CN107254280A - A kind of water-fast epoxy resin being bonded for dalle - Google Patents
A kind of water-fast epoxy resin being bonded for dalle Download PDFInfo
- Publication number
- CN107254280A CN107254280A CN201610995155.2A CN201610995155A CN107254280A CN 107254280 A CN107254280 A CN 107254280A CN 201610995155 A CN201610995155 A CN 201610995155A CN 107254280 A CN107254280 A CN 107254280A
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- parts
- epoxy resin
- water
- bonded
- dalle
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a kind of water-fast epoxy resin being bonded for dalle, represented with parts by weight, including 320 500 parts of bisphenol-s epoxy resin base-material, 52 83 parts of dodecenylsuccinic anhydride curing agent, 18 32 parts of dimethylformamide, 28 42 parts of filler, 19 27 parts of liquid polysulfide rubber, 17 32 parts of dimethyl methyl phosphonate.The present invention is by rationally controlling the proportioning between each reactant, rationally control reaction condition and prepare a kind of High-durability epoxy resin adhesive for applying to light industry and textile industry, with moisture-proof, excellent heat resistance, and the mechanical properties such as impact resistance also excellent performance, adhesive property is good, excellent in durability, and preparation method is simple and easy to apply, is adapted to industrialized production.
Description
Technical field
The present invention relates to high-molecular gel field, a kind of water-fast epoxy resin being bonded for dalle is specifically referred to.
Background technology
The adhesive product that house decoration adhesive is commonly used as light industry industry is widely used in decoration plastics or wooden
Material processing and other fields, for house decoration, need to use bonding agent when being bonded multilayer material.And it is conventional at present general
Logical bonding agent usually contains the organic poisons such as aldehydes, and its release can influence health.So, how to solve general adhesive and release
Put the technical problem that dusty gas is urgent need to resolve.
And epoxyn as a kind of environment-friendly type gel rubber material the problem of can solve the problem that existing building adhesive, institute
The epoxyn stated is the work that a class is formulated by epoxy resin base-material, curing agent, diluent, accelerator and filler
Journey adhesive.Because its adhesive property is good, feature is good, less expensive, technique for sticking easy, so existing in recent decades
Household electrical appliances, automobile, water conservancy traffic, electronic apparatus and aerospace industry field are widely used.With new and high technology and nanometer
Technology is continued to develop, and in recent years, the modification to epoxy resin deepens continuously, and interpenetrating networks, chemical copolymerization and nano-particle increase
The method extensive use such as tough, by epoxy preparation into various high-performance adhesive kinds it is also more and more.But it has one
Individual obvious shortcoming is toughness deficiency, easily poor impact resistance, cracking after solidification, and the shortcoming greatly limit answering for epoxy resin
With.The characteristic requirements more and more highers developed rapidly to epoxy resin of various materials, epoxy resin is solidified into epoxy resin
The emphasis of use research, people carry out solidification toughness reinforcing using a variety of methods to epoxy resin, so that its application field is more
Extensively.
The content of the invention
Dalle bonding is used in it is an object of the invention to provide a kind of and with the adhesive of efficient water-fast function.
The present invention is achieved through the following technical solutions：A kind of water-fast epoxy resin being bonded for dalle, with weight
Part represents, including 320-500 parts of bisphenol-s epoxy resin base-material, 52-83 parts of dodecenylsuccinic anhydride curing agent, dimethyl
18-32 parts of formamide, 28-42 parts of filler, 19-27 parts of liquid polysulfide rubber, 17-32 parts of dimethyl methyl phosphonate.In the present invention
Described bisphenol-s epoxy resin chemical name be bisphenol-S diglycidyl ether, referred to as BPS or KGEBS, be by bisphenol S with
Epoxychloropropane is in sodium hydroxide catalyzed lower obtained, bisphenol-s epoxy resin heat resistance height, and heat distortion temperature is than bisphenol-A ring
Oxygen tree fat high 60 ~ 700C solidfied materials cun are stable, and solvent resistance is good.
And described dodecenylsuccinic anhydride curing agent liquid is easily mixed with resin, working life is long, glue-line good toughness, resistance to
Thermal impact, good electrical property but resistance to chemical reagents is poor, are at room temperature liquid, are easily combined with epoxy resin, are commonly used in adhesive
A kind of curing agent.
Further, the filler is graphite microparticles.
Further, 330 parts of the bisphenol-s epoxy resin base-material, 54 parts of dodecenylsuccinic anhydride curing agent, diformazan
19 parts of base formamide, 30 parts of filler, 20 parts of liquid polysulfide rubber, 18 parts of dimethyl methyl phosphonate.
Further, 430 parts of the bisphenol-s epoxy resin base-material, 73 parts of dodecenylsuccinic anhydride curing agent, diformazan
26 parts of base formamide, 34 parts of filler, 23 parts of liquid polysulfide rubber, 26 parts of dimethyl methyl phosphonate.
Further, 492 parts of the bisphenol-s epoxy resin base-material, 81 parts of dodecenylsuccinic anhydride curing agent, diformazan
31 parts of base formamide, 40 parts of filler, 27 parts of liquid polysulfide rubber, 32 parts of dimethyl methyl phosphonate.
The present invention compared with prior art, with advantages below and beneficial effect：
The method of the present invention by rationally controlling each reactant between proportioning, rationally control reaction condition and prepare a kind of height
Solidify obtained from endurance quality epoxy resin adhesive, the epoxy resin composition that epoxy resin of the invention is obtained
Thing, with the mechanical properties such as moisture-proof, excellent heat resistance, and impact resistance also excellent performance, adhesive property is good, durability
Can be good, and preparation method is simple and easy to apply, is adapted to industrialized production, is compared compared with other epoxy resin adhesives, is bonded without strict
The metal of surface treatment and it is nonmetallic all have good adhesive property and endurance quality, can be applied to adhesive field.
Embodiment
Embodiments of the invention are described below in detail.
Embodiment 1：
A kind of water-fast epoxy resin being bonded for dalle of the present embodiment, is represented with parts by weight, including bisphenol S type epoxy
320-500 parts of resin binder, 52-83 parts of dodecenylsuccinic anhydride curing agent, 18-32 parts of dimethylformamide, filler 28-42
Part, 19-27 parts of liquid polysulfide rubber, 17-32 parts of dimethyl methyl phosphonate.
The preparation method of the present invention, is concretely comprised the following steps：
（1）Preparation prepares the raw material of bisphenol-s epoxy resin first, takes 11-18 parts of sodium hydroxide, 24-39 parts of epoxy
Chloropropane, 16-24 parts of bisphenol S, 19-27 parts of methyl iso-butyl ketone (MIBK) is simultaneously added in reactor by a certain percentage, and addition is urged
Agent, then 42-55 DEG C of water bath with thermostatic control and is stirred；Then condensing reflux reacts 21h；
（2）Then add after deionized water is sufficiently mixed and staticly settle after question response terminates, will after then upper aqueous layer is filtered out
Surplus solution is heated to 78 DEG C and adds sodium hydroxide solution, then constant temperature stirring reaction 1-2.5h；Distillation is added after question response
Water washes a point liquid, until when the water layer pH value separated is neutrality, after filtrate is completely distilled off, obtaining light yellow, transparent pair
Phenol S type epoxy resin；
（4）Then the modification operation of bisphenol-s epoxy resin is carried out, modifying agent is got out, the modifying agent is vinylacetate
Latex and dibutyl phthalate latex, by dry for standby after two kinds of latex demulsifications；Then vinyl acetate latex is added
In bisphenol-s epoxy resin, then 1.8-3.5h is reacted under for 120-140 DEG C of temperature conditionss；Question response is added after terminating
Dibutyl phthalate latex, reacts 1-1.2h under 120-140 DEG C of temperature conditionss, that is, obtains under normal temperature as thick liquid
Modified epoxy；
（5）Then mixed curing agent is prepared by raw material of dodecenylsuccinic anhydride curing agent, 52-83 parts of laurylene is first taken
Base succinic anhydride curing agent, and add 19-27 parts of liquid polysulfide rubber and 28-42 parts of filler progress Hybrid Heating stirring 1-
2h, the slow dimethylformamide for adding 18-32 parts thereto in whipping process；Then 17-32 parts of methylphosphine is added
Dimethyl phthalate continues constant temperature stirring 30-50min, produces mixing fixative；
（6）After modified epoxy and mixed curing agent are independently encapsulated, then packed products together two-by-two.
Embodiment 2：
A kind of water-fast epoxy resin being bonded for dalle of the present embodiment, is represented, the bisphenol S type epoxy with parts by weight
240 parts of resin binder, 39 parts of dodecenylsuccinic anhydride curing agent, 8 parts of dimethylformamide, 18 parts of filler, liquid polysulfide rubber
6 parts of glue, 10 parts of dimethyl methyl phosphonate.
Embodiment 3：
A kind of water-fast epoxy resin being bonded for dalle of the present embodiment, is represented, the bisphenol S type epoxy with parts by weight
310 parts of resin binder, 46 parts of dodecenylsuccinic anhydride curing agent, 12 parts of dimethylformamide, 24 parts of filler, liquid polysulfide rubber
12 parts of glue, 14 parts of dimethyl methyl phosphonate.
Embodiment 4：
A kind of water-fast epoxy resin being bonded for dalle of the present embodiment, is represented, the bisphenol S type epoxy with parts by weight
375 parts of resin binder, 49 parts of dodecenylsuccinic anhydride curing agent, 14 parts of dimethylformamide, 27 parts of filler, liquid polysulfide rubber
17 parts of glue, 15 parts of dimethyl methyl phosphonate.
Then the water-resistant adhesive of three kinds of different formulations ratios of embodiment 2 ~ 4 is subjected to detection contrast, to verify this hair
Bright implementation result.
1st, adhesive strength is tested：Take one group（4）The ligneous piece of same specification, in each ligneous piece, corresponding contact surface is pressed
Every square metre of glue coating of 100g, the specification of each contact surface is 80mm × 40mm, afterwards by the contact surface pair of Liang Ge ligneous pieces
Compression should be overlapped, closed assembly time is no more than 20 minutes, and contact surface applies 0.85-1.20Mpa pressure, and at room temperature, installation time 8 is small
When, place 16 hours after pressure relief, make a strength test again；4 repetitions, average；
2nd, bending strength is tested：Take one group（4）The plastic part of same specification, the modeling referring next to state marked as GB1042-79
Material bend test method is tested, and the specification of every group of plastic part is 100 × 20 × 15mm；
3rd, compressive strength is tested：Take one group（4）The plastic part of same specification, the modeling referring next to state marked as GB1041-79
Material compression test method is tested, and the cross-sectional dimensions for the plastic part tested are 20 × 15mm, a height of 10mm；
4th, water resistance test：Take one group（4）The ligneous piece of same specification, it is every by 100g in the corresponding contact surface of each ligneous piece
Square metre cementing, the specification of each contact surface is 80mm × 40mm, and the contact surface correspondence of Liang Ge ligneous pieces is overlapped into pressure afterwards
Tightly, spontaneously dry 8 hours, soaked in 32-40 DEG C of water, measure is come unglued the time, and 4 repetitions are averaged；
5th, hardening time tests：Take bisphenol-s epoxy resin 5g to be placed in beaker, keep room temperature under conditions of 20-25 DEG C,
Take mixed curing agent 2.0-2.5g to add in beaker, and stir standing after 15-20min and test its hardening time, 4 repetitions are made even
Average.
Table 1
Will according to the adhesive strength of the results showed that embodiment of the present invention 2 ~ 4, bending strength, compressive strength and water resistance
It is better than the comparative example using ordinary epoxy resin adhesive, and hardening time will also be less than ordinary epoxy resin adhesive,
And between three embodiments of the present invention, it can be seen that all test indexs all show the formula rate of the present invention in certain limit
It is interior to reach preferable effect, obvious difference occurs if too small or too big, and pass through to institute by the present invention
There is the collaboration between the adjustment of component proportion, each component, both keep high intensity, there can be preferable water resistance again, with aobvious
The novelty of work.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
A variety of change, modification, replacement and modification can be carried out to these embodiments by departing under the principle and objective of the present invention, of the invention
Scope is limited by claim and its equivalent.
Claims (5)
1. a kind of water-fast epoxy resin being bonded for dalle, it is characterised in that：Represented with parts by weight, including bisphenol S type
320-500 parts of epoxy resin base-material, 52-83 parts of dodecenylsuccinic anhydride curing agent, 18-32 parts of dimethylformamide, filler
28-42 parts, 19-27 parts of liquid polysulfide rubber, 17-32 parts of dimethyl methyl phosphonate.
2. a kind of water-fast epoxy resin being bonded for dalle according to claim 1, it is characterised in that：It is described to fill out
Expect for graphite microparticles.
3. a kind of water-fast epoxy resin being bonded for dalle according to claim 1, it is characterised in that：It is described double
330 parts of phenol S type epoxy resin base-material, 54 parts of dodecenylsuccinic anhydride curing agent, 19 parts of dimethylformamide, 30 parts of filler,
20 parts of liquid polysulfide rubber, 18 parts of dimethyl methyl phosphonate.
4. a kind of water-fast epoxy resin being bonded for dalle according to claim 1, it is characterised in that：It is described double
430 parts of phenol S type epoxy resin base-material, 73 parts of dodecenylsuccinic anhydride curing agent, 26 parts of dimethylformamide, 34 parts of filler,
23 parts of liquid polysulfide rubber, 26 parts of dimethyl methyl phosphonate.
5. a kind of water-fast epoxy resin being bonded for dalle according to claim 1, it is characterised in that：It is described double
492 parts of phenol S type epoxy resin base-material, 81 parts of dodecenylsuccinic anhydride curing agent, 31 parts of dimethylformamide, 40 parts of filler,
27 parts of liquid polysulfide rubber, 32 parts of dimethyl methyl phosphonate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610995155.2A CN107254280A (en) | 2016-11-11 | 2016-11-11 | A kind of water-fast epoxy resin being bonded for dalle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610995155.2A CN107254280A (en) | 2016-11-11 | 2016-11-11 | A kind of water-fast epoxy resin being bonded for dalle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107254280A true CN107254280A (en) | 2017-10-17 |
Family
ID=60028116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610995155.2A Withdrawn CN107254280A (en) | 2016-11-11 | 2016-11-11 | A kind of water-fast epoxy resin being bonded for dalle |
Country Status (1)
| Country | Link |
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| CN (1) | CN107254280A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104726045A (en) * | 2013-12-24 | 2015-06-24 | 上海海鹰粘接科技有限公司 | High-temperature resistant flame-retardant epoxy glue and preparation method thereof |
| CN104804693A (en) * | 2015-05-20 | 2015-07-29 | 叶芳 | Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof |
-
2016
- 2016-11-11 CN CN201610995155.2A patent/CN107254280A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104726045A (en) * | 2013-12-24 | 2015-06-24 | 上海海鹰粘接科技有限公司 | High-temperature resistant flame-retardant epoxy glue and preparation method thereof |
| CN104804693A (en) * | 2015-05-20 | 2015-07-29 | 叶芳 | Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof |
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| SE01 | Entry into force of request for substantive examination | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171017 |
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| WW01 | Invention patent application withdrawn after publication |