CN103066385B - For the LTCC Two--Layer Microstrip Antenna of system in package - Google Patents
For the LTCC Two--Layer Microstrip Antenna of system in package Download PDFInfo
- Publication number
- CN103066385B CN103066385B CN201210595681.1A CN201210595681A CN103066385B CN 103066385 B CN103066385 B CN 103066385B CN 201210595681 A CN201210595681 A CN 201210595681A CN 103066385 B CN103066385 B CN 103066385B
- Authority
- CN
- China
- Prior art keywords
- radiating element
- antenna
- hole
- lower floor
- upper strata
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Waveguide Aerials (AREA)
Abstract
The invention discloses a kind of LTCC Two--Layer Microstrip Antenna for system in package, comprise antenna coating (1), upper strata radiating element (2), intermediate course (3), lower floor's radiating element (4), antenna substrate layer (5), inner ground plate (6), packaging body (7), external ground plate (8) from top to bottom; The present invention compared with prior art, has following remarkable advantage: (1) the present invention adopts 3D-MCM technology, offers cavity in package interior, can built-in IC bare chip, makes that the size of system is less, function is more diversified.(2) the present invention uses at outside ground plate place and entirely designs, thus makes the use restriction do not had spatially of antenna, need not be placed in pcb board corner.(3) the present invention adopts double-layer microstrip-line as radiating element, thus makes antenna while the less lateral dimension of maintenance, obtains 2.35GHz-2.55GHz comparatively large bandwidth.
Description
Technical field
The invention belongs to microwave and millimeter wave communication technical field, relate to antenna technology and System-in-Package technology, particularly relate to the stacked microstrip antenna technology of coaxial feed.
Background technology
Along with popularizing of modern Interior mobile communication equipment, all need little, the lightweight antenna assembly of volume in a lot of application scenario.Microstrip antenna with its thin profile, lightweight, can, easily with the active device advantage such as integrated and become focus that people pay close attention to conformal with carrier, and extensive for fields such as bluetooth, Wireless USB, WIFI.But common single layer microstrip antenna also has its intrinsic shortcoming, and namely impedance bandwidth is narrower, generally only has a few percent, this point limits its practical application.
In the past few years, researchers in order to constantly bring forth new ideas in maintenance antenna comparatively large bandwidth and reduced size.The present invention is exactly by adopting the mode of corner feed and add the mode of Shorted post on Two--Layer Microstrip Antenna, effectively while control antenna height, maintaining the comparatively large bandwidth of antenna, and do not change the polarization mode of antenna.
System-in-Package technology proposed till now from the nineties in 20th century, accepting extensively by academia and industrial quarters, and became one of Main way of electronic technology study hotspot and technology application.By system in package, can as much as possible passive device and small-power active device be imbedded in substrate, be therefore integrated, miniaturized, the microminiaturized effective way of electronic system.
LTCC technology, i.e. LTCC Technology, be the integrated assembly technology attracted people's attention that developed recently gets up, and become the mainstream technology of passive integration.Ceramic substrate can built-in passive component and attachment active device, make passive and active integrated functional module, can further by communication part miniaturization.
Summary of the invention
The comprehensive above-mentioned consideration of the present invention, provide a kind of volume little, be with roomy, can inner integrated IC, realize the LTCC Two--Layer Microstrip Antenna of system in package, to meet the application of the bluetooth of 2.35GHz-2.55GHz frequency range, Wireless USB, WiFi.
The present invention adopts following technical scheme for achieving the above object:
For a LTCC Two--Layer Microstrip Antenna for system in package, comprise antenna coating (1), upper strata radiating element (2), intermediate course (3), lower floor's radiating element (4), antenna substrate layer (5), inner ground plate (6), packaging body (7), external ground plate (8) from top to bottom; The LTCC dielectric material that antenna coating (1) adopts thickness H=0.79mm, dielectric constant is 7.8, the LTCC dielectric material that intermediate course (3) adopts thickness 3.3mm, dielectric constant is 7.8, the LTCC dielectric material that antenna substrate layer (5) adopts thickness 1.03mm, dielectric constant is 7.8; Antenna substrate layer (5) lower surface scribbles silver or gold as inner ground metal level (6); External ground plate (8) adopts dielectric constant to be the pcb board of 4.4, and length is 41mm, and width is 41mm; The characteristic impedance of upper strata radiating element (2) and lower floor's radiating element (4) is 50 Ω, the length of side PL=20.2mm of lower floor's radiating element (2), and the length of side of upper strata radiating element (2) is UPL=17.9mm; Antenna substrate (5) offers the first vertical through hole (9), the second vertical through hole (10); First vertical through hole (9) is respectively L3=10.25mm and L4=12.8mm with the nearest border of antenna substrate (5) and the distance on time nearest border, and the second vertical through hole (10) is respectively L5=12.4mm and L4=12.8mm with the nearest border of substrate and secondary nearest distance.
The described LTCC Two--Layer Microstrip Antenna for system in package, upper strata radiating element (2) and lower floor's radiating element (4) all adopt microstrip line construction, and shape to be upper strata radiating element (2) and the shape of square sheets the be central shaft of lower floor's radiating element (4) of square sheets is not on the same line; Lower floor's radiating element (4) and intermediate course (3) frontier distance L1 are 11.4mm, and upper strata radiating element (2) and intermediate course (3) frontier distance L2=11.55mm.
The described LTCC Two--Layer Microstrip Antenna for system in package, antenna coating (1) thickness H1=0.83mm; Antenna substrate (5) thickness H3=1.32mm; Upper strata radiating element (2) and lower floor's radiating element (4) central shaft are on the same line, upper strata radiating element (2) is L1=13.2mm apart from dielectric layer frontier distance, and lower floor's radiating element (4) is L2=13.9mm apart from dielectric layer frontier distance; The thickness W1=2mm of each package wall of packaging body, on it, through-hole spacing is 0.8mm.
The described LTCC Two--Layer Microstrip Antenna for system in package, inner ground metal level (6) is coated in below antenna substrate (5), for the unwanted coupling between minimize antenna and packaging body (7); First through hole (12) communicated with the first vertical through hole (9) is offered in inner ground metal level (6), the diameter 0.5mm of the first through hole (12), be greater than the diameter 0.25mm of the first vertical through hole (9), for the feed passage as antenna; Second through hole (13) communicated with the first vertical through hole (9) and the first through hole (12) is offered in external ground metal level (8), the diameter 0.5mm of the second through hole (13), for the feed passage as antenna.
The described LTCC Two--Layer Microstrip Antenna for system in package, packaging body (7) comprises four package wall (16), four package wall (16) surround an internal cavities (15), and packaging body (7) is coaxial with lower floor's radiating element (4); Packaging body (7) is highly 4mm, and the length of side is 20.2mm, material to be dielectric constant be 7.8 LTCC dielectric material; The wall thickness of each package wall (16) is 2mm, it has some perforates, and pitch of holes is 1mm; Filling ag material in perforate, for connecting as one external ground plate (8) and lower floor's radiating element (4).
The present invention compared with prior art, has following remarkable advantage:
(1) the present invention adopts 3D-MCM technology, offers cavity in package interior, can built-in IC bare chip, makes that the size of system is less, function is more diversified.
(2) the present invention uses at outside ground plate place and entirely designs, thus makes the use restriction do not had spatially of antenna, need not be placed in pcb board corner.
(3) the present invention adopts double-layer microstrip-line as radiating element, thus makes antenna while the less lateral dimension of maintenance, obtains 2.35GHz-2.55GHz comparatively large bandwidth.
(4) the present invention is owing to being placed in radiating element edge by power feed hole, and another edge adds Shorted post again, significantly reduces the height of antenna, and does not change the linear polarization mode of antenna,
Accompanying drawing explanation
Fig. 1 is the structural representation of present system;
Fig. 2 is the structural representation (vertical view) of the antenna radiation unit in present system;
Fig. 3 is the antenna substrate in present system;
Fig. 4 is interior (outward) portion ground plate schematic diagram (vertical view);
Fig. 5 is the structural representation (vertical view) of present system encapsulated layer;
Fig. 6 is the relation analogous diagram between present system and reflection loss S11;
Fig. 7 is the gain pattern of present system.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.
Embodiment 1
With reference to Fig. 1, present system comprises eight layers, ground floor is antenna coating 1, the second layer is upper strata radiating element 2, and third layer is intermediate course 3, and the 4th layer is lower floor's radiating element 4, layer 5 is antenna substrate layer 5, layer 6 is inner ground plate 6, and layer 7 is packaging body 7, and the 8th layer is external ground plate 8.Wherein: ground floor antenna coating 1 adopt thickness H=0.79mm, dielectric constant be 7.8 LTCC dielectric material form, third layer intermediate course 3 adopt thickness H=3.3mm, dielectric constant be 7.8 LTCC dielectric material form, layer 5 antenna substrate layer 5 adopt thickness H=1.03mm, dielectric constant be 7.8 LTCC dielectric material form.Layer 5 lower surface scribbles silver or gold as inner ground metal level 6; Layer 7 packaging body 7 adopt dielectric constant be 7.8 LTCC material; 8th layer of external ground plate 8 adopt dielectric constant be 4.4 pcb board, length is 41mm, and width is 41mm.
Upper strata radiating element 2 and lower floor's radiating element 4 all adopt microstrip line construction, and shape to be upper strata radiating element 2 and the shape of square sheets the be central shaft of lower floor's radiating element 4 of square sheets is not on the same line.Lower floor's radiating element 4 and intermediate course 3 frontier distance L1 are 11.4mm, and upper strata radiating element 2 and intermediate course 3 frontier distance L2=11.55mm.The characteristic impedance of two-layer radiating element is the length of side PL=20.2mm of 50 Ω, lower floor's radiating element 2, and the length of side of upper strata radiating element 2 is UPL=17.9mm.
The antenna substrate 5 of layer 5, its structure is as Fig. 3, and it offers two vertical through hole 9,10.Vertical through hole 9 is respectively L3=10.25mm and L4=12.8mm with the nearest border of antenna substrate 5 and the distance on time nearest border, and vertical through hole 10 is respectively L5=12.4mm and L4=12.8mm with the nearest border of substrate and secondary nearest distance.
The inner ground metal level 6 of layer 6, as Fig. 4, is coated in below antenna substrate 5, for the unwanted coupling between minimize antenna and packaging body 7.Offer a through hole 12 communicated with vertical through hole 9 in inner ground metal level 6, the diameter 0.5mm of this through hole 12, be greater than the diameter 0.25mm of vertical through hole 9, for the feed passage as antenna.A through hole 13 communicated with vertical through hole 9 and through hole 12 is offered, the diameter 0.5mm of this through hole 13, for the feed passage as antenna in external ground metal level 8.
The packaging body 7 of layer 7, as shown in Figure 5, four package wall 16 surround an internal cavities 15 to its structure, and packaging body 7 is coaxial with lower floor radiating element 4.Packaging body 7 height H 4 is 4mm, and the length of side is PL=20.2mm, material to be dielectric constant be 7.8 LTCC dielectric material.The wall thickness W1 of each package wall is 2mm, it has some perforates, and pitch of holes is 1mm.Filling ag material in through hole, for connecting as one external ground plate 8 and lower floor's radiating element 4.
Embodiment 2
General structure is identical with embodiment 1, and its different parameters is as follows:
Antenna coating 1 thickness H1=0.83mm.
Antenna substrate 5 thickness H3=1.32mm
Square sheets upper strata radiating element and square sheets lower floor radiating element adopt coaxial design, central shaft on the same line, namely upper strata radiating element 2 is L1=13.2mm apart from intermediate course 3 frontier distance, and lower floor's radiating element 4 is L2=13.9mm apart from intermediate course 3 frontier distance.
The thickness W1=2mm of each package wall of packaging body, on it, through-hole spacing is 0.8mm.
Adopt this example can change the resonance frequency of antenna.
Effect of the present invention can be further illustrated by following emulation:
Adopt electromagnetic field simulation software Ansoft-HFSS to emulate embodiment 1, the antenna reflection coefficient S11 curve obtained is as Fig. 6, and antenna pattern is as Fig. 7.
Fig. 6 shows, the resonance point of antenna is 2.4GHz, and the reflection coefficient at this some place is-21.4613dB, is less than-10db at the reflection coefficient of 2.35GHz-2.55GHz frequency range.
Fig. 7 is the antenna pattern of antenna.
Visible, the LTCC Two--Layer Microstrip Antenna that this collection can be used for system in package can meet the instructions for uses of field in 2.35GHz-2.55GHz bandwidth such as bluetooth, Wireless USB, WIFI.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (1)
1. the LTCC Two--Layer Microstrip Antenna for system in package, it is characterized in that, comprise antenna coating (1), upper strata radiating element (2), intermediate course (3), lower floor's radiating element (4), antenna substrate layer (5), inner ground plate (6), packaging body (7), external ground plate (8) from top to bottom; The LTCC dielectric material that antenna coating (1) adopts thickness H=0.79mm, dielectric constant is 7.8, the LTCC dielectric material that intermediate course (3) adopts thickness 3.3mm, dielectric constant is 7.8, the LTCC dielectric material that antenna substrate layer (5) adopts thickness 1.03mm, dielectric constant is 7.8; Antenna substrate layer (5) lower surface scribbles silver or gold as inner ground metal level (6); External ground plate (8) adopts dielectric constant to be the pcb board of 4.4, and length is 41mm, and width is 41mm; The characteristic impedance of upper strata radiating element (2) and lower floor's radiating element (4) is 50 Ω, the length of side PL=20.2mm of lower floor's radiating element (2), and the length of side of upper strata radiating element (2) is UPL=17.9mm; Antenna substrate (5) offers the first vertical through hole (9), the second vertical through hole (10); First vertical through hole (9) is respectively L3=10.25mm and L4=12.8mm with the nearest border of antenna substrate (5) and the distance on time nearest border, and the second vertical through hole (10) is respectively L5=12.4mm and L4=12.8mm with the nearest border of substrate and secondary nearest distance;
Upper strata radiating element (2) and lower floor's radiating element (4) all adopt microstrip line construction, and shape to be upper strata radiating element (2) and the shape of square sheets the be central shaft of lower floor's radiating element (4) of square sheets is not on the same line; Lower floor's radiating element (4) and intermediate course (3) frontier distance L1 are 11.4mm, and upper strata radiating element (2) and intermediate course (3) frontier distance L2=11.55mm;
Antenna coating (1) thickness H1=0.83mm; Antenna substrate (5) thickness H3=1.32mm; Upper strata radiating element (2) and lower floor's radiating element (4) central shaft are on the same line, upper strata radiating element (2) is L1=13.2mm apart from dielectric layer frontier distance, and lower floor's radiating element (4) is L2=13.9mm apart from dielectric layer frontier distance; The thickness W1=2mm of each package wall of packaging body, on it, through-hole spacing is 0.8mm;
Inner ground metal level (6) is coated in below antenna substrate (5), for the unwanted coupling between minimize antenna and packaging body (7); First through hole (12) communicated with the first vertical through hole (9) is offered in inner ground metal level (6), the diameter 0.5mm of the first through hole (12), be greater than the diameter 0.25mm of the first vertical through hole (9), for the feed passage as antenna; Second through hole (13) communicated with the first vertical through hole (9) and the first through hole (12) is offered in external ground metal level (8), the diameter 0.5mm of the second through hole (13), for the feed passage as antenna;
Packaging body (7) comprises four package wall (16), and four package wall (16) surround an internal cavities (15), and packaging body (7) is coaxial with lower floor's radiating element (4); Packaging body (7) is highly 4mm, and the length of side is 20.2mm, material to be dielectric constant be 7.8 LTCC dielectric material; The wall thickness of each package wall (16) is 2mm, it has some perforates, and pitch of holes is 1mm; Filling ag material in perforate, for connecting as one external ground plate (8) and lower floor's radiating element (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210595681.1A CN103066385B (en) | 2012-12-22 | 2012-12-22 | For the LTCC Two--Layer Microstrip Antenna of system in package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210595681.1A CN103066385B (en) | 2012-12-22 | 2012-12-22 | For the LTCC Two--Layer Microstrip Antenna of system in package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103066385A CN103066385A (en) | 2013-04-24 |
| CN103066385B true CN103066385B (en) | 2015-08-05 |
Family
ID=48108910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210595681.1A Active CN103066385B (en) | 2012-12-22 | 2012-12-22 | For the LTCC Two--Layer Microstrip Antenna of system in package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103066385B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160294068A1 (en) * | 2015-03-30 | 2016-10-06 | Huawei Technologies Canada Co., Ltd. | Dielectric Resonator Antenna Element |
| CN105609944B (en) * | 2015-12-28 | 2018-06-05 | 西安电子科技大学昆山创新研究院 | Double-deck fractal microstrip radio frequency package antenna based on cavity structure |
| CN110611160B (en) | 2016-01-30 | 2021-08-03 | 华为技术有限公司 | Patch antenna unit and antenna |
| CN109390663A (en) * | 2017-08-08 | 2019-02-26 | 京信通信系统（中国）有限公司 | A kind of micro-strip radiating element and its antenna |
| CN107994010B (en) * | 2017-11-28 | 2019-12-13 | 北方电子研究院安徽有限公司 | Tool for realizing micro-system vertical interconnection integrated packaging structure and manufacturing method |
| CN108183329B (en) * | 2018-01-05 | 2020-11-10 | 山西大学 | Low-profile unidirectional radiation differential ultra-wideband antenna |
| WO2021045677A1 (en) * | 2019-09-04 | 2021-03-11 | Agency For Science, Technology And Research | Antenna system, and method of forming the same |
| CN110808455B (en) * | 2019-10-31 | 2022-09-23 | 维沃移动通信有限公司 | Antenna unit and electronic equipment |
| CN111129704B (en) * | 2019-12-26 | 2021-10-29 | 维沃移动通信有限公司 | Antenna unit and electronic equipment |
| CN111129712A (en) | 2020-01-10 | 2020-05-08 | 深圳市信维通信股份有限公司 | 5G millimeter wave dual-polarized antenna module and handheld device |
| KR20220054004A (en) * | 2020-10-23 | 2022-05-02 | 삼성전자주식회사 | Antenna structure including interposer and electronic device including same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101707284A (en) * | 2009-11-20 | 2010-05-12 | 电子科技大学 | LTCC electrically small integrated antenna for radio-frequency front-end system |
| CN101859927A (en) * | 2010-04-14 | 2010-10-13 | 电子科技大学 | LTCC lamination double-fed circularly polarized micro-strip paster antenna |
| CN102201607A (en) * | 2010-03-25 | 2011-09-28 | 周建明 | Microstrip and strip line transformation based on low temperature co-fired ceramic (LTCC) technology |
| CN102694565A (en) * | 2012-05-18 | 2012-09-26 | 西安电子科技大学 | 3D-MCM (three dimension multi-chip module) radio frequency system with integrated snakelike antenna |
-
2012
- 2012-12-22 CN CN201210595681.1A patent/CN103066385B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101707284A (en) * | 2009-11-20 | 2010-05-12 | 电子科技大学 | LTCC electrically small integrated antenna for radio-frequency front-end system |
| CN102201607A (en) * | 2010-03-25 | 2011-09-28 | 周建明 | Microstrip and strip line transformation based on low temperature co-fired ceramic (LTCC) technology |
| CN101859927A (en) * | 2010-04-14 | 2010-10-13 | 电子科技大学 | LTCC lamination double-fed circularly polarized micro-strip paster antenna |
| CN102694565A (en) * | 2012-05-18 | 2012-09-26 | 西安电子科技大学 | 3D-MCM (three dimension multi-chip module) radio frequency system with integrated snakelike antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103066385A (en) | 2013-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103066385B (en) | For the LTCC Two--Layer Microstrip Antenna of system in package | |
| CN105609944B (en) | Double-deck fractal microstrip radio frequency package antenna based on cavity structure | |
| US9819098B2 (en) | Antenna-in-package structures with broadside and end-fire radiations | |
| US7696930B2 (en) | Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities | |
| EP2144329A1 (en) | Radio frequency integrated circuit packages | |
| US20140145883A1 (en) | Millimeter-wave radio frequency integrated circuit packages with integrated antennas | |
| JP5669043B2 (en) | Post-wall waveguide antenna and antenna module | |
| CN103258817B (en) | Semiconductor package and manufacture method thereof | |
| KR20110093597A (en) | Ground radiation antenna | |
| CN104852137A (en) | Miniaturized frequency reconfigurable microstrip slit antenna | |
| CN211578982U (en) | Novel double-layer multi-frequency broadband microstrip antenna | |
| CN110444855A (en) | A kind of dual polarization 5G antenna being integrated on mobile terminal metal edge frame | |
| CN109462028A (en) | A kind of radio-frequency micro electromechanical microstrip antenna | |
| CN102694565A (en) | 3D-MCM (three dimension multi-chip module) radio frequency system with integrated snakelike antenna | |
| CN107134638A (en) | A kind of integrated cavity millimeter wave antenna of substrate | |
| CN104966903B (en) | A kind of suspension micro-strip antenna array and its antenna for 60GHz millimetre-wave attenuators | |
| CN106785403A (en) | Two-band 5G microstrip antennas | |
| CN106384876B (en) | Broadband air medium antenna unit | |
| CN202905941U (en) | A miniaturized multilayer chip antenna | |
| CN107275783A (en) | A kind of integral type dual-antenna system with high-isolation | |
| CN103943963A (en) | Dual polarization slot antenna based on SIW technology | |
| CN102800953B (en) | Indirect feed type omnidirectional printed antenna with radiant load | |
| WO2012171041A1 (en) | Multiple layer dielectric panel directional antenna | |
| CN202905935U (en) | Small high-performance chip antenna | |
| CN101728643A (en) | Millimeter-wave ultra-wideband slot antenna made of liquid crystal polymer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |