CN107275518B - OLED film packaging structure and packaging device - Google Patents
OLED film packaging structure and packaging device Download PDFInfo
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- CN107275518B CN107275518B CN201710543501.8A CN201710543501A CN107275518B CN 107275518 B CN107275518 B CN 107275518B CN 201710543501 A CN201710543501 A CN 201710543501A CN 107275518 B CN107275518 B CN 107275518B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 54
- 239000005022 packaging material Substances 0.000 claims abstract description 117
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000010408 film Substances 0.000 claims description 26
- 238000005538 encapsulation Methods 0.000 claims description 24
- 230000002093 peripheral effect Effects 0.000 claims description 21
- 239000010409 thin film Substances 0.000 claims description 21
- 230000007246 mechanism Effects 0.000 claims description 10
- 238000003754 machining Methods 0.000 claims description 2
- 238000005336 cracking Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 115
- 239000000463 material Substances 0.000 description 22
- 239000002245 particle Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses an OLED film packaging structure and a packaging device, wherein the OLED film packaging structure comprises: the device comprises a substrate, a pixel area and a processing area, wherein the substrate is provided with the pixel area and the processing area; the first packaging material layer is laid on the substrate, and the part of the first packaging material layer, which is positioned in the processing area, is a first processing area; the second packaging material layer is laid on the first packaging material layer, the part, located in the processing area, of the second packaging material layer is a second processing area, the surface, close to the second packaging material layer, of the first packaging material layer is a first surface, the surface, close to the first packaging material layer, of the second packaging material layer is a second surface, in the first processing area, at least part of the area of the first surface is provided with a groove, and the second surface is provided with a protrusion matched with the groove. According to the OLED film packaging structure, the bonding area between the first packaging material layer and the second packaging material layer can be increased, and the risk of cracking of the first packaging material layer and the second packaging material layer is reduced.
Description
Technical Field
The invention relates to the technical field of flexible OLED packaging, in particular to an OLED film packaging structure and a packaging device.
Background
In recent years, as market demand is continuously increasing, flexible OLED (Organic Light-Emitting Diode, UIV OLED) is shown as an important direction for development of display industry, the service life of the product is determined by the quality of the OLED packaging technology, and the three-layer-stacked structure (CVD-planarization-CVD) becomes a main mode of the current flexible OLED packaging due to its excellent performance. The first inorganic layer of the three-layer stack is a smooth-surfaced substrate on which the organic planarization layer is obtained by ink-jet printing and then curing. In this structure, the organic layer and the first inorganic layer are most likely to crack from the edges due to the smooth surface of the first inorganic layer, thereby causing device failure.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides an OLED thin film packaging structure which has the advantage of high reliability.
The invention also provides an encapsulating device, which is used for processing the OLED film encapsulating structure.
The OLED thin film packaging structure comprises the following components: the device comprises a substrate, wherein a pixel area and a processing area are arranged on the substrate, the processing area is arranged around the pixel area, a boss is arranged on the periphery of the processing area, and the boss extends along the circumferential direction of the processing area; the first packaging material layer is laid on the substrate, and the part of the first packaging material layer, which is positioned in the processing area, is a first processing area; the second packaging material layer is laid on the first packaging material layer, the part of the second packaging material layer, which is located in the processing area, is a second processing area, the first packaging material layer is close to the surface of the second packaging material layer, which is a first surface, the surface of the second packaging material layer is close to the surface of the first packaging material layer, which is a second surface, in the first processing area, at least part of the area of the first surface is provided with a groove, and the second surface is provided with a protrusion matched with the groove.
According to the OLED thin film encapsulation structure provided by the embodiment of the invention, at least partial area of the first surface is provided with the groove in the first processing area, and the second surface is provided with the protrusion matched with the groove. The bonding area between the first packaging material layer and the second packaging material layer can be increased, and the bonding force is increased, so that the risk of cracking of the first packaging material layer and the second packaging material layer is reduced.
According to some embodiments of the invention, the first encapsulation material layer covers the pixel region and the processing region.
According to some embodiments of the invention, an outer circumferential edge of the second material layer is in contact with an inner circumferential wall of the boss.
According to some embodiments of the invention, an outer peripheral edge of the pixel region is directly connected to an inner peripheral edge of the processing region, and an outer peripheral edge of the processing region is directly connected to an inner peripheral wall of the boss.
According to some embodiments of the invention, the width of the treatment zones is equal in the circumferential direction of the treatment zones.
According to the packaging device for OLED film packaging provided by the embodiment of the invention, the packaging device for OLED film packaging is used for processing the OLED film packaging structure, the OLED film packaging structure is the OLED film packaging structure, and the packaging device for OLED film packaging comprises: a frame; the roller assembly is movably arranged on the rack and is suitable for machining the groove in the first surface.
According to the OLED film packaging device provided by the embodiment of the invention, at least partial area of the first surface is provided with the groove in the first processing area, and the second surface is provided with the protrusion matched with the groove. The bonding area between the first packaging material layer and the second packaging material layer can be increased, and the bonding force is increased, so that the risk of cracking of the first packaging material layer and the second packaging material layer is reduced.
According to some embodiments of the invention, the rack comprises: a first bar extending in a first direction; a second bar connected to the first bar and movable in the first direction, the second bar extending in a second direction perpendicular to the first direction; the third rod piece is connected with the second rod piece and can move in the second direction, the third rod piece extends in a third direction, the third direction is perpendicular to the first direction and the second direction respectively, and the roller assembly is arranged on the third rod piece.
In some embodiments of the present invention, a driving mechanism is disposed on the second rod, and the driving mechanism drives the third rod to move along the third direction.
According to some embodiments of the invention, the roller assembly comprises: the device comprises a shell, a first fixing piece and a second fixing piece, wherein one side of the shell is provided with a mounting groove; the bracket is positioned in the mounting groove, and one end of the bracket is connected with the shell; and the roller is suitable for pressing the first surface out of the groove, and the roller is pivotally connected with the other end of the bracket.
In some embodiments of the present invention, a plurality of air outlets are disposed on a side wall of the mounting groove, and a plurality of first air inlets are disposed on a bottom wall of the mounting groove.
In some embodiments of the invention, the included angle between the side wall of the mounting groove and the bottom wall of the mounting groove is α, and the α satisfies the condition that 15 degrees is less than or equal to α degrees and less than or equal to 75 degrees.
In some embodiments of the present invention, the end surface of the housing having the mounting groove has a plurality of second suction holes spaced apart in a circumferential direction of the open mouth of the mounting groove.
In some embodiments of the present invention, the width of the roller is less than or equal to the width of the treatment zone.
In some embodiments of the present invention, a distance from a point on the roller farthest from the bottom wall of the mounting groove to the bottom wall of the mounting groove is L1, a depth of the mounting groove is L2, and the following requirements are satisfied: L1-L2 is more than or equal to 10 and less than or equal to 100 um.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of an OLED thin film encapsulation structure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an OLED thin film encapsulation structure according to an embodiment of the present invention, wherein the second encapsulation material layer is not shown;
FIG. 3 is a schematic structural diagram of a substrate of an OLED thin film encapsulation structure according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an OLED thin film encapsulation structure and an OLED thin film encapsulation device according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a roller assembly of the packaging apparatus according to an embodiment of the present invention.
Reference numerals:
the OLED thin-film encapsulation structure 100 is,
a substrate 11, a pixel region 111, a processing region 112, a boss 113,
the first packaging material layer 12, the first processed region 121, the first surface 122, the recess 123,
the second packaging material layer 13, the second processed region 131,
the packaging of the device 200 is carried out,
a frame 21, a first rod 211, a first slider 212, a second rod 213, a second slider 214, a third rod 215,
the roller assembly 22, the housing 221, the mounting groove 222, the air outlet 223, the first suction hole 224, the second suction hole 225, the bracket 226, the roller 227,
and a CCD surface treatment device 23.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "length", "width", "up", "down", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations or positional relationships that are based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus are not to be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
An OLED thin film encapsulation structure 100 according to an embodiment of the present invention is described below with reference to fig. 1 to 3.
Specifically, as shown in fig. 1 to 3, the OLED thin film encapsulation structure 100 according to the embodiment of the present invention includes a substrate 11, a first encapsulation material layer 12, and a second encapsulation material layer 13.
As shown in fig. 3, a pixel region 111 and a processing region 112 are provided on the substrate 11, the processing region 112 is provided around the pixel region 111, a boss 113 is provided along an outer periphery of the processing region 112, and the boss 113 extends in a circumferential direction of the processing region 112. For example, in the example shown in fig. 3, the substrate 11 is a rectangular plate, the pixel region 111 is a rectangular region, the pixel region 111 is provided at a middle position of the substrate 11, the outside of the pixel region 111 is the processing region 112, the processing region 112 is a rectangular ring region, the outer periphery of the processing region 112 is provided with a boss 113, the boss 113 extends from the upper surface of the substrate 11 in a direction away therefrom, and the boss 113 extends in a ring shape in the circumferential direction of the processing region 112, the end surface of the free end of the boss 113 is higher than the upper surface of the substrate 11.
As shown in fig. 2, the first packaging material layer 12 is disposed on the substrate 11, the first packaging material layer 12 may be an inorganic layer, the first packaging material layer 12 covers the pixel region 111 and the processing region 112, and a portion of the first packaging material layer 12 located in the processing region 112 is a first processing region 121. The first packaging material layer 12 can be arranged in the space defined by the boss 113, and the outer periphery of the first packaging material layer 12 is in contact with the inner peripheral wall of the boss 113; of course, the edge of the first packaging material layer 12 may also exceed the peripheral wall of the boss 113, as shown in fig. 2, when the first packaging material layer 12 is laid on the substrate 11, due to the existence of the boss 113, the region of the first packaging material layer 12 corresponding to the boss 113 may be recessed toward the direction away from the substrate 11 in the laying process to form a groove, the groove is matched with the boss 113, and the outer wall surface of the boss 113 is attached to the inner wall surface of the groove.
As shown in fig. 1, the second packaging material layer 13 is laid on the first packaging material layer 12, the second packaging material layer 13 may be an organic layer, the second packaging material layer 13 is located inside the space defined by the boss 113, the outer circumferential edge of the second packaging material layer 13 is in contact with the inner circumferential wall of the boss 113, and the portion of the second packaging material layer 13 located in the processing area 112 is a second processing area 131. The second packaging material layer 13 may be obtained by solidifying a liquid, after the first packaging material layer 12 is laid, a liquid of a second material is poured into the space defined by the boss 113, and after the liquid is solidified, the second packaging material layer 13 is formed, and the boss 113 may play a role in collecting and fixing the liquid of the second material. In addition, when the first packaging material layer 12 is located in the boss 113, the outer peripheral edge of the second packaging material layer 13 directly contacts with the inner peripheral wall of the boss 113, when the edge of the first packaging material layer 12 exceeds the outer peripheral wall of the boss 113, the outer peripheral edge of the second packaging material layer 13 indirectly contacts with the inner peripheral wall of the boss 113, and the first packaging material layer 12 is arranged between the outer peripheral edge of the second packaging material layer 13 and the inner peripheral wall of the boss 113.
The surface of the first packaging material layer 12 close to the second packaging material layer 13 is a first surface 122, the surface of the second packaging material layer 13 close to the first packaging material layer 12 is a second surface, at least a partial area of the first surface 122 is provided with a groove 123 in the first processing area 121, and the second surface is provided with a protrusion matching with the groove 123. Therefore, the bonding area between the first packaging material layer 12 and the second packaging material layer 13 can be increased, the bonding force is increased, the risk of cracking of the first packaging material layer 12 and the second packaging material layer 13 is reduced, and the reliability of packaging is improved.
It should be noted that there may be a plurality of grooves 123, and the plurality of grooves 123 may be disposed in a partial area of the first surface 122 in the first processing region 121, or may be disposed in the entire area of the first surface 122 in the first processing region 121.
According to the OLED thin film encapsulation structure 100 of the embodiment of the present invention, the groove 123 is disposed on at least a partial region of the first surface 122 in the first processing region 121, and the protrusion matched with the groove 123 is disposed on the second surface. The bonding area between the first packaging material layer 12 and the second packaging material layer 13 can be increased, and the bonding force is increased, so that the risk of cracking of the first packaging material layer 12 and the second packaging material layer 13 is reduced, and the reliability of the package is improved.
In some embodiments of the present invention, as shown in fig. 3, the outer peripheral edge of the pixel region 111 is directly connected to the inner peripheral edge of the processing region 112, and the outer peripheral edge of the processing region 112 is directly connected to the inner peripheral wall of the boss 113. This makes it possible to make the structure on the substrate 11 more compact and save space on the substrate 11. Of course, the present invention is not limited thereto, and the outer circumferential edge of the pixel region 111 and the inner circumferential edge of the processing region 112 may have a certain distance therebetween, that is, the pixel region 111 and the processing region 112 are disposed at a distance. When the pixel region 111 and the processing region 112 are disposed at an interval, the first packaging material layer 12 may be a whole, that is, the first packaging material layer 12 covers the pixel region 111, the processing region 112 and the blank region between the pixel region 111 and the processing region 112, so that the risk of cracking between the first packaging material layer 12 and the second packaging material layer 13 may be reduced, and the reliability of the package may be improved.
In some embodiments of the present invention, as shown in fig. 1-3, the width of the treatment zones 112 is equal in the circumferential direction of the treatment zones 112. Accordingly, the first treated region 121 and the second treated region 131 are equal in width in the circumferential direction thereof. Therefore, the first packaging material layer 12 and the second packaging material layer 13 can be combined more uniformly in the circumferential direction, the risk that the first packaging material layer 12 and the second packaging material layer 13 are cracked due to unreliable combination in a certain place is prevented, and the reliability of packaging is improved.
An encapsulation apparatus 200 for thin film encapsulation of an OLED according to an embodiment of the present invention is described below with reference to fig. 1 to 5.
The packaging device 200 for OLED film packaging according to an embodiment of the present invention is used for processing the OLED film packaging structure 100, the OLED film packaging structure 100 is the above OLED film packaging structure 100, and the packaging device 200 for OLED film packaging includes a frame 21 and a roller assembly 22.
Specifically, as shown in fig. 4, the roller assembly 22 is movably disposed on the frame 21, and the roller assembly 22 is adapted to machine the first surface with the groove 123. When the roller assembly 22 rolls on the first processing region 121, the groove 123 may be formed on the first surface, and when the liquid of the second material is poured into the space defined by the boss 113 and the second material is cured to form the second packaging material layer 13, the second surface of the second packaging material layer 13 forms a protrusion that is matched with the groove 123, so as to increase the bonding area between the first packaging material layer 12 and the second packaging material layer 13, thereby increasing the bonding force between the first packaging material layer 12 and the second packaging material layer 13, reducing the risk of cracking between the first packaging material layer 12 and the second packaging material layer 13, and improving the reliability of packaging.
According to the encapsulating device 200 for the OLED thin film encapsulation of the embodiment of the invention, at least a partial region of the first surface 122 is provided with the groove 123 in the first processing region 121, and the second surface is provided with the protrusion matched with the groove 123. The bonding area between the first packaging material layer 12 and the second packaging material layer 13 can be increased, and the bonding force is increased, so that the risk of cracking of the first packaging material layer 12 and the second packaging material layer 13 is reduced, and the reliability of the package is improved.
In some embodiments of the present invention, as shown in fig. 4, the frame 21 includes a first bar 211, a second bar 213, and a third bar 215. The first rod 211 extends along a first direction, the second rod 213 is connected with the first rod 211 and the second rod 213 is movable along the first direction, the second rod 213 extends along a second direction, the second direction is perpendicular to the first direction, the third rod 215 is connected with the second rod 213 and the third rod 215 is movable along the second direction, the third rod 215 extends along a third direction, the third direction is perpendicular to the first direction and the second direction, respectively, and the roller assembly 22 is disposed on the third rod 215.
Thereby, the roller assembly 22 can be moved in the first direction and the second direction, so that the roller assembly 22 can roll in the first treatment region 121 to machine the first surface 122 with the groove 123, and further form the protrusion matching with the groove 123 on the second surface during the curing process of the second packaging material layer 13. Therefore, the bonding area of the first packaging material layer 12 and the second packaging material layer 13 is increased, the bonding force between the first packaging material layer 12 and the second packaging material layer 13 is increased, the risk of cracking between the first packaging material layer 12 and the second packaging material layer 13 is reduced, and the packaging reliability is improved.
Further, a driving mechanism is disposed on the second rod 213, and the driving mechanism drives the third rod 215 to move along the third direction. The third direction is perpendicular to the substrate 11, the first direction and the second direction are parallel to the substrate 11, the driving mechanism can control the third rod 215 to move along the third direction, the third rod 215 drives the roller assembly 22 to press down, the downward pressure of the roller assembly 22 on the first surface 122 is controlled according to the downward movement distance of the third rod 215, and the depth of the groove 123 can be adjusted by controlling the downward pressure. The driving mechanism may be a screw mechanism, and of course, may also be other mechanisms that can move the third rod 215 in the third direction.
As shown in fig. 4, the frame 21 further includes a first slider 212 and a second slider 214, the first slider 212 is connected to the second rod 213, the first slider 212 is movable on the first rod 211 in a first direction, the second slider 214 is connected to the third rod 215, and the second slider 214 is movable on the second rod 213 in a second direction. This can simplify the structure of the frame 21.
In some embodiments of the present invention, as shown in fig. 4, the packaging apparatus 200 further includes an alignment CCD surface processing device 23, and the alignment CCD surface processing device 23 is used for finding the MARK on the substrate 11 for alignment, so as to ensure the correctness of the moving track of the roller assembly 22.
In some embodiments of the present invention, as shown in FIG. 5, the scroll wheel assembly 22 includes: the first surface pressing device comprises a shell 221, a bracket 226 and a roller 227, wherein one side of the shell 221 is provided with a mounting groove 222, the bracket 226 is positioned in the mounting groove 222, one end of the bracket 226 is connected with the shell 221, the roller 227 is pivotally connected with the other end of the bracket 226, and the roller 227 is suitable for pressing the first surface out of a groove 123. For example, in the example shown in fig. 5, the bracket 226 is located in the mounting groove 222 and one end of the bracket 226 is connected to the bottom wall of the mounting groove 222 and the bracket 226 is located at the center of the mounting groove 222, the other end of the bracket 226 extends toward the opening direction of the mounting groove 222, the roller 227 is pivotally connected to the other end of the bracket 226, and the roller 227 and the bracket 226 are in shaft clearance fit. The roller 227 is in contact friction with the first processing area 121 of the first packaging material layer 12 to generate irregular grooves 123, particles are generated by friction, the roller 227 is covered by the shell 221, and particles generated in the friction process can be prevented from leaking.
Further, be equipped with a plurality of ventholes 223 on the lateral wall of mounting groove 222, a plurality of ventholes 223 are along the even interval distribution of the circumferential direction of mounting groove 222, are equipped with a plurality of first air suction holes 224 on the diapire of mounting groove 222, and a plurality of first air suction holes 224 are even interval distribution on the diapire of mounting groove 222. The air outlet 223 can blow up the debris particles generated by the friction of the roller 227 on the first surface 122, and the first air suction hole 224 sucks away the debris to prevent the debris from leaking.
Furthermore, the included angle between the side wall of the mounting groove 222 and the bottom wall of the mounting groove 222 is α, which is equal to or greater than 15 degrees and equal to or less than α degrees and equal to or less than 75 degrees, so that the air outlet 223 can better blow up the debris particles generated during the friction process between the roller 227 and the first surface 122, and further can be sucked away from the first air suction hole 224, and furthermore, α is equal to or greater than 15 degrees and equal to or less than α degrees and equal to or less than 30 degrees, so that the air outlet 223 can better blow up the debris particles generated during the friction process between the roller 227 and the first surface 122, and further can be sucked away from the first air suction hole 224.
As shown in fig. 5, the end surface of the case 221 having the mounting groove 222 has a plurality of second suction holes 225, and the plurality of second suction holes 225 are spaced apart in the circumferential direction of the open opening of the mounting groove 222. Thereby, the debris particles between the end surface of the casing 221 and the first surface 122 can be sucked away by the second suction holes 225, avoiding the debris particles and the like from leaking out through the gap between the end surface of the casing 221 and the first surface 122. As shown in fig. 5, the diameter of the second suction holes 225 is smaller than that of the first suction holes 224, but the present invention is not limited thereto as long as the debris particles can be reasonably arranged and sucked away.
In some embodiments of the present invention, the width of the roller 227 is less than or equal to the width of the processing region 112, and the roller 227 rolls at the middle position of the first processing region 121. Therefore, the roller 227 can be prevented from rolling the groove 123 on the region outside the first processing region 121, for example, the region corresponding to the pixel region 111, thereby ensuring the reliability of the OLED package. Further, the width of the roller 227 is D, D satisfies: d is more than or equal to 0.1 and less than or equal to 1mm, the diameter of the roller 227 is D, and D satisfies the following conditions: d is more than or equal to 0.8 and less than or equal to 1.2mm, the height of the bracket 226 is h, and h satisfies that h is more than or equal to 8 and less than or equal to 12 mm.
In some embodiments of the present invention, the bottom wall of the mounting groove 222 has a size of about 10x10mm, and the outer size of the housing 221 is 15x15 mm. Of course, the present invention is not limited thereto, and the size of the bottom wall of the mounting groove 222 and the outer size of the housing 221 may be adjusted based on actual requirements.
In some embodiments of the present invention, a distance from a point of the roller 227 farthest from the bottom wall of the mounting groove 222 to the bottom wall of the mounting groove 222 is L1, a depth of the mounting groove 222 is L2, and the following requirements are satisfied: L1-L2 is more than or equal to 10 and less than or equal to 100 um. Therefore, when the roller 227 contacts the first surface 122, the housing 221 does not contact the first surface 122, and the roller 227 presses down to form the groove 123 on the first surface 122.
In some embodiments of the present invention, the bracket 226 and the fixing portion at the bottom of the bracket 226 are made of stainless steel, the surface of the roller 227 is made of nylon material or carbon fiber reinforced plastic, and the inside of the roller 227 is made of stainless steel. Thereby, it is possible to enhance the structural strength of the bracket 226 and the roller 227, and also to form the groove 123 on the first surface.
An encapsulation process of the OLED thin film encapsulation structure 100 according to an embodiment of the present invention is described below.
After the deposition of the first packaging material layer 12 is completed, the roller 227 of the roller assembly 22 rubs the first processing area 121 to form a tiny irregular groove 123 on the first surface 122, the second packaging material layer is printed inside the boss 113, and the irregular groove 123 on the first surface 122 of the first packaging material layer 12 increases the bonding area between the second packaging material layer 13 and the first packaging material layer 12, increases the bonding force, and thus reduces the risk of cracking of the first packaging material layer 12 and the second packaging material layer 13. Meanwhile, the processing region 112 is located between the boss 113 and the pixel region 111, and the first packaging material layer above the pixel region 111 is still smooth in surface, so that the transmittance of the film is not affected.
Of course, the third packaging material layer (e.g., inorganic layer) of the thin film packaging structure 100 and the second packaging material layer 13 can be packaged in the above manner. For example, before the second encapsulating material layer 13 is not completely cured, a third encapsulating material layer may be laid on the second encapsulating material layer 13, and the roller 227 rolls on a side of the third encapsulating material layer away from the second encapsulating material layer, the third encapsulating material layer protrudes toward the second encapsulating material layer, and a groove matched with the protrusion is formed on the second encapsulating material layer, so as to increase a bonding area between the second encapsulating material layer and the third encapsulating material layer, and improve reliability of encapsulation.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. An OLED thin film packaging encapsulation device, the OLED thin film packaging encapsulation device is used for processing the OLED thin film packaging structure, and the OLED thin film packaging structure comprises:
the device comprises a substrate, wherein a pixel area and a processing area are arranged on the substrate, the processing area is arranged around the pixel area, a boss is arranged on the periphery of the processing area, and the boss extends along the circumferential direction of the processing area;
the first packaging material layer is laid on the substrate, and the part of the first packaging material layer, which is positioned in the processing area, is a first processing area;
the second packaging material layer is laid on the first packaging material layer, the part of the second packaging material layer, which is positioned in the processing area, is a second processing area, the surface of the first packaging material layer, which is close to the second packaging material layer, is a first surface, the surface of the second packaging material layer, which is close to the first packaging material layer, is a second surface, in the first processing area, at least part of the area of the first surface is provided with a groove, and the second surface is provided with a protrusion matched with the groove,
the packaging device for OLED film packaging comprises:
a frame;
the roller assembly is movably arranged on the frame and is suitable for machining the groove in the first surface, and the roller assembly comprises:
the device comprises a shell, a first fixing piece and a second fixing piece, wherein one side of the shell is provided with a mounting groove;
the bracket is positioned in the mounting groove, and one end of the bracket is connected with the shell; and
a roller adapted to press the first surface out of the groove, the roller being pivotally connected to the other end of the bracket,
the side wall of the mounting groove is provided with a plurality of air outlets, and the bottom wall of the mounting groove is provided with a plurality of first air suction holes.
2. The OLED film packaged packaging device of claim 1, wherein the first packaging material layer covers the pixel region and the processing region.
3. The OLED film packaged packaging device according to claim 1, wherein the outer circumference of the second packaging material layer is in contact with the inner circumference wall of the boss.
4. The OLED film packaged packaging device according to claim 1, wherein the outer peripheral edge of the pixel region is directly connected with the inner peripheral edge of the processing region, and the outer peripheral edge of the processing region is directly connected with the inner peripheral wall of the boss.
5. The OLED film encapsulated package device of claim 1, wherein said treated regions are of equal width in a circumferential direction of said treated regions.
6. The OLED film packaged encapsulation device of claim 1, wherein the frame comprises:
a first bar extending in a first direction;
a second bar connected to the first bar and movable in the first direction, the second bar extending in a second direction perpendicular to the first direction;
the third rod piece is connected with the second rod piece and can move in the second direction, the third rod piece extends in a third direction, the third direction is perpendicular to the first direction and the second direction respectively, and the roller assembly is arranged on the third rod piece.
7. The OLED film packaging and packaging device as claimed in claim 6, wherein a driving mechanism is disposed on the second rod, and the driving mechanism drives the third rod to move along the third direction.
8. The OLED film packaged packaging device as claimed in claim 1, wherein the included angle between the side wall of the mounting groove and the bottom wall of the mounting groove is α, and the α satisfies the condition of 15 ° ≦ α ≦ 75 °.
9. The OLED film package packaging device of claim 1, wherein the end surface of the housing having the mounting groove has a plurality of second suction holes spaced along a circumferential direction of the open opening of the mounting groove.
10. The OLED film packaged encapsulation device of claim 1, wherein the width of the roller is less than or equal to the width of the processing region.
11. The OLED thin film packaging and packaging device as claimed in claim 1, wherein a point on the roller farthest from the bottom wall of the mounting groove is at a distance L1 from the bottom wall of the mounting groove, the depth of the mounting groove is L2, and the following conditions are satisfied: L1-L2 is more than or equal to 10 and less than or equal to 100 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710543501.8A CN107275518B (en) | 2017-07-05 | 2017-07-05 | OLED film packaging structure and packaging device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710543501.8A CN107275518B (en) | 2017-07-05 | 2017-07-05 | OLED film packaging structure and packaging device |
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| CN107275518A CN107275518A (en) | 2017-10-20 |
| CN107275518B true CN107275518B (en) | 2020-04-17 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983290A (en) * | 2012-11-21 | 2013-03-20 | 京东方科技集团股份有限公司 | Organic light-emitting diode (OLED) device packaging method and OLED display device |
| CN105206763A (en) * | 2015-10-21 | 2015-12-30 | 京东方科技集团股份有限公司 | Flexible displayer and production method thereof |
| CN106848087A (en) * | 2015-12-07 | 2017-06-13 | 上海和辉光电有限公司 | Display module encapsulating structure and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102414110B1 (en) * | 2015-09-07 | 2022-06-29 | 삼성디스플레이 주식회사 | Display apparatus |
| CN105870355A (en) * | 2016-05-27 | 2016-08-17 | 京东方科技集团股份有限公司 | Flexible OLED device and preparation method thereof |
| CN106873839B (en) * | 2017-02-15 | 2019-09-13 | 上海天马微电子有限公司 | A kind of touch-control display panel and touch control display apparatus |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983290A (en) * | 2012-11-21 | 2013-03-20 | 京东方科技集团股份有限公司 | Organic light-emitting diode (OLED) device packaging method and OLED display device |
| CN105206763A (en) * | 2015-10-21 | 2015-12-30 | 京东方科技集团股份有限公司 | Flexible displayer and production method thereof |
| CN106848087A (en) * | 2015-12-07 | 2017-06-13 | 上海和辉光电有限公司 | Display module encapsulating structure and preparation method thereof |
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