CN107300132A - A kind of LED filament lamp of solid conductive heat and preparation method thereof - Google Patents
A kind of LED filament lamp of solid conductive heat and preparation method thereof Download PDFInfo
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- CN107300132A CN107300132A CN201710537465.4A CN201710537465A CN107300132A CN 107300132 A CN107300132 A CN 107300132A CN 201710537465 A CN201710537465 A CN 201710537465A CN 107300132 A CN107300132 A CN 107300132A
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- 239000007787 solid Substances 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- 239000004020 conductor Substances 0.000 claims abstract description 112
- 238000007711 solidification Methods 0.000 claims abstract description 10
- 230000008023 solidification Effects 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- 238000007493 shaping process Methods 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000012546 transfer Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 238000005086 pumping Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention relates to LED filament lamp of a kind of solid conductive heat and preparation method thereof, the heat that LED filament is produced is conducted to cell-shell using the transparent heat conductor of solid structure, radiated directly into air.LED filament is contacted by the transparent heat conductor of solidification, the heat transfer distances of gas are eliminated in theory, the heat that LED filament is produced is led in transparent heat conductor rapidly, and then passes on cell-shell and is radiated.The sinking path of LED filament is not passed to cell-shell merely through gas, and conduct and distribute to cell-shell by transparent heat conductor, not only solve the radiating of LED filament, and make the making apparatus and technique easedization of LED filament lamp.In described preparation method, due to carrying out heat conduction using solid, then in production process, vacuum pumping need not be carried out, and then the thorough traditional processing technology needs for changing LED filament lamp are vacuumized, reinflated process, the reliability of LED filament lamp is not only increased, and makes the manufacture craft of LED filament lamp simpler, is automated.
Description
Technical field
The present invention relates to LED filament lamp field, more specifically to the LED filament lamp and its system of a kind of solid conductive heat
Make method.
Background technology
Compared to incandescent lamp and common LED lamp, LED filament lamp has both both advantages and turn avoid their weakness：
1st, 360 degree of full angle light-emitting 3 D light sources.
Conventional LED/light source, such as plug-in unit LED, paster LED, COB, integrated high-power LED lamp bead, be not added with lens it
All can only be planar light source in the case of the optics of class.But LED filament breaches this point, using micropore metal substrate list
Face die bond wire soldering technology, really realize 360 degree of full angle light-emitting 3 D light sources, it is to avoid influences light effect because adding lens
And the problem of cause light loss result, meet the full visual angle of client and light demand, bring unprecedented lighting experience and more save.
2nd, high-color rendering, specular removal.
Blue light+red light chips encapsulation, can make colour developing reach the effect of traditional lighting, improve light efficiency and brightness, substitute tradition
Blue light plus red color and green emitting phosphor improve the aobvious technique for referring to loss brightness.
3rd, people couple and the custom of light source outward appearance are met.
LED filament meets consumer demand：When incandescent lamp, electricity-saving lamp are also monopolizing the market, most can commonly it be disappeared
The product that expense person receives is exactly the illuminator being accustomed in the past with not changing, and LED filament complies fully with consumer for illuminating lamp
The habitual understanding of tool.
4th, compared to common LED lamp, cost is relatively low.
For general LED lamp, it is mainly sapphire substrate and wick used in LED filament lamp, without
It is non-renewable aluminium and nondegradable plastics.Due to being only coated in by fluorescent material on 0.8mm sapphire substrate, so
For relatively common packing forms, fluorescent material consumption is less.From the point of view of main flow model instantly, according to power typically only with 25,28,
32 chips are encapsulated, and compared to the common encapsulation of equal wattage, the usage amount of LED chip is also less, that correspondingly overall cost compared with
Common LED lamp is low.
But LED filament lamp is there is also some shortcomings, such as radiating problem.The heat dissipating method of the LED filament lamp of prior art is
By vacuumizing heat-conducting gas is poured into again radiated.As in Chinese invention patent application 20121006370.5, radiating passes through lamp
Silk leads heat on glass envelope through the gas that radiates, although heat-conducting gas has certain heat sinking function, but the physics by gas in itself
The limitation of characteristic, the radiating of LED filament is restricted, it is impossible to export heat rapidly.
The content of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of simple production process, heat dispersion be strong, work
Make the LED filament lamp of reliable solid conductive heat, and the preparation method that the LED filament lamp of solid conductive heat is provided.
Technical scheme is as follows：
Transparent heat conductor is set in a kind of LED filament lamp of solid conductive heat, cell-shell, and LED filament is fixed with transparent heat conductor
Connection, the heat that LED filament is produced is transferred to cell-shell through transparent heat conductor, is radiated.
Preferably, transparent heat conductor is the structure of curing molding, LED filament is connected to the outer wall of transparent heat conductor.
Preferably, transparent heat conductor is the structure of curing molding, holding tank, LED are offered in the middle of transparent heat conductor
Silk is arranged in holding tank, is connected with the inwall of transparent heat conductor.
Preferably, transparent heat conductor is the structure of curing molding, LED filament is coated in transparent heat conductor.
Preferably, transparent heat conductor is column structure, pyramidal structure, square structure or polymorphic structure.
Preferably, at least two positions of transparent heat conductor are contacted with cell-shell.
Preferably, company is fixed by the transparent thermal conducting agent of solidification between transparent heat conductor and LED filament, cell-shell
Connect.
A kind of preparation method of the LED filament lamp of solid conductive heat, including prepare transparent heat conductor, assembling；
The preparation process of transparent heat conductor is：Transparent heat-conducting liquid is injected in a mold, is carried out the shaping that is heating and curing, is obtained
Transparent heat conductor；
Installation step is：LED filament is fixedly connected with transparent heat conductor by transparent thermal conducting agent；It will be fixedly connected
The transparent heat conductor for having LED filament is put into cell-shell, and contacts with cell-shell connection；The contact conductor of LED filament stretches out cell-shell, with
Driver is connected；Driver is installed in lamp holder.
Preferably, transparent heat conductor is the structure of curing molding, LED filament is connected to the outer wall of transparent heat conductor；Or
Holding tank is offered in the middle of person, transparent heat conductor, LED filament is arranged in holding tank, be connected with the inwall of transparent heat conductor.
Preferably, transparent thermal conducting agent is respectively coated between transparent heat conductor and LED filament, cell-shell, and heated,
Transparent thermal conducting agent solidification, transparent heat conductor is fixedly connected with LED filament, cell-shell.
Preferably, transparent heat-conducting liquid, transparent thermal conducting agent are respectively liquid silica gel, organic resin, or glass
Powder.
A kind of preparation method of the LED filament lamp of solid conductive heat, including prepare transparent heat conductor, assembling；
The preparation process of transparent heat conductor is：LED filament is positioned in mould, transparent conductive fluid is injected in a mold
Body, carries out the shaping that is heating and curing, obtains transparent heat conductor, LED filament is coated in transparent heat conductor；
Installation step is：The transparent heat conductor for being coated with LED filament is put into cell-shell, and contacts with cell-shell connection；LED
The contact conductor of filament stretches out cell-shell, is connected with driver；Driver is installed in lamp holder.
Preferably, coating transparent thermal conducting agent between transparent heat conductor and cell-shell, and heated, transparent thermal conducting agent is consolidated
Change, transparent heat conductor is fixedly connected with cell-shell.
Preferably, transparent heat-conducting liquid, transparent thermal conducting agent are respectively liquid silica gel, organic resin, or glass
Powder.
Beneficial effects of the present invention are as follows：
The LED filament lamp of solid conductive heat of the present invention, the heat transfer of gas is better than using the heat-conductive characteristic of solid
This feature of performance, is conducted the heat that LED filament is produced to cell-shell using the transparent heat conductor of solid structure, directly to sky
Radiated in gas.LED filament is contacted by the transparent heat conductor of solidification, the heat transfer distances of gas are eliminated in theory, by LED filament
The heat of generation is led in transparent heat conductor rapidly, and then is passed on cell-shell and radiated.Not only increase the radiating surface of LED filament
Product, makes the sinking path of LED filament not pass to cell-shell merely through gas, and conducts and distribute to cell-shell by transparent heat conductor,
The radiating of LED filament is not only solved, and makes the making apparatus and technique easedization of LED filament lamp.
Then in preparation method of the present invention, due to carrying out heat conduction using solid, then in production process, it is not necessary to carry out
Vacuum pumping, and then the thorough traditional processing technology needs for changing LED filament lamp are vacuumized, reinflated process, are not only carried
The high reliability of LED filament lamp, and make the manufacture craft of LED filament lamp simpler, automate.
Brief description of the drawings
Fig. 1 is the sectional view of embodiment one；
Fig. 2 is the sectional view of embodiment two；
Fig. 3 is the sectional view of embodiment three；
In figure：10 be cell-shell, and 11 be transparent heat conductor, and 111 be holding tank, and 12 be LED filament, and 13 be lamp holder.
Embodiment
The present invention is described in further detail below in conjunction with drawings and Examples.
The present invention is reinflated in order to solve first to vacuumize the need for the production method of the LED filament lamp of prior art is present
Complex steps, it is high to technological requirement, the deficiency such as reliability of product is influenceed again there is provided a kind of LED filament lamp of solid conductive heat,
, will using the transparent heat conductor of solid structure using the heat-conductive characteristic of solid better than this feature of the heat-conductive characteristic of gas
The heat that LED filament is produced is conducted to cell-shell, is radiated directly into air.Corresponding to structure, the present invention also provides a kind of solid
The preparation method of the LED filament lamp of body heat conduction, thoroughly change LED filament lamp traditional processing technology need vacuumize, it is reinflated
Process, it is only necessary to prepared by transparent heat conductor, luggage of going forward side by side is matched somebody with somebody, not only increases the reliability of LED filament lamp,
And make the manufacture craft of LED filament lamp simpler, automate.
As shown in Figure 1, Figure 2, Figure 3 shows, transparent lead is set in the LED filament lamp of solid conductive heat of the present invention, cell-shell 10
Hot body 11, the transparent heat conductor 11 of LED filament 12 is fixedly connected, and is entered between LED filament 12 and cell-shell 10 by transparent heat conductor 11
Row thermal contact conductance, the heat that LED filament 12 is produced is transferred to cell-shell 10 through transparent heat conductor 11, is radiated.I.e. transparent heat conduction
Body 11 is contacted with LED filament 12, cell-shell 10 simultaneously, and using the thermal conductivity of solid, the heat that LED filament 12 is produced passes through transparent
Heat carrier 11 is conducted to cell-shell 10, then is radiated into air.
Embodiment one
Transparent heat conductor 11 is the structure of curing molding, when it is implemented, can be according to product demand, by transparent heat conductor 11
It is set to column structure, pyramidal structure, square structure or polymorphic structure (such as diamond structure, or complicated regular texture, no
Regular texture).In the present embodiment, as shown in figure 1, transparent heat conductor 11 is cylindrical structure, LED filament 12 is connected to transparent heat conduction
The outer wall of body 11.The heat that then LED filament 12 is produced a, part is conducted to cell-shell 10 by transparent heat conductor 11, and a part is logical
The air transmitted crossed in cell-shell 10 is to cell-shell 10.The present invention carries out heat biography due to the transparent heat conductor 11 mainly by solid
Lead, thus relatively low is required to the heat conductivility of gas, it is not necessary to select the preferable gas of heat conductivility, then also it is avoided that in production
During, it is necessary to which the step of vacuumizing with inflation, and can also save Material Cost and process costs.
In order to ensure that the heat that transparent heat conductor 11 effectively produces LED filament 12 is conducted to cell-shell 10, transparent heat conduction
At least two positions of body 11 are contacted with cell-shell 10.In the present embodiment, the bottom of the two ends of transparent heat conductor 11 respectively with cell-shell 10
End carries out contact with top and is connected.Entered between transparent heat conductor 11 and LED filament 12, cell-shell 10 by the transparent thermal conducting agent of solidification
Row is fixedly connected, it is ensured that the connection between transparent heat conductor 11 and LED filament 12, cell-shell 10 is seamless, and heat transfer efficiency is higher.
Embodiment two
As shown in Fig. 2 the difference of the present embodiment and embodiment one is mainly LED filament 12 and the installation of transparent heat conductor 11
Position and structure are different.In the present embodiment, holding tank 111 is offered in the middle of transparent heat conductor 11, LED filament 12 is arranged on receiving
In groove 111, it is connected with the inwall of transparent heat conductor 11.That is the setting of holding tank 111 so that transparent heat conductor 11 is in cylinder knot
Structure.
Other parts are identical with embodiment one.
Corresponding to the LED filament lamp of the solid conductive heat described in embodiment one, embodiment two, the present invention provides a kind of solid and led
The preparation method of the LED filament lamp of heat, including prepare transparent heat conductor 11, assembling.
Wherein, the preparation process of transparent heat conductor 11 is：Transparent heat-conducting liquid is injected in a mold, and in corresponding high temperature
It is middle to carry out the shaping that is heating and curing, obtain transparent heat conductor 11.
Installation step is：After some LED filaments 12 are linked together by wire, by LED filament 12 and transparent heat conduction
The contact connection of body 11.Transparent heat conductor 11 is the structure of curing molding, and corresponding to embodiment one, LED filament 12 is connected to transparent
The outer wall of heat carrier 11；Or, corresponding to embodiment two, holding tank 111, LED filament 12 are offered in the middle of transparent heat conductor 11
It is arranged in holding tank 111, is connected with the inwall of transparent heat conductor 11.Again by transparent thermal conducting agent by LED filament 12 with it is transparent
Heat carrier 11 is fixedly connected；The transparent heat conductor 11 for being fixedly connected with LED filament 12 is put into cell-shell 10, and and cell-shell
10 contact connections；The contact conductor of LED filament 12 stretches out cell-shell 10, is connected with driver；Driver is installed in lamp holder 13.
In installation step, transparent thermal conducting agent is respectively coated between transparent heat conductor 11 and LED filament 12, cell-shell 10, and
Heated, transparent thermal conducting agent solidification, transparent heat conductor 11 is fixedly connected with LED filament 12, cell-shell 10.Transparent heat-conducting liquid,
Transparent thermal conducting agent is respectively liquid silica gel, organic resin, or glass dust.When transparent thermal conducting agent be liquid silica gel,
During organic resin (such as epoxy resin), be heating and curing in corresponding high temperature, complete transparent heat conductor 11 and LED filament 12,
Cell-shell 10 is fixedly connected；When transparent thermal conducting agent is glass dust, progress heating is melt into transparent glass in corresponding high temperature
Glass body, completes transparent heat conductor 11 and LED filament 12, cell-shell 10 and is fixedly connected.
Embodiment three
As shown in figure 3, the present embodiment and embodiment one, the difference of embodiment two are mainly LED filament 12 and transparent heat conduction
The connected mode of body 11 is different.In the present embodiment, LED filament 12 is coated in transparent heat conductor 11.Then transparent heat conductor 11 can
Contacted in all directions with LED filament 12 and carry out heat conduction.
Other parts are identical with embodiment one.
Corresponding to the LED filament lamp of the solid conductive heat described in embodiment three, the present invention provides a kind of LED of solid conductive heat
The preparation method of silk lamp, including prepare transparent heat conductor 11, assembling.
Wherein, the preparation process of transparent heat conductor 11 is：LED filament 12 is positioned in mould, injects saturating in a mold
Bright heat-conducting liquid, and the shaping that is heating and curing is carried out in corresponding high temperature, transparent heat conductor 11 is obtained, LED filament 12 is coated on
In transparent heat conductor 11.
Installation step is：After some LED filaments 12 are linked together by wire, the saturating of LED filament 12 will be coated with
Bright heat carrier 11 is put into cell-shell 10, and contacts connection with cell-shell 10.The contact conductor of LED filament 12 stretches out cell-shell 10, with drive
Dynamic device connection；Driver is installed in lamp holder 13.
In installation step, transparent thermal conducting agent is respectively coated between transparent heat conductor 11 and cell-shell 10, and is heated, thoroughly
Bright thermal conducting agent solidification, transparent heat conductor 11 is fixedly connected with cell-shell 10.Transparent heat-conducting liquid, transparent thermal conducting agent are respectively liquid
Silica gel, organic resin, or glass dust.When transparent thermal conducting agent is liquid silica gel, organic resin (such as epoxy resin),
It is heating and curing in corresponding high temperature, completion transparent heat conductor 11 is fixedly connected with cell-shell 10；When transparent thermal conducting agent is glass
During glass powder, heating is carried out in corresponding high temperature and is melt into transparent vitreum, completion transparent heat conductor 11 is consolidated with cell-shell 10
Fixed connection.
Above-described embodiment is intended merely to the explanation present invention, and is not used as limitation of the invention.As long as according to this hair
Bright technical spirit, is changed, modification etc. will all fall in the range of the claim of the present invention to above-described embodiment.
Claims (14)
1. the LED filament lamp of a kind of solid conductive heat, it is characterised in that transparent heat conductor is set in cell-shell, LED filament is led with transparent
Hot body is fixedly connected, and the heat that LED filament is produced is transferred to cell-shell through transparent heat conductor, is radiated.
2. the LED filament lamp of solid conductive heat according to claim 1, it is characterised in that transparent heat conductor is curing molding
Structure, LED filament is connected to the outer wall of transparent heat conductor.
3. the LED filament lamp of solid conductive heat according to claim 1, it is characterised in that transparent heat conductor is curing molding
Structure, offer holding tank in the middle of transparent heat conductor, LED filament is arranged in holding tank, connect with the inwall of transparent heat conductor
Connect.
4. the LED filament lamp of solid conductive heat according to claim 1, it is characterised in that transparent heat conductor is curing molding
Structure, LED filament is coated in transparent heat conductor.
5. the LED filament lamp of the solid conductive heat according to any one of claim 2 to 4, it is characterised in that transparent heat conductor is
Column structure, pyramidal structure, square structure or polymorphic structure.
6. the LED filament lamp of solid conductive heat according to claim 1, it is characterised in that transparent heat conductor at least two
Position is contacted with cell-shell.
7. the LED filament lamp of solid conductive heat according to claim 6, it is characterised in that transparent heat conductor and LED filament,
It is fixedly connected between cell-shell by the transparent thermal conducting agent of solidification.
8. the preparation method of the LED filament lamp of a kind of solid conductive heat, it is characterised in that including preparing transparent heat conductor, assembling；
The preparation process of transparent heat conductor is：Transparent heat-conducting liquid is injected in a mold, is carried out the shaping that is heating and curing, is obtained transparent
Heat carrier；
Installation step is：LED filament is fixedly connected with transparent heat conductor by transparent thermal conducting agent；It will be fixedly connected with
The transparent heat conductor of LED filament is put into cell-shell, and contacts with cell-shell connection；The contact conductor of LED filament stretches out cell-shell, with drive
Dynamic device connection；Driver is installed in lamp holder.
9. the preparation method of the LED filament lamp of solid conductive heat according to claim 8, it is characterised in that transparent heat conductor
For the structure of curing molding, LED filament is connected to the outer wall of transparent heat conductor；Or, receiving is offered in the middle of transparent heat conductor
Groove, LED filament is arranged in holding tank, is connected with the inwall of transparent heat conductor.
10. the preparation method of the LED filament lamp of solid conductive heat according to claim 9, it is characterised in that in transparent heat conduction
Transparent thermal conducting agent is respectively coated between body and LED filament, cell-shell, and is heated, the solidification of transparent thermal conducting agent, transparent heat conductor with
LED filament, cell-shell are fixedly connected.
11. the preparation method of the LED filament lamp of solid conductive heat according to claim 8, it is characterised in that transparent conductive fluid
Body, transparent thermal conducting agent are respectively liquid silica gel, organic resin, or glass dust.
12. the preparation method of the LED filament lamp of a kind of solid conductive heat, it is characterised in that including preparing transparent heat conductor, assembling；
The preparation process of transparent heat conductor is：LED filament is positioned in mould, transparent heat-conducting liquid is injected in a mold, is entered
The capable shaping that is heating and curing, obtains transparent heat conductor, LED filament is coated in transparent heat conductor；
Installation step is：The transparent heat conductor for being coated with LED filament is put into cell-shell, and contacts with cell-shell connection；LED filament
Contact conductor stretch out cell-shell, be connected with driver；Driver is installed in lamp holder.
13. the preparation method of the LED filament lamp of solid conductive heat according to claim 12, it is characterised in that led transparent
Transparent thermal conducting agent is coated between hot body and cell-shell, and is heated, transparent thermal conducting agent solidification, transparent heat conductor is fixed with cell-shell to be connected
Connect.
14. the preparation method of the LED filament lamp of solid conductive heat according to claim 12, it is characterised in that transparent heat conduction
Liquid, transparent thermal conducting agent are respectively liquid silica gel, organic resin, or glass dust.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710537465.4A CN107300132A (en) | 2017-07-04 | 2017-07-04 | A kind of LED filament lamp of solid conductive heat and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710537465.4A CN107300132A (en) | 2017-07-04 | 2017-07-04 | A kind of LED filament lamp of solid conductive heat and preparation method thereof |
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| CN107300132A true CN107300132A (en) | 2017-10-27 |
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| CN201710537465.4A Pending CN107300132A (en) | 2017-07-04 | 2017-07-04 | A kind of LED filament lamp of solid conductive heat and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110553163A (en) * | 2019-10-17 | 2019-12-10 | 湖南匡楚科技有限公司 | High-heat-conductivity LED filament lamp and manufacturing method thereof |
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| CN202972617U (en) * | 2012-11-05 | 2013-06-05 | 浙江锐迪生光电有限公司 | Ceramic tube LED (Light Emitting Diode) lamp |
| CN204153540U (en) * | 2014-10-31 | 2015-02-11 | 上海博恩世通光电股份有限公司 | A kind of wide-angle light extracting LED bulb lamp |
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