CN107253134B - Polishing head without accumulated water - Google Patents
Polishing head without accumulated water Download PDFInfo
- Publication number
- CN107253134B CN107253134B CN201710606798.8A CN201710606798A CN107253134B CN 107253134 B CN107253134 B CN 107253134B CN 201710606798 A CN201710606798 A CN 201710606798A CN 107253134 B CN107253134 B CN 107253134B
- Authority
- CN
- China
- Prior art keywords
- polishing head
- cover
- polishing
- clamping piece
- cover body
- Prior art date
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Links
- 238000005498 polishing Methods 0.000 title claims abstract description 118
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 37
- 239000012528 membrane Substances 0.000 claims abstract description 17
- 210000004907 gland Anatomy 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 15
- 238000007517 polishing process Methods 0.000 abstract description 9
- 238000009825 accumulation Methods 0.000 abstract description 5
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 230000003139 buffering effect Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a polishing head without water accumulation, which comprises: a clip assembly; the cover body is movably arranged on the clamping piece assembly and is used for limiting a containing cavity with the clamping piece assembly; the base body is arranged on the clamping piece assembly in a vertical moving manner and is positioned in the accommodating cavity, and the base body is tightly connected with the cover body; the membrane is respectively connected with the clamping piece assembly and the base body and defines a closed cavity. According to the polishing head without water accumulation, no gap exists between the cover body and the top of the base body, and polishing liquid is prevented from entering the polishing head, so that the polishing liquid cannot be extruded from the inside of the polishing head under the relative movement of the clamping piece assembly and the base body, and the polishing process and the polishing effect cannot be influenced.
Description
Technical Field
The invention relates to the technical field of chemical mechanical polishing equipment, in particular to a polishing head free of water accumulation.
Background
The cover body of the polishing device in the related art is sealed with the outer side of the clamping piece assembly, a gap is reserved between the cover body and the base body, polishing liquid can enter the polishing device from the gap between the cover body and the base body, and in the polishing process, the polishing liquid deposited in the polishing device can overflow outwards, so that the polishing effect of the substrate of the polishing device is affected.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the polishing head without water accumulation, and the polishing head can prevent polishing liquid from entering the inside of the polishing head so as to influence the polishing effect.
A water-free polishing head according to an embodiment of the present invention includes: a clip assembly; the cover body is movably arranged on the clamping piece assembly and is used for limiting a containing cavity with the clamping piece assembly; the base body is arranged on the clamping piece assembly in a vertical moving mode and is positioned in the accommodating cavity, and the base body is closely connected with the cover body; and the membrane is respectively connected with the clamping piece assembly and the base body and defines a closed cavity.
According to the polishing head without water accumulation, the substrate is tightly contacted with the cover body, so that no gap exists between the cover body and the top of the substrate, and polishing liquid is prevented from entering the polishing head, so that the polishing liquid is not extruded from the inside of the polishing head under the relative movement of the clamping piece assembly and the substrate, and the polishing process and the polishing effect are not influenced.
According to one embodiment of the invention, the base body is connected with the inner top wall surface of the cover body in a matching way.
Optionally, the substrate comprises: the middle shaft part penetrates through the shaft hole in the vertical direction, a through hole is formed in the center of the cover body, and the upper end of the middle shaft part penetrates through the through hole; and the outer ring part is arranged around the middle shaft part and is connected with the cover body through bolts.
According to an alternative example of the present invention, the upper surface of the clip assembly is provided with a second groove and a gland partially located in the cover, and the cover is at least partially overlapped with the gland when moving up and down.
According to a further example of the present invention, a first seal ring is disposed between the gland and the clip assembly.
Optionally, a second sealing ring is arranged on one of the upper surface of the outer ring part and the inner top surface of the cover body.
Optionally, the outer peripheral surface of the middle shaft part is closely attached to the inner peripheral wall of the through hole.
Optionally, the cover body includes: the base body is tightly connected with the top cover on the membrane; a shroud is disposed about the top cover and extends downwardly from an outer periphery of the top cover.
According to an alternative example of the present invention, the top cover is horizontally disposed.
According to an alternative example of the present invention, the top cover and the coaming are connected by an arc portion.
According to an alternative example of the present invention, the top cover and the coaming are connected by an inclined portion.
According to an alternative example of the present invention, the top cover is disposed gradually downward inclined in a direction from a center thereof to the coaming.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic view of a polishing head according to an embodiment of the present invention;
FIG. 2 is a schematic view of a polishing head according to an embodiment of the present invention;
FIG. 3 is a schematic view of a polishing head according to another embodiment of the present invention;
FIG. 4 is a schematic view of a polishing head according to an embodiment of the present invention;
FIG. 5 is a schematic view of a polishing head according to still another embodiment of the present invention;
fig. 6 is a schematic view of a polishing head according to an embodiment of the present invention.
Reference numerals:
100: a polishing head;
10: a clip assembly; 11: a middle pivot; 12: a second groove; 13: a third groove; 14: a retaining ring;
20: a cover body; 20a: a receiving chamber; 21: a top cover; 22: coaming plate;
23: an arc part; 24: an inclined portion;
30: a base; 30a: a shaft hole; 31: a middle shaft portion; 32: an outer ring portion; 321: a first groove; 322: a compression ring;
40: a membrane;
50: a gland;
60: a first seal ring;
70: and a second sealing ring.
Description of the embodiments
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
A water-free polishing head 100 according to an embodiment of the present invention is described below with reference to fig. 1-6.
As shown in FIG. 1, polishing head 100 according to an embodiment of the present invention includes a clip assembly 10, a cover 20, a base 30, and a membrane 40.
Wherein, the cover 20 is mounted on the clip assembly 10 and can move relative to the clip assembly 10 (as shown in fig. 1 and 2, the cover 20 moves up and down relative to the clip assembly 10), the cover 20 and the clip assembly 10 define a containing cavity 20a therebetween, the base 30 is mounted on the clip assembly 10 and can move up and down relative to the clip assembly 10, the base 30 is located in the containing cavity 20a, and the base 30 is tightly connected with the cover 20; the membrane 40 is connected to the clip assembly 10 and the base 30, respectively, and defines a closed chamber, no gap exists between the base 30 and the cover 20, and the membrane 40 has a buffering effect in the relative movement of the clip assembly 10 and the base 30.
According to the polishing head 100 of the embodiment of the invention, the substrate 30 is tightly connected with the cover body 20, so that the tightness between the cover body 20 and the top of the substrate 30 is ensured, and the polishing liquid is prevented from entering the accommodating cavity 20a to cause the deposition of the polishing liquid in the accommodating cavity 20a, so that the polishing liquid is not extruded from the accommodating cavity 20a when the substrate 30 and the shear blade assembly 10 relatively move, the polishing effect and the polishing process are not influenced, and the use stability and the good polishing effect of the polishing head 100 are ensured.
It should be further noted that a rotation driving mechanism (not shown) is fixed to the upper end of the polishing head 100 and drives the polishing head to rotate, and a substrate (not shown) is pressed between a polishing pad (not shown) on a polishing platen (not shown) and the clip assembly. The polishing disk is driven by the driving mechanism to rotate, the polishing head 100 moves back and forth along a predetermined track while self-transmitting, and a proper amount of polishing liquid is supplied between the substrate and the polishing pad, so that the polishing effect on the substrate is realized under the combined action of chemistry and machinery.
In the polishing process of the polishing head 100, the supply amount of the polishing liquid and the supply period of the polishing liquid are strictly required, when the substrate 30 is tightly connected with the cover body 20, the polishing liquid cannot be deposited inside the polishing head 100, the phenomenon that extrusion deposition occurs to the relative motion of the substrate 30 and the clamping piece assembly 10 is effectively avoided, when the substrate is polished, only a proper amount of the polishing liquid is sprayed on the substrate, and the period of the supply of the polishing liquid accords with the polishing process, so that the polishing effect of the substrate cannot be influenced.
Optionally, the substrate 30 is cooperatively connected with the inner top wall of the cover 20, so as to prevent the polishing solution from entering the polishing head 100 from the top of the cover 20, and avoid the polishing solution deposited in the polishing head 100 from being extruded when the substrate 30 moves up and down, thereby affecting the polishing effect.
According to one embodiment of the present invention, the clip assembly 10 has a central shaft 11 extending upward at the center thereof, the central shaft 11 is fixed in a shaft hole 30a formed in the base 30, the base 30 has a shaft hole 30a formed at the center thereof to be matched with the central shaft 11, and the central shaft 11 is extended into the shaft hole 30a, thereby realizing the matched connection of the base 30 and the clip assembly 10.
Alternatively, the base 30 includes a middle shaft portion 31 and an outer ring portion 32, the shaft hole 30a penetrates the middle shaft portion 31 in the up-down direction, a through hole is provided in the cover 20, the outer diameter of the middle shaft portion 31 is equal to the diameter of the through hole, and the upper end of the middle shaft portion 31 of the base 30 can penetrate the through hole of the cover 20 to achieve tight fit connection between the base 30 and the cover 20.
The outer ring portion 32 of the base 30 is arranged around the middle shaft portion 31, the diaphragm 40 has a buffering effect on the outer ring portion 32, the upper surface of the outer ring portion 32 is tightly connected with the inner wall surface of the cover 20, so that the outer ring portion 32 and the cover 20 are tightly matched and connected, specifically, the base 30 and the outer ring portion 32 can be connected through bolts, the connection between the base 30 and the cover 20 is more tight and reliable, and the base 30 and the cover 20 are connected to form a tight whole.
In addition, after the upper end of the central shaft portion 31 passes through the through hole, the central shaft portion 31 is connected with the through hole, and the cover body 20 is in tight fit with the outer ring portion 32 through bolts, so that the accommodating cavity 20a forms a closed cavity, the polishing liquid is effectively prevented from entering the accommodating cavity 20a to cause the deposition of the polishing liquid, the polishing effect is prevented from being influenced by the relative motion of the base body 30 and the shear blade assembly 10, and the smooth execution of the polishing process is ensured.
It should be noted that, by providing the through hole on the base 30, the vacuum degree of the cavity is controlled by the external air source, so as to realize the relative movement between the clip assembly 10 and the base 30, wherein the base 30 is fixed, when the external air source inflates into the cavity to form positive pressure in the cavity, the clip assembly 10 moves towards the direction away from the base 30 (as shown in fig. 2), and when the external air source pumps air from the cavity to form negative pressure in the cavity, the clip assembly 10 moves towards the direction close to the base 30 until the clip assembly returns to the original position (as shown in fig. 1).
Further, a first groove 321 is provided on the lower surface of the outer ring portion 32, the first groove 321 penetrates through the outer peripheral surface of the base 30, that is, the first groove 321 extends circumferentially along the lower surface of the outer ring portion 32 to form a first annular groove, a compression ring 322 is provided at the peripheral edge of the lower surface of the outer ring portion 32, and one end of the membrane 40 is pressed into the first groove 321 by the compression ring 322, so that one end of the membrane 40 is tightly connected with the outer ring portion 32, and the buffering effect of the membrane 40 on the base 30 is ensured.
According to a further example of the present invention, the upper surface of the clip assembly 10 is provided with the second groove 12, and the clip assembly 10 is further provided with the pressing cover 50, wherein the pressing cover 50 is partially positioned in the cover body 20, the other end of the membrane 40 is pressed into the second groove 12 by the pressing cover 50, the second groove 12 is formed into a second annular groove along the circumferential direction of the clip assembly 10, and the other end of the membrane 40 is pressed into the second annular groove, so that the connection between the clip assembly 10 and the membrane 40 is reliable, the buffering effect of the base 30 and the cover body 20 on the membrane 40 is ensured, and the membrane 40 cannot be separated from the clip assembly 10.
Optionally, when the cover 20 moves up and down, at least a portion of the cover 20 coincides with at least a portion of the cover 50, so that the cover 20 is prevented from being separated from the cover 50, and a closed cavity inside the polishing head 100 is ensured.
According to an alternative example of the present invention, a first sealing ring 60 is provided between the gland 50 and the clip assembly 10, and the first sealing ring 60 is used for sealing a gap between the lower surface of the gland 50 and the clip assembly 10, so as to prevent polishing liquid from entering the polishing head 100 through the gap between the gland 50 and the clip assembly 10, and ensure tightness between the gland 50 and the clip assembly 10.
The inside of gland 50 is provided with the fourth ring channel, and the annular boss on clamping piece subassembly 10 upper portion is installed to the fourth ring channel of gland 50, and gland 50 sets up in the upper portion of base member 30, and the circular through-hole in lid 20 middle part is installed in the upper portion of base member 30, and lid 20 and the upper portion of base member 30 are provided with second sealing washer 70, and there is certain clearance between the inner wall surface of lid 20 and the outer wall surface of gland 50 to guarantee that lid 20 and base member 30 do along the self-adaptation removal of upper and lower direction relative to gland 50 on the clamping piece subassembly 10.
Optionally, a second sealing ring 70 is arranged between the upper surface of the outer ring portion 32 and the inner top wall surface of the cover body 20, and a gap between the inner top wall surface of the cover body 20 and the upper surface of the outer ring portion 32 is sealed by the second sealing ring 70, so that tightness between the cover body 20 and the outer ring portion 32 is ensured, polishing liquid is prevented from entering the accommodating cavity 20a from a gap between the cover body 20 and the outer ring portion 32, and poor polishing effect caused by extrusion of the polishing liquid in a polishing process is effectively avoided.
Alternatively, the outer circumferential surface of the central shaft portion 31 is tightly fitted with the inner circumferential wall of the through hole, and it is understood that the outer diameter of the central shaft 11 is equal to the diameter of the through hole, so that the central shaft 11 is exactly tightly fitted with the through hole, and the tightness between the central shaft 11 and the cover 20 is ensured.
According to a further embodiment of the present invention, a third groove 13 is provided on the lower surface of the clip assembly 10, the third groove 13 extends along the outer circumference of the lower surface of the clip assembly 10 to form a third annular groove, that is, the third annular groove penetrates the outer circumference of the clip assembly 10, and a retaining ring 14 is provided in the third groove 13 to prevent the polishing head 100 from being thrown out during operation, and has a fixing effect on the polishing head 100.
As shown in fig. 1, according to an alternative embodiment of the present invention, the cover 20 includes a top cover 21 and a surrounding plate 22, the base 30 is closely coupled to the top cover 21 between the membrane 40 and the bottom wall of the top cover 21, the surrounding plate 22 is disposed annularly around the top cover 21 and extends downward from the outer periphery of the top cover 21, and the top cover 21 and the surrounding plate 22 cooperate to close the accommodating chamber 20a to form a closed chamber, thereby preventing the polishing liquid from entering the accommodating chamber 20 a.
As shown in fig. 1, according to an alternative example of the present invention, the top cover 21 is horizontally disposed, and the surface of the top cover 21 is disposed in a horizontal plane, which is convenient for molding.
As shown in fig. 1, in some specific examples of the present invention, the top cover 21 and the coaming 22 are connected by an arc part 23, so that the transition between the top cover 21 and the coaming 22 is natural and attractive in appearance.
Fig. 2 is a schematic diagram of the extreme position of the example shown in fig. 1, that is, the compression ring 322 disposed on the base 30 and the top of the clip assembly 10 have the maximum gap, at this time, the shroud 22 and the gland 50 in the vertical direction of the cover 20 have a section of position overlapping each other, during the chemical mechanical polishing process, the splashed polishing liquid can slide down along the top of the cover 20 and drop onto the polishing disk (not shown), so that the polishing liquid can be effectively prevented from entering the polishing head 100, and the polishing liquid is prevented from being extruded during the relative movement of the base 30 and the clip assembly 10, thereby affecting the polishing effect.
In other embodiments of the present invention, as shown in fig. 3, the top cover 21 and the surrounding plate 22 are connected by an inclined portion 24, so that the polishing liquid falling onto the cover 20 can slide down along the top cover 21 by the inclined portion 24, which is advantageous for the polishing liquid to slide down and drop onto the polishing disk.
Fig. 4 is a schematic diagram of the extreme position of the example shown in fig. 3, that is, the compression ring 322 disposed on the base 30 and the top of the clip assembly 10 have the maximum gap, at this time, the coaming 22 and the gland 50 in the vertical direction of the cover 20 have a section of overlapping position, and the splashed polishing liquid can slide down along the top of the cover 20 and drop on the polishing disk, so that the polishing liquid can be effectively prevented from entering the polishing head 100, and the polishing liquid is prevented from being extruded to affect the polishing effect.
Referring to fig. 5, according to an alternative example of the present invention, the top cover 21 is disposed gradually and downwardly inclined in a direction from the center thereof toward the peripheral plate 22, the surface of the top cover 21 is formed into a tapered surface, and the top cover 21 is directly in transitional engagement with the peripheral plate 22, so that when the splashed polishing liquid splashes on the top cover 21, it can slide down along the tapered surface to prevent the polishing liquid from accumulating on the top cover 21 and finally dripping on the polishing pad.
Fig. 6 is a schematic diagram of the extreme position of the example shown in fig. 5, that is, the compression ring 322 disposed on the base 30 and the top of the clip assembly 10 have a maximum gap, at this time, the coaming 22 and the gland 50 in the vertical direction of the cover 20 have a section of overlapping position, and the splashed polishing liquid can slide down along the conical surface of the cover 20 and drop on the polishing disk, so that the polishing liquid can be effectively prevented from entering the polishing head 100, and the polishing liquid is prevented from being extruded during the working process of the polishing head 100, thereby affecting the polishing effect.
Optionally, the cover 20, the gland 50, the second seal ring 70 and the first seal ring 60 together form a protection device for the polishing head 100, so that the polishing liquid can be effectively prevented from entering the polishing head 100, and meanwhile, the requirement of self-adaptability of the polishing head 100 is met.
Other constructions and operations of the non-water bearing polishing head 100 according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (6)
1. A water-free polishing head, comprising:
a clip assembly;
the cover body is movably arranged on the clamping piece assembly and is used for limiting a containing cavity with the clamping piece assembly;
the base body is arranged on the clamping piece assembly in a vertical moving mode and is positioned in the accommodating cavity, and the base body is closely connected with the cover body;
the membrane is respectively connected with the clamping piece assembly and the base body and defines a closed cavity;
the cover body includes: the base body is tightly connected with the top cover; a shroud disposed about the top cover and extending downwardly from an outer periphery of the top cover;
the upper surface of the clamping piece assembly is provided with a second groove and a gland which is partially positioned in the cover body, the cover body is overlapped with at least a part of the gland in the inside and outside when moving up and down, and a first sealing ring is arranged between the gland and the clamping piece assembly;
the top cover is connected with the coaming through the inclined part, so that the polishing liquid does not enter the polishing head and is not extruded when the substrate and the clamping piece assembly relatively move, but slides down along the top cover through the inclined part;
the base body is connected with the inner top wall surface of the cover body in a matching way.
2. A water-free polishing head as recited in claim 1, wherein the substrate comprises:
the middle shaft part is penetrated by the shaft hole along the up-down direction, a through hole is arranged in the center of the cover body, and the upper end of the middle shaft part passes through the through hole;
and the outer ring part is arranged around the middle shaft part and is connected with the cover body through bolts.
3. A water-free polishing head as recited in claim 2, wherein a second seal ring is provided on one of an upper surface of the outer ring portion and an inner top surface of the cover body.
4. The water-free polishing head as recited in claim 2, wherein an outer peripheral surface of the central shaft portion is closely fitted to an inner peripheral wall of the through hole.
5. The water-free polishing head as recited in claim 1, wherein the top cover is horizontally disposed.
6. A water-free polishing head as claimed in claim 1, wherein the top cover is disposed gradually downward sloping in a direction from a center thereof toward the coaming.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710606798.8A CN107253134B (en) | 2017-07-24 | 2017-07-24 | Polishing head without accumulated water |
| PCT/CN2018/096003 WO2019019941A1 (en) | 2017-07-24 | 2018-07-17 | Polishing head capable of preventing water accumulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710606798.8A CN107253134B (en) | 2017-07-24 | 2017-07-24 | Polishing head without accumulated water |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107253134A CN107253134A (en) | 2017-10-17 |
| CN107253134B true CN107253134B (en) | 2024-01-12 |
Family
ID=60026469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710606798.8A Active CN107253134B (en) | 2017-07-24 | 2017-07-24 | Polishing head without accumulated water |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107253134B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019019941A1 (en) * | 2017-07-24 | 2019-01-31 | 清华大学 | Polishing head capable of preventing water accumulation |
| CN107900893A (en) * | 2017-11-20 | 2018-04-13 | 上海华力微电子有限公司 | One kind grinding arm cover board |
| CN109048627A (en) * | 2018-08-27 | 2018-12-21 | 清华大学 | Rubbing head and chemical-mechanical polisher |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6241593B1 (en) * | 1999-07-09 | 2001-06-05 | Applied Materials, Inc. | Carrier head with pressurizable bladder |
| US6572462B1 (en) * | 1998-05-04 | 2003-06-03 | Motorola, Inc. | Carrier assembly for chemical mechanical planarization systems and method |
| CN102172888A (en) * | 2011-02-16 | 2011-09-07 | 清华大学 | Polishing head |
| CN103144027A (en) * | 2013-04-02 | 2013-06-12 | 清华大学 | Air cylinder for polishing head |
| CN103192317A (en) * | 2013-04-02 | 2013-07-10 | 清华大学 | Polishing head |
| CN207139536U (en) * | 2017-07-24 | 2018-03-27 | 清华大学 | A kind of rubbing head of not ponding |
-
2017
- 2017-07-24 CN CN201710606798.8A patent/CN107253134B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6572462B1 (en) * | 1998-05-04 | 2003-06-03 | Motorola, Inc. | Carrier assembly for chemical mechanical planarization systems and method |
| US6241593B1 (en) * | 1999-07-09 | 2001-06-05 | Applied Materials, Inc. | Carrier head with pressurizable bladder |
| CN102172888A (en) * | 2011-02-16 | 2011-09-07 | 清华大学 | Polishing head |
| CN103144027A (en) * | 2013-04-02 | 2013-06-12 | 清华大学 | Air cylinder for polishing head |
| CN103192317A (en) * | 2013-04-02 | 2013-07-10 | 清华大学 | Polishing head |
| CN207139536U (en) * | 2017-07-24 | 2018-03-27 | 清华大学 | A kind of rubbing head of not ponding |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107253134A (en) | 2017-10-17 |
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