CN107365478A - A kind of electronic package material of radiation-screening and its preparation method and application - Google Patents

A kind of electronic package material of radiation-screening and its preparation method and application Download PDF

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Publication number
CN107365478A
CN107365478A CN201710720322.7A CN201710720322A CN107365478A CN 107365478 A CN107365478 A CN 107365478A CN 201710720322 A CN201710720322 A CN 201710720322A CN 107365478 A CN107365478 A CN 107365478A
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parts
electronic package
package material
radiation
heated
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季燎原
张浩杰
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/52—Amino carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/21—Urea; Derivatives thereof, e.g. biuret
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The invention discloses a kind of electronic package material of radiation-screening and its preparation method and application, the electronic package material, include according to the raw material of parts by weight：45 55 parts of epoxy resin, 21 29 parts of fatty amine, 60 70 parts of montmorillonite, 12 20 parts of ethylenediamine tetra-acetic acid, 13 21 parts of ethynylcyclohexanol, 7 15 parts of fenuron, 37 parts of allyl glycidyl ether.The present invention is had the characteristics that thermal coefficient of expansion is small, thermal conductivity factor is high, ageing-resistant and fine corrosion resistance, easy processing, good insulating, is also had extremely excellent alpha ray shield performance using electronic package material made from above-mentioned raw materials and technique.Raw material of the present invention is simple, and preparation process is simple, reduces energy consumption, reduces preparation cost, suitable for large-scale promotion.

Description

A kind of electronic package material of radiation-screening and its preparation method and application
Technical field
The present invention relates to electronic package material field, the electronic package material of specifically a kind of radiation-screening and its preparation side Method and application.
Background technology
Electronic Packaging is exactly to install the shell of integrated circuit built-in chip external application, plays placement fixing seal, and protection is integrated Circuit built-in chip, the ability that enhancing environment adapts to, and riveting point i.e. contact on IC chip, are welded onto envelope On the pin of tubulature shell.Many electronic package materials are all plastics, ceramics.Plastics radiation resistance is poor, heavy dose of The reaction such as aging, degraded easily occurs under rate x ray irradiation x, and thermal coefficient of expansion is big, it is poor with chip matching.Ceramics are originally Body has the advantages such as radiation resistance is good, mechanical strength is high, chemical resistance and thermal coefficient of expansion are low, is a kind of excellent Electronic package material.But ceramics hardly have radiation shield performance, it is necessary to be modified to it so as to effectively improve encapsulation Radiation protection performance of the material to chip.It has been found that a kind of novel seal material, epoxide resin material, uses epoxy resin Pure colloid encapsulation, for other materials, sealing property is more preferable, and for some specific apparatus, can directly be embedded to soil Middle utilization, and will not degenerate, but it hardly has radiation shield performance.The electronics member to be worked in high-energy particle radiation environment Part, produce ionisation effect and damage chip, cause the performance degradation of integrated circuit, cause logic function mistake even completely permanent Property damage, so as to cause electronic component global failure.Radiation shield can effectively improve the radiation hardness grade of electronic device and chip. But existing screen method exist single shielding material, thick and heavy, processing difficulties, it is poisonous the shortcomings of.Existing material anti-radiation Can poor, complex process, cost height, low yield.
The content of the invention
It is an object of the invention to provide a kind of electronic package material of radiation-screening and its preparation method and application, with solution The problem of being proposed in certainly above-mentioned background technology.
To achieve the above object, the present invention provides following technical scheme：
A kind of electronic package material of radiation-screening, includes according to the raw material of parts by weight：Epoxy resin 45-55 parts, fat Amine 21-29 parts, montmorillonite 60-70 parts, ethylenediamine tetra-acetic acid 12-20 parts, ethynylcyclohexanol 13-21 parts, fenuron 7-15 parts, Allyl glycidyl ether 3-7 parts.
As the further scheme of the present invention：The electronic package material of the radiation-screening, according to the raw material bag of parts by weight Include：Epoxy resin 48-52 parts, fatty amine 23-27 parts, montmorillonite 62-68 parts, ethylenediamine tetra-acetic acid 14-18 parts, acetenyl hexamethylene Alcohol 15-19 parts, fenuron 9-13 parts, allyl glycidyl ether 4-6 parts.
As the further scheme of the present invention：The electronic package material of the radiation-screening, according to the raw material bag of parts by weight Include：50 parts of epoxy resin, 25 parts of fatty amine, 65 parts of montmorillonite, 16 parts of ethylenediamine tetra-acetic acid, 17 parts of ethynylcyclohexanol, non-grass Grand 11 parts, 5 parts of allyl glycidyl ether.
A kind of preparation method of the electronic package material of radiation-screening, comprises the following steps：
1) deionized water of 6-7 times of fatty amine and its quality is mixed, fatty amine aqueous solution is made；Then montmorillonite is crushed 100-150 mesh sieves are crossed, and are mixed with fatty amine aqueous solution, heating is heated to 72-75 DEG C, and stir process 45- at such a temperature 60min, allyl glycidyl ether is then added, be heated to 85-90 DEG C and at such a temperature stir process 30-40min, then Mixture A is made；
2) epoxy resin, ethylenediamine tetra-acetic acid, ethynylcyclohexanol, fenuron are mixed into 25-30min, Ran Houjia Heat to 95-100 DEG C and at such a temperature stir process 30-40min, is then heated to 125 DEG C and at such a temperature stir process 55-60min, 145 DEG C and at such a temperature stir process 10-20min are then heated to, mixture B is made；
3) mixture A is mixed with mixture B, carries out supersound process 1.2h, then heated sealed is to 160 DEG C and in the temperature The lower stir process 45-50min of degree, and vacuumized in heating process in heating, then leading to nitrogen makes its pressure be 1.5- 2MPa, 200 DEG C and at such a temperature stir process 1.5h are again heated to, discharge, cool down and produce electronic package material.
As the further scheme of the present invention：In step 1), mixing speed 250-300r/min.
As the further scheme of the present invention：In step 2), mixing speed 200-220r/min.
As the further scheme of the present invention：In step 3), mixing speed 150-180r/min.
As the further scheme of the present invention：In step 3), ultrasonic power 900W.
Another object of the present invention is to provide the application of the electronic package material in the electronic device.
Another object of the present invention is to provide application of the electronic package material in radiation shield equipment.
Compared with prior art, the beneficial effects of the invention are as follows：
The present invention has that thermal coefficient of expansion is small, thermal conductivity factor using electronic package material made from above-mentioned raw materials and technique The features such as high, ageing-resistant and fine corrosion resistance, easy processing, good insulating, also there is extremely excellent alpha ray shield performance.This hair Bright raw material is simple, and preparation process is simple, reduces energy consumption, reduces preparation cost, suitable for large-scale promotion.
Embodiment
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, Obviously, described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Based in the present invention Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all Belong to the scope of protection of the invention.
Embodiment 1
In the embodiment of the present invention, a kind of electronic package material of radiation-screening, include according to the raw material of parts by weight：Asphalt mixtures modified by epoxy resin Fat 45kg, fatty amine 21kg, montmorillonite 60kg, ethylenediamine tetra-acetic acid 12kg, ethynylcyclohexanol 13kg, fenuron 7kg, allyl Base glycidol ether 3kg.
6 times of deionized water of fatty amine and its quality is mixed, fatty amine aqueous solution is made；Then montmorillonite crushed 100 mesh sieves, and mixed with fatty amine aqueous solution, heating is heated to 72 DEG C, and is stirred at such a temperature with 250r/min mixing speed Processing 45min is mixed, then adds allyl glycidyl ether, is heated to 85 DEG C and at such a temperature with 250r/min stirring speed Stir process 30min is spent, mixture A is then made.Epoxy resin, ethylenediamine tetra-acetic acid, ethynylcyclohexanol, fenuron are mixed Stirring 25min is closed, is then heated to 95 DEG C and at such a temperature with 200r/min mixing speed stir process 30min, then Be heated to 125 DEG C and at such a temperature with 200r/min mixing speed stir process 55min, be then heated to 145 DEG C and At this temperature with 200r/min mixing speed stir process 10min, mixture B is made.Mixture A is mixed with mixture B, Supersound process 1.2h, ultrasonic power 900W are carried out, then heated sealed to 160 DEG C and at such a temperature stirring with 150r/min Speed stir process 45min is mixed, and is vacuumized in heating process in heating, then leading to nitrogen makes its pressure be 1.5MPa, It is again heated to 200 DEG C and at such a temperature with 150r/min mixing speed stir process 1.5h, discharges, cools down and produce electronic seal Package material.
Embodiment 2
In the embodiment of the present invention, a kind of electronic package material of radiation-screening, include according to the raw material of parts by weight：Asphalt mixtures modified by epoxy resin Fat 55kg, fatty amine 29kg, montmorillonite 70kg, ethylenediamine tetra-acetic acid 20kg, ethynylcyclohexanol 21kg, fenuron 15kg, alkene Propyl glycidyl ether 7kg.
7 times of deionized water of fatty amine and its quality is mixed, fatty amine aqueous solution is made；Then montmorillonite crushed 150 mesh sieves, and mixed with fatty amine aqueous solution, heating is heated to 75 DEG C, and is stirred at such a temperature with 300r/min mixing speed Processing 60min is mixed, then adds allyl glycidyl ether, is heated to 90 DEG C and at such a temperature with 300r/min stirring speed Stir process 40min is spent, mixture A is then made.Epoxy resin, ethylenediamine tetra-acetic acid, ethynylcyclohexanol, fenuron are mixed Stirring 30min is closed, is then heated to 100 DEG C and at such a temperature with 220r/min mixing speed stir process 40min, then Be heated to 125 DEG C and at such a temperature with 220r/min mixing speed stir process 60min, be then heated to 145 DEG C and At this temperature with 220r/min mixing speed stir process 20min, mixture B is made.Mixture A is mixed with mixture B, Supersound process 1.2h, ultrasonic power 900W are carried out, then heated sealed to 160 DEG C and at such a temperature stirring with 180r/min Speed stir process 50min is mixed, and is vacuumized in heating process in heating, then leading to nitrogen makes its pressure be 2MPa, then It is heated to 200 DEG C and at such a temperature with 180r/min mixing speed stir process 1.5h, discharges, cools down and produce Electronic Packaging Material.
Embodiment 3
In the embodiment of the present invention, a kind of electronic package material of radiation-screening, include according to the raw material of parts by weight：Asphalt mixtures modified by epoxy resin Fat 48kg, fatty amine 23kg, montmorillonite 62kg, ethylenediamine tetra-acetic acid 14kg, ethynylcyclohexanol 15kg, fenuron 9kg, allyl Base glycidol ether 4kg.
6.5 times of deionized water of fatty amine and its quality is mixed, fatty amine aqueous solution is made；Then montmorillonite crushed 120 mesh sieves, and mixed with fatty amine aqueous solution, heating is heated to 74 DEG C, and is stirred at such a temperature with 280r/min mixing speed Processing 50min is mixed, then adds allyl glycidyl ether, is heated to 88 DEG C and at such a temperature with 280r/min stirring speed Stir process 35min is spent, mixture A is then made.Epoxy resin, ethylenediamine tetra-acetic acid, ethynylcyclohexanol, fenuron are mixed Stirring 28min is closed, is then heated to 98 DEG C and at such a temperature with 210r/min mixing speed stir process 35min, then Be heated to 125 DEG C and at such a temperature with 210r/min mixing speed stir process 58min, be then heated to 145 DEG C and At this temperature with 210r/min mixing speed stir process 15min, mixture B is made.Mixture A is mixed with mixture B, Supersound process 1.2h, ultrasonic power 900W are carried out, then heated sealed to 160 DEG C and at such a temperature stirring with 160r/min Speed stir process 48min is mixed, and is vacuumized in heating process in heating, then leading to nitrogen makes its pressure be 1.8MPa, It is again heated to 200 DEG C and at such a temperature with 160r/min mixing speed stir process 1.5h, discharges, cools down and produce electronic seal Package material.
Embodiment 4
In the embodiment of the present invention, a kind of electronic package material of radiation-screening, include according to the raw material of parts by weight：Asphalt mixtures modified by epoxy resin Fat 52kg, fatty amine 27kg, montmorillonite 68kg, ethylenediamine tetra-acetic acid 18kg, ethynylcyclohexanol 19kg, fenuron 13kg, alkene Propyl glycidyl ether 6kg.
6.5 times of deionized water of fatty amine and its quality is mixed, fatty amine aqueous solution is made；Then montmorillonite crushed 120 mesh sieves, and mixed with fatty amine aqueous solution, heating is heated to 74 DEG C, and is stirred at such a temperature with 280r/min mixing speed Processing 50min is mixed, then adds allyl glycidyl ether, is heated to 88 DEG C and at such a temperature with 280r/min stirring speed Stir process 35min is spent, mixture A is then made.Epoxy resin, ethylenediamine tetra-acetic acid, ethynylcyclohexanol, fenuron are mixed Stirring 28min is closed, is then heated to 98 DEG C and at such a temperature with 210r/min mixing speed stir process 35min, then Be heated to 125 DEG C and at such a temperature with 210r/min mixing speed stir process 58min, be then heated to 145 DEG C and At this temperature with 210r/min mixing speed stir process 15min, mixture B is made.Mixture A is mixed with mixture B, Supersound process 1.2h, ultrasonic power 900W are carried out, then heated sealed to 160 DEG C and at such a temperature stirring with 160r/min Speed stir process 48min is mixed, and is vacuumized in heating process in heating, then leading to nitrogen makes its pressure be 1.8MPa, It is again heated to 200 DEG C and at such a temperature with 160r/min mixing speed stir process 1.5h, discharges, cools down and produce electronic seal Package material.
Embodiment 5
In the embodiment of the present invention, a kind of electronic package material of radiation-screening, include according to the raw material of parts by weight：Asphalt mixtures modified by epoxy resin Fat 50kg, fatty amine 25kg, montmorillonite 65kg, ethylenediamine tetra-acetic acid 16kg, ethynylcyclohexanol 17kg, fenuron 11kg, alkene Propyl glycidyl ether 5kg.
6.5 times of deionized water of fatty amine and its quality is mixed, fatty amine aqueous solution is made；Then montmorillonite crushed 120 mesh sieves, and mixed with fatty amine aqueous solution, heating is heated to 74 DEG C, and is stirred at such a temperature with 280r/min mixing speed Processing 50min is mixed, then adds allyl glycidyl ether, is heated to 88 DEG C and at such a temperature with 280r/min stirring speed Stir process 35min is spent, mixture A is then made.Epoxy resin, ethylenediamine tetra-acetic acid, ethynylcyclohexanol, fenuron are mixed Stirring 28min is closed, is then heated to 98 DEG C and at such a temperature with 210r/min mixing speed stir process 35min, then Be heated to 125 DEG C and at such a temperature with 210r/min mixing speed stir process 58min, be then heated to 145 DEG C and At this temperature with 210r/min mixing speed stir process 15min, mixture B is made.Mixture A is mixed with mixture B, Supersound process 1.2h, ultrasonic power 900W are carried out, then heated sealed to 160 DEG C and at such a temperature stirring with 160r/min Speed stir process 48min is mixed, and is vacuumized in heating process in heating, then leading to nitrogen makes its pressure be 1.8MPa, It is again heated to 200 DEG C and at such a temperature with 160r/min mixing speed stir process 1.5h, discharges, cools down and produce electronic seal Package material.
Comparative example 1
All raw materials are directly mixed, carry out supersound process 1.2h, ultrasonic power 900W, then heated sealed to 160 DEG C and at such a temperature with 160r/min mixing speed stir process 48min, and in heating process while heating while vacuumize, Then leading to nitrogen makes its pressure be 1.8MPa, is again heated to 200 DEG C and is stirred at such a temperature with 160r/min mixing speed 1.5h is handled, discharged, cooled down and produce electronic package material.And material quality is consistent with embodiment 5.
Using Co-60 radioactive sources as irradiation bomb, the shielding properties of electronic package material is tested.Test result such as table 1 It is shown：
Table 1
Radiation shield performance can be significantly improved using electronic package material made from present invention process.
Also the thermal coefficient of expansion and thermal conductivity of electronic package material are measured, as a result as shown in table 2.
Table 2
Thermal coefficient of expansion (* 10-6K-1/ room temperature) Thermal conductivity (Wm-1·K-1/ room temperature)
Embodiment 1 6.2 148
Embodiment 2 6.1 150
Embodiment 3 5.7 152
Embodiment 4 5.5 153
Embodiment 5 5.2 155
Comparative example 1 8.5 141
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling Change is included in the present invention.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art It is appreciated that other embodiment.

Claims (10)

1. a kind of electronic package material of radiation-screening, it is characterised in that include according to the raw material of parts by weight：Epoxy resin 45- 55 parts, fatty amine 21-29 parts, montmorillonite 60-70 parts, ethylenediamine tetra-acetic acid 12-20 parts, ethynylcyclohexanol 13-21 parts, non-grass Grand 7-15 parts, allyl glycidyl ether 3-7 parts.
2. the electronic package material of radiation-screening according to claim 1, it is characterised in that according to the raw material bag of parts by weight Include：Epoxy resin 48-52 parts, fatty amine 23-27 parts, montmorillonite 62-68 parts, ethylenediamine tetra-acetic acid 14-18 parts, acetenyl hexamethylene Alcohol 15-19 parts, fenuron 9-13 parts, allyl glycidyl ether 4-6 parts.
3. the electronic package material of radiation-screening according to claim 1, it is characterised in that according to the raw material bag of parts by weight Include：50 parts of epoxy resin, 25 parts of fatty amine, 65 parts of montmorillonite, 16 parts of ethylenediamine tetra-acetic acid, 17 parts of ethynylcyclohexanol, non-grass Grand 11 parts, 5 parts of allyl glycidyl ether.
A kind of 4. preparation method of the electronic package material of radiation-screening as described in claim 1-3 is any, it is characterised in that Comprise the following steps：
1) deionized water of 6-7 times of fatty amine and its quality is mixed, fatty amine aqueous solution is made；Then montmorillonite crushed 100-150 mesh sieves, and mixed with fatty amine aqueous solution, heating is heated to 72-75 DEG C, and stir process 45- at such a temperature 60min, allyl glycidyl ether is then added, be heated to 85-90 DEG C and at such a temperature stir process 30-40min, then Mixture A is made；
2) epoxy resin, ethylenediamine tetra-acetic acid, ethynylcyclohexanol, fenuron are mixed into 25-30min, are then heated to 95-100 DEG C and stir process 30-40min at such a temperature, it is then heated to 125 DEG C and at such a temperature stir process 55- 60min, 145 DEG C and at such a temperature stir process 10-20min are then heated to, mixture B is made；
3) mixture A is mixed with mixture B, carries out supersound process 1.2h, then heated sealed is to 160 DEG C and at such a temperature Stir process 45-50min, and vacuumized in heating process in heating, then leading to nitrogen makes its pressure be 1.5-2MPa, then 200 DEG C and at such a temperature stir process 1.5h are heated to, discharged, cooled down and produce electronic package material.
5. the preparation method of the electronic package material of radiation-screening according to claim 4, it is characterised in that step 1) In, mixing speed 250-300r/min.
6. the preparation method of the electronic package material of radiation-screening according to claim 4, it is characterised in that step 2) In, mixing speed 200-220r/min.
7. the preparation method of the electronic package material of radiation-screening according to claim 4, it is characterised in that step 3) In, mixing speed 150-180r/min.
8. the preparation method of the electronic package material of radiation-screening according to claim 4, it is characterised in that step 3) In, ultrasonic power 900W.
9. the application of electronic package material in the electronic device as described in claim 1-3 is any.
10. application of the electronic package material as described in claim 1-3 is any in radiation shield equipment.
CN201710720322.7A 2017-08-21 2017-08-21 A kind of electronic package material of radiation-screening and its preparation method and application Pending CN107365478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710720322.7A CN107365478A (en) 2017-08-21 2017-08-21 A kind of electronic package material of radiation-screening and its preparation method and application

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Application Number Priority Date Filing Date Title
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1528852A (en) * 2003-09-26 2004-09-15 中国科学院广州化学研究所 Epoxy plastic cement and preparing method thereof
CN105936739A (en) * 2016-06-21 2016-09-14 阜阳市光普照明科技有限公司 Thermal conductive, optically focusing, and room temperature cured modified epoxy resin adhesive for encapsulating chips of LED plant growth lamps

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1528852A (en) * 2003-09-26 2004-09-15 中国科学院广州化学研究所 Epoxy plastic cement and preparing method thereof
CN105936739A (en) * 2016-06-21 2016-09-14 阜阳市光普照明科技有限公司 Thermal conductive, optically focusing, and room temperature cured modified epoxy resin adhesive for encapsulating chips of LED plant growth lamps

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
韩硕: "碳化硅/环氧树脂电子封装材料的研究", 《中国优秀硕士学位论文全文数据库 信息科技辑》 *

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