CN102694565A - 3D-MCM (three dimension multi-chip module) radio frequency system with integrated snakelike antenna - Google Patents
3D-MCM (three dimension multi-chip module) radio frequency system with integrated snakelike antenna Download PDFInfo
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- CN102694565A CN102694565A CN2012101567528A CN201210156752A CN102694565A CN 102694565 A CN102694565 A CN 102694565A CN 2012101567528 A CN2012101567528 A CN 2012101567528A CN 201210156752 A CN201210156752 A CN 201210156752A CN 102694565 A CN102694565 A CN 102694565A
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Abstract
The invention discloses a 3D-MCM (three dimension multi-chip module) radio frequency system with an integrated snakelike antenna. The 3D-MCM radio frequency system comprises four layers, namely, from top down, a first layer is the snakelike antenna, a second layer is an internal ground metal layer, a third layer is a packaging body and a fourth layer is an external metal ground plate. The 3D-MCM radio frequency system is small in size, wide in frequency bandwidth and high in reliability and is applicable to wireless communication at frequency band around 2.4GHz.
Description
Technical field
The invention belongs to the microwave and millimeter wave communication technical field, relate to 3-D multi-chip assembly 3D-MCM technology and LTCC LTCC technology, relate in particular to a kind of minimized wide-band antenna that is applied to wireless communication system.
Background technology
Modern wireless communication specification requirement radio system develops to miniaturization, high performance, multifunction and low-cost direction.Antenna is as the requisite parts of wireless communication system, must carry out system integration encapsulation with the IC components and parts of specific function, make Wireless Telecom Equipment in light weight, volume is little, function is many.
In the past few years, based on LTCC LTCC technology, make antenna have portable, light, thin, short, little advantage, utilize 3-D multi-chip assembly 3D-MCM technological, it is integrated to be easy to carry out chip, can increase substantially packaging density.But the combine report of the radio system that is used for integrated encapsulation of LTCC antenna technology and 3D-MCM technology is not also had.
The radio system of existing integrated encapsulation is encapsulated in antenna and IC components and parts the same surface of single-layer medium substrate usually, and this makes that the volume of system is bigger, and the coupling between antenna and the IC components and parts is comparatively serious.Some are also arranged is not to be placed on the report that the same surface of medium substrate encapsulates with antenna and IC components and parts; But the IC components and parts are single layer structure; And antenna and encapsulated layer volume are bigger; The bandwidth of antenna is narrower, and can not satisfy the instructions for use of antenna integrated radio system to bluetooth and near Zigbee/802.15.4 technology frequency range 2.4GHz.
Summary of the invention
The objective of the invention is to the problems referred to above; Provide that a kind of volume is little, function is many, the antenna integrated 3D-MCM radio system of stable performance, to satisfy the instructions for use of modern wireless communication systems to bluetooth and near Zigbee/802.15.4 technology frequency range 2.4GHz.
The object of the invention is realized through following technical proposals:
A kind of 3D-MCM radio system of integrated snakelike antenna comprises four layers, is followed successively by from top to bottom, and ground floor is the snakelike antenna of LTCC, and the second layer is inner ground metal layer, and the 3rd layer is packaging body, and the 4th layer is the external metallization ground plate;
The snakelike antenna of said LTCC: it is made up of LTCC substrate (7), 50 ohm of matched lines (5) and snakelike radiating element (6); 50 ohm of matched lines (5) and snakelike radiating element (6) are arranged in LTCC substrate (7) and are in same plane; 50 ohm of matched lines (5) are positioned at the left side of snakelike radiating element (6) and are attached thereto; Snakelike radiating element (6) is one section serpentine structure; Offer vertical through hole (9) in the LTCC substrate (7) under 50 ohm of matched lines (5) left side and be used for antenna feed;
Said inner ground metal layer (2) is positioned at the lower surface of LTCC substrate (7), and be positioned at 50 ohm of matched lines (5) under, and do not have metal in the below of snakelike radiating element (6); Said inner ground metal layer (2) is through realizing at the lower surface coated silver or the copper conductive material of LTCC substrate (7); Offer a holes (10) that communicates with vertical through hole (9) in the said inner ground metal layer (2), be used to antenna the feed passage is provided, the diameter of this holes (10) is greater than the diameter of vertical through hole (9);
The 3rd layer of packaging body: it is by cavity (13) and four package wall: first package wall 151, second package wall 152, the 3rd package wall 153, the 4th package wall 154 constitute; Cavity (13) be positioned at inner ground metal layer (2) under; In cavity (13), adopt the 3D-MCM technology to be integrated with multilayer IC bare chip (14); In four package wall, offer some grounding through hole (12), can ag material in the hole is used for inner ground metal layer (2) is connected with the external metallization ground plate; Also offer a feed through hole (11) in the package wall (151) under vertical through hole (9), the diameter in this hole equals the diameter of vertical through hole (9), is used to realize antenna feed;
The 4th layer of metal ground plate: this metal ground plate is positioned at the below of packaging body, be positioned at inner ground metal layer (2) under, and under snakelike radiating element (6), do not have metal ground plate; Metal micro-strip feeder line 8 is positioned at the upper surface of pcb board 18, is used to realize antenna feed.
It is 2～14 that the 3D-MCM radio system of described integrated snakelike antenna, LTCC substrate (7) and packaging body adopt the relative dielectric constant scope of LTCC pottery.
The 3D-MCM radio system of described integrated snakelike antenna, the distance of 50 ohm of matched lines (5) and snakelike radiating element (6) distance L TCC substrate (7) upper surface is 0～0.2mm, the length SL of 50 ohm of matched lines (5) is 10mm; Width S W is 2～3mm; The length L of snakelike radiating element (6) is 10.2mm, and width W is 5～7mm, and the width W 2 of this serpentine is 0.5mm; Distance between centers of tracks W1 is 0.5mm; The length of LTCC substrate (7) is 20.2mm, and width is than the big 0～0.5mm of width of snakelike radiating element (6), and thickness is 1～1.5mm.
The 3D-MCM radio system of described integrated snakelike antenna, the length FL of packaging body equals the length of LTCC substrate (7), and width FW equals the width of LTCC substrate (7), and thickness F H is 1～1.6mm; 3 package wall: the width FW1 of first package wall (151), second package wall (152), the 3rd package wall (153) is 0.6～1.4mm, and the width FW2 of the 4th package wall (154) is FW1+10.2mm; The height of cavity (13) is 0.9～1.5mm; The size of IC bare chip (14) is less than the size of cavity; The pitch of holes of some grounding through hole (12) is 0.01 λ～0.1 λ, and λ is a free space wavelength.
The 3D-MCM radio system of described integrated snakelike antenna; Said external metallization ground plate is to form the first metal layer (4) and second metal level (17) through the upper and lower electroplating surface layer of metal copper at pcb board (18), and pcb board (18) adopts glass-epoxy FR-4; The first metal layer (4) and second metal level (17) are positioned at the below of packaging body, and be positioned at inner ground metal layer (2) under, and under snakelike radiating element (6), do not have metal; The length GL of the first metal layer (4) and second metal level (17) is 40mm, and width G W is 30mm, and the length of pcb board (18) is 50.2mm, and width is 30mm; Microstrip feed line (8) is one section 50 ohm microstrip, and length is 30.75mm, and width is 1.5mm, and microstrip feed line (8) is S1=S2=0.75mm with the spacing of the first metal layer (4), S3=0.5mm.
The present invention compared with prior art has following remarkable advantage:
(1) the present invention makes the bandwidth of antenna wideer owing to adopt snakelike antenna structure, and the volume of the radio system of integrated this antenna is littler.
(2) the present invention adopts the 3D-MCM technology owing in packaging body, offer internal cavities, and it is integrated to carry out multilayer IC bare chip, makes the volume of system littler, function variation more.
(3) the present invention is owing to be provided with inner ground metal layer between snakelike antenna and packaging body, it can minimize antenna and packaging between unwanted coupling, system reliability is improved.
(4) position and these key factors of quantity of the thickness that the present invention can be through adjustment antenna medium material, package dimension, packaging height, through hole; The resonance point that makes snakelike antenna is near 2.4GHz, and the 3D-MCM radio system of integrated snakelike antenna satisfies the requirement of Modern wireless communication to bluetooth and Zigbee/802.15.4 technology.
Description of drawings
Fig. 1 is the cross-sectional view of system of the present invention;
Fig. 2 is the antenna structure view in the system of the present invention;
Fig. 3 is the encapsulating structure sketch map in the system of the present invention;
Fig. 4 is a metal ground plate surface structure sketch map in the system of the present invention;
Fig. 5 is the analogous diagram that concerns between antenna medium frequency and the reflection loss S11 in the system of the present invention;
Fig. 6 is the E face and the H side gains direction analogous diagram of the antenna in the system of the present invention.
Embodiment
Below in conjunction with specific embodiment, the present invention is elaborated.
With reference to Fig. 1, system of the present invention comprises four layers, and from top to bottom, ground floor is the snakelike antenna of LTCC, and the second layer is inner ground metal layer, and the 3rd layer is packaging body, and the 4th layer is the external metallization ground plate.
The snakelike antenna of ground floor LTCC, its structure is as shown in Figure 2, and it is made up of 7,50 ohm of matched lines 5 of LTCC substrate and snakelike radiating element 6.50 ohm of matched lines 5 link to each other with snakelike radiating element 6 and are in the same plane, and the upper surface of their distance L TCC substrates 7 has certain distance, is used to reduce the influence of environmental change to antenna, and snakelike radiating element 6 is one section serpentine structure.The distance of 50 ohm of matched lines 5 and snakelike radiating element 6 distance L TCC substrates 7 upper surfaces is 0.127mm; The length SL of 50 ohm of matched lines is 10mm; Width S W is 2.85mm, and the length L of snakelike radiating element 6 is 10.2mm, and width W is 6.1mm; The width W 2 of this serpentine is 0.5mm, and distance between centers of tracks W1 is 0.5mm.The length of LTCC substrate 7 is 20.2mm, and width is than the big 0.2mm of width of snakelike radiating element 6, and thickness is 1.27mm.Offer vertical through hole 9 in the LTCC substrate 7 under 50 ohm of matched line 5 left sides, the can ag material is used for antenna feed in the hole, the radius R=0.075mm in this hole.
The inner ground metal layer 2 of the second layer realizes through lower surface coated silver or copper product at LTCC substrate 7, this inside ground metal layer 2 be positioned at 50 ohm of matched lines 5 under, and below snakelike radiating element 6, do not have metal.Owing to there is coupling between antenna and the chip 14, this coupling reduces systematic function, and the effect of metal level 2 is that this coupling is minimized.Offer a holes 10 that communicates with vertical through hole 9 in this inside ground metal layer 2 and for antenna the feed passage is provided, the diameter R=0.075mm of this vertical through hole 9, the radius R=0.3mm of holes 10;
The 3rd layer of packaging body, its structure are like figure, and it is by cavity 13 and four package wall: package wall 151, package wall 152, package wall 153, package wall 154 formations.The length FL of packaging body equals the length of LTCC substrate 7, and width FW equals the width of LTCC substrate 7, and thickness F H is 1.397mm.Cavity 13 be positioned at inner ground metal layer 2 under, the height of cavity is 1.143mm, in cavity 13, adopts the integrated IC bare chip 14 that haves three layers of 3D-MCM technology, the length of this chip is 3mm, width is 3mm, highly is 0.3mm.The width FW1 of 3 package wall 151,152,153 is 0.8mm, and the width FW2 of package wall 154 is 11mm.In four package wall, offer some grounding through hole 12, the radius R=0.075mm in this hole, pitch of holes is 0.01 λ, and λ is a free space wavelength, and can ag material in the hole is used for inner ground metal layer 2 is connected with the external metallization ground plate.Also offer a feed through hole 11 in the package wall 151 under vertical through hole 9, the diameter in this hole equals the diameter of vertical through hole 9, is used to realize antenna feed.
The 4th layer of external metallization ground plate, it is to form metal level 4 and metal level 17 through the upper and lower electroplating surface layer of metal copper at pcb board 18, pcb board 18 adopts glass-epoxy FR-4.Structure such as Fig. 4 of the metal level 4 of its upper surface, the metal level 17 of its lower surface is an all-metal, upper and lower surface metal-layer is positioned at the below of packaging body, be positioned at inner ground metal layer 2 under, and under snakelike radiating element 6, do not have metal.The length GL of metal level 4 and metal level 17 is 40mm, and width G W is 30mm, and the length of pcb board 18 is 50.2mm, and width is 30mm.Metal micro-strip feeder line 8 is positioned at the upper surface of pcb board 18, is used to realize antenna feed, and it is one section 50 ohm microstrip, and length is 30.75mm, and width is 1.5mm, and microstrip feed line 8 is S1=S2=0.75mm with the spacing of metal all around, S3=0.5mm.
Wherein, LTCC substrate 7 is 5.9 with the ceramic relative dielectric constant scope of LTCC that packaging body adopts.
Effect of the present invention can further specify through following emulation:
Adopt electromagnetic field simulation software Ansoft-HFSS preferred embodiment to be carried out emulation, antenna reflection coefficient S11 curve such as Fig. 5 of obtaining, E face and H side gains directional diagram such as Fig. 6.
Fig. 5 shows that the resonance point of antenna is 2.4GHz, and the reflection coefficient at this some place is-35dB that the standing-wave ratio in the 2.257GHz-2.553GHz frequency range is less than 2, it is thus clear that the beamwidth of antenna is about 300M.
Fig. 6 shows that this antenna is omni-directional antenna and in whole working frequency range scope, can obtains fabulous linear polarization.The antenna peak gain is 2.68dBi.
It is thus clear that the integrated package system of this antenna integrated 3D-MCM can satisfy the instructions for use of cordless communication network to bluetooth and near Zigbee/802.15.4 technology frequency range 2.4GHz.
Should be understood that, concerning those of ordinary skills, can improve or conversion, and all these improvement and conversion all should belong to the protection range of accompanying claims of the present invention according to above-mentioned explanation.
Claims (5)
1. the 3D-MCM radio system of an integrated snakelike antenna is characterized in that, comprises four layers, is followed successively by from top to bottom, and ground floor is the snakelike antenna of LTCC, and the second layer is inner ground metal layer, and the 3rd layer is packaging body, and the 4th layer is the external metallization ground plate;
The snakelike antenna of said LTCC: it is made up of LTCC substrate (7), 50 ohm of matched lines (5) and snakelike radiating element (6); 50 ohm of matched lines (5) and snakelike radiating element (6) are arranged in LTCC substrate (7) and are in same plane; 50 ohm of matched lines (5) are positioned at the left side of snakelike radiating element (6) and are attached thereto; Snakelike radiating element (6) is one section serpentine structure; Offer vertical through hole (9) in the LTCC substrate (7) under 50 ohm of matched lines (5) left side and be used for antenna feed;
Said inner ground metal layer (2) is positioned at the lower surface of LTCC substrate (7), and be positioned at 50 ohm of matched lines (5) under, and do not have metal in the below of snakelike radiating element (6); Said inner ground metal layer (2) is through realizing at the lower surface coated silver or the copper conductive material of LTCC substrate (7); Offer a holes (10) that communicates with vertical through hole (9) in the said inner ground metal layer (2), be used to antenna the feed passage is provided, the diameter of this holes (10) is greater than the diameter of vertical through hole (9);
The 3rd layer of packaging body: it is by cavity (13) and four package wall: first package wall 151, second package wall 152, the 3rd package wall 153, the 4th package wall 154 constitute; Cavity (13) be positioned at inner ground metal layer (2) under; In cavity (13), adopt the 3D-MCM technology to be integrated with multilayer IC bare chip (14); In four package wall, offer some grounding through hole (12), can ag material in the hole is used for inner ground metal layer (2) is connected with the external metallization ground plate; Also offer a feed through hole (11) in the package wall (151) under vertical through hole (9), the diameter in this hole equals the diameter of vertical through hole (9), is used to realize antenna feed;
The 4th layer of metal ground plate: this metal ground plate is positioned at the below of packaging body, be positioned at inner ground metal layer (2) under, and under snakelike radiating element (6), do not have metal ground plate; Metal micro-strip feeder line 8 is positioned at the upper surface of pcb board 18, is used to realize antenna feed.
2. the 3D-MCM radio system of integrated snakelike antenna according to claim 1 is characterized in that, it is 2～14 that LTCC substrate (7) and packaging body adopt the relative dielectric constant scope of LTCC pottery.
3. the 3D-MCM radio system of integrated snakelike antenna according to claim 1 is characterized in that, the distance of 50 ohm of matched lines (5) and snakelike radiating element (6) distance L TCC substrate (7) upper surface is 0～0.2mm; The length SL of 50 ohm of matched lines (5) is 10mm, and width S W is 2～3mm, and the length L of snakelike radiating element (6) is 10.2mm; Width W is 5～7mm; The width W 2 of this serpentine is 0.5mm, and distance between centers of tracks W1 is 0.5mm, and the length of LTCC substrate (7) is 20.2mm; Width is than the big 0～0.5mm of width of snakelike radiating element (6), and thickness is 1～1.5mm.
4. the 3D-MCM radio system of integrated snakelike antenna according to claim 1 is characterized in that, the length FL of packaging body equals the length of LTCC substrate (7), and width FW equals the width of LTCC substrate (7), and thickness F H is 1～1.6mm; 3 package wall: the width FW1 of first package wall (151), second package wall (152), the 3rd package wall (153) is 0.6～1.4mm, and the width FW2 of the 4th package wall (154) is FW1+10.2mm; The height of cavity (13) is 0.9～1.5mm; The size of IC bare chip (14) is less than the size of cavity; The pitch of holes of some grounding through hole (12) is 0.01 λ～0.1 λ, and λ is a free space wavelength.
5. the 3D-MCM radio system of integrated snakelike antenna according to claim 1; It is characterized in that; Said external metallization ground plate is to form the first metal layer (4) and second metal level (17) through the upper and lower electroplating surface layer of metal copper at pcb board (18), and pcb board (18) adopts glass-epoxy FR-4; The first metal layer (4) and second metal level (17) are positioned at the below of packaging body, and be positioned at inner ground metal layer (2) under, and under snakelike radiating element (6), do not have metal; The length GL of the first metal layer (4) and second metal level (17) is 40mm, and width G W is 30mm, and the length of pcb board (18) is 50.2mm, and width is 30mm; Microstrip feed line (8) is one section 50 ohm microstrip, and length is 30.75mm, and width is 1.5mm, and microstrip feed line (8) is S1=S2=0.75mm with the spacing of the first metal layer (4), S3=0.5mm.
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| CN103022714A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Amplitude impedance calibrated planar horn antenna |
| CN103066385A (en) * | 2012-12-22 | 2013-04-24 | 西安电子科技大学 | Low temperature co-fired ceramic (LTCC) double-layer microstrip antenna used for system-in-package |
| CN106961166A (en) * | 2017-03-28 | 2017-07-18 | 江苏科技大学 | A kind of parallel RF energy collector of multiple antennas |
| CN106961167A (en) * | 2017-03-28 | 2017-07-18 | 江苏科技大学 | A kind of multiple antennas tandem RF energy collector |
| CN107742780A (en) * | 2017-10-25 | 2018-02-27 | 四川莱源科技有限公司 | A kind of adaptable antenna |
| CN112003008A (en) * | 2020-08-18 | 2020-11-27 | 上海矽杰微电子有限公司 | Miniaturized millimeter wave microstrip antenna |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022714A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Amplitude impedance calibrated planar horn antenna |
| CN103066385A (en) * | 2012-12-22 | 2013-04-24 | 西安电子科技大学 | Low temperature co-fired ceramic (LTCC) double-layer microstrip antenna used for system-in-package |
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| CN106961166A (en) * | 2017-03-28 | 2017-07-18 | 江苏科技大学 | A kind of parallel RF energy collector of multiple antennas |
| CN106961167A (en) * | 2017-03-28 | 2017-07-18 | 江苏科技大学 | A kind of multiple antennas tandem RF energy collector |
| CN107742780A (en) * | 2017-10-25 | 2018-02-27 | 四川莱源科技有限公司 | A kind of adaptable antenna |
| CN112003008A (en) * | 2020-08-18 | 2020-11-27 | 上海矽杰微电子有限公司 | Miniaturized millimeter wave microstrip antenna |
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Application publication date: 20120926 |