CN110625274A - Laser precision machining method for dense holes - Google Patents
Laser precision machining method for dense holes Download PDFInfo
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- CN110625274A CN110625274A CN201911068827.5A CN201911068827A CN110625274A CN 110625274 A CN110625274 A CN 110625274A CN 201911068827 A CN201911068827 A CN 201911068827A CN 110625274 A CN110625274 A CN 110625274A
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- hole
- laser
- holes
- laser beam
- drilling
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- 238000003754 machining Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000005553 drilling Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 35
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 230000008569 process Effects 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000011148 porous material Substances 0.000 claims abstract description 4
- 239000002893 slag Substances 0.000 claims description 11
- 238000010926 purge Methods 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910001868 water Inorganic materials 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 2
- 238000003672 processing method Methods 0.000 abstract description 4
- 238000004080 punching Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- 238000007664 blowing Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser precision machining method for dense holes, which comprises the following steps: drive the laser beam machining head through long stroke motion and remove to the substrate and treat the processing hole position, drive the laser beam machining head through micro-gap mechanism and treat the processing hole position at the substrate and carry out laser beam drilling, laser beam drilling includes following step: the center of the positioning hole; forming a pore boundary; forming holes; and removing materials in the holes. The invention solves the problems of difficult application to large-area high-density group hole processing occasions, low processing efficiency, low hole quality and the like in the laser drilling process in the prior art, and the processing method can be used for drilling high-quality group holes on a plane and a complex curved surface, and has strong universality, short processing time and high drilling efficiency.
Description
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a laser precision processing method of dense holes.
Background
Laser drilling is widely applied to key part processing technologies of high-precision products such as aerospace, medical instruments and hardware parts at present. Laser drilling refers to a laser processing process in which laser is focused and then used as a high-intensity heat source to heat materials, so that the materials in a laser action area are melted or gasified and then evaporated to form holes. The laser beam is highly concentrated in space and time by utilizing lens focusing, the diameter of a laser spot can be reduced to 105-1015 watt per square centimeter of power density, and almost all materials can be punched by the laser under the high power density. For example, a micrometer-scale hole can be processed on a molybdenum plate with a high melting point by using a laser drilling technology, and a small hole with the scale of tens of micrometers can also be processed on hard alloy (tungsten carbide).
Laser drilling is limited to processing group holes with low density on a thin plate, so that the processing speed can be ensured, and a larger hole depth-diameter ratio can be processed. When large-area group hole processing is needed, and the occupation ratio of density holes (the area of a processing hole to the area of a processing material) reaches 0.5-0.785, for example, cooling holes and combustion holes on an engine are processed, because the laser processing head of the existing laser punching device is limited by the vertical direction movement range, follow-up punching processing of a large curved surface cannot be carried out, small holes on an inclined surface cannot be processed, and high-density group hole processing is difficult to realize; meanwhile, for example, a galvanometer for controlling a laser beam is commonly used in laser processing, and the galvanometer is applicable to a small processing range and cannot process a large-area workpiece. Therefore, the existing laser drilling process is difficult to accurately position the hole position in a very short time and finish group hole machining on a large-area curved surface.
The existing laser drilling technology mostly adopts pulse laser to act on the surface of a workpiece, the power density of the pulse laser used for processing is usually 106-108 watts per square centimeter, and the capacity of removing materials for thick plates and materials with fast heat dissipation is poor due to short laser acting time; the existing laser pulse punching system is difficult to realize the accurate positioning of the processing hole position on the workpiece; when the high-depth hole is machined, the amount of molten metal is small under the same power, and the required machining depth is difficult to achieve; laser pulse drilling is carried out without the assistance of protective gas and blowing gas, the edge burrs of the hole are more, the inner wall is not smooth, and the deformation of a machined part is easily caused due to heat concentration. Therefore, the existing laser pulse drilling technology has the problem that the quality of the processed group holes is not high enough.
In addition, the existing laser drilling technology is difficult to accurately control the processing depth due to the characteristic of high energy density of laser, and the blind hole processing is difficult to realize.
In view of the above, it is urgently needed to develop a new laser precision machining process, which can complete the machining of multiple types of group holes with high quality and efficiency, and better meet the requirement of large-area high-density group hole machining.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to solve the problems that the laser drilling process in the prior art is difficult to be applied to large-area high-density group hole machining occasions, the machining efficiency is low, the hole quality is not high and the like, and provides a dense hole laser precision machining method which can be used for drilling high-quality group holes on planes and complex curved surfaces, and has the advantages of strong universality, short machining time and high drilling efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme: a dense hole laser precision machining method is characterized by comprising the following steps:
drive the laser beam machining head through long stroke motion and remove to the substrate and treat the processing hole position, drive the laser beam machining head through micro-motion and wait at the substrate and process the hole position and carry out laser beam drilling, laser beam drilling includes following step:
step 1, positioning the center of a hole, comprising: irradiating the base material by adopting continuous laser beams to form a perforation point, and taking the perforation point as the hole center of the hole to be processed;
and 2, forming a pore boundary, comprising: adopting laser beams to surround the center of the hole and scan the hole boundary according to the hole pattern of the hole to be processed;
step 3, hole forming, comprising: within the range of hole boundaries, adopting pulse laser beams to irradiate the base material according to the spiral descending scanning of the hole pattern of the hole to be processed, and melting and cutting off the base material in the hole layer by layer to form the hole;
and 4, removing materials in the holes, comprising the following steps: removing residual slag in the hole by high-speed jet purging;
and 5, repeating the steps until the holes to be processed are completely processed.
Further, in the step 3, the pulse frequency of the laser is controlled according to the light intensity feedback of the irradiation position of the pulse laser beam on the substrate, and the duty ratio of the pulse laser is in the range of 1:100 to 1: 1.
Further, in the step 3, in the process of irradiating the substrate by the laser beam spiral descending scanning, the current drilling depth is measured in real time through laser ranging and/or CCD image ranging, and the defocusing amount of the pulse laser beam is adjusted according to the current drilling depth feedback until the drilling reaches the preset hole depth.
Further, in the step 4, multiple converged jet flows are adopted to aim at slag in the hole for high-speed jet flow purging.
Further, the fluid adopted by the jet flow is nitrogen, argon, water or cooling liquid.
Further, the long-stroke movement mechanism is a multi-axis robot or a truss machine tool.
Further, the micro-motion mechanism is a micro-motion manipulator.
Has the advantages that:
(1) the processing method drives the laser processing head to move to the position of the hole to be processed on the base material through the long-stroke motion mechanism, and drives the laser processing head to perform laser drilling on the position of the hole to be processed on the base material through the micro-motion mechanism, so that the position of the hole to be processed is conveniently and accurately positioned;
(2) the laser drilling device has the advantages that continuous laser and pulse laser are switched to be used during laser drilling, the continuous laser is adopted to drill holes in the center of the holes, the pulse laser is adopted to perform in-hole forming, the laser is guaranteed to have strong material removing capacity, the machining depth requirement of the holes is met, the forming process in the control holes is favorably and precisely cut, and the forming quality of the holes is prevented from being reduced due to the fact that the laser intensity is too large.
(3) The long-stroke motion mechanism and the micro-motion mechanism are matched to drive the laser processing head, so that the laser processing head is suitable for vertical processing of vertical holes, deep holes and blind holes of planes and various curved surfaces, the processing time is short, the processing efficiency is high, and the group holes are accurately positioned in the processing process;
(4) the micro-hole processing method is suitable for micro-hole processing of various forms of base materials, can be used for processing large-scale heavy parts with large widths, can locally and intensively process dense micro-group holes on a material, and can dispersedly process group holes on the material with large widths;
(5) laser drilling is carried out under the assistance of jet fluid, and the processed micro-group holes have few burrs on the surface, high smoothness and good verticality.
Drawings
FIG. 1 is a flow chart of the laser drilling step of the present invention;
FIG. 2 is a schematic view of the laser drilling principle of the present invention;
FIG. 3 is an exploded view of the laser drilling step shown in FIG. 2;
FIG. 4 is a schematic diagram of the high velocity jet purging of slag during laser drilling of the present invention;
FIG. 5 is a schematic view of the laser machining head installation of the precision hole laser machining method of the present invention;
in the figure: 1-laser processing head; 2-a micro-motion mechanism; 3-a long-stroke motion mechanism; 4-a substrate; 5-slag.
The specific implementation mode is as follows:
the invention is further explained below with reference to the drawings.
The invention relates to a laser precision machining method for dense holes, which comprises the following steps: the long-stroke motion mechanism drives the laser processing head to move to the position of the hole to be processed on the substrate, and the micro-motion mechanism drives the laser processing head to perform laser drilling on the position of the hole to be processed on the substrate.
As shown in fig. 1, the laser drilling includes the following steps:
step 1, positioning the center of a hole, comprising: irradiating the base material by adopting continuous laser beams to form a perforation point, and taking the perforation point as the hole center of the hole to be processed;
and 2, forming a pore boundary, comprising: adopting laser beams to surround the center of the hole and scan the hole boundary according to the hole pattern of the hole to be processed;
step 3, hole forming, comprising: within the range of hole boundaries, adopting pulse laser beams to irradiate the base material according to the spiral descending scanning of the hole pattern of the hole to be processed, and melting and cutting off the base material in the hole layer by layer to form the hole;
and 4, removing materials in the holes, comprising the following steps: removing residual slag in the hole by high-speed jet purging;
and 5, repeating the steps until the holes to be processed are completely processed.
As shown in fig. 5, in the processing equipment adopted in the technical scheme, the laser processing head is installed on a micro-motion mechanism, and the micro-motion mechanism is installed on a long-stroke motion mechanism. The long-stroke motion mechanism can adopt a multi-axis robot or a truss machine tool, can drive the laser processing head to perform long-distance translation and lifting motion, can be used for large-size heavy part processing with large breadth, and can be suitable for processing multi-plane or curved surface materials by driving the laser processing head to perform lifting motion. The micro-motion mechanism can adopt a micro-motion manipulator. The micro-motion mechanism can drive the laser processing head to perform small-amplitude translation and lifting motion.
As shown in fig. 2 to 4, in the technical solution, a laser beam output by a laser processing head is used to punch a hole on a substrate, and a continuous laser beam is output to irradiate a preset hole position to be processed on the substrate, and the continuous laser beam punctures the substrate to form a punching point, and the punching point is used as a hole center of the hole to be processed; after the hole center is positioned, performing preforming on a hole to be machined, wherein the hole pattern comprises a common round hole and can be used for machining various small holes and blind holes such as an elliptical hole, a triangular hole, a pentagonal hole and the like; after the hole boundary is formed, the pulse laser beam is utilized to scan the base material along the vertical direction in the range of the hole boundary in a spiral descending track, so that the base material is melted and cut layer by layer, a spiral line is formed in the hole, and the hole to be processed is formed. The method of the embodiment determines the position of the hole to be processed by long-distance movement, and forms the hole by a micro-motion track, so that the position of the hole to be processed is conveniently and accurately positioned; the continuous laser and the pulse laser are switched to be used when the base material is cut off, the continuous laser is adopted to perforate in the center of the hole, and the pulse laser is adopted to carry out forming in the hole, so that the laser is ensured to have stronger material removing capacity, the requirement on the processing depth of the hole is met, the forming process in the control hole is favorably and precisely cut, and the forming quality of the hole is prevented from being reduced due to too large laser intensity.
In the step 3, the height of the spiral descending is determined by the preset depth of the hole to be processed, the defocusing amount of the pulse laser beam can be controlled in a dynamic defocusing mode, the current punching depth is measured in real time through laser ranging and/or CCD images, and the defocusing amount of the pulse laser beam is adjusted according to the current punching depth feedback until the punching depth reaches the preset hole depth.
In step 3, the light intensity of the irradiation position of the pulse laser beam on the substrate can be detected in real time, the pulse frequency of the laser is controlled according to the light intensity feedback, the output intensity of the laser is adjusted, and the duty ratio of the pulse laser can be adjusted between 1:10 and 1: 1; .
When the base material in the hole is melted by the laser beam irradiation during the hole forming process, as shown in fig. 4, a part of the melted material can be discharged from the lower part of the hole, and the other part is evaporated to the surface of the base material workpiece, and the metal vapor of the deep hole processing of the thick plate is solidified to the wall surface before reaching the metal surface, so that the slag accumulated in the center of the hole is formed. Therefore, under the assistance of no protection and purging in laser pulse punching, the machined hole edge has more burrs and unsmooth inner wall, and a machined part is easy to deform due to the concentrated heat of laser beams.
In the step 4, the multiple converged jet flows are adopted to aim at the slag in the hole for high-speed jet flow blowing, and the multiple high-speed jet flows blow the slag on the inner wall of the hole, so that the slag accumulated in the center of the hole can be blown off, the machined group holes have fewer surface burrs and high smoothness, the jet flow blowing can also enhance the heat dissipation of the machining position, the surface of a machined part is cooled, and the improvement of the quality of the machined hole is facilitated. The high-speed jet fluid can be selected from various fluids according to requirements, and the fluid which can be used is nitrogen, argon, water or cooling liquid.
By adopting the laser precision drilling method provided by the embodiment, the small-size and micro-hole machining can be realized, the high-depth hole and the blind hole can be machined, the smooth edge is ensured, the roundness of the hole is good, the verticality of the inner wall is high, and the large-area group hole machining can be carried out.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (7)
1. A dense hole laser precision machining method is characterized by comprising the following steps:
drive the laser beam machining head through long stroke motion and remove to the substrate and treat the processing hole position, drive the laser beam machining head through micro-motion and wait at the substrate and process the hole position and carry out laser beam drilling, laser beam drilling includes following step:
step 1, positioning the center of a hole, comprising: irradiating the base material by adopting continuous laser beams to form a perforation point, and taking the perforation point as the hole center of the hole to be processed;
and 2, forming a pore boundary, comprising: adopting laser beams to surround the center of the hole and scan the hole boundary according to the hole pattern of the hole to be processed;
step 3, hole forming, comprising: adopting pulse laser beams to irradiate the base material within the hole boundary range according to the spiral descending scanning of the hole pattern of the hole to be processed, and melting and cutting off the base material in the hole layer by layer to form the hole;
and 4, removing materials in the holes, comprising the following steps: removing residual slag in the hole by high-speed jet purging;
and 5, repeating the steps until the holes to be processed are completely processed.
2. The precision laser machining method for the dense holes as claimed in claim 1, wherein: and in the step 3, the pulse frequency of the laser is controlled in a feedback mode according to the light intensity of the irradiation position of the pulse laser beam on the base material, and the duty ratio range of the pulse laser is 1: 100-1: 1.
3. The precision laser machining method for the dense holes as claimed in claim 2, wherein: and 3, in the process of irradiating the base material by the laser beam spiral descending scanning, measuring the current drilling depth in real time through laser ranging and/or CCD image ranging, and then adjusting the defocusing amount of the pulse laser beam according to the current drilling depth feedback until the drilling reaches the preset hole depth.
4. The precision laser machining method for the dense holes as claimed in claim 1, wherein: and 4, performing high-speed jet flow purging by adopting a plurality of converged jet flows to aim at slag in the hole.
5. The precision laser machining method for dense holes according to claim 4, wherein: the fluid adopted by the jet flow is nitrogen, argon, water or cooling liquid.
6. The precision laser machining method for the dense holes as claimed in claim 1, wherein: the long-stroke motion mechanism is a multi-axis robot or a truss machine tool.
7. The precision laser machining method for the dense holes as claimed in claim 1, wherein: the micro-motion mechanism is a micro-motion manipulator.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911068827.5A CN110625274B (en) | 2019-11-05 | 2019-11-05 | Laser precision machining method for dense holes |
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| CN201911068827.5A CN110625274B (en) | 2019-11-05 | 2019-11-05 | Laser precision machining method for dense holes |
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| CN110625274B CN110625274B (en) | 2021-12-21 |
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Cited By (2)
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| CN112536923A (en) * | 2020-11-11 | 2021-03-23 | 东莞市盛雄激光先进装备股份有限公司 | Precision punching equipment and method |
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