CN107254275A - A kind of epoxy resin that bonding is processed for light industry - Google Patents
A kind of epoxy resin that bonding is processed for light industry Download PDFInfo
- Publication number
- CN107254275A CN107254275A CN201610994721.8A CN201610994721A CN107254275A CN 107254275 A CN107254275 A CN 107254275A CN 201610994721 A CN201610994721 A CN 201610994721A CN 107254275 A CN107254275 A CN 107254275A
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- parts
- epoxy resin
- bonding
- light industry
- processed
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of epoxy resin that bonding is processed for light industry, represented with parts by weight, including 230 380 parts of bisphenol-s epoxy resin base-material, 36 51 parts of 2 methylimidazoles and epoxybutyl ether curing agent, 7 14 parts of neopentylglycol diglycidyl ether, 17 28 parts of filler, 4 17 parts of MBS toughener, 9 16 parts of melamine cyanurate.The present invention controls reaction condition by rationally controlling the proportioning between each reactant, rationally and prepares a kind of High-durability epoxy resin adhesive for applying to light industry and textile industry.
Description
Technical field
The present invention relates to high-molecular gel field, a kind of epoxy resin that bonding is processed for light industry is specifically referred to.
Background technology
The adhesive product that light industry adhesive is commonly used as light industry industry is widely used in leather manufacture and textile industry
Deng field, for textile industry, need to use bonding agent when being bonded multilayer material.And general adhesive conventional at present leads to
Often containing organic poisons such as aldehydes, its release can influence health.So, how to solve general adhesive release dusty gas
It is the technical problem of urgent need to resolve.
And epoxyn as a kind of environment-friendly type gel rubber material the problem of can solve the problem that existing building adhesive, institute
The epoxyn stated is the work that a class is formulated by epoxy resin base-material, curing agent, diluent, accelerator and filler
Journey adhesive.Because its adhesive property is good, feature is good, less expensive, technique for sticking easy, so existing in recent decades
Household electrical appliances, automobile, water conservancy traffic, electronic apparatus and aerospace industry field are widely used.With new and high technology and nanometer
Technology is continued to develop, and in recent years, the modification to epoxy resin deepens continuously, and interpenetrating networks, chemical copolymerization and nano-particle increase
The method extensive use such as tough, by epoxy preparation into various high-performance adhesive kinds it is also more and more.But it has one
Individual obvious shortcoming is toughness deficiency, easily poor impact resistance, cracking after solidification, and the shortcoming greatly limit answering for epoxy resin
With.The characteristic requirements more and more highers developed rapidly to epoxy resin of various materials, epoxy resin is solidified into epoxy resin
The emphasis of use research, people carry out solidification toughness reinforcing using a variety of methods to epoxy resin, so that its application field is more
Extensively.
The content of the invention
Light industry processing and textile industry adhesives are used in it is an object of the invention to provide one kind and with efficiently resistance to
The adhesive of water function.
The present invention is achieved through the following technical solutions：A kind of epoxy resin that bonding is processed for light industry, with parts by weight
Represent, including 36-51 parts of 230-380 parts of bisphenol-s epoxy resin base-material, 2-methylimidazole and epoxybutyl ether curing agent, newly
7-14 parts of neopentyl glycol diglycidyl glycerin ether, 17-28 parts of filler, 4-17 parts of MBS toughener, 9-16 parts of melamine cyanurate.
Heretofore described bisphenol-s epoxy resin chemical name is bisphenol-S diglycidyl ether, referred to as BPS or KGEBS, is
By bisphenol S and epoxychloropropane in sodium hydroxide catalyzed lower obtained, bisphenol-s epoxy resin heat resistance height, heat distortion temperature
60 ~ 700C solidfied materials higher than bisphenol A epoxide resin cun are stable, and solvent resistance is good.
And the toxicity of described 2-methylimidazole and epoxybutyl ether curing agent is low, consumption is small, and working life is long, middle Wen Gu
Change, solidfied material thermal deformation shape is high, other performance is roughly the same with the performance solidified with arylamine, with the adhesive that it is prepared, be glued
Intensity is good, and heat-resisting, solvent resistance is also good, is a kind of current comparatively ideal curing agent, can also be used as accelerator.Wherein 2- methyl miaow
Azoles performance is more comprehensive, and room temperature is liquid, is easily combined with epoxy resin, is a kind of curing agent commonly used in adhesive.
Further, the filler is silicon-carbide particle, and the silicon-carbide particle particle diameter is 0.4-0.8mm.
Further, 240 parts of the bisphenol-s epoxy resin base-material, 2-methylimidazole and epoxybutyl ether curing agent 39
Part, 8 parts of neopentylglycol diglycidyl ether, 18 parts of filler, 6 parts of MBS toughener, 10 parts of melamine cyanurate.
Further, 310 parts of the bisphenol-s epoxy resin base-material, 2-methylimidazole and epoxybutyl ether curing agent 46
Part, 12 parts of neopentylglycol diglycidyl ether, 24 parts of filler, 12 parts of MBS toughener, 14 parts of melamine cyanurate.
Further, 375 parts of the bisphenol-s epoxy resin base-material, 2-methylimidazole and epoxybutyl ether curing agent 49
Part, 14 parts of neopentylglycol diglycidyl ether, 27 parts of filler, 17 parts of MBS toughener, 15 parts of melamine cyanurate.
The present invention compared with prior art, with advantages below and beneficial effect：
The method of the present invention by rationally controlling each reactant between proportioning, rationally control reaction condition and prepare a kind of height
Solidify obtained from endurance quality epoxy resin adhesive, the epoxy resin composition that epoxy resin of the invention is obtained
Thing, with the mechanical properties such as moisture-proof, excellent heat resistance, and impact resistance also excellent performance, adhesive property is good, durability
Can be good, and preparation method is simple and easy to apply, is adapted to industrialized production, is compared compared with other epoxy resin adhesives, is bonded without strict
The metal of surface treatment and it is nonmetallic all have good adhesive property and endurance quality, can be applied to adhesive field.
Embodiment
Embodiments of the invention are described below in detail.
Embodiment 1：
A kind of epoxy resin that bonding is processed for light industry of the present embodiment, is represented with parts by weight, including bisphenol S type epoxy tree
230-380 parts of aliphatic radical material, 2-methylimidazole and 36-51 parts of epoxybutyl ether curing agent, neopentylglycol diglycidyl ether 7-14
Part, 17-28 parts of filler, 4-17 parts of MBS toughener, 9-16 parts of melamine cyanurate.
The preparation method of the present invention, is concretely comprised the following steps：
（1）Preparation prepares the raw material of bisphenol-s epoxy resin first, is represented with parts by weight, takes 4-13 parts of sodium hydroxide,
18-34 parts of epoxychloropropane, 15-22 parts of bisphenol S, 17-25 parts of methyl iso-butyl ketone (MIBK) simultaneously adds reaction by a certain percentage
In kettle, and catalyst is added, then 48-57 DEG C of water bath with thermostatic control and stirred；Then condensing reflux reacts 19h；
（2）Then add after deionized water is sufficiently mixed and staticly settle after question response terminates, will after then upper aqueous layer is filtered out
Surplus solution is heated to 75 DEG C and adds sodium hydroxide solution, then constant temperature stirring reaction 1-3h；Distilled water is added after question response
Washing point liquid, until when the water layer pH value separated is neutrality, after filtrate is completely distilled off, obtaining light yellow, transparent bisphenol S
Type epoxy resin；
（4）Then the modification operation of bisphenol-s epoxy resin is carried out, modifying agent is got out, the modifying agent is vinylacetate
Latex and dibutyl phthalate latex, by dry for standby after two kinds of latex demulsifications；Then vinyl acetate latex is added
In bisphenol-s epoxy resin, then 1.8-3.5h is reacted under for 120-140 DEG C of temperature conditionss；Question response is added after terminating
Dibutyl phthalate latex, reacts 1-1.2h under 120-140 DEG C of temperature conditionss, that is, obtains under normal temperature as thick liquid
Modified epoxy；
（5）Then mixed curing agent is prepared using 2-methylimidazole and epoxybutyl ether curing agent as raw material, first takes 36-51 parts
2-methylimidazole and epoxybutyl ether curing agent, and add 4-17 part of MBS toughener and 17-28 part of filler mix and added
Thermal agitation 1-2h, the slow neopentylglycol diglycidyl ether for adding 7-14 parts thereto in whipping process；Then add
9-16 parts of melamine cyanurate continues constant temperature stirring 30-50min, produces mixing fixative；
（6）After modified epoxy and mixed curing agent are independently encapsulated, then packed products together two-by-two.
Embodiment 2：
A kind of epoxy resin that bonding is processed for light industry of the present embodiment, is represented, the bisphenol S type epoxy tree with parts by weight
240 parts of aliphatic radical material, 2-methylimidazole and 39 parts of epoxybutyl ether curing agent, 8 parts of neopentylglycol diglycidyl ether, filler 18
Part, 6 parts of MBS toughener, 10 parts of melamine cyanurate.
Embodiment 3：
A kind of epoxy resin that bonding is processed for light industry of the present embodiment, is represented, the bisphenol S type epoxy tree with parts by weight
310 parts of aliphatic radical material, 2-methylimidazole and 46 parts of epoxybutyl ether curing agent, 12 parts of neopentylglycol diglycidyl ether, filler 24
Part, 12 parts of MBS toughener, 14 parts of melamine cyanurate.
Embodiment 4：
A kind of epoxy resin that bonding is processed for light industry of the present embodiment, is represented, the bisphenol S type epoxy tree with parts by weight
375 parts of aliphatic radical material, 2-methylimidazole and 49 parts of epoxybutyl ether curing agent, 14 parts of neopentylglycol diglycidyl ether, filler 27
Part, 17 parts of MBS toughener, 15 parts of melamine cyanurate.
Then the water-resistant adhesive of three kinds of different formulations ratios of embodiment 2 ~ 4 is subjected to detection contrast, to verify this hair
Bright implementation result.
1st, adhesive strength is tested：Take one group（4）The ligneous piece of same specification, in each ligneous piece, corresponding contact surface is pressed
Every square metre of glue coating of 100g, the specification of each contact surface is 80mm × 40mm, afterwards by the contact surface pair of Liang Ge ligneous pieces
Compression should be overlapped, closed assembly time is no more than 20 minutes, and contact surface applies 0.85-1.20Mpa pressure, and at room temperature, installation time 8 is small
When, place 16 hours after pressure relief, make a strength test again；4 repetitions, average；
2nd, bending strength is tested：Take one group（4）The plastic part of same specification, the modeling referring next to state marked as GB1042-79
Material bend test method is tested, and the specification of every group of plastic part is 100 × 20 × 15mm；
3rd, compressive strength is tested：Take one group（4）The plastic part of same specification, the modeling referring next to state marked as GB1041-79
Material compression test method is tested, and the cross-sectional dimensions for the plastic part tested are 20 × 15mm, a height of 10mm；
4th, water resistance test：Take one group（4）The ligneous piece of same specification, it is every by 100g in the corresponding contact surface of each ligneous piece
Square metre cementing, the specification of each contact surface is 80mm × 40mm, and the contact surface correspondence of Liang Ge ligneous pieces is overlapped into pressure afterwards
Tightly, spontaneously dry 8 hours, soaked in 32-40 DEG C of water, measure is come unglued the time, and 4 repetitions are averaged；
5th, hardening time tests：Take bisphenol-s epoxy resin 5g to be placed in beaker, keep room temperature under conditions of 20-25 DEG C,
Take mixed curing agent 2.0-2.5g to add in beaker, and stir standing after 15-20min and test its hardening time, 4 repetitions are made even
Average.
Table 1
Will according to the adhesive strength of the results showed that embodiment of the present invention 2 ~ 4, bending strength, compressive strength and water resistance
It is better than the comparative example using ordinary epoxy resin adhesive, and hardening time will also be less than ordinary epoxy resin adhesive,
And between three embodiments of the present invention, it can be seen that all test indexs all show the formula rate of the present invention in certain limit
It is interior to reach preferable effect, obvious difference occurs if too small or too big, and pass through to institute by the present invention
There is the collaboration between the adjustment of component proportion, each component, both keep high intensity, there can be preferable water resistance again, with aobvious
The novelty of work.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
A variety of change, modification, replacement and modification can be carried out to these embodiments by departing under the principle and objective of the present invention, of the invention
Scope is limited by claim and its equivalent.
Claims (5)
1. a kind of epoxy resin that bonding is processed for light industry, it is characterised in that：Represented with parts by weight, including bisphenol S type ring
Epoxy resin-based material 230-380 parts, 2-methylimidazole and 36-51 parts of epoxybutyl ether curing agent, neopentylglycol diglycidyl ether
7-14 parts, 17-28 parts of filler, 4-17 parts of MBS toughener, 9-16 parts of melamine cyanurate.
2. a kind of epoxy resin that bonding is processed for light industry according to claim 1, it is characterised in that：The filler
For silicon-carbide particle, the silicon-carbide particle particle diameter is 0.4-0.8mm.
3. a kind of epoxy resin that bonding is processed for light industry according to claim 1, it is characterised in that：The bis-phenol
240 parts of S type epoxy resin base-material, 2-methylimidazole and 39 parts of epoxybutyl ether curing agent, neopentylglycol diglycidyl ether 8
Part, 18 parts of filler, 6 parts of MBS toughener, 10 parts of melamine cyanurate.
4. a kind of epoxy resin that bonding is processed for light industry according to claim 1, it is characterised in that：The bis-phenol
310 parts of S type epoxy resin base-material, 2-methylimidazole and 46 parts of epoxybutyl ether curing agent, neopentylglycol diglycidyl ether 12
Part, 24 parts of filler, 12 parts of MBS toughener, 14 parts of melamine cyanurate.
5. a kind of epoxy resin that bonding is processed for light industry according to claim 1, it is characterised in that：The bis-phenol
375 parts of S type epoxy resin base-material, 2-methylimidazole and 49 parts of epoxybutyl ether curing agent, neopentylglycol diglycidyl ether 14
Part, 27 parts of filler, 17 parts of MBS toughener, 15 parts of melamine cyanurate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610994721.8A CN107254275A (en) | 2016-11-11 | 2016-11-11 | A kind of epoxy resin that bonding is processed for light industry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610994721.8A CN107254275A (en) | 2016-11-11 | 2016-11-11 | A kind of epoxy resin that bonding is processed for light industry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107254275A true CN107254275A (en) | 2017-10-17 |
Family
ID=60027820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610994721.8A Withdrawn CN107254275A (en) | 2016-11-11 | 2016-11-11 | A kind of epoxy resin that bonding is processed for light industry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107254275A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104726045A (en) * | 2013-12-24 | 2015-06-24 | 上海海鹰粘接科技有限公司 | High-temperature resistant flame-retardant epoxy glue and preparation method thereof |
| CN104804693A (en) * | 2015-05-20 | 2015-07-29 | 叶芳 | Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof |
-
2016
- 2016-11-11 CN CN201610994721.8A patent/CN107254275A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104726045A (en) * | 2013-12-24 | 2015-06-24 | 上海海鹰粘接科技有限公司 | High-temperature resistant flame-retardant epoxy glue and preparation method thereof |
| CN104804693A (en) * | 2015-05-20 | 2015-07-29 | 叶芳 | Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171017 |
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| WW01 | Invention patent application withdrawn after publication |