| KR20080061666A (en) | Apparatus and method for depositing organic film on substrate | |
| US20070298159A1 (en) | Organic evaporator, coating installation, and method for use thereof | |
| CN109596959A (en) | Life determining method, film thickness measuring device, film build method, film formation device and the electronic device manufacturing method of crystal oscillator | |
| DE112016004462B4 (en) | Position deviation detection device, gas epitaxy device and position deviation detection method | |
| KR20130105349A (en) | Evaporation source apparatus, vacuum deposition apparatus, and method of manufacturing organic el display device | |
| KR20240040063A (en) | Thin film deposition apparatus | |
| KR102399202B1 (en) | How to determine the surface temperature | |
| CN117821923B (en) | Baking and heating control method for vacuum coating machine | |
| TW200913346A (en) | Crucible heating apparatus and deposition apparatus including the same | |
| CN103805956B (en) | A kind of original position pattern and optical performance monitor evaporation source and vacuum sediment equipment | |
| JP2006111926A (en) | Vapor deposition system | |
| Wu et al. | Applications of lockin-thermography methods | |
| CN107300733A (en) | COA substrates and COA substrate color blocking layer thickness detection methods | |
| CN205246559U (en) | Tellurium zinc cadmium wafer corrodes quick image device of appearance | |
| CN207713814U (en) | Plasma enhanced chemical vapor deposition equipment | |
| CN207243986U (en) | Vacuum coating equipment | |
| CN202968676U (en) | Linear evaporation source device | |
| TWI624556B (en) | Detection element and measurement assembly for measuring a deposition rate and method thereof | |
| WO2002103333A1 (en) | Method of high throughput haze screening of material | |
| KR102572354B1 (en) | Monitoring system for evapoporation process and method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 230013 Southwest District of Hefei City, Anhui Province Patentee after: Hefei xinyihua Intelligent Machine Co.,Ltd. Address before: 230013 Southwest District of Hefei City, Anhui Province Patentee before: HEFEI SINEVA INTELLIGENT MACHINE Co.,Ltd. |