CN107234347A - A kind of laser auxiliary heating femtosecond pulse perforating device and method - Google Patents
A kind of laser auxiliary heating femtosecond pulse perforating device and method Download PDFInfo
- Publication number
- CN107234347A CN107234347A CN201710588212.XA CN201710588212A CN107234347A CN 107234347 A CN107234347 A CN 107234347A CN 201710588212 A CN201710588212 A CN 201710588212A CN 107234347 A CN107234347 A CN 107234347A
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- China
- Prior art keywords
- laser
- femtosecond pulse
- workpiece
- controller
- continuous
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
Abstract
The invention discloses a kind of laser auxiliary heating femtosecond pulse punching dress and method, the device includes femtosecond pulse laser, the first beam expander, CCD camera, plane of reflection mirror, beam splitter, convex lens, the second beam expander, continuous wave laser, femtosecond pulse controller, continuous laser controller, workpiece, fixture, movable working platform, stage controller, computer；Simultaneously there is provided a kind of laser auxiliary heating femtosecond pulse drilling method using said apparatus, its cardinal principle is before femtosecond pulse laser is to work pieces process, machining area is wanted to preheat workpiece using continuous wave laser, warm material is not undergone phase transition, so as to while the processing advantage of femtosecond laser is ensured, absorptivity of the material to femtosecond pulse is improved, the ablation threshold of femtosecond laser rapidoprint is reduced, femtosecond pulse perforating efficiency is improved.
Description
Technical field
The present invention relates to laser boring field, especially a kind of laser auxiliary heating femtosecond pulse drilling method and dress
Put.
Background technology
Femtosecond pulse has extremely short pulse width and high peak power.Femtosecond laser punching is exactly using winged
Pulse per second (PPS) laser removes material so as in the process in workpiece surface formation hole in a pulsed fashion in material surface.Due to femtosecond arteries and veins
The energy of impulse light is very big, and action time is extremely short, and energy is not in time for diffusion also, and material has been heated to high
Temperature, material direct boiling evaporation, therefore the fuel factor of femtosecond pulse is small, to machined material oxidation, deformation, heat affecting
Region is smaller, and machining accuracy is very high, can reach nanometer scale.
But the material that each pulse is removed during femtosecond pulse processing is considerably less, one hole of processing often takes very
Long, this resulted in femtosecond pulse processing efficiency it is relatively low, be not suitable with large-scale production, therefore be unfavorable for femtosecond pulse
The popularization of laser and use.Now there are some researches show most of metal material can be with the temperature of material to the absorptivity of laser
Rise and rise, therefore the present invention swashs from a kind of laser auxiliary heating femtosecond pulse of angle design for the absorptivity for improving femtosecond laser
Light drilling method and device, to improve the processing efficiency of femtosecond pulse.
The Chinese patent of number of patent application 201410251135.5《A kind of dual laser system drilling method》Propose a set of
Applied to the system of laser boring, first with power density is low, pulsewidth length pulse laser irradiation produced in workpiece surface it is molten
Pond, and produce above molten bath plasma, the pulsed laser action that then power density is high, pulsewidth is short in plasma, etc.
Gas ions, which absorb, produces plasma blast after short pulse superlaser, inside the impact wave direction hole produced of exploding and two outside hole
Direction is propagated, wherein the shock wave inwardly propagated is in molten bath, is made outside the quick squit hole of melted material, is so repeated, and is realized
Dual laser system is punched.But the method and apparatus that the patent is proposed will be first using power density is low, pulsewidth length pulse laser
Irradiate and first occur solid liquid phase before the pulsed laser action that power density is high, pulsewidth is short in workpiece surface generation molten bath, i.e. material
Become, the follow-up pulsed laser action that power density is high, pulsewidth is short is easily caused hole adjacent material generation on plasma, so
Change and reduction material surface quality, therefore and be not suitable for the ultra tiny punching of femtosecond pulse, especially in micron
And nanoscale punching when device to hole and hole around quality requirement it is very high, requirement can not be met using the patent.
The content of the invention
The present invention adds to solve the current slow-footed problem of femtosecond pulse perforation processing there is provided a kind of laser assisted
Hot femtosecond pulse drilling method and device.
The present invention is as follows to solve the technical scheme that technical problem is provided：
A kind of laser auxiliary heating femtosecond pulse perforating device, including computer table controller, continuous laser
Controller, continuous wave laser, the second beam expander, beam splitter, plane of reflection mirror, the first beam expander, femtosecond pulse laser, convex lens
Mirror, femtosecond pulse controller, fixture, workpiece, movable working platform and CCD camera；
The continuous laser controller input is connected with computer, continuous laser controller output end and continuous laser
Device input is connected, and continuous wave laser output end is connected with the second beam expander, and light beam is irradiated to 45 ° and set by the second beam expander
On the beam splitter put, beam splitter mirror reflexes to the light from the second beam expander on convex lens；
The femtosecond pulse controller input is connected with computer, femtosecond pulse controller output end with
Femtosecond pulse laser input is connected, and femtosecond pulse laser output end is connected with the first beam expander, the first beam expander
On the plane of reflection mirror that light beam is irradiated to 45 ° of settings, the light beam from the first beam expander is reflexed to beam splitting by plane of reflection mirror
On mirror, so that the light from the first beam expander is reflexed on convex lens；
Light beam on the convex lens is acted on the workpiece of underface, and the workpiece is arranged on removable start building by fixture
Make on platform, movable working platform is connected by stage controller with computer；Movable working platform is arranged above CCD
Camera.
Further, the continuous wave laser (4) is CO2Continuous wave laser or optical fiber continuous wave laser
A kind of laser auxiliary heating femtosecond pulse drilling method, comprises the following steps：
Step one) polishing is ground to workpiece surface；
Step 2) the treated workpiece of step one is fixed on fixture, by the monitoring of CCD camera, utilize workbench
Controller controls movable working platform, adjusts the position of workpiece；
Step 3) continuous wave laser is set by continuous laser controller export low energy continuous laser beam for heating
Output parameter；Open continuous wave laser to heat workpiece position to be processed, the heat time is by computer control；
Step 4) workpiece of step 3 was preheated after certain time, open femtosecond pulse laser to be processed to workpiece
Position exports femtosecond pulse beam, in material machining area formation aperture；
Step 5) femtosecond pulse laser and continuous wave laser are closed, stage controller control movable working platform is moved
Move next position；
Step 6) above step is repeated, the next position of workpiece is processed.
The beneficial effects of the invention are as follows：
1st, while the processing advantage of femtosecond laser is ensured, local heating is carried out to machining area using continuous laser,
Material is not undergone phase transition and temperature-controllable, influence will not be produced on material remainder, therefore can ensure that femtosecond laser is beaten
The advantage that the machining accuracy in hole is high, heat-affected zone is small.
2nd, material is improved to the absorptivity of femtosecond pulse, the ablation threshold of material is reduced, so as to improve material
Excision efficiency, that is, improve the processing efficiency of femtosecond pulse.
3rd, automaticity of the present invention is higher, and only workpiece need to be had good positioning, and just can be realized by computer programming automatic
Change processing.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of laser auxiliary heating femtosecond pulse perforating device；
Reference is as follows：1. computer, 2. stage controllers, 3. continuous laser controllers, 4. continuous wave lasers, 5.
Second beam expander, 6. beam splitters, 7. plane of reflection mirrors, 8. first beam expanders, 9. femtosecond pulse lasers, 10. convex lens, 11.
Femtosecond pulse controller, 12. fixtures, 13. workpiece, 14. movable working platforms, 15.CCD cameras.
Embodiment
To be understood the present invention is further, it is described further in conjunction with accompanying drawing：
Embodiment one：
A kind of laser auxiliary heating femtosecond pulse perforating device, as shown in figure 1, being controlled including computer 1, workbench
Device 2, continuous laser controller 3, continuous wave laser 4, the second beam expander 5, beam splitter 6, plane of reflection mirror 7, the first beam expander 8,
Femtosecond pulse laser 9, convex lens 10, femtosecond pulse controller 11, fixture 12, workpiece 13, movable working platform 14,
CCD camera 15.
CCD camera 15 is located at the top, and its underface is followed successively by plane of reflection mirror 7, beam splitter 6 and convex lens 10；Femtosecond
Pulse laser controller 11 is connected with femtosecond pulse laser 9, and continuous laser controller 3 is connected with continuous wave laser 4, workbench
Controller 2 is connected with movable working platform 14；Femtosecond pulse controller 11, continuous laser controller 3 are controlled with workbench
Device 14 is connected by signal wire with computer 1；Workpiece 13 is fixed on fixture 12, and fixture 12 is fixed on movable working platform 14
On.
A kind of laser auxiliary heating femtosecond pulse drilling method：It is mainly characterized by, in femtosecond pulse laser pair
Using continuous wave laser to wanting machining area to heat before work pieces process.Swashed according to above-mentioned laser auxiliary heating femtosecond pulse
Light perforating device, is mainly included the following steps that：
1. the surface of pair workpiece 13 is ground polishing；
2. workpiece 13 is fixed on fixture 12, fixture 12 is fixed on movable working platform 14；
3. under the monitoring of CCD camera 15, movable working platform is controlled using stage controller 2, the position of workpiece is adjusted；
4. the low energy continuous laser beam for heat effect is exported by the setting continuous wave laser of continuous laser controller 3
Output parameter；
5. opening continuous wave laser to heat the position to be processed of workpiece 13, the heat time is by computer control；
6. after the preheated one-section time, open femtosecond pulse laser 9 and the position to be processed of workpiece 13 output femtosecond pulse is swashed
Light beam, in material machining area formation aperture；
7. closing femtosecond pulse laser 9 and continuous wave laser 4, the control movable working platform 14 of stage controller 2 is moved
Move next position；
8. repeating above step, the next position of workpiece 13 is processed
For the present invention preferred embodiment, but the present invention is not limited to above-mentioned embodiment to the embodiment, not
In the case of the substantive content of the present invention, any conspicuously improved, replacement that those skilled in the art can make
Or modification belongs to protection scope of the present invention.
Claims (3)
1. a kind of laser auxiliary heating femtosecond pulse perforating device, it is characterised in that including the control of computer (1) workbench
Device (2), continuous laser controller (3), continuous wave laser (4), the second beam expander (5), beam splitter (6), plane of reflection mirror (7),
First beam expander (8), femtosecond pulse laser (9), convex lens (10), femtosecond pulse controller (11), fixture (12), work
Part (13), movable working platform (14) and CCD camera (15)；
Continuous laser controller (3) input is connected with computer (1), continuous laser controller (3) output end and company
Continuous laser (4) input is connected, and continuous wave laser (4) output end is connected with the second beam expander (5), the second beam expander
(5) light beam is irradiated on the beam splitter (6) of 45 ° of settings, beam splitter (6) reflexes to the light from the second beam expander (5) convex
On lens (10)；
Femtosecond pulse controller (11) input is connected with computer (1), femtosecond pulse controller (11)
Output end is connected with femtosecond pulse laser (9) input, femtosecond pulse laser (9) output end and the first beam expander (8)
It is connected, light beam is irradiated on the plane of reflection mirror (7) of 45 ° of settings by the first beam expander (8), and plane of reflection mirror (7) will come from
The light beam of first beam expander (8) is reflexed on transmission/reflection/angle level crossing (6), so that the light from the first beam expander (8) be reflected
Onto convex lens (10)；
Light beam on the convex lens (10) is acted on the workpiece (13) of underface, and the workpiece (13) passes through fixture (12) and pacified
On movable working platform (14), movable working platform (14) is connected by stage controller (2) with computer (1)；
Movable working platform (14) is arranged above CCD camera (15).
2. laser auxiliary heating femtosecond pulse perforating device according to claim 1, it is characterised in that described continuous
Laser (4) is CO2Continuous wave laser or optical fiber continuous wave laser.
3. a kind of laser auxiliary heating femtosecond pulse drilling method based on claim 1：It is characterised in that it includes as follows
Step：
Step one) polishing is ground to workpiece (13) surface；
Step 2) the treated workpiece (13) of step one is fixed on fixture (12), pass through the monitoring of CCD camera (15), profit
With stage controller (2) control movable working platform (14), the position of adjustment workpiece (13)；
Step 3) continuous wave laser (4) is set by continuous laser controller (3) export low energy continuous laser for heating
The output parameter of beam；Open continuous wave laser (4) to heat workpiece (10) position to be processed, the heat time is by computer
(1) control；
Step 4) workpiece (10) of step 3 is pre-heated to after its fusing point, femtosecond pulse laser (9) is opened to workpiece (10)
Position to be processed exports femtosecond pulse beam, in material machining area formation aperture；
Step 5) close femtosecond pulse laser (9) and continuous wave laser (4), stage controller (2) control mobile work
Platform (14) is moved to next position；
Step 6) above step is repeated, workpiece (10) next position is processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710588212.XA CN107234347A (en) | 2017-07-19 | 2017-07-19 | A kind of laser auxiliary heating femtosecond pulse perforating device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710588212.XA CN107234347A (en) | 2017-07-19 | 2017-07-19 | A kind of laser auxiliary heating femtosecond pulse perforating device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107234347A true CN107234347A (en) | 2017-10-10 |
Family
ID=59990656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201710588212.XA Pending CN107234347A (en) | 2017-07-19 | 2017-07-19 | A kind of laser auxiliary heating femtosecond pulse perforating device and method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108788496A (en) * | 2018-05-04 | 2018-11-13 | 江苏大学 | A kind of tow sides laser drilling device and method |
| CN109366017A (en) * | 2018-11-12 | 2019-02-22 | 江苏大学 | A kind of apparatus and method of the cooling auxiliary laser punching of energy-saving liquid nitrogen |
| WO2019114466A1 (en) * | 2017-12-13 | 2019-06-20 | 京东方科技集团股份有限公司 | Display product fabrication method and laser processing device |
| CN110625274A (en) * | 2019-11-05 | 2019-12-31 | 南京先进激光技术研究院 | Laser precision machining method for dense holes |
| CN110732789A (en) * | 2019-10-23 | 2020-01-31 | 中南大学 | heat-assisted femtosecond laser processing method |
| CN111014943A (en) * | 2019-12-23 | 2020-04-17 | 西安中科微精光子制造科技有限公司 | Double-light-source composite laser processing equipment and processing method |
| CN111408855A (en) * | 2020-04-10 | 2020-07-14 | 一汽解放汽车有限公司 | Automatic alignment device and method for circumferential micropore laser processing |
| CN113102900A (en) * | 2021-03-15 | 2021-07-13 | 沈阳万超激光科技有限公司 | Method for improving quality of water-conducting laser-machined hole through heat treatment |
| CN113510369A (en) * | 2021-08-10 | 2021-10-19 | 上海工程技术大学 | Laser material reduction machining device and method based on temperature control |
| CN114289903A (en) * | 2022-01-11 | 2022-04-08 | 常州富烯科技股份有限公司 | Graphene film laser processing method and graphene film laser processing equipment |
Citations (1)
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| CN106735943A (en) * | 2016-12-16 | 2017-05-31 | 江苏大学 | A kind of laser auxiliary heating Long Pulse LASER perforating device and its method |
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- 2017-07-19 CN CN201710588212.XA patent/CN107234347A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106735943A (en) * | 2016-12-16 | 2017-05-31 | 江苏大学 | A kind of laser auxiliary heating Long Pulse LASER perforating device and its method |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019114466A1 (en) * | 2017-12-13 | 2019-06-20 | 京东方科技集团股份有限公司 | Display product fabrication method and laser processing device |
| US11571767B2 (en) | 2017-12-13 | 2023-02-07 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Laser processing device and laser processing method |
| CN108788496A (en) * | 2018-05-04 | 2018-11-13 | 江苏大学 | A kind of tow sides laser drilling device and method |
| CN109366017A (en) * | 2018-11-12 | 2019-02-22 | 江苏大学 | A kind of apparatus and method of the cooling auxiliary laser punching of energy-saving liquid nitrogen |
| CN110732789A (en) * | 2019-10-23 | 2020-01-31 | 中南大学 | heat-assisted femtosecond laser processing method |
| CN110625274B (en) * | 2019-11-05 | 2021-12-21 | 南京先进激光技术研究院 | Laser precision machining method for dense holes |
| CN110625274A (en) * | 2019-11-05 | 2019-12-31 | 南京先进激光技术研究院 | Laser precision machining method for dense holes |
| CN111014943A (en) * | 2019-12-23 | 2020-04-17 | 西安中科微精光子制造科技有限公司 | Double-light-source composite laser processing equipment and processing method |
| CN111408855A (en) * | 2020-04-10 | 2020-07-14 | 一汽解放汽车有限公司 | Automatic alignment device and method for circumferential micropore laser processing |
| CN111408855B (en) * | 2020-04-10 | 2022-01-11 | 一汽解放汽车有限公司 | Automatic alignment device and method for circumferential micropore laser processing |
| CN113102900A (en) * | 2021-03-15 | 2021-07-13 | 沈阳万超激光科技有限公司 | Method for improving quality of water-conducting laser-machined hole through heat treatment |
| CN113510369A (en) * | 2021-08-10 | 2021-10-19 | 上海工程技术大学 | Laser material reduction machining device and method based on temperature control |
| CN114289903A (en) * | 2022-01-11 | 2022-04-08 | 常州富烯科技股份有限公司 | Graphene film laser processing method and graphene film laser processing equipment |
| CN114289903B (en) * | 2022-01-11 | 2024-02-02 | 常州富烯科技股份有限公司 | Graphene film laser processing method and graphene film laser processing equipment |
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Application publication date: 20171010 |