CN107248524B - Gallium nitride semiconductor device and method for manufacturing same - Google Patents

Gallium nitride semiconductor device and method for manufacturing same Download PDF

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CN107248524B
CN107248524B CN201710487779.8A CN201710487779A CN107248524B CN 107248524 B CN107248524 B CN 107248524B CN 201710487779 A CN201710487779 A CN 201710487779A CN 107248524 B CN107248524 B CN 107248524B
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gallium nitride
contact hole
grid
gate
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CN107248524A (en
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刘美华
林信南
刘岩军
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SHENZHEN JINGXIANG TECHNOLOGY CO LTD
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SHENZHEN JINGXIANG TECHNOLOGY CO LTD
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    • H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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    • H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material

Abstract

The invention relates to the technical field of semiconductor materials, and provides a gallium nitride semiconductor device which comprises: a gallium nitride epitaxial layer; and a dielectric layer disposed on the gallium nitride epitaxial layer; the source electrode, the drain electrode and the grid electrode are arranged on the dielectric layer and respectively penetrate through the dielectric layer to be connected with the gallium nitride epitaxial layer; and the insulating layer is arranged on the source electrode, the drain electrode, the grid electrode and the dielectric layer and is made of silicon dioxide. The gallium nitride semiconductor device is not easy to break through the aluminum gallium nitride layer, so that the problems of electric leakage and breakdown of the gallium nitride semiconductor device are solved, the gallium nitride semiconductor device is effectively protected, and the reliability of the gallium nitride semiconductor device is enhanced.

Description

Gallium nitride semiconductor device and method for manufacturing same
Technical Field
The invention relates to the field of semiconductor technology, in particular to a gallium nitride semiconductor device and a preparation method thereof.
Background
Gallium nitride has the advantages of large forbidden bandwidth, high electronic saturation velocity, high breakdown electric field, high thermal conductivity, corrosion resistance, radiation resistance and the like, so that gallium nitride can be used for manufacturing semiconductor materials to obtain the gallium nitride semiconductor device.
In the prior art, a method for manufacturing a gallium nitride semiconductor device comprises the following steps: forming a silicon nitride layer on the surface of the gallium nitride epitaxial layer, etching a source contact hole and a drain contact hole on the silicon nitride layer, and depositing metal in the source contact hole and the drain contact hole so as to form a source electrode and a drain electrode; etching the silicon nitride layer and the aluminum gallium nitride layer in the gallium nitride epitaxial layer to form a groove, and depositing a metal layer in the groove to form a grid; and then depositing a silicon dioxide layer and a field plate metal layer to form the gallium nitride semiconductor device.
However, in the prior art, the electric field density is large, which may cause the problems of leakage and breakdown of the gan semiconductor device, and further may damage the gan semiconductor device, and reduce the reliability of the gan semiconductor device. Further, after repeated high voltage tests are carried out on the gallium nitride power device, the breakdown voltage of the device can drift, and the unstable behavior is related to charge traps, so that the reliability of the device is damaged and the device is inhibited.
Disclosure of Invention
In order to solve the above problem, the present invention provides a gallium nitride semiconductor device, comprising: a gallium nitride epitaxial layer; and the number of the first and second groups,
the dielectric layer is arranged on the gallium nitride epitaxial layer and is made of hafnium oxide;
the source electrode, the drain electrode and the grid electrode are arranged on the dielectric layer and respectively penetrate through the dielectric layer to be connected with the gallium nitride epitaxial layer; the grid electrode penetrates through the dielectric layer and extends into the gallium nitride epitaxial layer;
the insulating layer is arranged on the source electrode, the drain electrode, the grid electrode and the dielectric layer and is made of silicon dioxide;
the field plate metal layer penetrates through the insulating layer and is connected with the source electrode.
The invention also provides a preparation method of the gallium nitride semiconductor device, and provides a gallium nitride epitaxial layer, wherein the gallium nitride epitaxial layer comprises a silicon substrate layer, a gallium nitride layer and an aluminum gallium nitride layer which are sequentially arranged from bottom to top;
depositing hafnium oxide on the surface of the gallium nitride epitaxial layer to form a dielectric layer;
obtaining a source contact hole and a drain contact hole: etching the dielectric layer to form a source contact hole and a drain contact hole which are independent from each other, wherein the source contact hole and the drain contact hole penetrate through the dielectric layer to reach the aluminum gallium nitride layer;
depositing a first metal in the source contact hole and the drain contact hole and on the surface of the dielectric layer to obtain a source electrode and a drain electrode;
photoetching and etching the first metal to form an ohmic contact electrode window; at this point, a first component is obtained;
performing high-temperature annealing treatment on the first assembly to enable the first metal accommodated in the source contact hole and the drain contact hole to form an alloy and react with the aluminum gallium nitride layer;
obtaining a gate contact hole: performing dry etching on the dielectric layer and the aluminum gallium nitride layer through the ohmic contact electrode window to form a gate contact hole, wherein the gate contact hole penetrates through the dielectric layer and the aluminum gallium nitride layer;
depositing a second metal piece on the outer edges of the gate contact hole and the gate contact hole to obtain a gate, and then obtaining a second assembly;
and depositing an insulating layer on the surface of the second component.
Has the advantages that:
according to the invention, multiple novel materials are applied to the dielectric layer on the surface of the gallium nitride epitaxial layer, and the first metal is deposited and subjected to high-temperature annealing treatment, so that the etched first metal and the aluminum gallium nitride layer which are in contact with each other react to form an alloy, and the contact resistance of the etched first metal and the aluminum gallium nitride layer is reduced;
in the embodiment, the structure of the grid is optimized, so that the grid penetrates through the whole aluminum gallium nitride layer, the grid is compatible with a CMOS (complementary metal oxide semiconductor) process line, and the electric field distribution is adjusted, so that the withstand voltage of the device is improved.
Drawings
Fig. 1a is a schematic structural diagram of a gallium nitride semiconductor device according to another embodiment of the present invention.
Fig. 1b is a schematic view of a process flow of manufacturing a gan semiconductor device according to another embodiment of the present invention.
Fig. 2a is a schematic structural diagram of a gan semiconductor device according to another embodiment of the present invention.
Fig. 2b is a schematic diagram of a gate structure of a gan semiconductor device according to another embodiment of the present invention.
Fig. 2c is a schematic view of a process flow of manufacturing a gan semiconductor device according to another embodiment of the present invention.
Fig. 3a is a schematic structural diagram of a gan semiconductor device according to another embodiment of the present invention.
Fig. 3b is a schematic view of a process flow of manufacturing a gan semiconductor device according to another embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1a, an embodiment of the present invention provides a gallium nitride semiconductor device, which includes, from bottom to top: gallium nitride epitaxial layer 210, dielectric layer 220, source 231 and drain 232, gate 233, insulating layer 240, field plate metal layer 250.
The gallium nitride epitaxial layer 210 is composed of a silicon (Si) substrate 212, a gallium nitride (GaN) layer 213, and an aluminum gallium nitride (AlGaN) layer 214, wherein the silicon substrate 212, the gallium nitride layer 213, and the aluminum gallium nitride layer 214 are sequentially disposed from bottom to top.
A dielectric layer 220 is disposed on the gallium nitride epitaxial layer 210; the dielectric layer 220 of the present embodiment may be made of hafnium oxide (HfO), for example2). The hafnium oxide is a high dielectric constant (high-k) dielectric.
A source 231, a drain 232, and a gate 233 are disposed on the dielectric layer 220. Specifically, the source 231, the drain 232 and the gate 233 are partially inserted into the dielectric layer 220 like "nails", and the source 231, the drain 232 and the gate 233 are respectively connected with the gallium nitride epitaxial layer 210 through the dielectric layer 220; and a portion protrudes above the top of the dielectric layer 220. The source 231 and/or drain 232 is composed of a first metal; the first metal composition is the same as in the above examples. The source electrode 231 and the drain electrode 232 which are made of the first metal material can react with the gallium nitride aluminum layer 214 in the gallium nitride epitaxial layer 210 in the high-temperature annealing process of the device to generate an alloy, so that the contact between the source electrode 231 and the drain electrode 232 and the contact surface of the aluminum gallium nitride layer is good, and the contact resistance between the source electrode 231 and the drain electrode 232 and the aluminum gallium nitride layer can be effectively reduced; the problems of electric leakage and soft breakdown of the gallium nitride semiconductor device are avoided.
Preferably, the gate 233 extends downward into the aluminum gallium nitride layer 214, and the distance H from the bottom end of the gate 233 to the bottom of the aluminum gallium nitride layer 214 is preferably half of the thickness of the entire aluminum gallium nitride layer 214. The gate 233 is made of a second metal, which is Ni, Au alloy.
Preferably, a gate dielectric layer 234 is further included between the gate 233 and the gan epitaxial layer 210, and in this embodiment, the gate dielectric layer 234 may be made of, for example, silicon nitride.
The insulating layer 240 is disposed above the drain 232, the gate 233 and a portion of the source 231, and on the exposed whole dielectric layer 220, and the insulating layer 240 is made of silicon dioxide. Wherein the insulating layer 240 is deposited uniformly over the entire surface of the device, with the same thickness throughout the deposit. Due to the existence of the source 231, the drain 232 and the gate 233, the insulating layer 240 between the source 231 and the gate 233 and the insulating layer 240 between the gate 233 and the drain 232 are recessed downward, and are flattened through a planarization process in a subsequent step.
A field plate metal layer 250 may also be included, for example, disposed on the insulating layer 240. The field plate metal layer 250 is connected to the source electrode 231 through the insulating layer 240. Preferably, the field plate metal layer 250 is made of an aluminum-silicon-copper metal layer.
The invention also provides a preparation method of the gallium nitride semiconductor device. As shown in fig. 1b, the specific steps include:
step 201: a gallium nitride layer 213 and an aluminum gallium nitride layer 214 are sequentially deposited on a silicon substrate 212 to form a gallium nitride epitaxial layer 210. Gallium nitride is a third-generation wide-bandgap semiconductor material, has the characteristics of large forbidden band width, high electronic saturation rate, high breakdown electric field, high thermal conductivity, corrosion resistance, radiation resistance and the like, and has strong advantages under the environmental conditions of high pressure, high frequency, high temperature, high power and radiation resistance, so that the gallium nitride is an optimal material for researching short-wave photoelectronic devices and high-pressure high-frequency high-power devices; wherein, the large forbidden band width is 3.4 electron volts, the high electron saturation velocity is 2e7 centimeters per second, and the high breakdown electric field is 1e10 to-3 e10 volts per centimeter.
A layer of hafnium oxide (HfO) may then be deposited on the surface of the GaN epitaxial layer 110 using plasma enhanced chemical vapor deposition2) A dielectric layer 220 is formed. The thickness of the hafnium oxide may be 2000 angstroms, for example.
Step 202, performing dry etching on the dielectric layer 220 to form a source contact hole 221 and a drain contact hole 222 which are oppositely arranged.
In order to clean the source contact hole 221 and the drain contact hole 222 with less impurities, an impurity removal step is further included. Specifically, after the dielectric layer 220 is dry etched, a method of "DHF (dilute hydrofluoric acid) + chemical cleaning agent SC-1+ chemical cleaning agent SC-2" may be used, for example, a diluted hydrofluoric acid solution may be used to treat the device, then an alkaline mixed solution of hydrogen peroxide and ammonium hydroxide is used to treat the device, and then an acidic mixed solution of hydrogen peroxide and hydrogen chloride is used to treat the device, so that impurities on the surface of the entire device may be removed.
In step 203, in this embodiment, a first metal is deposited in source contact hole 221 and drain contact hole 222 and on the surface of dielectric layer 220.
Specifically, a magnetron sputtering coating process can be adopted, and a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a titanium nitride layer are sequentially deposited in the source contact hole, the drain contact hole and the surface of the dielectric layer to form a first metal; the thickness of the first titanium metal layer may be, for example, 200 angstroms, the thickness of the aluminum metal layer may be, for example, 1200 angstroms, the thickness of the second titanium metal layer may be, for example, 200 angstroms, and the thickness of the titanium nitride layer may be, for example, 200 angstroms.
The first metal is subjected to photolithography and etching to form an ohmic contact electrode window 219.
Performing photolithography and etching on the first metal, wherein the photolithography process includes coating, exposing and developing, thereby forming an ohmic contact electrode window 219; a portion of the surface of dielectric layer 220 is visible through ohmic contact electrode window 219. Thus, the first metal on the source contact hole 221 constitutes a source 231 of the device, and the first metal on the drain contact hole 222 constitutes a drain 232 of the device. At this time, in order to clearly express the process of the present invention, the device obtained at this time is named as a first component.
Step 204, the whole first component is annealed at high temperature to form an alloy after the etched first metal and the aluminum gallium nitride layer 214 which are in contact with each other react.
In this embodiment, specifically, nitrogen gas is introduced into the reaction furnace, and the entire first component is subjected to high-temperature annealing treatment at 840 to 850 ℃ for 30 seconds, so that the etched first metal becomes an alloy, and the etched first metal in contact with the aluminum gallium nitride layer 214 may also form an alloy on the contact surface after the first metal reacts with the aluminum gallium nitride layer 214, thereby reducing the contact resistance between the first metal and the aluminum gallium nitride layer 214. I.e., reduce the contact resistance between the source 231, drain 232 and the aluminum gallium nitride layer 214.
Step 205, performing dry etching on the dielectric layer 220 and the aluminum gallium nitride layer 214 through the ohmic contact electrode window 219 to form a gate contact hole 223, wherein the bottom of the gate contact hole 223 has a preset distance from the bottom of the aluminum gallium nitride layer 214.
In this embodiment, a dry etching method is adopted to perform dry etching on the dielectric layer 220 and a portion of the aluminum gallium nitride layer 214 through the ohmic contact electrode window 219, so as to form a gate contact hole 223 on the first device. The gate contact hole 223 completely penetrates through the dielectric layer 220 and penetrates through a part of the aluminum gallium nitride layer 214, so that the distance H between the bottom of the gate contact hole 223 and the bottom of the aluminum gallium nitride layer 214 is preferably half the thickness of the aluminum gallium nitride layer 214.
In the present embodiment, after forming one gate contact hole 223, impurities such as impurities, particles, and ions may exist in the gate contact hole 223, so that the gate contact hole 223 may be cleaned by using a hydrochloric acid solution to remove the impurities in the gate contact hole 223.
In the embodiment, after the dielectric layer 220 is subjected to dry etching, impurities on the device are removed by adopting a method of DHF + SC1+ SC 2; after the gate contact hole 223 is formed, impurities in the gate contact hole 223 are removed by using a hydrochloric acid solution. Therefore, the surface of the dielectric layer and the cleanness in the gate contact hole 223 can be effectively ensured, and the performance of the gallium nitride semiconductor device is further ensured.
Step 206, in this embodiment, specifically, a magnetron sputtering coating process is adopted to deposit a silicon nitride layer in the gate contact hole 223, where the silicon nitride layer is not higher than the gate contact hole 223; then, Ni/Au is deposited on the silicon nitride layer and on the outer edge of the grid contact hole 223 to be used as a second metal, and the thickness of the metal is 0.01-0.04 mu m/0.08-0.4 mu m; thereby constituting a gate 233. Thus, the gate 233 is a composite structure having multiple materials.
At this time, in order to express the contents of the present invention more clearly, the device obtained at this time is named as a second component.
Step 207, an insulating layer 240 is deposited over the surface of the second component.
In this embodiment, specifically, a layer of silicon dioxide (SiO) is deposited over the entire surface of the second component2) A silicon dioxide layer may be formed as an insulating layer 240, for example, to a thickness of 5000 angstroms. The silicon dioxide is uniformly deposited on the surface of the whole device, the thickness of the silicon dioxide is the same everywhere, and due to the existence of the source 231, the drain 232 and the gate 233, the insulating layer 240 between the source 231 and the gate 233 and the insulating layer 240 between the gate 233 and the drain 232 are recessed downwards and can be flattened by using a grinding process.
In step 208, after the insulating layer 140 above the source contact hole 221 is dry etched, an opening 241 is formed. The gate 233 has a protrusion protruding out of the gate contact hole 223, and the width of the opening 241 is smaller than that of the protrusion.
In step 209, a field plate metal layer 250 is deposited within the opening 241 and on the insulating layer 240 extending from the source contact opening 221 to above the gate contact opening 223, forming the field plate metal layer 250.
In this embodiment, specifically, a magnetron sputtering coating process may be used to deposit a field plate metal, which may be 10000 angstroms in thickness, on the dielectric layer 220 within the opening 241 and over the first metal from the outer edge of the source contact hole 221 to the first metal above the outer edge of the gate contact hole 223, thereby forming the field plate metal layer 250. The thickness of the field plate metal layer 250 is uniform, and the field plate metal layer 250 is recessed downward at the position of the opening 241 and at the position between the source contact hole 221 and the gate contact hole 223, and can be planarized by using a planarization process.
The embodiment can optimize the device manufacturing process, is compatible with a CMOS (complementary metal oxide semiconductor) process line, optimizes the device process and improves the on-resistance. And the problems of electric leakage and breakdown of the gallium nitride semiconductor device are avoided, the gallium nitride semiconductor device is effectively protected, and the reliability of the gallium nitride semiconductor device is enhanced. The gallium nitride semiconductor device obtained by the embodiment can be applied to the technical fields of power electronic elements, filters, radio communication elements and the like, and has a good application prospect.
Referring to fig. 2a, an embodiment of the invention provides a gan semiconductor device, which includes, from bottom to top: gallium nitride epitaxial layer 310, dielectric layer 320, source 331 and drain 332, gate 333, insulating layer 340, field plate metal layer 350.
The gallium nitride epitaxial layer 310 is composed of a silicon (Si) substrate 312, a gallium nitride (GaN) layer 313 and an aluminum gallium nitride (AlGaN) layer 314, wherein the silicon substrate 312, the gallium nitride layer 313 and the aluminum gallium nitride layer 314 are sequentially arranged from bottom to top.
A dielectric layer 320 is disposed on the gallium nitride epitaxial layer 310; the material of the dielectric layer 320 of this embodiment may be, for example, oxideHafnium (HfO)2). The hafnium oxide is a high dielectric constant (high-k) dielectric.
The source 331, the drain 332 and the gate 333 are disposed on the dielectric layer 320. Specifically, a part of the source 331, the drain 332 and the gate 333 shaped like a "nail" are inserted into the dielectric layer 320, and the source 331, the drain 332 and the gate 333 are respectively connected with the gallium nitride epitaxial layer 310 through the dielectric layer 320; and a portion protrudes above the top of the dielectric layer 320. The source electrode 331 and/or the drain electrode 332 are composed of a first metal. Wherein the composition structure of the first metal is the same as in the above-described embodiment. The source electrode 331 and the drain electrode 332 which are made of the first metal material can react with the gallium nitride aluminum layer 314 in the gallium nitride epitaxial layer 310 in the high-temperature annealing process of the device to generate an alloy, so that the contact surface between the source electrode 331 and the drain electrode 332 and the aluminum gallium nitride layer is good, and the contact resistance between the source electrode 331 and the drain electrode 332 and the aluminum gallium nitride layer can be effectively reduced; the problems of electric leakage and soft breakdown of the gallium nitride semiconductor device are avoided.
Preferably, as shown in connection with fig. 2b, the gate 333 of the present embodiment includes two parts connected in parallel: the shorter is an enhancement type first gate part 333a, and the longer is a depletion type second gate part 333 b. The first gate part 333a is connected with the surface of the aluminum gallium nitride layer 314, and the second gate part 333b extends into the aluminum gallium nitride layer 314. The grid formed by the long part and the short part is different from the existing grid, and is in a special shape.
Further, the width D1 of the first gate 333a is preferably not less than the width D2 of the second gate 333 b. Of course, in other embodiments, the left and right positions of the first gate part 333a and the second gate part 333b may be interchanged.
The second gate part 333b may extend downward into the aluminum gallium nitride layer 314, and the distance H from the bottom end of the second gate part 333b to the bottom of the aluminum gallium nitride layer 314 is preferably half of the thickness of the entire aluminum gallium nitride layer 314. The entire gate electrode 333 is composed of the second metal, which is Ni, Au alloy.
The insulating layer 340 is disposed above the drain 332, the gate 333, and a portion of the source 331, and on the exposed whole dielectric layer 320, and the insulating layer 340 is made of silicon dioxide. Wherein the insulating layer 340 is deposited uniformly over the entire surface of the device, with the same thickness throughout the deposition. Due to the source electrode 331, the drain electrode 332 and the gate electrode 333, the insulating layer 340 between the source electrode 331 and the gate electrode 333 and the insulating layer 340 between the gate electrode 333 and the drain electrode 332 are recessed downward, and can be flattened through a subsequent grinding step.
A field plate metal layer 350 may also be included, for example, disposed on the insulating layer 340. The field plate metal layer 350 is connected to the source electrode 331 through the insulating layer 340. Preferably, the field plate metal layer 350 is made of an aluminum-silicon-copper metal layer.
The invention also provides a preparation method of the gallium nitride semiconductor device. As shown in fig. 2c, the specific steps include:
step 301: a gallium nitride layer 313 and an aluminum gallium nitride layer 314 are sequentially deposited on a silicon substrate 312 to form a gallium nitride epitaxial layer 310. Gallium nitride is a third-generation wide-bandgap semiconductor material, has the characteristics of large forbidden band width, high electronic saturation rate, high breakdown electric field, high thermal conductivity, corrosion resistance, radiation resistance and the like, and has strong advantages under the environmental conditions of high pressure, high frequency, high temperature, high power and radiation resistance, so that the gallium nitride is an optimal material for researching short-wave photoelectronic devices and high-pressure high-frequency high-power devices; wherein, the large forbidden band width is 3.4 electron volts, the high electron saturation velocity is 2e7 centimeters per second, and the high breakdown electric field is 1e10 to-3 e10 volts per centimeter.
A layer of hafnium oxide (HfO) may then be deposited on the surface of the gallium nitride epitaxial layer 310 using a plasma enhanced chemical vapor deposition process2) A dielectric layer 320 is formed. The thickness of the hafnium oxide may be 2000 angstroms, for example.
Step 302, performing dry etching on the dielectric layer 320 to form a source contact hole 321 and a drain contact hole 322 which are oppositely arranged.
In order to clean the source contact hole 321 and the drain contact hole 322 with less impurities, an impurity removing step is further included. Specifically, after the dielectric layer 320 is dry etched, a method of "DHF (dilute hydrofluoric acid) + chemical cleaning agent SC-1+ chemical cleaning agent SC-2" may be used, for example, a diluted hydrofluoric acid solution may be used to treat the device, then an alkaline mixed solution of hydrogen peroxide and ammonium hydroxide is used to treat the device, and then an acidic mixed solution of hydrogen peroxide and hydrogen chloride is used to treat the device, so that impurities on the surface of the entire device may be removed.
In step 303, a first metal is deposited in the source contact hole 321 and the drain contact hole 322 and on the surface of the dielectric layer 320.
Specifically, a magnetron sputtering coating process can be adopted, and a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a titanium nitride layer are sequentially deposited in the source contact hole, the drain contact hole and the surface of the dielectric layer to form a first metal; the thickness of the first titanium metal layer may be, for example, 200 angstroms, the thickness of the aluminum metal layer may be, for example, 1200 angstroms, the thickness of the second titanium metal layer may be, for example, 200 angstroms, and the thickness of the titanium nitride layer may be, for example, 200 angstroms.
The first metal is subjected to photolithography and etching to form an ohmic contact electrode window 319.
Performing photolithography and etching on the first metal, wherein the photolithography process includes coating, exposing and developing, so as to form an ohmic contact electrode window 319; a portion of the surface of the dielectric layer 320 can be seen through the ohmic contact electrode window 319. Thus, the first metal on the source contact hole 321 constitutes the source 331 of the device, and the first metal on the drain contact hole 322 constitutes the drain 332 of the device. At this time, in order to clearly express the process of the present invention, the device obtained at this time is named as a first component.
Step 304, the entire first assembly is annealed at a high temperature to form an alloy after the etched first metal in contact with the aluminum gallium nitride layer 314 reacts.
In this embodiment, specifically, nitrogen gas is introduced into the reaction furnace, and the entire first component is subjected to high-temperature annealing treatment at 840 to 850 ℃ for 30 seconds, so that the etched first metal becomes an alloy, and the etched first metal in contact with the aluminum gallium nitride layer 314 may also form an alloy on the contact surface after the first metal reacts with the aluminum gallium nitride layer 314, thereby reducing the contact resistance between the first metal and the aluminum gallium nitride layer 314. That is, the contact resistance between the source 331 and the drain 332 and the aluminum gallium nitride layer 314 is reduced.
Step 305, performing dry etching on the dielectric layer 320 and the aluminum gallium nitride layer 314 through the ohmic contact electrode window 319 to form a gate contact hole 323, wherein the bottom of the gate contact hole 323 has a preset distance from the bottom of the aluminum gallium nitride layer 314.
In this embodiment, a dry etching method is adopted to perform dry etching on the dielectric layer 320 and a portion of the aluminum gallium nitride layer 314 through the ohmic contact electrode window 319, so as to form a gate contact hole 323 on the first device.
During the first etching, only the dielectric layer 320 is etched, and a shallow first contact hole 323a is obtained; performing the second dry etching on one side of the first contact hole 323a obtained by the first etching, wherein the etching penetrates through the whole dielectric layer 320 and then penetrates into part of the aluminum gallium nitride layer 314 to form a deeper second contact hole 323 b; thus, the entire gate contact hole 323 is obtained. The proportional relation between the width D1 of the first gate and the width D2 of the second gate is controlled by adjusting the width of the second contact hole 323b by controlling the etching process parameters.
Step 306, depositing Ni/Au on the first contact hole 323a, the second contact hole 323b and part of the dielectric layer 320, wherein the metal thickness is 0.01-0.04 μm/0.08-0.4 μm; a gate 333 is obtained. It is understood that the two gate contact holes are actually connected to each other, and the first gate portion 333a and the second gate portion 333b are integrally formed.
Preferably, the second contact hole 323b completely penetrates the dielectric layer 320 and penetrates a portion of the aluminum gallium nitride layer 314, such that the distance H between the bottom of the second contact hole 323b and the bottom of the aluminum gallium nitride layer 314 is preferably half the thickness of the aluminum gallium nitride layer 314.
In this embodiment, after forming a gate contact hole 323, impurities such as impurities, particles, and ions may exist in the gate contact hole 323, so that the gate contact hole 323 may be cleaned by using a hydrochloric acid solution to remove the impurities in the gate contact hole 323.
Specifically, in this embodiment, after the dielectric layer 320 is dry etched, impurities on the device are removed by using a method of DHF + SC1+ SC 2; after the gate contact hole 323 is formed, impurities in the gate contact hole 323 are removed using a hydrochloric acid solution. Therefore, the surface of the dielectric layer and the cleanness in the gate contact hole 323 can be effectively ensured, and the performance of the gallium nitride semiconductor device is further ensured.
At this time, in order to express the contents of the present invention more clearly, the device obtained at this time is named as a second component.
Step 307, an insulating layer 340 is deposited over the surface of the second component.
In this embodiment, specifically, a layer of silicon dioxide (SiO) is deposited over the entire surface of the second component2) A silicon dioxide layer may be formed as an insulating layer 340, for example, to a thickness of 5000 angstroms. Wherein, silicon dioxide is deposited uniformly on the surface of the whole device, the thickness is the same everywhere, and due to the existence of the source electrode 331, the drain electrode 332 and the gate electrode 333, the insulating layer 340 between the source electrode 331 and the gate electrode 333, and the insulating layer 340 between the gate electrode 333 and the drain electrode 332 are recessed downwards, and can be flattened by using a grinding process.
In step 308, an opening 341 is formed after dry etching the insulating layer 340 over the source contact hole 321. The gate 333 has a protrusion protruding out of the gate contact hole 323, and the width of the opening 341 is smaller than the width of the protrusion.
In step 309, a field plate metal layer 350 is deposited within opening 341 and on insulating layer 340 extending from source contact opening 321 to above gate contact opening 323, forming field plate metal layer 350.
In this embodiment, specifically, a magnetron sputtering coating process may be used to deposit a field plate metal, which may be, for example, 10000 angstroms thick, in the opening 341 and on the dielectric layer 320 from the first metal at the outer edge of the source contact hole 321 to the first metal above the first metal at the outer edge of the gate contact hole 323, thereby forming the field plate metal layer 350. The thickness of the field plate metal layer 350 is uniform, and the field plate metal layer 350 is recessed downward at the position of the opening 341 and between the source contact hole 321 and the gate contact hole 323, and can be planarized by a planarization process in a subsequent step.
Has the advantages that:
the gallium nitride semiconductor device of the present embodiment employs a hybrid gate structure including a short first gate portion 333a belonging to an enhancement type and a long second gate portion 333b belonging to a depletion type. In the off-state condition, the first gate 333a is off, while the second gate 333b can latch the channel potential at the drain voltage, providing a high blocking capability; in the on state, the enhancement channel and the depletion channel provide low channel resistance, ensuring high on current and low on resistance. The gallium nitride semiconductor device obtained by the embodiment can be applied to the technical fields of power electronic elements, filters, radio communication elements and the like, and has a good application prospect.
As shown in fig. 3a, an embodiment of the present invention provides a gan semiconductor device, which includes, from bottom to top: gallium nitride epitaxial layer 610, dielectric layer 620, source 631 and drain 632, gate 633, insulating layer 640, field plate metal layer 650.
The gallium nitride epitaxial layer 610 is composed of a silicon (Si) substrate 612, a gallium nitride (GaN) layer 613, and an aluminum gallium nitride (AlGaN) layer 614, wherein the silicon substrate 612, the gallium nitride layer 613, and the aluminum gallium nitride layer 614 are sequentially disposed from bottom to top.
A dielectric layer 620 is disposed on the gallium nitride epitaxial layer 610; the material of the dielectric layer 620 in this embodiment may be, for example, hafnium oxide (HfO 2). The hafnium oxide is a high dielectric constant (high-k) dielectric.
A source 631, a drain 632, and a gate 633 are disposed on the dielectric layer 620. Specifically, a source 631, a drain 632 and a gate 633 are partially inserted into the dielectric layer 620 in the shape of a "nail", and the source 631, the drain 632 and the gate 633 are respectively connected with the gallium nitride epitaxial layer 610 through the dielectric layer 620; and a portion protrudes above the top of the dielectric layer 620. The source 631 and/or drain 632 are made of a first metal as in the previous embodiments. The source electrode 631 and the drain electrode 632 made of the first metal material can react with the gallium nitride aluminum layer 614 in the gallium nitride epitaxial layer 610 in the high-temperature annealing process of the device to generate an alloy, so that the contact between the source electrode 631 and the drain electrode 632 and the contact surface of the aluminum gallium nitride layer is good, and the contact resistance between the source electrode 631 and the drain electrode 632 and the aluminum gallium nitride layer can be effectively reduced; the problems of electric leakage and soft breakdown of the gallium nitride semiconductor device are avoided.
Preferably, the gate 633 extends down into the algan layer 614 and reaches the bottom of the algan layer 614, so as to obtain a "transmission gate". The gate electrode 633 is composed of a second metal, which is Ni, Au alloy.
The insulating layer 640 is disposed above the drain 632, the gate 633 and a portion of the source 631, and on the exposed whole dielectric layer 620, and the insulating layer 640 is made of silicon dioxide. Wherein the insulating layer 640 is deposited uniformly over the entire surface of the device, with the same thickness throughout the deposition. Due to the source electrode 631, the drain electrode 632 and the gate electrode 633, the insulating layer 640 between the source electrode 631 and the gate electrode 633 and the insulating layer 640 between the gate electrode 633 and the drain electrode 632 are recessed downward, and can be planarized by a planarization process.
A field plate metal layer 650 may also be included, for example, disposed on the insulating layer 640. The field plate metal layer 650 is connected to the source electrode 631 through the insulating layer 640. Preferably, the field plate metal layer 650 is made of an aluminum-silicon-copper metal layer.
The grid electrode 633 of the gallium nitride semiconductor device penetrates through the whole aluminum gallium nitride layer to reach the gallium nitride layer, so that a high electric field at the edge of the grid electrode can be inhibited, the stable blocking characteristic of the gallium nitride high-voltage device is effectively ensured, and the device can still keep good reliability after repeated high voltage.
The invention also provides a preparation method of the gallium nitride semiconductor device. As shown in fig. 3b, the specific steps include:
step 601: a gallium nitride layer 613 and an aluminum gallium nitride layer 614 are sequentially deposited on a silicon substrate 612 to form a gallium nitride epitaxial layer 610. Gallium nitride is a third-generation wide-bandgap semiconductor material, has the characteristics of large forbidden band width, high electronic saturation rate, high breakdown electric field, high thermal conductivity, corrosion resistance, radiation resistance and the like, and has strong advantages under the environmental conditions of high pressure, high frequency, high temperature, high power and radiation resistance, so that the gallium nitride is an optimal material for researching short-wave photoelectronic devices and high-pressure high-frequency high-power devices; wherein, the large forbidden band width is 3.4 electron volts, the high electron saturation velocity is 2e7 centimeters per second, and the high breakdown electric field is 1e10 to-3 e10 volts per centimeter.
A layer of hafnium oxide (HfO2) may then be deposited on the surface of the gan epitaxial layer 610 using a plasma enhanced chemical vapor deposition process to form a dielectric layer 620. The thickness of the hafnium oxide may be 2000 angstroms, for example.
Step 602, performing dry etching on the dielectric layer 620 to form a source contact hole 621 and a drain contact hole 622 which are oppositely arranged.
In order to clean the source contact hole 621 and the drain contact hole 622 with less impurities, an impurity removal step is further included. Specifically, after the dielectric layer 620 is dry etched, a method of "DHF (dilute hydrofluoric acid) + chemical cleaning agent SC-1+ chemical cleaning agent SC-2" may be used, for example, a diluted hydrofluoric acid solution may be used to treat the device, then an alkaline mixed solution of hydrogen peroxide and ammonium hydroxide is used to treat the device, and then an acidic mixed solution of hydrogen peroxide and hydrogen chloride is used to treat the device, so that impurities on the surface of the entire device may be removed.
In step 603, in this embodiment, a first metal is deposited in the source contact hole 621 and the drain contact hole 622, and on the surface of the dielectric layer 620.
Specifically, a magnetron sputtering coating process can be adopted, and a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a titanium nitride layer are sequentially deposited in the source contact hole, the drain contact hole and the surface of the dielectric layer to form a first metal; the thickness of the first titanium metal layer may be, for example, 200 angstroms, the thickness of the aluminum metal layer may be, for example, 1200 angstroms, the thickness of the second titanium metal layer may be, for example, 200 angstroms, and the thickness of the titanium nitride layer may be, for example, 200 angstroms.
The first metal is lithographically and etched to form ohmic contact electrode windows 619.
Performing photolithography and etching on the first metal, wherein the photolithography process includes photoresist coating, exposure and development, so as to form an ohmic contact electrode window 619; a portion of the surface of dielectric layer 620 is visible through ohmic contact electrode window 619. Thus, the first metal on the source contact hole 621 constitutes the source 631 of the device, and the first metal on the drain contact hole 622 constitutes the drain 632 of the device. At this time, in order to clearly express the process of the present invention, the device obtained at this time is named as a first component.
Step 604, a high temperature anneal is performed on the entire first assembly to form an alloy after the etched first metal and the aluminum gallium nitride layer 614, which are in contact with each other, react.
In this embodiment, specifically, nitrogen gas is introduced into the reaction furnace, and the entire first component is subjected to high-temperature annealing treatment at 840 to 850 ℃ for 30 seconds, so that the etched first metal becomes an alloy, and the etched first metal in contact with the aluminum gallium nitride layer 614 may also form an alloy on the contact surface after the first metal reacts with the aluminum gallium nitride layer 614, thereby reducing the contact resistance between the first metal and the aluminum gallium nitride layer 614. That is, the contact resistance between the source electrode 631 and the drain electrode 632 and the aluminum gallium nitride layer 14 is reduced.
In step 605, the dielectric layer 620 and the aluminum gallium nitride layer 614 are dry etched through the ohmic contact electrode window 619 to form a gate contact hole 623, wherein the bottom of the gate contact hole 623 reaches the bottom of the aluminum gallium nitride layer 614.
In this embodiment, a dry etching method is adopted to perform dry etching on the dielectric layer 620 and a portion of the aluminum gallium nitride layer 614 through the ohmic contact electrode window 619, so as to form a gate contact hole 623 on the first device. The gate contact hole 623 completely penetrates through the dielectric layer 620 and the aluminum gallium nitride layer 614, so that the gate contact hole 623 reaches the bottom of the aluminum gallium nitride layer 614.
In this embodiment, after forming a gate contact hole 623, impurities such as impurities, particles and ions may exist in the gate contact hole 623, so that the gate contact hole 623 may be cleaned by using a hydrochloric acid solution to remove the impurities in the gate contact hole 623.
In the embodiment, after the dielectric layer 620 is subjected to dry etching, impurities on the device are removed by adopting a method of DHF + SC1+ SC 2; after the gate contact hole 623 is formed, impurities in the gate contact hole 623 are removed by using a hydrochloric acid solution. Therefore, the surface of the dielectric layer and the cleanness of the inside of the gate contact hole 623 can be effectively ensured, and the performance of the gallium nitride semiconductor device is further ensured.
Step 606, in this embodiment, specifically, a magnetron sputtering coating process is adopted, Ni/Au is deposited on the outer edges of the gate contact hole 623 and the gate contact hole 623 to serve as a second metal, and the thickness of the metal is 0.01-0.04 μm/0.08-0.4 μm; thereby constituting the gate electrode 633. At this time, in order to express the contents of the present invention more clearly, the device obtained at this time is named as a second component.
In step 607, an insulating layer 640 is deposited over the entire surface of the second component.
In this embodiment, specifically, a layer of silicon dioxide (SiO2) is deposited over the entire surface of the second component, which may be, for example, 5000 angstroms thick, to form a silicon dioxide layer as an insulating layer 640. The silicon dioxide is uniformly deposited on the surface of the whole device, the thickness of the silicon dioxide is the same everywhere, and due to the existence of the source electrode 631, the drain electrode 632 and the gate electrode 633, the insulating layer 640 between the source electrode 631 and the gate electrode 633 and the insulating layer 640 between the gate electrode 633 and the drain electrode 632 are recessed downwards and can be flattened by a grinding process.
In step 608, after dry etching the insulating layer 640 over the source contact hole 621, an opening 641 is formed. The gate 33 has a protrusion protruding out of the gate contact hole 623, and the width of the opening 641 is smaller than that of the protrusion.
In step 609, field plate metal layer 650 is deposited in opening 641 and on insulating layer 640 extending from source contact 621 to above gate contact 623, forming field plate metal layer 650.
In this embodiment, specifically, a magnetron sputtering coating process may be used to deposit a field plate metal, which may be 10000 angstroms in thickness, in the opening 641 and on the dielectric layer 620 above the first metal from the outer edge of the source contact hole 621 to the first metal at the outer edge of the gate contact hole 623, thereby forming a field plate metal layer 650. The thickness of the field plate metal layer 650 is uniform, and the field plate metal layer 650 is recessed downward at the position of the opening 641 and at the position between the source contact hole 621 and the gate contact hole 623, and is smoothed by a planarization process in a subsequent step.
In the embodiment, a dielectric layer is deposited on the surface of the gallium nitride epitaxial substrate to replace the existing silicon oxide layer as the dielectric layer; then, the source electrode and the drain electrode react with the aluminum gallium nitride layer in the gallium nitride epitaxial layer by utilizing a high-temperature annealing treatment process to form an alloy, so that the contact between the source electrode and the contact surface between the drain electrode and the aluminum gallium nitride layer is good, and the contact resistance between the source electrode and the drain electrode and the aluminum gallium nitride layer can be effectively reduced; the problems of electric leakage and soft breakdown of the gallium nitride semiconductor device are avoided. Furthermore, the structure of the grid is optimized, so that the grid penetrates through the whole aluminum gallium nitride layer, the grid is compatible with a CMOS (complementary metal oxide semiconductor) process line, and the electric field distribution is adjusted, so that the withstand voltage of the device is improved. The gallium nitride semiconductor device obtained by the embodiment can be applied to the technical fields of power electronic elements, filters, radio communication elements and the like, and has a good application prospect.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (6)

1. A gallium nitride semiconductor device, comprising: the gallium nitride epitaxial layer comprises a silicon substrate, a gallium nitride layer arranged on the surface of the silicon substrate and an aluminum gallium nitride layer arranged on the surface of the gallium nitride layer; and the number of the first and second groups,
the dielectric layer is arranged on the gallium nitride epitaxial layer and is made of hafnium oxide;
the source electrode, the drain electrode and the grid electrode are arranged on the dielectric layer and respectively penetrate through the dielectric layer to be connected with the gallium nitride epitaxial layer; depositing a silicon nitride layer in the contact hole of the grid, wherein the silicon nitride layer is not higher than the contact hole of the grid; the grid comprises an asymmetric special-shaped grid which is formed by two parts in parallel connection and in different lengths, the shorter part of the grid is an enhancement type first grid part, the longer part of the grid is a depletion type second grid part, and the first grid part and the second grid part penetrate through the dielectric layer and are connected with the gallium nitride epitaxial layer; the second gate part extends downwards into the aluminum gallium nitride layer, and the distance from the bottom end of the second gate part to the bottom of the aluminum gallium nitride layer is half of the thickness of the whole aluminum gallium nitride layer; the width of the first grid part is not less than that of the second grid part; the insulating layer is arranged on the source electrode, the drain electrode, the grid electrode and the dielectric layer and is made of silicon dioxide; an opening is formed in the insulating layer, and the width of the opening is smaller than that of the protruding portion outside the gate contact hole;
the field plate metal layer penetrates through the insulating layer and is connected with the source electrode.
2. The gallium nitride semiconductor device according to claim 1, wherein the dielectric layer has a thickness of 2000 angstroms.
3. The gallium nitride semiconductor device according to claim 1, wherein the source or drain is composed of a first metal; the first metal sequentially comprises from bottom to top: the metal layer comprises a first titanium metal layer, an aluminum metal layer, a second titanium metal layer and a titanium nitride layer.
4. The gallium nitride semiconductor device according to claim 1, wherein the gate electrode is made of a second metal, and the second metal is an alloy of Ni and Au.
5. A method for preparing a gallium nitride semiconductor device is characterized by comprising the following steps:
providing a gallium nitride epitaxial layer, wherein the gallium nitride epitaxial layer comprises a silicon substrate layer, a gallium nitride layer and an aluminum gallium nitride layer which are arranged from bottom to top in sequence;
depositing hafnium oxide on the surface of the gallium nitride epitaxial layer to form a dielectric layer;
obtaining a source contact hole and a drain contact hole: etching the dielectric layer to form a source contact hole and a drain contact hole which are independent from each other, wherein the source contact hole and the drain contact hole penetrate through the dielectric layer to reach the aluminum gallium nitride layer; depositing a first metal in the source contact hole and the drain contact hole and on the surface of the dielectric layer to obtain a source electrode and a drain electrode;
photoetching and etching the first metal to form an ohmic contact electrode window; at this point, a first component is obtained;
performing high-temperature annealing treatment on the first assembly to enable the first metal accommodated in the source contact hole and the drain contact hole to form an alloy and react with the aluminum gallium nitride layer;
obtaining a gate contact hole: performing dry etching on the dielectric layer and the aluminum gallium nitride layer through the ohmic contact electrode window to form a gate contact hole; depositing a silicon nitride layer in the contact hole of the grid, wherein the silicon nitride layer is not higher than the contact hole of the grid;
depositing a second metal on the outer edges of the gate contact hole and the gate contact hole to obtain a gate, and then obtaining a second component; the grid comprises an asymmetric special-shaped grid which is formed by two parts in parallel connection and in different lengths, the shorter part of the grid is an enhancement type first grid part, the longer part of the grid is a depletion type second grid part, and the first grid part and the second grid part penetrate through the dielectric layer and are connected with the gallium nitride epitaxial layer; the second gate part extends downwards into the aluminum gallium nitride layer, and the distance from the bottom end of the second gate part to the bottom of the aluminum gallium nitride layer is half of the thickness of the whole aluminum gallium nitride layer; the width of the first grid part is not less than that of the second grid part;
depositing an insulating layer on the surface of the second component;
performing dry etching on the insulating layer to form an opening, wherein the opening corresponds to the source contact hole, and the width of the opening is smaller than that of the protruding part outside the gate contact hole;
depositing a field plate metal layer on the opening and the insulating layer, a projection of the field plate metal layer covering at least the opening and a region from the source contact hole to the gate contact hole.
6. The method for manufacturing a gallium nitride semiconductor device according to claim 5, wherein the high temperature annealing treatment step is: and keeping the temperature of the mixture at 840-850 ℃ for 30-60 seconds in a protective atmosphere.
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