CN107254262A - 一种导热胶片 - Google Patents

一种导热胶片 Download PDF

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CN107254262A
CN107254262A CN201710380811.2A CN201710380811A CN107254262A CN 107254262 A CN107254262 A CN 107254262A CN 201710380811 A CN201710380811 A CN 201710380811A CN 107254262 A CN107254262 A CN 107254262A
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parts
heat conduction
conduction film
butyl rubber
neoprene
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钱龙风
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J111/00—Adhesives based on homopolymers or copolymers of chloroprene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

本发明涉及一种导热胶片,包括改性丙烯酸低聚物、氧化锌、丁基胶、氯丁胶、导热填料、无卤环氧树脂和类石墨烯氮化硼纳米片，其原料各组分按重量计，所述改性丙烯酸低聚物15‑30份、氧化锌20‑30份、丁基胶10‑20份、氯丁胶20‑30份、导热填料8‑15份、无卤环氧树脂4‑9份和类石墨烯氮化硼纳米片7‑10份。本发明所述的导热胶片，导热性好，粘结能力强，耐磨、耐高温，稳定性好，无毒，环保。

Description

一种导热胶片
技术领域
本发明涉及界面散热材料领域，尤其涉及一种导热胶片。
背景技术
随着微电子器件集成密度越来越高，微电子器件的散热需求也越来越高，因此，开发一种具有高导热性能的界面散热材料具有重要意义。由于导热胶具备环境友好性和低成本特点，已逐渐取代传统锡铅焊料互连材料。然而，传统导热胶发展过程也遇到一些瓶颈，如导热性能不高、密度大，稳定性不高等问题。
发明内容
本发明解决其技术问题所采用的技术方案是：提供一种导热胶片，其特征是：包括改性丙烯酸低聚物、氧化锌、丁基胶、氯丁胶、导热填料、无卤环氧树脂和类石墨烯氮化硼纳米片，其原料各组分按重量计，所述改性丙烯酸低聚物15-30份、氧化锌20-30份、丁基胶10-20份、氯丁胶20-30份、导热填料8-15份、无卤环氧树脂4-9份和类石墨烯氮化硼纳米片7-10份。
作为优选，所述的导热胶片，其特征是：其原料各组分按重量计，包含改性丙烯酸低聚物26份、氧化锌30份、丁基胶14份、氯丁胶22份、导热填料15份、无卤环氧树脂5份和类石墨烯氮化硼纳米片7份。
作为优选，所述的导热胶片，其特征是：所述丁基胶为甲基硅油、甲基乙烯基硅橡胶、甲基苯基硅树脂的混合物。
作为优选，所述的导热胶片，其特征是：由下述方法制备：
将所述质量组份的原料依次添加至搅拌机内搅拌，搅拌时间为 60 ±30min ；随后将搅拌后的胶料转移至双辊成型机成型 ；最后通过3 ～8min固化时间即得。
本发明所述的导热胶片，导热性好，粘结能力强，耐磨、耐高温，稳定性好，无毒，环保。
具体实施方式
本发明所述的一种导热胶片，提供一种导热胶片，包括改性丙烯酸低聚物、氧化锌、丁基胶、氯丁胶、导热填料、无卤环氧树脂和类石墨烯氮化硼纳米片，其原料各组分按重量计，所述改性丙烯酸低聚物15-30份、氧化锌20-30份、丁基胶10-20份、氯丁胶20-30份、导热填料8-15份、无卤环氧树脂4-9份和类石墨烯氮化硼纳米片7-10份。
作为优选，所述的导热胶片，其特征是：其原料各组分按重量计，包含改性丙烯酸低聚物26份、氧化锌30份、丁基胶14份、氯丁胶22份、导热填料15份、无卤环氧树脂5份和类石墨烯氮化硼纳米片7份。
作为优选，所述的导热胶片，其特征是：所述丁基胶为甲基硅油、甲基乙烯基硅橡胶、甲基苯基硅树脂的混合物。
作为优选，所述的导热胶片，其特征是：由下述方法制备：
将所述质量组份的原料依次添加至搅拌机内搅拌，搅拌时间为 60 ±30min ；随后将搅拌后的胶料转移至双辊成型机成型 ；最后通过3 ～8min固化时间即得。
以上所述仅是本发明的优选实施方式，并不用于限制本发明，应当指出， 对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和变型，这些改进和变型也应视为本发明的保护范围。

Claims (4)

1.一种导热胶片，其特征是：包括改性丙烯酸低聚物、氧化锌、丁基胶、氯丁胶、导热填料、无卤环氧树脂和类石墨烯氮化硼纳米片，其原料各组分按重量计，所述改性丙烯酸低聚物15-30份、氧化锌20-30份、丁基胶10-20份、氯丁胶20-30份、导热填料8-15份、无卤环氧树脂4-9份和类石墨烯氮化硼纳米片7-10份。
2.如权利要求1所述的导热胶片，其特征是：其原料各组分按重量计，包含改性丙烯酸低聚物26份、氧化锌30份、丁基胶14份、氯丁胶22份、导热填料15份、无卤环氧树脂5份和类石墨烯氮化硼纳米片7份。
3.如权利要求1-2所述的导热胶片，其特征是：所述丁基胶为甲基硅油、甲基乙烯基硅橡胶、甲基苯基硅树脂的混合物。
4.如权利要求1-2所述的导热胶片，其特征是：由下述方法制备：
将所述质量组份的原料依次添加至搅拌机内搅拌，搅拌时间为 60 ±30min ；随后将搅拌后的胶料转移至双辊成型机成型 ；最后通过3 ～8min固化时间即得。
CN201710380811.2A 2017-05-25 2017-05-25 一种导热胶片 Pending CN107254262A (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108192510A (zh) * 2017-12-20 2018-06-22 陈景芳 一种导热胶片
CN109852294A (zh) * 2019-01-28 2019-06-07 江西省航宇新材料股份有限公司 一种覆铜板用混合型导热胶及其制造方法
CN110982457A (zh) * 2019-10-16 2020-04-10 山东金鼎电子材料有限公司 一种高导热胶黏剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104017508A (zh) * 2014-06-20 2014-09-03 合肥长城制冷科技有限公司 一种铝板和铝管粘贴用导热胶膜
CN105950024A (zh) * 2016-05-22 2016-09-21 周淑华 一种导热胶片

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104017508A (zh) * 2014-06-20 2014-09-03 合肥长城制冷科技有限公司 一种铝板和铝管粘贴用导热胶膜
CN105950024A (zh) * 2016-05-22 2016-09-21 周淑华 一种导热胶片

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108192510A (zh) * 2017-12-20 2018-06-22 陈景芳 一种导热胶片
CN109852294A (zh) * 2019-01-28 2019-06-07 江西省航宇新材料股份有限公司 一种覆铜板用混合型导热胶及其制造方法
CN110982457A (zh) * 2019-10-16 2020-04-10 山东金鼎电子材料有限公司 一种高导热胶黏剂及其制备方法

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