CN107118726A - A kind of heat-conducting glue and preparation method thereof - Google Patents
A kind of heat-conducting glue and preparation method thereof Download PDFInfo
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- CN107118726A CN107118726A CN201710343415.2A CN201710343415A CN107118726A CN 107118726 A CN107118726 A CN 107118726A CN 201710343415 A CN201710343415 A CN 201710343415A CN 107118726 A CN107118726 A CN 107118726A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a kind of heat-conducting glue and preparation method thereof.Including following component in parts by weight：50 60 parts of epoxy matrix resin, modified 8 15 parts of nbr carboxyl terminal, 12 parts of triphenylphosphine, 12 parts of bactericide, 12 parts of platinum catalyst, 0.5 1 parts of curing agent.Bactericide in the present invention in heat-conducting glue can efficiently control or kill bacterium, fungi and algae, prevent bacterium to be attached on heat-conducting glue and grown, so as to produce more harm；Curing agent is that a class is promoted or controls the material or mixture of curing reaction, heat-conducting glue is using epoxy adhesive as stickup base material, epoxy adhesive bonding is reliable, intensity is high, thermal conducting agent is used as using zinc oxide, silica flour, boron nitride, aluminium hydroxide etc. simultaneously, epoxy adhesive has good heat resistance, it will not also be deformed upon when temperature is higher, it is ensured that the permanent use of LED silica gel.
Description
Technical field
The present invention relates to LED silica gel technical fields, more particularly to a kind of heat-conducting glue and preparation method thereof.
Background technology
In today of the continuous development ＆ production of high-tech, the industry of Heat Conduction Material is also in sprouting, and heat-conducting glue plays very big
Core is made of because general Heat Conduction Material is difficult to play not only heat conduction to electronics significant points but also plays the role of viscosity very well, is led
Hot glue completely solves this problem；Particularly great work is served in electronics, LED illumination industry and LED television field
With.
Heat-conducting glue is to fill thermal conductive ceramic powder by acrylic polymers, is composited with organic silicon adhesive.With height
Heat conduction and the characteristic of insulation, and with flexibility, compressibility, docile property, strong viscosity.Adaptive temperature scope is big, can fill up uneven
Whole surface, can close and firm ground fit thermal source device and fin, heat is quickly conducted；Heat-conducting glue mainly has following
Several types：A kind of is conduction powder of the addition with high thermal conductivity coefficient, such as ceramic powder, graphite composite powder or metal in glue material
Powder, this heat-conducting glue, because the form of filler is limited, can only fill less ratio, and volatile small in use
Molecular substance and desiccation, therefore the thermal conductivity factor of this kind of heat-conducting glue is smaller；Another is to improve noble metal powder in glue material to contain
The proportioning of amount, purity and grain shape, the shortcoming of this kind of heat-conducting glue is expensive and performance is unstable.
The content of the invention
The technical problem existed based on background technology, the present invention proposes a kind of heat-conducting glue and preparation method thereof.
A kind of heat-conducting glue proposed by the present invention, including following component in parts by weight：Epoxy matrix resin 50-60
Part, modified 8-15 parts of nbr carboxyl terminal, 1-2 parts of triphenylphosphine, 1-2 parts of bactericide, 1-2 parts of platinum catalyst, curing agent
0.5-1 parts.
Preferably, the heat-conducting glue also includes 25-30 parts of zinc oxide.
Preferably, the heat-conducting glue also includes 25-30 parts of boron nitride.
Preferably, the heat-conducting glue also includes 20-25 parts of silica flour.
Preferably, the heat-conducting glue also includes 10-15 parts of aluminium hydroxide.
Preferably, the modified nbr carboxyl terminal is by nbr carboxyl terminal, epoxy resin E51, epoxy resin E44
In mix for two or three.
A kind of preparation method of heat-conducting glue proposed by the present invention, specifically includes following steps：
S1. the preparation of epoxy adhesive：By epoxy matrix resin, modified nbr carboxyl terminal, triphenylphosphine according to title
The component taken, heating stirring is mixed in the case of logical nitrogen, and heating-up temperature is 120-140 DEG C, and the heating stirring time is 1-
1.5h, the suspension of gained is disperseed after 50min to cool down with ultrasonic wave, cool time 1-2h, then by suspension deionized water
Epoxy adhesive is made above washing, suction filtration, filter paper；
S2. the synthesis of heat-conducting glue：Zinc oxide, boron nitride, silica flour, aluminium hydroxide are weighed according to component, in logical nitrogen situation
Lower stirred with deionized water mixes, and mixed liquor is made, then the epoxy adhesive obtained by S1 is proportionally weighed into addition mixing
In liquid, bactericide, platinum catalyst, curing agent are sequentially added, ultrasonic wave disperses after strong stirring 1-1.5h at room temperature
0.5-1h, is sufficiently mixed and finishes, vacuum abjection solvent and bubble, final curing formation heat-conducting glue finished product.
Compared with prior art, the beneficial effects of the invention are as follows：
1st, heat-conducting glue is using epoxy adhesive as base material is pasted, and epoxy adhesive bonding is reliable, intensity is high, while using oxidation
Zinc, silica flour, boron nitride, aluminium hydroxide etc. are as thermal conducting agent, and epoxy adhesive has good heat resistance, when temperature is higher
It will not deform upon, it is ensured that the permanent use of LED silica gel；
2nd, the bactericide in heat-conducting glue can efficiently control or kill bacterium, fungi and algae, prevent bacterium to be attached to
Grown on heat-conducting glue, so as to produce more harm；Curing agent is the material or mixed that curing reaction is promoted or controlled to a class
Compound；Resin solidification is chemically reacted by condensation, closed loop, addition or catalysis etc., thermosetting resin is occurred irreversible become
Change process, solidification is completed by adding solidification (crosslinking) agent, it ensure that heat-conducting glue hardness, so as not to due to by
Extrude and be deformed, at the same curing agent can also make heat-conducting glue adapt to cold/hot temperature change, it is ensured that performance it is consistent and steady
It is fixed.
Embodiment
The present invention is made with reference to specific embodiment further to explain.
Embodiment 1
A kind of heat-conducting glue, including following component in parts by weight：50 parts of epoxy matrix resin, modified end carboxyl butyronitrile
8 parts of rubber, 1 part of triphenylphosphine, 1 part of bactericide, 1 part of platinum catalyst, 0.5 part of curing agent, 25 parts of zinc oxide, boron nitride 25
Part, 20 parts of silica flour, 10 parts of aluminium hydroxide.
Modified nbr carboxyl terminal is mixed by nbr carboxyl terminal, epoxy resin E51, and mixed proportion is 2: 1.
A kind of preparation method of heat-conducting glue, specifically includes following steps：
S1. the preparation of epoxy adhesive：By epoxy matrix resin, modified nbr carboxyl terminal, triphenylphosphine according to title
The component taken, heating stirring is mixed in the case of logical nitrogen, and heating-up temperature is 120 DEG C, and the heating stirring time is 1h, gained
Suspension ultrasonic wave disperses after 50min to cool down, and then cool time 1h suspension is washed with deionized, suction filtration, filter paper
Top is that epoxy adhesive is made；
S2. the synthesis of heat-conducting glue：Zinc oxide, boron nitride, silica flour, aluminium hydroxide are weighed according to component, in logical nitrogen situation
Lower stirred with deionized water mixes, and mixed liquor is made, then the epoxy adhesive obtained by S1 is proportionally weighed into addition mixing
In liquid, bactericide, platinum catalyst, curing agent are sequentially added, ultrasonic wave disperses 0.5h after strong stirring 1h at room temperature, fills
Mixing is divided to finish, vacuum abjection solvent and bubble, final curing formation heat-conducting glue finished product.
Embodiment 2
A kind of heat-conducting glue, including following component in parts by weight：52 parts of epoxy matrix resin, modified end carboxyl butyronitrile
10 parts of rubber, 2 parts of triphenylphosphine, 1 part of bactericide, 1 part of platinum catalyst, 1 part of curing agent, 26 parts of zinc oxide, 26 parts of boron nitride,
21 parts of silica flour, 12 parts of aluminium hydroxide.
Modified nbr carboxyl terminal is mixed by epoxy resin E51, epoxy resin E44, and mixed proportion is 2: 1.
A kind of preparation method of heat-conducting glue, specifically includes following steps：
S1. the preparation of epoxy adhesive：By epoxy matrix resin, modified nbr carboxyl terminal, triphenylphosphine according to title
The component taken, heating stirring is mixed in the case of logical nitrogen, and heating-up temperature is 125 DEG C, and the heating stirring time is 1.1h, gained
Suspension disperseed after 50min to cool down with ultrasonic wave, then cool time 1.2h suspension is washed with deionized, suction filtration,
Epoxy adhesive is made above filter paper；
S2. the synthesis of heat-conducting glue：Zinc oxide, boron nitride, silica flour, aluminium hydroxide are weighed according to component, in logical nitrogen situation
Lower stirred with deionized water mixes, and mixed liquor is made, then the epoxy adhesive obtained by S1 is proportionally weighed into addition mixing
In liquid, bactericide, platinum catalyst, curing agent are sequentially added, ultrasonic wave disperses 0.6h after strong stirring 1.1h at room temperature,
It is sufficiently mixed and finishes, vacuum abjection solvent and bubble, final curing formation heat-conducting glue finished product.
Embodiment 3
A kind of heat-conducting glue, including following component in parts by weight：54 parts of epoxy matrix resin, modified end carboxyl butyronitrile
11 parts of rubber, 2 parts of triphenylphosphine, 2 parts of bactericide, 1 part of platinum catalyst, 0.8 part of curing agent, 27 parts of zinc oxide, boron nitride 27
Part, 22 parts of silica flour, 12 parts of aluminium hydroxide.
Modified nbr carboxyl terminal is mixed by epoxy resin E51, epoxy resin E44, and mixed proportion is 1: 2.
A kind of preparation method of heat-conducting glue, specifically includes following steps：
S1. the preparation of epoxy adhesive：By epoxy matrix resin, modified nbr carboxyl terminal, triphenylphosphine according to title
The component taken, heating stirring is mixed in the case of logical nitrogen, and heating-up temperature is 130 DEG C, and the heating stirring time is 1h, gained
Suspension ultrasonic wave disperses after 50min to cool down, and then cool time 1.5h suspension is washed with deionized, suction filtration, filter
Epoxy adhesive is made above paper；
S2. the synthesis of heat-conducting glue：Zinc oxide, boron nitride, silica flour, aluminium hydroxide are weighed according to component, in logical nitrogen situation
Lower stirred with deionized water mixes, and mixed liquor is made, then the epoxy adhesive obtained by S1 is proportionally weighed into addition mixing
In liquid, bactericide, platinum catalyst, curing agent are sequentially added, ultrasonic wave disperses 0.8h after strong stirring 1.5h at room temperature,
It is sufficiently mixed and finishes, vacuum abjection solvent and bubble, final curing formation heat-conducting glue finished product.
Embodiment 4
A kind of heat-conducting glue, including following component in parts by weight：58 parts of epoxy matrix resin, modified end carboxyl butyronitrile
13 parts of rubber, 2 parts of triphenylphosphine, 1.5 parts of bactericide, 1.5 parts of platinum catalyst, 1 part of curing agent, 28 parts of zinc oxide, boron nitride
28 parts, 23 parts of silica flour, 13 parts of aluminium hydroxide.
Modified nbr carboxyl terminal is mixed by nbr carboxyl terminal, epoxy resin E51, epoxy resin E44, is mixed
Composition and division in a proportion example is 2: 1: 1.
A kind of preparation method of heat-conducting glue, specifically includes following steps：
S1. the preparation of epoxy adhesive：By epoxy matrix resin, modified nbr carboxyl terminal, triphenylphosphine according to title
The component taken, heating stirring is mixed in the case of logical nitrogen, and heating-up temperature is 135 DEG C, and the heating stirring time is 1.3h, gained
Suspension disperseed after 50min to cool down with ultrasonic wave, then cool time 1h suspension is washed with deionized, suction filtration, filter
Epoxy adhesive is made above paper；
S2. the synthesis of heat-conducting glue：Zinc oxide, boron nitride, silica flour, aluminium hydroxide are weighed according to component, in logical nitrogen situation
Lower stirred with deionized water mixes, and mixed liquor is made, then the epoxy adhesive obtained by S1 is proportionally weighed into addition mixing
In liquid, bactericide, platinum catalyst, curing agent are sequentially added, ultrasonic wave disperses 0.8h after strong stirring 1.5h at room temperature,
It is sufficiently mixed and finishes, vacuum abjection solvent and bubble, final curing formation heat-conducting glue finished product.
Embodiment 5
A kind of heat-conducting glue, including following component in parts by weight：60 parts of epoxy matrix resin, modified end carboxyl butyronitrile
15 parts of rubber, 2 parts of triphenylphosphine, 2 parts of bactericide, 2 parts of platinum catalyst, 1 part of curing agent, 30 parts of zinc oxide, 30 parts of boron nitride,
25 parts of silica flour, 15 parts of aluminium hydroxide.
Modified nbr carboxyl terminal is formed by nbr carboxyl terminal, epoxy resin E51, epoxy resin E44, mixing ratio
Example is 2: 2: 1.
A kind of preparation method of heat-conducting glue, specifically includes following steps：
S1. the preparation of epoxy adhesive：By epoxy matrix resin, modified nbr carboxyl terminal, triphenylphosphine according to title
The component taken, heating stirring is mixed in the case of logical nitrogen, and heating-up temperature is 140 DEG C, and the heating stirring time is 1.5h, gained
Suspension disperseed after 50min to cool down with ultrasonic wave, then cool time 2h suspension is washed with deionized, suction filtration, filter
Epoxy adhesive is made above paper；
S2. the synthesis of heat-conducting glue：Zinc oxide, boron nitride, silica flour, aluminium hydroxide are weighed according to component, in logical nitrogen situation
Lower stirred with deionized water mixes, and mixed liquor is made, then the epoxy adhesive obtained by S1 is proportionally weighed into addition mixing
In liquid, bactericide, platinum catalyst, curing agent are sequentially added, ultrasonic wave disperses 1h after strong stirring 1.5h at room temperature, fills
Mixing is divided to finish, vacuum abjection solvent and bubble, final curing formation heat-conducting glue finished product.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (7)
1. a kind of heat-conducting glue, it is characterised in that including following component in parts by weight：50-60 parts of epoxy matrix resin, change
8-15 parts of nbr carboxyl terminal of property, 1-2 parts of triphenylphosphine, 1-2 parts of bactericide, 1-2 parts of platinum catalyst, curing agent 0.5-1
Part.
2. a kind of heat-conducting glue according to claim 1, it is characterised in that the heat-conducting glue also includes 25-30 parts of zinc oxide.
3. a kind of heat-conducting glue according to claim 1, it is characterised in that the heat-conducting glue also includes 25-30 parts of boron nitride.
4. a kind of heat-conducting glue according to claim 1, it is characterised in that the heat-conducting glue also includes 20-25 parts of silica flour.
5. a kind of heat-conducting glue according to claim 1, it is characterised in that the heat-conducting glue also includes aluminium hydroxide 10-15
Part.
6. a kind of heat-conducting glue according to claim 1, it is characterised in that the modified nbr carboxyl terminal is by end carboxyl
Mix for two or three in nitrile rubber, epoxy resin E51, epoxy resin E44.
7. the preparation method of a kind of heat-conducting glue as described in claim 1-6, it is characterised in that specifically include following steps：
S1. the preparation of epoxy adhesive：By epoxy matrix resin, modified nbr carboxyl terminal, triphenylphosphine according to weighing
Component, heating stirring is mixed in the case of logical nitrogen, and heating-up temperature is 120-140 DEG C, and the heating stirring time is 1-1.5h, institute
The suspension obtained ultrasonic wave disperses after 50min to cool down, and then suspension be washed with deionized, take out by cool time 1-2h
Epoxy adhesive is made above filter, filter paper；
S2. the synthesis of heat-conducting glue：Zinc oxide, boron nitride, silica flour, aluminium hydroxide are weighed according to component, used in the case of logical nitrogen
Deionized water stirring mixing, is made mixed liquor, then the epoxy adhesive obtained by S1 is proportionally weighed in addition mixed liquor,
Bactericide, platinum catalyst, curing agent are sequentially added, ultrasonic wave disperses 0.5-1h after strong stirring 1-1.5h at room temperature,
It is sufficiently mixed and finishes, vacuum abjection solvent and bubble, final curing formation heat-conducting glue finished product.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710343415.2A CN107118726A (en) | 2017-05-16 | 2017-05-16 | A kind of heat-conducting glue and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710343415.2A CN107118726A (en) | 2017-05-16 | 2017-05-16 | A kind of heat-conducting glue and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107892893A (en) * | 2017-12-20 | 2018-04-10 | 陈景英 | A kind of high-efficiency heat conduction glue |
| CN107936760A (en) * | 2017-11-15 | 2018-04-20 | 佛山杰致信息科技有限公司 | A kind of electric power distributing cabinet insulating coating material and preparation method thereof |
| CN108485566A (en) * | 2018-03-15 | 2018-09-04 | 南安市创培电子科技有限公司 | A kind of preparation method of electronic component adhesive |
| CN111818764A (en) * | 2020-07-17 | 2020-10-23 | 江苏中商碳素研究院有限公司 | Carbon radiating fin and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102250573A (en) * | 2011-05-05 | 2011-11-23 | 北京天山新材料技术股份有限公司 | High shear and high peel strength epoxy adhesive |
| CN102676109A (en) * | 2012-06-04 | 2012-09-19 | 华烁科技股份有限公司 | Method for preparing flexible heat conducting insulating adhesive film used in LED heat radiation substrate |
| CN104231994A (en) * | 2013-06-19 | 2014-12-24 | 聚鼎科技股份有限公司 | Adhesive material |
-
2017
- 2017-05-16 CN CN201710343415.2A patent/CN107118726A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102250573A (en) * | 2011-05-05 | 2011-11-23 | 北京天山新材料技术股份有限公司 | High shear and high peel strength epoxy adhesive |
| CN102676109A (en) * | 2012-06-04 | 2012-09-19 | 华烁科技股份有限公司 | Method for preparing flexible heat conducting insulating adhesive film used in LED heat radiation substrate |
| CN104231994A (en) * | 2013-06-19 | 2014-12-24 | 聚鼎科技股份有限公司 | Adhesive material |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107936760A (en) * | 2017-11-15 | 2018-04-20 | 佛山杰致信息科技有限公司 | A kind of electric power distributing cabinet insulating coating material and preparation method thereof |
| CN107892893A (en) * | 2017-12-20 | 2018-04-10 | 陈景英 | A kind of high-efficiency heat conduction glue |
| CN108485566A (en) * | 2018-03-15 | 2018-09-04 | 南安市创培电子科技有限公司 | A kind of preparation method of electronic component adhesive |
| CN111818764A (en) * | 2020-07-17 | 2020-10-23 | 江苏中商碳素研究院有限公司 | Carbon radiating fin and preparation method thereof |
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| RJ01 | Rejection of invention patent application after publication |