CN107309577A - One kind is applied to signal distributor solder(ing) paste and preparation method thereof - Google Patents

One kind is applied to signal distributor solder(ing) paste and preparation method thereof Download PDF

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Publication number
CN107309577A
CN107309577A CN201610266186.4A CN201610266186A CN107309577A CN 107309577 A CN107309577 A CN 107309577A CN 201610266186 A CN201610266186 A CN 201610266186A CN 107309577 A CN107309577 A CN 107309577A
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China
Prior art keywords
solder
paste
ing
signal distributor
weld
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CN201610266186.4A
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Chinese (zh)
Inventor
韩惠琴
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SYRELN (XIAMEN) NEW MATERIAL TECHNOLOGY Co Ltd
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SYRELN (XIAMEN) NEW MATERIAL TECHNOLOGY Co Ltd
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Priority to CN201610266186.4A priority Critical patent/CN107309577A/en
Publication of CN107309577A publication Critical patent/CN107309577A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder

Abstract

The present invention relates to a kind of solder(ing) paste suitable for signal distributor, the solder(ing) paste is made up of weld-aiding cream and Tin Based Alloy Solder Powder.By solvent 25% ~ 40%, modified rosin 42% ~ 50%, organic acid 2% ~ 5%, borofluoride 2% ~ 5%, thixotropic agent 7% ~ 10%, antioxidant 5% ~ 10% is added 150 DEG C of dissolvings are heated with stirring in reactor after obtain weld-aiding cream.By weld-aiding cream and Sn96.5Ag3.0Cu0.5, Sn97.5Ag2.0Cu0.5, Sn98.5Ag1.0Cu0.5, Sn99Ag0.3Cu0.7, Sn99Cu0.7, Sn42Bi58, any one in this several solder powder of Sn64Bi35Ag1.0, Sn64.7Bi35Ag0.3, Sn64.9Bi35Ag0.1 is by weight 15 ~ 10:85 ~ 90 uniformly obtain the solder(ing) paste suitable for signal distributor in stirrer for mixing.Solder(ing) paste in the present invention is particularly suitable for signal distributor and used, it is possible to decrease production cost, improves production efficiency;Viscosity is suitable, and thixotropy is strong, and layering is difficult during point gum machine spot printing, specified welding region can be spread evenly across;The oxide-film of solder powder electroplating surface layer can be removed completely in 5 ~ 8 seconds, prevent dry joint and missing solder from occurring;The preservation long lifespan of solder(ing) paste and higher welding temperature can be born.Postwelding residual is few, is easily cleaned using environment-friendly cleaning agent.

Description

One kind is applied to signal distributor solder(ing) paste and preparation method thereof
Technical field
The present invention relates to a kind of technical field of solder(ing) paste, the more particularly to solder(ing) paste applied to signal distributor welding And its preparation method.
Background technology
The surface mounting technology (Surface Mount Technology, abbreviation SMT) started in 1970s, be Refer to the printed solder paste on printed circuit board pad, and Surface Mount Component be placed with the pad for being printed with solder(ing) paste, According to specific reflux temperature curve(Generally total weld interval was at 5 ~ 6 minutes)Heater circuit plate, allows solder(ing) paste to melt, and it is closed Solder joint is formed between component and printed circuit board and realize the metallurgical technology connected after golden composition cooled and solidified.
Solder(ing) paste is accompanied by a kind of novel welding material that SMT arises at the historic moment.Solder(ing) paste by solder powder, scaling powder and The lotion of other additives mixeds.Solder(ing) paste has certain viscosity at normal temperatures, will can be bonded at both at the beginning of electronic component Positioning is put, under welding temperature, with the volatilization of solvent and portions additive, will be by weldering component and printed circuit pad solder Formed together permanently connected.
Maturation because of solder(ing) paste in SMT industries is used, production signal distributor enterprise for economization workman, reduce cost, Improve efficiency, improve product quality so as to which solder(ing) paste to be applied to the welding of signal distributor, be different from SMT welding techniques, believe The technique of number distributor is that solder(ing) paste is equably put to the shell that is coated onto and need to weld using point gum machine before welding, and coating is completed Afterwards, the firing equipment by temperature higher than 500 DEG C is close to 1 ~ 2 centimetre of solder(ing) paste, by the effect of air heat transfer, general to require Welding process was completed in 5 ~ 8 seconds.
Solder(ing) paste applied to signal distributor welding other conventional SMT that compare are compared with solder(ing) paste, during spot printing Require to adapt to higher heating-up temperature in the bad phenomenon of layering, welding process it is required that occurring without under the impact of continuous atmospheric pressure, The time of welding also requires that and completed in 5 ~ 8 seconds, because long weld interval can cause signal distributor to electroplate outside layer surface The damage of sight and the circuit board function defect of shell parcel, while also requiring that the wettability of solder(ing) paste is strong during welding, because letter The top layer of number distributor is electroless nickel layer, and nickel easily forms one layer of fine and close oxide-film in atmosphere, and this layer oxide film needs Solder(ing) paste possesses very strong deoxidation ability.Require that residual is fewer and easily cleans after welding, to reach outside final products See requirement attractive in appearance.
The requirement welded for above-mentioned signal distributor, if simply will SMT is applied to solder(ing) paste on the market at present The welding of signal distributor, just occurs that the layering in above mentioned problem is bad, and dry joint and missing solder rate are high, and residual also compares many, and And do not allow easy cleaning.Do not reach enterprise economization workman, save cost, improve the requirement of production effect and production quality.
Therefore, welding for signal distributor, it is necessary to specially adjusted to solder(ing) paste, patent 201010586234.0 ] a kind of preparation method of spot coating type high-temperature solder(ing) paste is proposed, is welded for point coating type, when solving spot printing The bad phenomenon being easily layered, while it is also ensured that being resistant to 340 DEG C of high temperature above reflow solderings when welding, residual is few after welding Do not sinter, easily cleaning.But the alloy solder powder used in the patent is limited only to Sn5Pb92.5Ag2.5, solder powder Sn5Pb92.5Ag2.5 is because leaded, and environmental pollution is serious, and weld interval when also not accounting for signal distributor welding It is short, deoxidation ability strong requirement during welding.So tin cream that the patent is researched and developed and can guarantee that suitable for signal distributor Welding needs.
The amount of solder(ing) paste used in signal distributor increasingly increases with the demand for development of manufacturing enterprise, but at present on the market simultaneously Not exclusively for the tin cream product and related invention patent of signal distributor welding, so that specially exploitation is applied to signal distribution The solder(ing) paste of device welding is excellent to be important.
In view of this, the present inventor proposes following technical proposals.
The content of the invention
The purpose of the present invention is to solve the above problems, providing a kind of solder(ing) paste for being used in particular for signal distributor welding And preparation method thereof.The solder(ing) paste can occur without layering bad phenomenon when using point gum machine spot printing solder(ing) paste, can equably apply Cloth removed solder powder completely in specified welding region in 5 ~ 8 seconds, and the oxide-film of electroplating surface layer prevents dry joint and missing solder Bad generation, postwelding residual is few, is easily cleaned using environment-friendly cleaning agent.Reach the need with number distributor manufacturing enterprise Ask.
What the purpose of the present invention was mainly realized by following technical scheme.
A kind of solder(ing) paste for being particularly suitable for use in signal distributor welding, it is by weld-aiding cream and Tin Based Alloy Solder Powder group Into,
Described weld-aiding cream is made up of following percentage by weights:
Organic solvent 25% ~ 40%
Modified rosin 42% ~ 50%
Organic acid 2% ~ 5%
Borofluoride 2% ~ 5%
Thixotropic agent 7% ~ 10%
Antioxidant 5% ~ 10%
Wherein, described organic solvent is diethylene glycol monohexyl ether, diethylene glycol list octyl ether, 2- ethyls -1,3- hexylene glycols, second The one or more combination of glycol monobutyl ether.
Described modified rosin is hydrogenated rosin, ice galbanum, the one or more combination of water-white rosin.
Described organic acid is phenylsuccinic acid, dimethyl succinic acid, the one or more combination of p-tert-butyl benzoic acid.
Described borofluoride is potassium fluoborate, sodium fluoborate, zinc fluoroborate, one or more of groups of stannous fluoboric acid Close.
Described thixotropic agent is modified hydrogenated castor oil, and rilanit special, second two supports the one or more of bis-stearamides Combination.
Described antioxidant is antioxidant 264, antioxidant 245, the one or more combination of antioxidant 1010.
Described kamash alloy solder powder be Sn96.5Ag3.0Cu0.5, Sn97.5Ag2.0Cu0.5, Sn98.5Ag1.0Cu0.5, Sn99Ag0.3Cu0.7, Sn99Cu0.7, Sn42Bi58, Sn64Bi35Ag1.0, Any one of Sn64.7Bi35Ag0.3, Sn64.9Bi35Ag0.1.
The weight ratio of described weld-aiding cream and both kamash alloy solder powders is 15 ~ 10:85~90.
The preparation method of the above-described solder(ing) paste suitable for signal distributor welding, including following preparation process:
A. by the organic solvent of the amount, modified rosin, organic acid, borofluoride, thixotropic agent, antioxidant is added in reactor Mixing, is heated with stirring to 150 DEG C and is dissolved.B. place in room temperature environment and cool down after the material in question response kettle is completely dissolved. C. it is cooled to after room temperature, is ground using three-roll grinder, weld-aiding cream is obtained after the completion of grinding.D. weld-aiding cream and tinbase are closed Gold solder glass putty is 15 ~ 12 by weight:85 ~ 88 ratio is mixed in mixer, is applicable after stirring In the solder(ing) paste of signal distributor welding.
The solder(ing) paste of the present invention is made up of weld-aiding cream and kamash alloy solder powder, and the organic solvent that weld-aiding cream is selected is main Play a part of getting up to dissolve other effects added materials in a carrier, weld-aiding cream preparation process.And after high-temperature soldering Phase plays a part of the surface tension of certain reduction solder side.
The modified rosin that the present invention is selected is that natural rosin passes through light, the high rosin of acid number obtained by the processes such as dehydrogenation, Processed gained modified rosin can provide certain activity in welding process, with solder powder, and area to be welded because acid number is high The oxide-film in domain carries out reduction reaction, reaches the purpose of removing oxide layer.
The modified rosin that weld-aiding cream is selected is that natural rosin passes through light, the high rosin of acid number obtained by the processes such as dehydrogenation, Processed gained modified rosin can provide certain activity in welding process, with solder powder, and area to be welded because acid number is high The oxide-film in domain carries out reduction reaction, reaches the purpose of removing oxide layer.
The organic acid that the present invention is selected be molecular weight than larger organic acid, activation temperature is higher, be adapted to welding temperature Compare it is high in the case of use, and rosin is used cooperatively together, can strengthen the ability and wettability of deoxidation.
The present invention selects borofluoride, because being a kind of metal salt, and state is a kind of metal salt of stabilization at normal temperatures, will not Find to react with glass putty, but under the external condition for having heating, boron trifluoride can be decomposited, boron trifluoride contains fluorine element, and fluorine is One kind of halogen, but not in International Electrotechnical Commission(IEC)With Electronic Industries Joint Association(IPC)The nothing of defined In halogen demand, the boron trifluoride containing fluorine element is a kind of extremely strong material of reactivity, can particularly be swashed with metalliferous material Strong reaction, in contact solder powder, the oxide-film of signal distributor electroplating surface layer, and modified rosin, organic acid one work In the case of, it can destroy metal oxide film rapidly within a very short time, weld the oxide-film of contact surface after removal, liquid Tin-base alloy solder is with regard to that can soak the surface welded needed for signal distributor.
The thixotropic agent that the present invention is selected, plays the viscosity of increase solder(ing) paste, and provide very strong thixotropy, it is ensured that weldering It is not stratified when tin cream is used on point gum machine, the welding region specified can be uniformly coated to during spot printing.
The antioxidant that the present invention is selected, adds in solder(ing) paste, air can be caught during normal temperature and high-temperature soldering Oxonium ion, prevents contact surface of the oxonium ion constantly with welding from carrying out oxidation reaction.So as to ensure preservation life-span and the energy of solder(ing) paste Bear higher welding temperature.
Due to taking above-mentioned technical proposal so that the technology of the present invention has following features:
A. the welding for being particularly suitable for signal distributor is used, and reduces enterprise's production cost, improves production efficiency;
B. viscosity is suitable, and thixotropy is strong, does not allow to be also easy to produce layering during point gum machine spot printing, can be uniformly coated on the weld zone specified Domain;
C. solder powder can be removed completely in 5 ~ 8 seconds, the oxide-film of electroplating surface layer prevents dry joint and the bad generation of missing solder;
D. the preservation long lifespan of solder(ing) paste and higher welding temperature can be born.
E. postwelding residual is few, is easily cleaned using environment-friendly cleaning agent.
Embodiment
With reference to specific embodiment, the present invention will be described.
Embodiment one, one kind is applied to signal distributor solder(ing) paste, and it is made up of weld-aiding cream and Tin Based Alloy Solder Powder, helped Soldering paste raw material:Diethylene glycol monohexyl ether 25%, hydrogenated rosin 50%, phenylsuccinic acid 2%, potassium fluoborate 5%, modified hydrogenated castor-oil plant Oil 8%, antioxidant 264 10%.
Preparation method:The material of above-mentioned amount is added in reactor by weight percentage and mixed, 150 DEG C is heated with stirring to and enters Row dissolving, is placed in room temperature environment after being completely dissolved and cooled down, be cooled to after room temperature, be ground using three-roll grinder, ground After the completion of obtain weld-aiding cream.It is 15 by weight by weld-aiding cream and kamash alloy solder powder:85 ratio is carried out in mixer Mix, the solder(ing) paste suitable for signal distributor welding is obtained after stirring.
Embodiment two, one kind is applied to signal distributor solder(ing) paste, and it is made up of weld-aiding cream and Tin Based Alloy Solder Powder, helped Soldering paste raw material:Diethylene glycol list octyl ether 30%, ice galbanum 45%, dimethyl succinic acid 4%, sodium fluoborate 3%, rilanit special 9%, Antioxidant 245 10%.
Preparation method:The material of above-mentioned amount is added in reactor by weight percentage and mixed, 150 DEG C is heated with stirring to and enters Row dissolving, is placed in room temperature environment after being completely dissolved and cooled down, be cooled to after room temperature, be ground using three-roll grinder, ground After the completion of obtain weld-aiding cream.It is 14 by weight by weld-aiding cream and kamash alloy solder powder:86 ratio is carried out in mixer Mix, the solder(ing) paste suitable for signal distributor welding is obtained after stirring.
Embodiment three, one kind is applied to signal distributor solder(ing) paste, and it is made up of weld-aiding cream and Tin Based Alloy Solder Powder, helped Soldering paste raw material:2- ethyls -1,3- hexylene glycols 35%, water-white rosin 48%, p-tert-butyl benzoic acid 3%, zinc fluoroborate 2%, second two are supportted Bis-stearamides 7%, antioxidant 1010 10%.
Preparation method:The material of above-mentioned amount is added in reactor by weight percentage and mixed, 150 DEG C is heated with stirring to and enters Row dissolving, is placed in room temperature environment after being completely dissolved and cooled down, be cooled to after room temperature, be ground using three-roll grinder, ground After the completion of obtain weld-aiding cream.It is 13 by weight by weld-aiding cream and kamash alloy solder powder:87 ratio is carried out in mixer Mix, the solder(ing) paste suitable for signal distributor welding is obtained after stirring.
Example IV, one kind is applied to signal distributor solder(ing) paste, and it is made up of weld-aiding cream and Tin Based Alloy Solder Powder, helped Soldering paste raw material:Ethylene glycol monobutyl ether 40%, hydrogenated rosin 16%, ice galbanum 26%, dimethyl succinic acid 2%, stannous fluoboric acid 4% changes Property rilanit special 3%, rilanit special 4%, antioxidant 264 2%, antioxidant 245 3%.
Preparation method:The material of above-mentioned amount is added in reactor by weight percentage and mixed, 150 DEG C is heated with stirring to and enters Row dissolving, is placed in room temperature environment after being completely dissolved and cooled down, be cooled to after room temperature, be ground using three-roll grinder, ground After the completion of obtain weld-aiding cream.It is 12 by weight by weld-aiding cream and kamash alloy solder powder:88 ratio is carried out in mixer Mix, the solder(ing) paste suitable for signal distributor welding is obtained after stirring.
Embodiment five, one kind is applied to signal distributor solder(ing) paste, and it is made up of weld-aiding cream and Tin Based Alloy Solder Powder, helped Soldering paste raw material:Diethylene glycol monohexyl ether 14%, diethylene glycol list octyl ether 14%, ice galbanum 26%, water-white rosin 20%, phenyl fourth Diacid 3%, dimethyl succinic acid 2%, potassium fluoborate 2%, sodium fluoborate 2%, rilanit special 5%, the support bis-stearamides 5% of second two resist Oxidant 264 4%, antioxidant 1010 3%.
Preparation method:The material of above-mentioned amount is added in reactor by weight percentage and mixed, 150 DEG C is heated with stirring to and enters Row dissolving, is placed in room temperature environment after being completely dissolved and cooled down, be cooled to after room temperature, be ground using three-roll grinder, ground After the completion of obtain weld-aiding cream.It is 11 by weight by weld-aiding cream and kamash alloy solder powder:89 ratio is carried out in mixer Mix, the solder(ing) paste suitable for signal distributor welding is obtained after stirring.
Embodiment six, one kind is applied to signal distributor solder(ing) paste, and it is made up of weld-aiding cream and Tin Based Alloy Solder Powder, helped Soldering paste raw material:2- ethyls -1,3- hexylene glycols 9%, ethylene glycol monobutyl ether 20%, hydrogenated rosin 17%, ice galbanum 20%, methyl fourth Diacid 3%, p-tert-butyl benzoic acid 2%, zinc fluoroborate 2%, stannous fluoboric acid 3%, modified hydrogenated castor oil 4%, second two supports double tristearin Acid amides 4%, antioxidant 245 3%, antioxidant 1010 3%.
Preparation method:The material of above-mentioned amount is added in reactor by weight percentage and mixed, 150 DEG C is heated with stirring to and enters Row dissolving, is placed in room temperature environment after being completely dissolved and cooled down, be cooled to after room temperature, be ground using three-roll grinder, ground After the completion of obtain weld-aiding cream.It is 10 by weight by weld-aiding cream and kamash alloy solder powder:90 ratio is carried out in mixer Mix, the solder(ing) paste suitable for signal distributor welding is obtained after stirring.
Embodiment seven, one kind is applied to signal distributor solder(ing) paste, and it is made up of weld-aiding cream and Tin Based Alloy Solder Powder, helped Soldering paste raw material:Diethylene glycol monohexyl ether 5%, diethylene glycol list octyl ether 20%, 2- ethyls -1,3- hexylene glycols 5%, ethylene glycol monobutyl ether 8%, hydrogenated rosin 10%, ice galbanum 13%, water-white rosin 20%, phenylsuccinic acid 1%, dimethyl succinic acid 1%, to tert-butyl benzene first Acid 1%, potassium fluoborate 1%, sodium fluoborate 1%, zinc fluoroborate 1%, stannous fluoboric acid 1%, modified hydrogenated castor oil 2%, hydrogenated castor Oil 3%, the support bis-stearamides 2% of second two, antioxidant 264 1%, antioxidant 245 2%, antioxidant 1010 2%.
Preparation method:The material of above-mentioned amount is added in reactor by weight percentage and mixed, 150 DEG C is heated with stirring to and enters Row dissolving, is placed in room temperature environment after being completely dissolved and cooled down, be cooled to after room temperature, be ground using three-roll grinder, ground After the completion of obtain weld-aiding cream.It is 13 by weight by weld-aiding cream and kamash alloy solder powder:87 ratio is carried out in mixer Mix, the solder(ing) paste suitable for signal distributor welding is obtained after stirring.

Claims (10)

1. a kind of solder(ing) paste for being particularly suitable for use in signal distributor welding, is made up of weld-aiding cream and Tin Based Alloy Solder Powder, it is special Levy and be:Described weld-aiding cream is made up of following percentage by weights:Organic solvent 25% ~ 40%, modified rosin 42% ~ 50%, has Machine acid 2% ~ 5%, borofluoride 2% ~ 5%, thixotropic agent 7% ~ 10%, antioxidant 5% ~ 10%.
2. a kind of solder(ing) paste for being particularly suitable for use in signal distributor welding according to claim 1, it is characterised in that:It is described Organic solvent be diethylene glycol monohexyl ether, diethylene glycol list octyl ether, 2- ethyls -1,3- hexylene glycols, the one of ethylene glycol monobutyl ether Plant or several combinations.
3. a kind of solder(ing) paste for being particularly suitable for use in signal distributor welding according to claim 1, it is characterised in that:It is described Modified rosin be hydrogenated rosin, ice galbanum, the one or more combination of water-white rosin.
4. a kind of solder(ing) paste for being particularly suitable for use in signal distributor welding according to claim 1, it is characterised in that:It is described Organic acid be phenylsuccinic acid, dimethyl succinic acid, the one or more combination of p-tert-butyl benzoic acid.
5. a kind of solder(ing) paste for being particularly suitable for use in signal distributor welding according to claim 1, it is characterised in that:It is described Borofluoride be potassium fluoborate, sodium fluoborate, zinc fluoroborate, the one or more combination of stannous fluoboric acid.
6. a kind of solder(ing) paste for being particularly suitable for use in signal distributor welding according to claim 1, it is characterised in that:It is described Thixotropic agent be modified hydrogenated castor oil, rilanit special, second two support bis-stearamides one or more combination.
7. a kind of solder(ing) paste for being particularly suitable for use in signal distributor welding according to claim 1, it is characterised in that:It is described Antioxidant be antioxidant 264, antioxidant 245, the one or more combination of antioxidant 1010.
8. a kind of solder(ing) paste for being particularly suitable for use in signal distributor welding according to claim 1, it is characterised in that:It is described Kamash alloy solder powder be Sn96.5Ag3.0Cu0.5, Sn97.5Ag2.0Cu0.5, Sn98.5Ag1.0Cu0.5, Sn99Ag0.3Cu0.7, Sn99Cu0.7, Sn42Bi58, Sn64Bi35Ag1.0, Sn64.7Bi35Ag0.3, Any one of Sn64.9Bi35Ag0.1.
9. a kind of solder(ing) paste for being particularly suitable for use in signal distributor welding according to claim 1, it is characterised in that:It is described The weight ratio of both weld-aiding cream and kamash alloy solder powder be 15 ~ 10:85~90.
10. a kind of preparation method for the solder(ing) paste for being particularly suitable for use in signal distributor welding according to claim 1, it is special Levy and be:By the organic solvent of the amount, modified rosin, organic acid, borofluoride, thixotropic agent, antioxidant adds reactor Middle mixing, is heated with stirring to 150 DEG C and is dissolved;Material in question response kettle is placed in room temperature environment after being completely dissolved and cooled down; It is cooled to after room temperature, is ground using three-roll grinder, weld-aiding cream is obtained after the completion of grinding;Weld-aiding cream and kamash alloy are welded Glass putty is 15 ~ 12 by weight:85 ~ 88 ratio is mixed in mixer, obtains being applied to letter after stirring The solder(ing) paste of number distributor welding.
CN201610266186.4A 2016-04-27 2016-04-27 One kind is applied to signal distributor solder(ing) paste and preparation method thereof Pending CN107309577A (en)

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CN107900551A (en) * 2017-12-19 2018-04-13 河南格瑞恩工业科技有限公司 Leadless environment-friendly miniature electronic welding tin cream and preparation method thereof
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CN112894194A (en) * 2021-03-03 2021-06-04 厦门市及时雨焊料有限公司 Solder paste and preparation method and welding method thereof
CN114101971A (en) * 2021-12-06 2022-03-01 深圳市唯特偶新材料股份有限公司 Active microsphere, solder paste soldering flux and preparation method thereof
CN114101971B (en) * 2021-12-06 2023-03-14 深圳市唯特偶新材料股份有限公司 Active microsphere, solder paste soldering flux and preparation method thereof

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