CN111408855A - Automatic alignment device and method for circumferential micropore laser processing - Google Patents

Automatic alignment device and method for circumferential micropore laser processing Download PDF

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Publication number
CN111408855A
CN111408855A CN202010277022.8A CN202010277022A CN111408855A CN 111408855 A CN111408855 A CN 111408855A CN 202010277022 A CN202010277022 A CN 202010277022A CN 111408855 A CN111408855 A CN 111408855A
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axis
lead screw
servo motor
axis lead
controller
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CN202010277022.8A
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CN111408855B (en
Inventor
周峰
张宝田
吴欲龙
吴淳武
张荣华
蒋磊
陆洋
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FAW Jiefang Automotive Co Ltd
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FAW Jiefang Automotive Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention relates to an automatic alignment device and method for circumferential micropore laser processing. The device comprises a rotary servo motor, a counter bore bottom surface, a jaw, a lens, a CCD (charge coupled device), a mounting plate, a laser processing head, an X, Y, Z-axis servo motor, a Z servo driver, a controller, a display, a X, Y, Z-axis lead screw and a laser range finder; the display is connected with the controller; the controller transmits the signal to the servo driver; the servo driver drives X, Y, Z shaft servo motors to drive X, Y, Z shaft screws to rotate; x, Y, Z the shaft screw is installed on the installation board through the fixed seat; the controller drives the rotary servo motor to drive the part to rotate; the bottom surface of the counter bore rotates around the axis of the part along with the rotary servo motor; the CCD, the laser range finder and the laser processing head are fixed at the lower end of the mounting plate; the lens is fixed at the lower end of the CCD; the part is fixed on the machine tool through the clamping jaws. The invention solves the problems of low efficiency and low precision of manual alignment and offline alignment in the conventional circumferential micropore laser processing.

Description

Automatic alignment device and method for circumferential micropore laser processing
Technical Field
The invention belongs to the technical field of processing, and particularly relates to an automatic alignment device and method for circumferential micropore laser processing.
Background
The machined circumferential micropore part is used in the field of hydraulic control, and the verticality of the circumferential micropore and the surface of a counter bore to be machined influences the response speed of a hydraulic system. In production, the hydraulic system is frequently failed due to unqualified verticality, so a stable and reliable method and a device are adopted to control the verticality of the processed circumferential micropores and the bottom surface of the counter bore. At present, the circumferential micropore positioning mode mainly adopts the offline alignment of the pallet and the online alignment of the pallet integration, and the alignment structure has the defects of complex operation, low efficiency, poor reliability and the like.
Disclosure of Invention
The invention provides an automatic alignment device and method for circumferential micropore laser processing, which solve the problems of low efficiency and low precision due to the fact that manual alignment and offline alignment are needed in the conventional circumferential micropore laser processing.
The technical scheme of the invention is described as follows by combining the attached drawings:
a circumferential micropore laser processing automatic alignment device comprises a rotary servo motor 1, a counter bore bottom surface 3, a part 4, a clamping jaw 5, a lens 6, a CCD7, a mounting plate 8, a laser processing head 9, a Y-axis lead screw 10, a Y-axis servo motor 11, a Z-axis lead screw 12, a Z-axis servo motor 13, a servo driver 14, a controller 15, a display 16, an X-axis servo motor 17, an X-axis lead screw 18 and a laser range finder 19; the display 16 is connected with the controller 15; the controller 15 transmits a signal to the servo driver 14; the servo driver 14 drives the X-axis servo motor 17, the Y-axis servo motor 11 and the Z-axis servo motor 13 to drive the X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12 to rotate; the X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12 are arranged on the mounting plate 8 through a fixed seat; the controller 15 drives the rotary servo motor 1 to drive the part 4 to rotate; the bottom surface 3 of the counter bore rotates around the axis of the part 4 along with the rotary servo motor 1; the CCD7 is fixed at the lower end of one side of the mounting plate 8; the lens 6 is fixed at the lower end of the CCD 7; the laser range finder 19 is fixed at the lower end of the other side of the mounting plate 8; the laser processing head 9 is fixed at the lower end of the middle part of the mounting plate 8; the piece 4 is fixed to the machine tool by means of jaws 5.
An automatic alignment method of an automatic alignment device for circumferential micropore laser processing comprises the following steps:
step one, transmitting a processing program to a controller 15 through a display 16;
secondly, the controller 15 transmits signals to the servo driver 14, drives the rotary servo motor 1 to drive the part 4 to rotate, drives the X-axis servo motor 17, the Y-axis servo motor 11 and the Z-axis servo motor 13, and drives the corresponding X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12 to move through the X-axis servo motor 17, the Y-axis servo motor 11 and the Z-axis servo motor 13;
driving the CCD7 and the lens 6 to move to the area of the bottom surface 3 of the counter bore by the X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12, and detecting the projection area of the bottom surface 3 of the counter bore in the radial direction of the part 4 by the CCD7 and the lens 6 in real time;
step four, when detecting that the projection area of the bottom surface 3 of the counter bore is the largest, the controller 15 sends a rotation stopping signal to the servo driver 14 to control the rotary servo motor 1 to stop rotating, and the bottom surface 3 of the counter bore is kept in a horizontal state;
step five, the controller 15 sends a signal to the servo driver 14 to drive the X-axis servo motor 17, the Y-axis servo motor 11 and the Z-axis servo motor 13, and the corresponding X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12 move;
sixthly, driving the mounting plate 8 to displace by the X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12, enabling a laser range finder 19 arranged on the mounting plate 8 to move to the position above the bottom surface 3 of the counter bore, measuring the Z-direction height of the bottom surface 3 of the counter bore and feeding the height back to the controller 15;
seventhly, the controller 15 sends signals to the servo driver 14 to drive the X-axis servo motor 17, the Y-axis servo motor 11 and the Z-axis servo motor 13 to drive, and the corresponding X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12 move;
and step eight, driving the mounting plate 8 to move by the X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12, so that the laser processing head 9 arranged on the mounting plate 8 moves to the position of the micropore 2 to be processed and maintains the height in the Z direction to start processing.
The invention has the beneficial effects that:
1) circumferential alignment is performed in an automatic mode, manual adjustment is reduced, and the machining efficiency is greatly improved;
2) the visual scheme is adopted for circumferential alignment, so that the problem of reduced positioning precision caused by tool abrasion when a mechanical structure is aligned is solved;
3) when different types of parts are replaced to carry out circumferential micropore machining, different follow-up clamps do not need to be designed, and the device and the method can be shared.
Drawings
FIG. 1 is a schematic structural view of an automatic aligning device for circumferential micropore laser processing according to the present invention;
in the figure: 1. a rotary servo motor; 2. micropores to be processed; 3. a counterbore bottom surface; 4. a part; 5. a claw; 6. a lens; 7. a CCD; 8. mounting a plate; 9. a laser processing head; 10. a Y-axis lead screw; 11. a Y-axis servo motor; 12. a Z-axis lead screw; 13. a Z-axis servo motor; 14. a servo driver; 15. a controller; 16. a display; 17. an X-axis servo motor; 18. an X-axis lead screw; 19. laser range finder.
Detailed Description
Referring to fig. 1, the device for automatically aligning the circumferential micropore laser processing comprises a rotary servo motor 1, a counter bore bottom surface 3, a part 4, a clamping jaw 5, a lens 6, a CCD7 (charge coupled device), an installation plate 8, a laser processing head 9, a Y-axis screw 10, a Y-axis servo motor 11, a Z-axis screw 12, a Z-axis servo motor 13, a servo driver 14, a controller 15, a display 16, an X-axis servo motor 17, an X-axis screw 18 and a laser range finder 19.
The display 16 is connected with the controller 15; the controller 15 transmits a signal to the servo driver 14; the servo driver 14 drives the X-axis servo motor 17, the Y-axis servo motor 11 and the Z-axis servo motor 13 to drive the X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12 to rotate; the X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12 are arranged on the mounting plate 8 through a fixed seat; the controller 15 drives the rotary servo motor 1 to drive the part 4 to rotate; the bottom surface 3 of the counter bore rotates around the axis of the part 4 along with the rotary servo motor 1; the CCD7 is fixed at the lower end of one side of the mounting plate 8; the lens 6 is fixed at the lower end of the CCD 7; the laser range finder 19 is fixed at the lower end of the other side of the mounting plate 8; the laser processing head 9 is fixed at the lower end of the middle part of the mounting plate 8; the piece 4 is fixed to the machine tool by means of jaws 5.
When carrying out circumference micropore (0.1mm is no less than phi and is no greater than 0.3mm) laser beam machining, the micropore 2 of treating that needs the processing has higher straightness requirement of hanging down (no greater than 0.05mm) with the counter bore bottom surface 3 of part 4 excircle, drive part 4 through rotary servo motor 1 and rotate and cooperate the visual real-time detection counter bore bottom surface 3 at the radial projection area of part 4, when projection area is the biggest, rotary servo motor 1 stall, counter bore bottom surface 3 keeps the level, laser beam machining head 9 moves and processes to the micropore 2 processing position of treating the processing, guarantee that the micropore that processes has high straightness that hangs down with counter bore bottom surface 3.
The specific method comprises the following steps:
step one, transmitting a processing program to a controller 15 through a display 16;
secondly, the controller 15 transmits signals to the servo driver 14, drives the rotary servo motor 1 to drive the part 4 to rotate, drives the X-axis servo motor 17, the Y-axis servo motor 11 and the Z-axis servo motor 13, and drives the corresponding X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12 to move through the X-axis servo motor 17, the Y-axis servo motor 11 and the Z-axis servo motor 13;
driving the CCD7 and the lens 6 to move to the area of the bottom surface 3 of the counter bore by the X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12, and detecting the projection area of the bottom surface 3 of the counter bore in the radial direction of the part 4 by the CCD7 and the lens 6 in real time;
step four, when detecting that the projection area of the bottom surface 3 of the counter bore is the largest, the controller 15 sends a rotation stopping signal to the servo driver 14 to control the rotary servo motor 1 to stop rotating, and the bottom surface 3 of the counter bore is kept in a horizontal state;
step five, the controller 15 sends a signal to the servo driver 14 to drive the X-axis servo motor 17, the Y-axis servo motor 11 and the Z-axis servo motor 13, and the corresponding X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12 move;
sixthly, driving the mounting plate 8 to displace by the X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12, enabling a laser range finder 19 arranged on the mounting plate 8 to move to the position above the bottom surface 3 of the counter bore, measuring the Z-direction height of the bottom surface 3 of the counter bore and feeding the height back to the controller 15;
seventhly, the controller 15 sends signals to the servo driver 14 to drive the X-axis servo motor 17, the Y-axis servo motor 11 and the Z-axis servo motor 13 to drive, and the corresponding X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12 move;
and step eight, driving the mounting plate 8 to move by the X-axis lead screw 18, the Y-axis lead screw 10 and the Z-axis lead screw 12, so that the laser processing head 9 arranged on the mounting plate 8 moves to the position of the micropore 2 to be processed and maintains the height in the Z direction to start processing.

Claims (2)

1. The automatic aligning device for circumferential micropore laser processing is characterized by comprising a rotary servo motor (1), a counter bore bottom surface (3), a part (4), a clamping jaw (5), a lens (6), a CCD (7), a mounting plate (8), a laser processing head (9), a Y-axis lead screw (10), a Y-axis servo motor (11), a Z-axis lead screw (12), a Z-axis servo motor (13), a servo driver (14), a controller (15), a display (16), an X-axis servo motor (17), an X-axis lead screw (18) and a laser range finder (19); the display (16) is connected with the controller (15); the controller (15) transmits a signal to the servo driver (14); the servo driver (14) drives the X-axis servo motor (17), the Y-axis servo motor (11) and the Z-axis servo motor (13) to drive the X-axis lead screw (18), the Y-axis lead screw (10) and the Z-axis lead screw (12) to rotate; the X-axis lead screw (18), the Y-axis lead screw (10) and the Z-axis lead screw (12) are arranged on the mounting plate (8) through a fixing seat; the controller (15) drives the rotary servo motor (1) to drive the part (4) to rotate; the bottom surface (3) of the counter bore rotates around the axis of the part (4) along with the rotary servo motor (1); the CCD (7) is fixed at the lower end of one side of the mounting plate (8); the lens (6) is fixed at the lower end of the CCD (7); the laser range finder (19) is fixed at the lower end of the other side of the mounting plate (8); the laser processing head (9) is fixed at the lower end of the middle part of the mounting plate (8); the part (4) is fixed on the machine tool through the clamping jaws (5).
2. The automatic alignment method of the circumferential micropore laser processing automatic alignment device as claimed in claim 1, wherein the method comprises the following steps:
step one, transmitting a processing program to a controller (15) through a display (16);
secondly, the controller (15) transmits signals to the servo driver (14), drives the rotary servo motor (1) to drive the part (4) to rotate, drives the X-axis servo motor (17), the Y-axis servo motor (11) and the Z-axis servo motor (13), and drives the corresponding X-axis lead screw (18), the Y-axis lead screw (10) and the Z-axis lead screw (12) to move through the X-axis servo motor (17), the Y-axis servo motor (11) and the Z-axis servo motor (13);
driving a CCD (7) and a lens (6) to move to the region of the bottom surface (3) of the counter bore by an X-axis lead screw (18), a Y-axis lead screw (10) and a Z-axis lead screw (12), and detecting the projection area of the bottom surface (3) of the counter bore in the radial direction of the part (4) in real time by the CCD (7) and the lens (6);
step four, when detecting that the projection area of the bottom surface (3) of the counter bore is the largest, the controller (15) sends a rotation stopping signal to the servo driver (14) to control the rotary servo motor (1) to stop rotating, and the bottom surface (3) of the counter bore is kept in a horizontal state;
step five, the controller (15) sends a signal to the servo driver (14) to drive the X-axis servo motor (17), the Y-axis servo motor (11) and the Z-axis servo motor (13) to drive, and the corresponding X-axis lead screw (18), the Y-axis lead screw (10) and the Z-axis lead screw (12) move;
sixthly, driving the mounting plate (8) to displace by the X-axis lead screw (18), the Y-axis lead screw (10) and the Z-axis lead screw (12), enabling a laser range finder (19) arranged on the mounting plate (8) to move to the position above the bottom surface (3) of the counter bore, measuring the Z-direction height of the bottom surface (3) of the counter bore and feeding the height back to the controller (15);
seventhly, the controller (15) sends signals to a servo driver (14) to drive an X-axis servo motor (17), a Y-axis servo motor (11) and a Z-axis servo motor (13) to drive, and the corresponding X-axis lead screw (18), the Y-axis lead screw (10) and the Z-axis lead screw (12) move;
and step eight, driving the mounting plate (8) to move by the X-axis lead screw (18), the Y-axis lead screw (10) and the Z-axis lead screw (12), so that the laser processing head (9) arranged on the mounting plate (8) moves to the position of the micropore (2) to be processed and maintains the Z-direction height to start processing.
CN202010277022.8A 2020-04-10 2020-04-10 Automatic alignment device and method for circumferential micropore laser processing Active CN111408855B (en)

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Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11287567A (en) * 1998-04-01 1999-10-19 Nippon Steel Corp Opening method for tuyere for converter observation
JP2003204137A (en) * 2002-01-09 2003-07-18 Hitachi Via Mechanics Ltd Machining method for drilling with laser beam
US6734390B1 (en) * 2003-03-24 2004-05-11 Honeywell International, Inc. Laser cutting holes by trepanning on the fly
JP2007319927A (en) * 2006-06-05 2007-12-13 Toyota Motor Corp Hole machining method and hole machining device
CN101909808A (en) * 2008-01-17 2010-12-08 本田技研工业株式会社 Laser working apparatus, and laser working method
CN102773524A (en) * 2012-08-01 2012-11-14 西北工业大学 Hole making method with alignment based on machine vision
CN104722931A (en) * 2015-03-25 2015-06-24 孙树峰 Device for machining superfine oil spraying inclined holes in oil spraying plate part of oil sprayer through lasers
CN104759945A (en) * 2015-03-25 2015-07-08 西北工业大学 Mobile hole-making robot standard alignment method based on high precision industrial camera
CN105473272A (en) * 2013-09-02 2016-04-06 三菱重工业株式会社 Composite processing device and composite processing method
KR20170088781A (en) * 2017-05-30 2017-08-02 김덕호 Stent manufacturing device using one-way machining
CN107107272A (en) * 2015-01-22 2017-08-29 株式会社电装 Perforate processing unit (plant)
CN107234347A (en) * 2017-07-19 2017-10-10 江苏大学 A kind of laser auxiliary heating femtosecond pulse perforating device and method

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11287567A (en) * 1998-04-01 1999-10-19 Nippon Steel Corp Opening method for tuyere for converter observation
JP2003204137A (en) * 2002-01-09 2003-07-18 Hitachi Via Mechanics Ltd Machining method for drilling with laser beam
US6734390B1 (en) * 2003-03-24 2004-05-11 Honeywell International, Inc. Laser cutting holes by trepanning on the fly
JP2007319927A (en) * 2006-06-05 2007-12-13 Toyota Motor Corp Hole machining method and hole machining device
CN101909808A (en) * 2008-01-17 2010-12-08 本田技研工业株式会社 Laser working apparatus, and laser working method
CN102773524A (en) * 2012-08-01 2012-11-14 西北工业大学 Hole making method with alignment based on machine vision
CN105473272A (en) * 2013-09-02 2016-04-06 三菱重工业株式会社 Composite processing device and composite processing method
CN107107272A (en) * 2015-01-22 2017-08-29 株式会社电装 Perforate processing unit (plant)
CN104722931A (en) * 2015-03-25 2015-06-24 孙树峰 Device for machining superfine oil spraying inclined holes in oil spraying plate part of oil sprayer through lasers
CN104759945A (en) * 2015-03-25 2015-07-08 西北工业大学 Mobile hole-making robot standard alignment method based on high precision industrial camera
KR20170088781A (en) * 2017-05-30 2017-08-02 김덕호 Stent manufacturing device using one-way machining
CN107234347A (en) * 2017-07-19 2017-10-10 江苏大学 A kind of laser auxiliary heating femtosecond pulse perforating device and method

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