CN107271881A - A kind of EMC two-dimensional scan imaging systems for printed circuit board (PCB) - Google Patents

A kind of EMC two-dimensional scan imaging systems for printed circuit board (PCB) Download PDF

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Publication number
CN107271881A
CN107271881A CN201710422610.4A CN201710422610A CN107271881A CN 107271881 A CN107271881 A CN 107271881A CN 201710422610 A CN201710422610 A CN 201710422610A CN 107271881 A CN107271881 A CN 107271881A
Authority
CN
China
Prior art keywords
slideway
host computer
emc
motion control
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710422610.4A
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Chinese (zh)
Inventor
闻映红
曹鹤飞
任杰
陈嘉祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Jiaotong University
Original Assignee
Beijing Jiaotong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Jiaotong University filed Critical Beijing Jiaotong University
Priority to CN201710422610.4A priority Critical patent/CN107271881A/en
Publication of CN107271881A publication Critical patent/CN107271881A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
    • G01R31/002Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit

Abstract

The present invention discloses a kind of EMC two-dimensional scan imaging systems for printed circuit board (PCB), and the system includes host computer and the mechanical scanning system with the upper mechatronics;The host computer is used to send motion control instruction to the mechanical scanning system and frequency sweep is instructed, and receives the field strength data of the mechanical scanning system transmission, generates scan image;The mechanical scanning system includes motion control unit, field intensity probe and frequency spectrograph;The mechanical control unit is used for the motion control instruction for receiving the host computer, drives the field intensity probe to be moved to specified location;The frequency spectrograph is used for the frequency sweep instruction for receiving the host computer, read the field strength data of the field intensity probe, and it is uploaded to the host computer, the present invention can accurately position the interference source of radiation and crucial IC electromagnetic compatibilities are assessed, fundamentally solve electromagnetic compatibility problem, the production efficiency and qualification rate of product are improved, cost is reduced.

Description

A kind of EMC two-dimensional scan imaging systems for printed circuit board (PCB)
Technical field
The present invention relates to EMC near-field test technical fields.More particularly, to a kind of EMC bis- for printed circuit board (PCB) Tie up scanning imaging system.
Background technology
Product can only obtain whether product is up to state standards and exceeded frequency by standard testing (far field test) The conclusion of point, once and product can not it is up to standard, by detection, engineer can only light from the exceeded frequency on examining report Hand, goes to improve the electromagnetic compatibility of product with the experience of oneself, and the product that engineer can not be after changing intuitively finds out it Whether Time To Market and the increasing of product, consequently, it is possible to carrying out repeated detection and improvement, can be increased by detection next time Plus product cost.One product have electromagnetic compatibility problem can not representative products whole circuit it is all problematic, it be probably by Caused by some part, some chip, some pin or place and route of product etc., if now can accurately find this A little radiation sources are simultaneously improved and just can easily solve electromagnetic compatibility problem.But want accurately to find in actual debugging Radiation source needs engineer to have abundant Electric Circuit Electromagnetic Compatibility knowledge.Even if experience is relatively enriched, also not necessarily can be accurate Find radiation source.Now we can only take the measures such as shielding, filtering to whole product, electromagnetic radiation pass in product Portion.The cost and power consumption of product can so be increased, and effect is nor highly desirable, it is impossible to fundamentally solve radiation problem.
Accordingly, it is desirable to provide a kind of system that can accurately detect product radiation position, improve product production efficiency and Qualification rate, reduces cost.
The content of the invention
It is an object of the present invention to provide a kind of EMC (electromagnetic compatibility) two-dimensional scan imaging for printed circuit board (PCB) System, the interference source of accurate positioning radiation is simultaneously assessed crucial IC electromagnetic compatibilities, fundamentally solves electromagnetic compatibility Problem, improves the production efficiency and qualification rate of product, reduces cost.
To reach above-mentioned purpose, the present invention uses following technical proposals:
The invention discloses a kind of EMC two-dimensional scan imaging systems for printed circuit board (PCB), the system includes upper Machine and the mechanical scanning system with the upper mechatronics;
The host computer is used to send motion control instruction to the mechanical scanning system and sends frequency sweep instruction, receives institute The field strength data of mechanical scanning system transmission are stated, scan image is generated;
The mechanical scanning system includes motion control unit, field intensity probe and frequency spectrograph;
The motion control unit is used for the motion control instruction for receiving the host computer, drives the field intensity probe movement To specified location;
The frequency spectrograph is used for the frequency sweep instruction for receiving the host computer, reads the field strength data of the field intensity probe, and It is uploaded to the host computer.
Preferably, the motion control unit includes mechanical control unit and mechanical transmission unit;
The mechanical control unit is used for the motion control instruction for receiving the host computer;
The mechanical transmission unit is used to perform the motion control instruction, drives the field intensity probe to be moved to specific bit Put.
Preferably, the mechanical control unit is PLC logic controllers.
Preferably, the mechanical transmission unit includes parallel the first slideway and the second slideway and is vertical at described the The 3rd slideway on one slideway and the second slideway;
The infall of first slideway and the 3rd slideway, second slideway and the 3rd slideway is respectively equipped with For the first sliding block and the second sliding block for driving the 3rd slideway to be slided in first slideway and the second slideway;
3rd slideway is provided with the 3rd cunning for being used for fixing the field intensity probe, can be slided along the 3rd slideway Block;
Each slideway is provided with a stepper motor for being used to drive correspondence sliding block.
Preferably, the stepping motor synchronous operation of first slideway and the second slideway.
Preferably, the field intensity probe includes electric field probe and magnet field probe;
The electric field probe is used to detect electric field information;
The magnet field probe is used to detect Magnetic Field.
Preferably, the host computer is communicated by serial ports with the mechanical scanning system.
Beneficial effects of the present invention are as follows:
Analysis detection of the invention primarily directed to PCB, the wrong frequency of the compatibility of inspection product, confirmation, Follow the trail of rapid wear component, positioning source etc., application of the EMC electromagnetic compatibility two-dimensional scan imaging systems in PCB design and debugging, energy Help is pinpointed the problems early, with external electromagnetic interference inside adopt an effective measure in time elimination or suppression system, it is ensured that product E MC Test passes through, so as to accelerate product design process, improves Product Design Quality, saves product developing expense, reduces selling for product Services amount afterwards.
Brief description of the drawings
The embodiment to the present invention is described in further detail below in conjunction with the accompanying drawings.
Fig. 1 shows the signal according to a kind of EMC two-dimensional scan imaging system embodiments for printed circuit board (PCB) of the invention Figure.
Fig. 2 shows to be passed according to a kind of EMC two-dimensional scans imaging system embodiment machinery for printed circuit board (PCB) of the present invention The schematic diagram of moving cell.
Embodiment
In order to illustrate more clearly of the present invention, the present invention is done further with reference to preferred embodiments and drawings It is bright.Similar part is indicated with identical reference in accompanying drawing.It will be appreciated by those skilled in the art that institute is specific below The content of description is illustrative and be not restrictive, and should not be limited the scope of the invention with this.
Fig. 1 shows a kind of schematic diagram of EMC two-dimensional scan imaging system embodiments for printed circuit board (PCB) of the invention, institute State EMC two-dimensional scans imaging system includes host computer and the mechanical scanning system with the upper mechatronics including the system System.
User can send motion control instruction to the mechanical scanning system by host computer and frequency sweep is instructed, and receives described The field strength data of mechanical scanning system transmission, generate scan image.
The mechanical scanning system includes motion control unit, field intensity probe and frequency spectrograph.
The motion control unit is used for the motion control instruction for receiving the host computer, drives the field intensity probe movement To specified location.The frequency spectrograph is used for the frequency sweep instruction for receiving the host computer, reads the field strength data of the field intensity probe, And it is uploaded to the host computer.The motion control unit preferably may include motion control unit and mechanical transmission unit.
Wherein, the mechanical control unit can be used for the motion control instruction for receiving the host computer, then drive described Mechanical transmission unit performs the instruction.The motion control unit can select PLC logic controllers.
As shown in Fig. 2 the mechanical transmission unit can perform the fortune of host computer under the control of the mechanical control unit Dynamic control instruction, drives the field intensity probe to be moved to specified location.The mechanical transmission unit may include that parallel first is slided Road and the second slideway and the 3rd slideway being vertical on first slideway and the second slideway.First slideway with it is described The infall of 3rd slideway, second slideway and the 3rd slideway is respectively provided with drive the 3rd slideway described The first sliding block and the second sliding block that first slideway and the second slideway are slided.3rd slideway, which is provided with, to be used to fix the field strength Probe, the 3rd sliding block that can be slided along the 3rd slideway.Each slideway is provided with a stepping electricity for being used to drive correspondence sliding block Machine.Positioned at the preferred synchronous operation of stepper motor of the first sliding block and the second sliding block, the 3rd sliding block is controlled in the first sliding block With horizontal translation on the second sliding block, control the stepper motor operation on the lengthwise position of the field intensity probe, the 3rd sliding block controllable The lengthwise position of field intensity probe processed, so as to carry out the positioning of two-dimentional transverse and longitudinal coordinate to field intensity probe.
After user reads the field intensity probe from host computer is moved to specified location, user can be sent by host computer The frequency sweep instruction, the frequency spectrograph is received i.e. from field intensity probe reading field strength data after the frequency sweep instruction, and on Reach the host computer.The host computer recognizes troublesome frequencies by being scanned to the radiation on the products such as cable or PCB, Automatic identification peak position is simultaneously automatically converted to XY figures.It can be led to using highly sensitive probe and the XY mechanical devices of pinpoint accuracy Cross 2 dimension displays of RF streams, it may be determined that produce the track or element of problem, transmitting and vulnerability to jamming performance to PCB are analyzed, So as to recognizing troublesome frequencies, localizing emission source, following the trail of sensing element and examining homogeneity of product.Engineer just can be accurate Positioning radiation interference source and crucial IC electromagnetic compatibilities are assessed, so as to find the basic reason of electromagnetic problem.Pin To reason we need to only change the simple measure such as wiring on circuit board, the layout of element plus decoupling capacitor just can be from root Electromagnetic compatibility problem is solved on this so that product is tested by EMC.
The present invention is detected primarily directed to the analysis of PCB, can detect the field strength letter of measurand diverse location Number, the overall radiation colour temperature figure of output measurand, so as to check the compatibility of product, confirm the frequency of mistake, follow the trail of rapid wear Component, positioning source etc., application of the EMC electromagnetic compatibility two-dimensional scan imagers in PCB design and debugging can help to send out early With external electromagnetic interference inside existing problem, adopt an effective measure in time elimination or suppression system, it is ensured that product E MC tests pass through, So as to accelerate product design process, Product Design Quality is improved, product developing expense is saved, the after-sale service work of product is reduced Amount.
Obviously, the above embodiment of the present invention is only intended to clearly illustrate example of the present invention, and is not pair The restriction of embodiments of the present invention, for those of ordinary skill in the field, may be used also on the basis of the above description To make other changes in different forms, all embodiments can not be exhaustive here, it is every to belong to this hair Row of the obvious changes or variations that bright technical scheme is extended out still in protection scope of the present invention.

Claims (7)

1. a kind of EMC two-dimensional scan imaging systems for printed circuit board (PCB), it is characterised in that the system include host computer and With the mechanical scanning system of the upper mechatronics;
The host computer is used to send motion control instruction to the mechanical scanning system and frequency sweep is instructed, and receives the machinery and sweeps The field strength data of system transmission are retouched, scan image is generated;
The mechanical scanning system includes motion control unit, field intensity probe and frequency spectrograph;
The motion control unit is used for the motion control instruction for receiving the host computer, drives the field intensity probe to be moved to finger Positioning is put;
The frequency spectrograph is used for the frequency sweep instruction for receiving the host computer, reads the field strength data of the field intensity probe, and upload To the host computer.
2. EMC two-dimensional scans imaging system according to claim 1, it is characterised in that the motion control unit includes Mechanical control unit and mechanical transmission unit;
The mechanical control unit is used for the motion control instruction for receiving the host computer;
The mechanical transmission unit is used to perform the motion control instruction, drives the field intensity probe to be moved to specified location.
3. EMC two-dimensional scans imaging system according to claim 1, it is characterised in that the mechanical control unit is PLC Logic controller.
4. EMC two-dimensional scans imaging system according to claim 1, it is characterised in that the mechanical transmission unit includes The first parallel slideway and the second slideway and the 3rd slideway being vertical on first slideway and the second slideway;
The infall of first slideway and the 3rd slideway, second slideway and the 3rd slideway is respectively provided with The first sliding block and the second sliding block for driving the 3rd slideway to be slided in first slideway and the second slideway;
3rd slideway is provided with the 3rd sliding block for being used for fixing the field intensity probe, can be slided along the 3rd slideway;
Each slideway is provided with a stepper motor for being used to drive correspondence sliding block.
5. EMC two-dimensional scans imaging system according to claim 1, it is characterised in that first slideway and second is slided The stepping motor synchronous operation in road.
6. EMC two-dimensional scans imaging system according to claim 1, it is characterised in that the field intensity probe includes electric field Probe and magnet field probe;
The electric field probe is used to detect electric field information;
The magnet field probe is used to detect Magnetic Field.
7. EMC two-dimensional scans imaging system according to claim 1, it is characterised in that the host computer by serial ports with The mechanical scanning system communication.
CN201710422610.4A 2017-06-07 2017-06-07 A kind of EMC two-dimensional scan imaging systems for printed circuit board (PCB) Pending CN107271881A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710422610.4A CN107271881A (en) 2017-06-07 2017-06-07 A kind of EMC two-dimensional scan imaging systems for printed circuit board (PCB)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710422610.4A CN107271881A (en) 2017-06-07 2017-06-07 A kind of EMC two-dimensional scan imaging systems for printed circuit board (PCB)

Publications (1)

Publication Number Publication Date
CN107271881A true CN107271881A (en) 2017-10-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710422610.4A Pending CN107271881A (en) 2017-06-07 2017-06-07 A kind of EMC two-dimensional scan imaging systems for printed circuit board (PCB)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2788201Y (en) * 2004-12-08 2006-06-14 比亚迪股份有限公司 Electromagnetic compatible pre-scanning analyzer
US20130304413A1 (en) * 2012-05-10 2013-11-14 Hon Hai Precision Industry Co., Ltd. Computing device and method for testing electromagnetic compatiblity of printed circuit board
CN103941106A (en) * 2014-04-29 2014-07-23 工业和信息化部电子第五研究所 Electromagnetic field near-field scanning device and scanning method
CN105916300A (en) * 2015-02-23 2016-08-31 Ls产电株式会社 Printed circuit board design device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2788201Y (en) * 2004-12-08 2006-06-14 比亚迪股份有限公司 Electromagnetic compatible pre-scanning analyzer
US20130304413A1 (en) * 2012-05-10 2013-11-14 Hon Hai Precision Industry Co., Ltd. Computing device and method for testing electromagnetic compatiblity of printed circuit board
CN103941106A (en) * 2014-04-29 2014-07-23 工业和信息化部电子第五研究所 Electromagnetic field near-field scanning device and scanning method
CN105916300A (en) * 2015-02-23 2016-08-31 Ls产电株式会社 Printed circuit board design device

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Application publication date: 20171020

RJ01 Rejection of invention patent application after publication