CN107317080A - Inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate - Google Patents
Inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate Download PDFInfo
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- CN107317080A CN107317080A CN201710451332.5A CN201710451332A CN107317080A CN 107317080 A CN107317080 A CN 107317080A CN 201710451332 A CN201710451332 A CN 201710451332A CN 107317080 A CN107317080 A CN 107317080A
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- dielectric
- microstrip line
- slab
- top layer
- gap waveguide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
- H01P3/082—Multilayer dielectric
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Abstract
The present invention relates to a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate, the micro-strip wire encapsulation construction is by top layer dielectric-slab（1）With underlying dielectric plate（2）Two layer medium plate bonding is formed.Top layer dielectric-slab（1）Upper surface be printed with metal level, and in dielectric-slab（1）On have periodicity metallic vias（3）；Underlying dielectric plate（2）Upper surface is printed with square metal paster（4）, microstrip line is provided with centre position（5）, its lower surface is printed with ground metal layer.The present invention is encapsulated using the dielectric-slab of low cost to microstrip line, solve the Cost Problems of microstrip line encapsulation, and there are problems that radiation loss, plane wave and cavity resonance in conventional microstrip line, simultaneously have the advantages that simple in construction, size it is small, with it is wide, be lost low and Stability Analysis of Structures, it is easier to it is integrated, assembling and process.
Description
Technical field
The present invention relates to electronic technology field, and in particular to a kind of inexpensive microstrip line based on the integrated gap waveguide of substrate
Encapsulation.
Background technology
Microstrip line is a kind of transmission line for transmitting microwave signal, and it is widely used in many fields.With gold
Category waveguide is compared, and microstrip line has that small volume, lightweight, working band be wide, reliability is high and the low characteristic of manufacturing cost.But
Be, conventional microstrip line there are problems that radiation loss, surface wave and.
The integrated gap waveguide of substrate（Substrate Integrated Gap Waveguide, SIGW）, can effectively press down
Space radiation processed and surface wave.Due to the integrated gap waveguide of substrate（SIGW）Middle transmission is quasi- TEM ripples, when itself and microstrip line collection
Cheng Shi, is just not present patten transformation loss.The integrated gap waveguide of substrate（SIGW）Clearance layer is used as using dielectric-slab, it is ensured that steady
Fixed clearance height, overcomes gap waveguide（GW）The problem of being difficult to ensure that continuous the air gap height.
Recently it is based on the integrated gap waveguide of substrate（SIGW）Encapsulation technology to conventional microstrip line is suggested, but it is used
Dielectric-slab high expensive, and it is higher to requirement on machining accuracy.So so that the integrated gap waveguide of substrate（SIGW）The application of technology
Receive larger limitation.
The present invention is based on the integrated gap waveguide of substrate（SIGW）Carry out microstrip line encapsulation, it is real using the dielectric-slab of two layers of low cost
Now to the encapsulation of microstrip line, while the assembling of two layer medium plate can be screwed, can also be by being adhesively fixed on one
Rise.The present invention realizes encapsulation of the low cost to conventional microstrip line, while space radiation and surface wave can be suppressed, and can be real
Existing high transmission performance, low cost, it is easily assembled circuit design with small size.
Present invention, by literature search, has no and discloses report with identical of the present invention.
The content of the invention
It is an object of the invention to overcome the deficiency of prior art, design a kind of based on the low of the integrated gap waveguide of substrate
Cost microstrip line is encapsulated.
Including：Top layer dielectric-slab（1）With underlying dielectric plate（2）, wherein：
A, top layer dielectric-slab（1）Upper surface be printed with metal level, in top layer dielectric-slab（1）On be equipped with periodicity metallic vias
（3）；
B, underlying dielectric plate（2）Upper surface is printed with periodicity square metal paster（4）, periodicity square metal paster（4）Position
In periodicity metallic vias（3）Underface；Periodicity metallic vias（3）With periodicity square metal paster（4）Constitute together
Mushroom-shaped electro-magnetic bandgap（EBG）In structure；Dielectric-slab（2）Lower surface be printed with metal level；Transmit microstrip line（5）It is printed on Jie
Scutum（2）The centre position of upper surface, and with periodicity square metal paster（4）No overlap；
C, it is described it is a kind of based on the integrated gap waveguide of substrate inexpensive microstrip line encapsulation two layer medium plate dielectric constant and
Thickness is different, and two layer medium plate can be fixed together by bonding or screw；
D, a kind of top layer dielectric-slab of the inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate（1）With underlying dielectric
Plate（2）Width is identical, but length is different；Underlying dielectric plate（2）Than top layer dielectric-slab（1）Length it is slightly longer, it is certain to expose
The microstrip line of length, is easy to test.
As described above, the inexpensive microstrip line encapsulation top layer dielectric-slab based on the integrated gap waveguide of substrate（1）Cheap FR4
Dielectric-slab or Rogers 4350B, and underlying dielectric plate（2）Use cheap Rogers 4003C dielectric-slabs.
As described above, the inexpensive microstrip line encapsulation top layer dielectric-slab based on the integrated gap waveguide of substrate（1）Thickness ratio
Underlying dielectric plate（2）Thickness will thickness, to reduce conduction loss, reduction space radiation and surface wave obtain wider bandwidth.
As described above, the inexpensive microstrip line encapsulation increase underlying dielectric plate based on the integrated gap waveguide of substrate（2）Thickness
Degree can reduce the high-frequency cut-off frequency of microstrip line；When underlying dielectric plate（2）Thickness it is smaller when, increase underlying dielectric plate（2）'s
Thickness will increase the low-frequency cut-off frequency of microstrip line；When underlying dielectric plate（2）Thickness increase to a certain extent after, with bottom
Dielectric-slab（2）Thickness increase, the low-frequency cut-off frequency of microstrip line will no longer change.
The inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate, adjusts top layer dielectric-slab as described above（1）With
Underlying dielectric plate（2）Dielectric constant can realize make the microstrip line encapsulate bandwidth of operation be changed；Increase top layer dielectric-slab
（1）Dielectric constant, will reduce microstrip line high-frequency cut-off frequency；Increase underlying dielectric plate（2）Dielectric constant, will be reduced simultaneously
The high-frequency cut-off frequency and low-frequency cut-off frequency of microstrip line.
As described above, the inexpensive microstrip line based on the integrated gap waveguide of substrate is encapsulated to underlying dielectric plate（2）Loss
Angle tangent requires higher, need to the small dielectric-slab of selection loss angle tangent, but to top layer dielectric-slab as far as possible（1）Loss angle tangent will
Ask not high, the dielectric-slab of less expensive relatively lossy may be selected, to reduce cost.
As described above, the inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate employs square metal paster（4）,
In equal area（I.e. inductance is identical）Under, square patch has smaller size than circular patch, can so effectively reduce two
Individual square metal paster（4）There is broader gap between unit, so as to preferably arrangement microstrip line.
As described above, the new integrated gap waveguide transmission Quasi-TEM mode of substrate, is conducive to and the microstrip line of TEM mode
It is integrated, patten transformation loss when reducing integrated.
As described above, the inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate is constituted only with two layer medium plate
The integrated gap waveguide structure of substrate, the dielectric-slab for using the micro-strip wire encapsulation construction is minimized, advantageously reduces dielectric-slab and disappears
Consumption and ease of assembly.
As described above, the inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate is different from conventional gap waveguide（GW）
Clearance layer be air, the clearance layer of the micro-strip wire encapsulation construction is underlying dielectric plate（1）, so as to there is a stable gap high
Degree.
As described above, the inexpensive microstrip line encapsulation top layer dielectric-slab based on the integrated gap waveguide of substrate（1）With cycle mistake
Hole（3）And square metal paster（4）Constitute perfect magnetic conductor（Perfect magnetic conductor, PMC）Layer, effectively
Space radiation loss is reduced, it is suppressed that plane wave, while the problem of solving air resonance.
The present invention compared with prior art, has the following advantages that：
1st, radiation loss is solved in the encapsulation of conventional microstrip line and the problem of plane wave；
2nd, with small size, low section is easy of integration, easy processing；
3rd, Stability Analysis of Structures, transmission performance is good；
4th, with wider working band.
Brief description of the drawings
The overall structure figure that Fig. 1 encapsulates for the microstrip line of the integrated gap waveguide of the inexpensive substrate of the present invention.
The top layer dielectric-slab upper surface figure that Fig. 2 encapsulates for the microstrip line of the integrated gap waveguide of the inexpensive substrate of the present invention.
The top layer dielectric-slab lower surface figure that Fig. 3 encapsulates for the microstrip line of the integrated gap waveguide of the inexpensive substrate of the present invention.
The underlying dielectric plate upper surface figure that Fig. 4 encapsulates for the microstrip line of the integrated gap waveguide of the inexpensive substrate of the present invention.
The underlying dielectric plate lower surface figure that Fig. 5 encapsulates for the microstrip line of the integrated gap waveguide of the inexpensive substrate of the present invention.
Fig. 6 uses Rogers for the microstrip line encapsulation top layer dielectric-slab of the integrated gap waveguide of the inexpensive substrate of the present invention
40350B S11 and S21 test chart.
Embodiment
Technical scheme is described in further detail with reference to embodiment.
As Figure 1-5, a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate, including：Top layer medium
Plate（1）, underlying dielectric plate（2）, wherein：
A, top layer dielectric-slab（1）Upper surface be printed with metal level, in top layer dielectric-slab（1）On be equipped with periodicity metallic vias
（3）；
B, underlying dielectric plate（2）Upper surface is printed with periodicity square metal paster（4）, periodicity square metal paster（4）Position
In periodicity metallic vias（3）Underface；Periodicity metallic vias（3）With periodicity square metal paster（4）Constitute together
Mushroom-shaped electro-magnetic bandgap（EBG）In structure；Dielectric-slab（2）Lower surface be printed with metal level；Transmit microstrip line（5）It is printed on Jie
Scutum（2）The centre position of upper surface, and with periodicity square metal paster（4）No overlap；
C, it is described it is a kind of based on the integrated gap waveguide of substrate inexpensive microstrip line encapsulation two layer medium plate dielectric constant and
Thickness is different, and two layer medium plate can be fixed together by bonding or screw；
D, a kind of top layer dielectric-slab of the inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate（1）With underlying dielectric
Plate（2）Width is identical, but length is different；Underlying dielectric plate（2）Than top layer dielectric-slab（1）Length it is slightly longer, it is certain to expose
The microstrip line of length, is easy to test.
As described above, the inexpensive microstrip line encapsulation top layer dielectric-slab based on the integrated gap waveguide of substrate（1）Cheap FR4
Dielectric-slab or Rogers 4350B, and underlying dielectric plate（2）Use cheap Rogers 4003C dielectric-slabs.
As described above, the inexpensive microstrip line encapsulation top layer dielectric-slab based on the integrated gap waveguide of substrate（1）Thickness ratio
Underlying dielectric plate（2）Thickness will thickness, to reduce conduction loss, reduction space radiation and surface wave obtain wider bandwidth.
As described above, the inexpensive microstrip line encapsulation increase underlying dielectric plate based on the integrated gap waveguide of substrate（2）Thickness
Degree can reduce the high-frequency cut-off frequency of microstrip line；When underlying dielectric plate（2）Thickness it is smaller when, increase underlying dielectric plate（2）'s
Thickness will increase the low-frequency cut-off frequency of microstrip line；When underlying dielectric plate（2）Thickness increase to a certain extent after, with bottom
Dielectric-slab（2）Thickness increase, the low-frequency cut-off frequency of microstrip line will no longer change.
The inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate, adjusts top layer dielectric-slab as described above（1）With
Underlying dielectric plate（2）Dielectric constant can realize make the microstrip line encapsulate bandwidth of operation be changed；Increase top layer dielectric-slab
（1）Dielectric constant, will reduce microstrip line high-frequency cut-off frequency；Increase underlying dielectric plate（2）Dielectric constant, will be reduced simultaneously
The high-frequency cut-off frequency and low-frequency cut-off frequency of microstrip line.
As described above, the inexpensive microstrip line based on the integrated gap waveguide of substrate is encapsulated to underlying dielectric plate（2）Loss
Angle tangent requires higher, need to the small dielectric-slab of selection loss angle tangent, but to top layer dielectric-slab as far as possible（1）Loss angle tangent will
Ask not high, the dielectric-slab of less expensive relatively lossy may be selected, to reduce cost.
As described above, the inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate employs square metal paster（4）,
In equal area（I.e. inductance is identical）Under, square patch has smaller size than circular patch, can so effectively reduce two
Individual square metal paster（4）There is broader gap between unit, so as to preferably arrangement microstrip line.
As described above, the new integrated gap waveguide transmission Quasi-TEM mode of substrate, is conducive to and the microstrip line of TEM mode
It is integrated, patten transformation loss when reducing integrated.
As described above, the inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate is constituted only with two layer medium plate
The integrated gap waveguide structure of substrate, the dielectric-slab for using the micro-strip wire encapsulation construction is minimized, advantageously reduces dielectric-slab and disappears
Consumption and ease of assembly.
As described above, the inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate is different from conventional gap waveguide（GW）
Clearance layer be air, the clearance layer of the micro-strip wire encapsulation construction is underlying dielectric plate（1）, so as to there is a stable gap high
Degree.
As described above, the inexpensive microstrip line encapsulation top layer dielectric-slab based on the integrated gap waveguide of substrate（1）With cycle mistake
Hole（3）And square metal paster（4）Constitute perfect magnetic conductor（Perfect magnetic conductor, PMC）Layer, effectively
Space radiation loss is reduced, it is suppressed that plane wave, while the problem of solving air resonance.
Top layer dielectric-slab as described above（1）Two kinds of materials and underlying dielectric plate are respectively adopted（2）Constitute the microstrip line of encapsulation
Structure, top layer dielectric-slab（1）The first material dielectric constant is that the Rogers 40350B that 3.48, loss angle tangent is 0.004 are situated between
Material, size is 27.5mm*21.6*1.524mm；Top layer dielectric-slab（1）Second of material dielectric constant is 4.6, loss angle
0.02 FR4_epoxy dielectric materials are just being cut to, size is 27.5mm*21.6*1.6mm；Underlying dielectric plate（2）It is normal using dielectric
Number is the Rogers 4003C dielectric materials that 3.38, loss angle tangent is 0.0027, and size is 33.3mm*21.6*0.508mm.
Shown in Fig. 6 is top layer dielectric-slab（1）Test result using Rogers 40350B dielectric materials shows, micro-
In ripple and millimeter wave frequency band 6GHz-25GHz, the microstrip line encapsulation of the integrated gap waveguide of novel low-cost substrate of the invention has
S11 is less than -12dB, partly the impedance operator less than -15dB, and S21 is less than -3dB transmission characteristic, the partly transmission less than -2dB
Characteristic；The micro-strip wire encapsulation construction is that a kind of size is small, simple in construction, be easily assembled to, the inexpensive substrate collection that transmission performance is good
Microstrip line into gap waveguide is encapsulated.
The better embodiment to the present invention is explained in detail above, but the present invention is not limited to above-mentioned embodiment party
, can also be on the premise of present inventive concept not be departed from formula, the knowledge that one skilled in the relevant art possesses
Make a variety of changes.
Claims (9)
1. a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate, it is characterised in that including top layer dielectric-slab
（1）, underlying dielectric plate（2）, wherein：
A, top layer dielectric-slab（1）Upper surface be printed with metal level, in top layer dielectric-slab（1）On be equipped with periodicity metallic vias
（3）；
B, underlying dielectric plate（2）Upper surface is printed with periodicity square metal paster（4）, periodicity square metal paster（4）Position
In periodicity metallic vias（3）Underface；Periodicity metallic vias（3）With periodicity square metal paster（4）Constitute together
Mushroom-shaped electro-magnetic bandgap（EBG）In structure；Dielectric-slab（2）Lower surface be printed with metal level；Transmit microstrip line（5）It is printed on Jie
Scutum（2）The centre position of upper surface, and with periodicity square metal paster（4）No overlap；
C, it is described it is a kind of based on the integrated gap waveguide of substrate inexpensive microstrip line encapsulation two layer medium plate dielectric constant and
Thickness is different, and two layer medium plate can be fixed together by bonding or screw；
D, a kind of top layer dielectric-slab of the inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate（1）With underlying dielectric
Plate（2）Width is identical, but length is different；Underlying dielectric plate（2）Than top layer dielectric-slab（1）Length it is slightly longer, it is certain to expose
The microstrip line of length, is easy to test.
2. a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate according to claims 1, its feature
It is：Described top layer dielectric-slab（1）With underlying dielectric plate（2）It is situated between using cheap FR4 or Rogers 4350B or 4003C
Scutum.
3. a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate according to claims 1, its feature
It is：Described top layer dielectric-slab（1）Thickness ratio underlying dielectric plate（2）Thickness will thickness, to reduce conduction loss, reduction is empty
Between radiation and surface wave, obtain wider bandwidth.
4. a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate according to claims 1, its feature
It is：Described increase underlying dielectric plate（2）Thickness can reduce the high-frequency cut-off frequency of microstrip line；When underlying dielectric plate（2）
Thickness it is smaller when, increase underlying dielectric plate（2）Thickness will increase microstrip line low-frequency cut-off frequency；When underlying dielectric plate
（2）Thickness increase to a certain extent after, with underlying dielectric plate（2）Thickness increase, the low-frequency cut-off frequency of microstrip line will
No longer change.
5. a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate according to claims 1, its feature
It is：Adjust top layer dielectric-slab（1）With underlying dielectric plate（2）Dielectric constant can realize make the microstrip line encapsulate bandwidth of operation
It is changed；Increase top layer dielectric-slab（1）Dielectric constant, will reduce microstrip line high-frequency cut-off frequency；Increase underlying dielectric
Plate（2）Dielectric constant, the high-frequency cut-off frequency and low-frequency cut-off frequency of microstrip line will be reduced simultaneously.
6. a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate according to claims 1, its feature
It is：To underlying dielectric plate（2）Loss angle tangent require higher, need to the small dielectric-slab of selection loss angle tangent, but right as far as possible
Top layer dielectric-slab（1）Loss angle tangent it is less demanding, the dielectric-slab of less expensive relatively lossy may be selected, to reduce cost.
7. a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate according to claims 1, its feature
It is：The described micro-strip wire encapsulation construction employs square metal paster（4）, in equal area（I.e. inductance is identical）Under, side
Shape paster has smaller size than circular patch, can so effectively reduce in two square metal pasters（4）Have between unit
Broader gap, so as to preferably arrangement microstrip line.
8. a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate according to claims 1, its feature
It is：The described micro-strip wire encapsulation construction constitutes the integrated gap waveguide structure of substrate only with two layer medium plate, makes the micro-strip
The dielectric-slab that wire encapsulation construction is used is minimized, advantageously reduces dielectric-slab consumption and ease of assembly.
9. a kind of inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate according to claims 1, its feature
It is：Described top layer dielectric-slab（1）Two kinds of materials and underlying dielectric plate are respectively adopted（2）Constitute the microstrip line construction of encapsulation；
Top layer dielectric-slab（1）The Rogers that the dielectric constant of the first material used is 0.004 for 3.48, loss angle tangent
40350B dielectric materials, size is 27.5mm*21.6*1.524mm；Top layer dielectric-slab（1）The dielectric of second of the material used
Constant is the FR4_epoxy dielectric materials that 4.6, loss angle tangent is 0.02, and size is 27.5mm*21.6*1.6mm；Bottom is situated between
Scutum（2）The Rogers 4003C dielectric materials that dielectric constant is 0.0027 for 3.38, loss angle tangent are used, size is
33.3mm*21.6*0.508mm。
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710451332.5A CN107317080A (en) | 2017-06-15 | 2017-06-15 | Inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710451332.5A CN107317080A (en) | 2017-06-15 | 2017-06-15 | Inexpensive microstrip line encapsulation based on the integrated gap waveguide of substrate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108306087A (en) * | 2017-12-06 | 2018-07-20 | 北京交通大学 | A kind of double frequency transmission line and its double frequency leaky-wave antenna |
| CN109216845A (en) * | 2018-10-24 | 2019-01-15 | 云南大学 | A kind of substrate integration groove gap waveguide structure |
| CN110364799A (en) * | 2019-07-15 | 2019-10-22 | 云南大学 | Double ridge integral substrate gap waveguides |
| CN113178670A (en) * | 2021-05-13 | 2021-07-27 | 上海大学 | Novel printed circuit board slow wave transmission line |
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| CN206976548U (en) * | 2017-06-15 | 2018-02-06 | 云南大学 | SIGW low costs microstrip line encapsulates |
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2017
- 2017-06-15 CN CN201710451332.5A patent/CN107317080A/en active Pending
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| CN206976548U (en) * | 2017-06-15 | 2018-02-06 | 云南大学 | SIGW low costs microstrip line encapsulates |
Non-Patent Citations (1)
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| JING ZHANG等: ""Design of Substrate Integrated Gap Waveguide"", 《2016 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS)》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108306087A (en) * | 2017-12-06 | 2018-07-20 | 北京交通大学 | A kind of double frequency transmission line and its double frequency leaky-wave antenna |
| CN108306087B (en) * | 2017-12-06 | 2020-03-31 | 北京交通大学 | Double-frequency transmission line and double-frequency leaky-wave antenna thereof |
| CN109216845A (en) * | 2018-10-24 | 2019-01-15 | 云南大学 | A kind of substrate integration groove gap waveguide structure |
| CN110364799A (en) * | 2019-07-15 | 2019-10-22 | 云南大学 | Double ridge integral substrate gap waveguides |
| CN113178670A (en) * | 2021-05-13 | 2021-07-27 | 上海大学 | Novel printed circuit board slow wave transmission line |
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