CN107208427B - 用于形成地板覆盖物的地板镶板 - Google Patents

用于形成地板覆盖物的地板镶板 Download PDF

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CN107208427B
CN107208427B CN201680005856.5A CN201680005856A CN107208427B CN 107208427 B CN107208427 B CN 107208427B CN 201680005856 A CN201680005856 A CN 201680005856A CN 107208427 B CN107208427 B CN 107208427B
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floor panel
substrate layer
locking
floor
substrate
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CN107208427A (zh
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彼得·德福斯
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Unilin BV
Flooring Industries Ltd SARL
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Flooring Industries Ltd SARL
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Priority to CN202010357807.6A priority Critical patent/CN111502173B/zh
Priority to CN202010349449.4A priority patent/CN111502172B/zh
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Abstract

用于形成地板覆盖物的地板镶板，其中，该地板镶板(1)包括基板(2)，基板由密度不同的至少两个基板层(15、16)构成，并且该地板镶板在至少一对相对边缘(3、4)上设置有所谓的推动锁定型的耦接部分(5、6)，其中，在竖直有效锁定表面(17、18)在两个这种地板镶板(1)的耦接状态中配合的情况下，该竖直有效锁定表面限定水平的或与水平面偏离不超过50度的切线(R)；并且其中，锁定表面(17、18)定位成更靠近第一基板层(15)的上侧，而不是更靠近第一基板层(15)的下侧。

Description

用于形成地板覆盖物的地板镶板
技术领域
本发明涉及用于形成地板覆盖物的地板镶板，更具体地涉及用于形成可安装在下垫面上的地板覆盖物的地板镶板。
更具体地，本发明涉及用于形成这样一类地板覆盖物的地板镶板，其中，地板镶板包括基板；其中，地板镶板包括至少两个相对边缘上的耦接部分，该耦接部分允许两个这种地板镶板可通过一个地板镶板相对于另一地板镶板的向下运动而彼此耦接；其中，在两个这种地板镶板的耦接状态中，耦接部分形成第一锁定系统，该第一锁定系统在位于地板镶板的平面中且垂直于所述边缘的第一方向上实现锁定，并且形成第二锁定系统，该第二锁定系统在横向于地板镶板的平面的第二方向上实现锁定；其中，至少向上指向的下钩形部分以及向下指向的上钩形部分形成第一锁定系统，下钩形部分位于所述两个相对边缘中的一个边缘上，上钩形部分位于所述两个相对边缘中的另一相对边缘上，两个钩形部分可通过所述向下运动彼此前后接合；其中，下钩形部分由具有向上指向的锁定元件的唇缘构成，而上钩形部分由具有向下指向的锁定元件的唇缘构成；其中，第二锁定系统包括锁定部分，锁定部分分别位于下钩形部分的近端附近和上钩形部分的远端附近。
背景技术
除此之外，从文献WO 2011/077311中已知这类地板镶板。
这种地板镶板的一般问题在于，在一方面耦接的地板镶板之间的锁定的强度或可靠性与在另一方面安装地板镶板的简易性之间达到良好的平衡。
发明内容
本发明主要在于上述类型的用于形成地板覆盖物的可替换的地板镶板。更具体地，本发明的目的在于这种地板覆盖物可容易安装，然而，同时仍保持地板覆盖物中足够的强度。
本发明人已发现可通过结合实现耦接部分的某些特征应用基板的某些结构特征和/或材料特性来实现该目的。
下面将在本发明六个独立的方面中描述基板的结构特征和/或材料特性与实现耦接部分中的特性的这些特定组合。
根据其第一独立方面，本发明涉及上述类型的用于形成地板覆盖物的地板镶板，其特征为，所述基板涉及组成基板，该组成基板至少由两个基板层构成，即，基于合成材料的第一基板层和优选直接位于其上的第二基板层，第二基板层的厚度为至少0.5mm并且优选为至少1mm；第一基板层的密度与第二基板层的密度不同，并且优选地，第二基板层具有比第一基板层高的密度；所述锁定部分设置有锁定表面，在锁定表面在两个这种地板镶板的耦接状态中配合的情况下，该锁定表面限定水平的或与水平面偏离不超过50度的切线；并且无论这些锁定表面是否位于所述第二基板层中，所述锁定表面定位为更靠近第一基板层的上侧，而不是更靠近第一基板层的下侧。
由于在锁定表面在两个这种地板镶板的耦接状态中配合的情况下该锁定表面限定水平的或与水平面偏离不超过50度的切线，优点是得到可在耦接的地板镶板之间提供牢固的竖直锁定。然而，通过锁定表面相对于具有不同的密度的基板层的特定位置仍可保证地板镶板的安装的简易性。这些基板层的密度是不同的而且提供了针对其应用的特征(例如，相对于强度和/或弹性)来优化这些基板层进行的可能性。
根据本发明的独立的第二方面，本发明涉及上述类型的用于形成地板覆盖物的地板镶板，其特征为，所述基板涉及组成基板，该组成基板至少由两个基板层构成，即，基于合成材料的第一基板层和优选直接位于其上的第二基板层，第二基板层的厚度为至少0.5mm并且优选为至少1mm；第一基板层是发泡的，优选是闭孔型的并且更优选是所谓的硬质泡沫型，并且优选地，第二基板层不是发泡的或者发泡程度比第一基板层小；所述锁定部分设置有锁定表面，在该锁定表面在两个这种地板镶板的耦接状态中配合的情况下，该锁定表面限定水平的或与水平面偏离不超过50度的切线；并且无论这些锁定表面是否位于所述第二基板层中，所述锁定表面定位为更靠近第一基板层的上侧，而不是更靠近第一基板层的下侧。
由于在锁定表面在两个这种地板镶板的耦接状态中配合的情况下该锁定表面限定水平的或与水平面偏离不超过50度的切线，优点是得到可在耦接的地板镶板之间提供牢固的竖直锁定。然而，通过锁定表面相对于相应基板层的特定位置仍可保证地板镶板的安装的简易性。基于合成材料的基板层是发泡的，而且提供了提供具有有用的特征(诸如，相对于硬度和/或可变形性)的该基板层的可能性。
在具体实施方式中，第一基板层逐渐发泡，其中，发泡程度可以在向下或向上的方向上增大。
根据本发明的独立的第三方面，本发明涉及上述类型的用于形成地板覆盖物的地板镶板，其特征为，所述基板涉及组成基板，该组成基板至少由两个基板层构成，即，基于合成材料的第一基板层和优选直接位于其上的第二基板层，第二基板层的厚度为至少0.5mm并且优选为至少1mm；所述第一基板层是挤出型的；所述锁定部分设置有锁定表面，在锁定表面在两个这种地板镶板的耦接状态中配合的情况下，该锁定表面限定水平的或与水平面偏离不超过50度的切线；并且无论这些锁定表面是否位于所述第二基板层中，所述锁定表面定位为更靠近第一基板层的上侧，而不是更靠近第一基板层的下侧。
由于在锁定表面在两个这种地板镶板的耦接状态中配合的情况下该锁定表面限定水平的或与水平面偏离不超过50度的切线，优点是得到可在耦接的地板镶板之间提供牢固的竖直锁定。然而，通过锁定表面相对于相应基板层的特定位置仍可保证地板镶板的安装的简易性。基于合成材料的基板层是挤出型的，而且提供了以简单有效的方式提供具有功能特征(诸如，相对于刚性和/或尺寸稳定性)的该基板层的可能性。
根据本发明的独立的第四方面，本发明涉及上述类型的用于形成地板覆盖物的地板镶板，其特征为，所述基板涉及组成基板，该组成基板至少由两个基板层组成，即，基于合成材料的第一基板层和优选直接位于其上的第二基板层，第二基板层的厚度为至少0.5mm并且优选为至少1mm；两个基板层彼此粘合，优选地通过防水胶彼此粘合；所述锁定部分设置有锁定表面，在锁定表面在两个这种地板镶板的耦接状态中配合的情况下，该锁定表面限定水平的或与水平面偏离不超过50度的切线；并且无论这些锁定表面是否位于所述第二基板层中，所述锁定表面定位为更靠近第一基板层的上侧，而不是更靠近第一基板层的下侧。
由于在锁定表面在两个这种地板镶板的耦接状态中配合的情况下该锁定表面限定水平的或与水平面偏离不超过50度的切线，优点是得到可在耦接的地板镶板之间提供牢固的竖直锁定。然而，通过锁定表面相对于相应基板层的特定位置仍可保证地板镶板的安装的简易性。基板由粘合的基板层组成和构成，而且提供了针对其这些基板层必须提供的特征(诸如，相对于弹性和/或强度)构造这些基板层中的每一个的可能性。
根据本发明的独立的第五方面，本发明涉及上述类型的用于形成地板覆盖物的地板镶板，其特征为，所述基板涉及组成基板，该组成基板至少由两个基板层构成，即，基于合成材料的第一基板层和优选直接位于其上的第二基板层，第二基板层的厚度为至少0.5mm并且优选为至少1mm；所述基板层根据以下可能性中的任一种或根据其组合制成：
-第一基板层的密度与第二基板层的密度不同，并且优选地，第二基板层具有比第一基板层高的密度；
-第一基板层是发泡的并且优选是闭孔型的并且更优选是所谓的硬质泡沫型，并且优选地，第二基板层不是发泡的或者发泡程度比第一基板层小；
-第一基板层是挤出型的；和/或
-两个基板层彼此粘合，优选地通过防水胶彼此粘合；
所述锁定部分设置有锁定表面，在锁定表面在两个这种地板镶板的耦接状态中配合的情况下，该锁定表面限定水平的或与水平面偏离不超过50度的切线；其中，所述锁定表面至少部分地位于第一基板层中，并且优选地，全部位于第一基板层中；所述向上指向的锁定元件和所述向下指向的锁定元件均设置有锁定表面，该锁定表面在两个这种地板镶板的耦接状态中配合；并且锁定距离小于1cm，优选地小于5mm，并且更优选地小于3mm，锁定距离由在耦接状态中的两个这种地板镶板之间形成的竖直封闭面与穿过锁定元件的所述锁定表面在耦接状态中彼此接触的区域中心的竖直面之间的水平距离形成。
由于在锁定表面在两个这种地板镶板的耦接状态中配合的情况下该锁定表面限定水平的或与水平面偏离不超过50度的切线，优点是得到可在耦接的地板镶板之间提供牢固的竖直锁定。此外，锁定距离相对较小，其允许使钩形部分相对紧凑，这对于耦接的强度有益。然而，通过锁定表面的至少部分地位于第一基板层中仍可保证地板镶板的安装的简易性。该基板根据在相应方面提及的任何可能性组成和实现，而且提供了针对所提及的基板层必须提供的特征(诸如，相对于弹性和/或强度)构造这些基板曾中的每一个的可能性。
根据本发明的独立的第六方面，本发明涉及上述类型的用于形成地板覆盖物的地板镶板，其特征为，所述基板涉及组成基板，该组成基板至少由两个基板层构成，即，基于合成材料的第一基板层和优选直接位于其上的第二基板层，第二基板层的厚度为至少0.5mm并且优选为至少1mm；所述基板层根据以下可能性中的任一种或根据其组合制成：
-第一基板层的密度与第二基板层的密度不同，并且优选地，第二基板层具有比第一基板层高的密度；
-第一基板层是发泡的并且优选是闭孔型的并且更优选是所谓的硬质泡沫型，并且优选地，第二基板层不是发泡的或者发泡程度比第一基板层小；
-第一基板层是挤出型的；和/或
-两个基板层彼此粘合，优选地通过防水胶彼此粘合；
所述锁定部分设置有锁定表面，在锁定表面在两个这种地板镶板的耦接状态中配合的情况下，该锁定表面限定水平的或与水平面偏离不超过50度的切线；并且所述锁定表面至少部分地位于第二基板层中，并且优选地，全部位于第二基板层中。
由于在锁定表面在两个这种地板镶板的耦接状态中配合的情况下该锁定表面限定水平的或与水平面偏离不超过50度的切线，优点是得到可在耦接的地板镶板之间提供牢固的竖直锁定。然而，通过锁定表面至少部分地位于第二基板层中仍可保证地板镶板的安装的简易性。该基板根据在相应方面提及的任何可能性组成和实现，而且提供了针对所提及的基板层必须提供的特征(诸如，相对于弹性和/或强度)构造这些基板曾中的每一个的可能性。
还应注意，本发明的六个独立方面中的任一方面的任一特征可以任选地与六个独立方面中的另一方面的任一特征组合，只要这种组合不矛盾即可。
下文中描述了根据六个独立方面的本发明的优选实施方式和可替换实施方式。
组成基板的第一基板层是基于合成材料的。优选地，其至少包括热塑性材料，其中，“热塑性材料”是应当理解为至少包括热塑性合成材料。换言之，第一基板层优选至少包括热塑性材料，或者该基板层是至少基于热塑性材料实现的。
当实现第一基板层时可应用的合成材料的实例涉及聚氯乙烯、聚乙烯、聚丙烯、聚对苯二甲酸乙二醇酯、聚氨酯或本文中上述合成材料的两种或更多种的组合。
优选地，第一基板层是填充的合成材料复合物。这是指除了合成材料以外，第一基板层还包括填充物。该填充物可以由以下材料中的一种或以下材料的组合构成：竹材、软木和/或木材。具体地，填充物由纤维和/或粉剂(dust)和/或粉末的形式的本文中上述材料的一种或组合构成。
在第一基板层被制成为填充的合成材料复合物的情况下，该基板层也可以是发泡的。然后优选地，其是闭孔型的。
一般地说，第一基板层可以是发泡的，与作为填充的合成材料复合物的该基板层的实施方式无关。
优选地，这种发泡导致密度至少减少10％或者更好地密度至少减少20％。更优选地，实现密度减少20％到60％之间。
组成基板的第一基板层可以至少包括一种或多种增塑剂。然而，该第一基板层优选为刚性的。换言之，优选的是，第一基板层不包含任何增塑剂。在确实应用增塑剂的情况下，增塑剂优选地以低于20phr的量并且更优选地以5到15phr之间的量存在。
优选地，第一基板层包括填充物，诸如，白垩、石灰石和/或滑石，这些填充物可以或者不可以与上述填充物结合使用。
为了增大第一基板层的稳定性，该基板层可设置有至少一个加强层，加强层优选由玻璃纤维等制成。具体地，加强层涉及玻璃纤维织物。
实际上，第一基板层优选具有至少3mm的厚度，更优选地至少4mm的厚度，并且更优选地至少5mm的厚度。
优选地，第一基板层构造有地板镶板的多于一半的厚度。具体地，该基板层确定地板镶板的基板的刚性或者固体性。
组成基板的第一基板层和/或第二基板层优选被实现为防水。
如同第一基板层一样，组成基板的第二基板层优选地是基于合成材料的。然后，其优选地包括热塑性材料，热塑性材料优选为软质或柔软型的。
优选地，第二基板层可基于乙烯基，诸如，聚氯乙烯，更优选软质聚乙烯氯化物、聚乙烯，更优选软质聚乙烯、聚氨酯、聚丙烯、聚对苯二甲酸乙二醇酯或以上的组合实现。
为了提供具有一定柔软度/柔性的第二基板层，可以向其添加一种或多种增塑剂。优选地，这些增塑剂以大于15phr的量并且更优选地甚至以最小20phr的量存在。
还可以向第二基板层添加填充物，诸如，白垩、石灰石和/或滑石。
根据可替换方案，第二基板层由以下材料中的一种或以下材料的组合组成：胶合板、橡胶、油布或用乙烯基或树脂涂覆的任何材料，更具体地，用乙烯基或树脂涂覆的软木、竹材、或胶合板。
为了增大稳定性的目的，第二基板层可设置有至少一个加强层，优选为玻璃纤维等的加强层。
地板镶板可以包括优选直接位于第一基板层下面的衬背层。衬背层优选地示出以下特征中的一种或组合：
-衬背层由热塑性合成材料层和/或热熔胶构成；
-衬背层基于以下材料中的一种或多种实现：软木、橡胶和/或泡沫。
衬背层可以提供具有声学特征的地板镶板，使得例如在所安装的地板镶板上行走期间的脚步声音被抑制。
地板镶板可以包括顶层，无论该顶层是否由多个层构成，顶层优选直接位于第二基板层上面。顶层可以包括以下特征中的一种或组合：
-顶层包括至少一个装饰层，优选地是印刷物的形式，优选设置于箔或膜上，箔或膜优选地是热塑性种类的；
-顶层包括至少一个半透明或透明的耐磨层，其优选地涉及箔或膜，特别是热塑性类型的箔或膜。
在可替换的实施方式中，第二基板层在第二基板层的下侧上可设置有衬背层，该衬背层可以或者不可以与所述顶层结合。
优选地，地板镶板的厚度小于10mm，更好地为8mm量级或可能更薄。
上述组成基板基本上被实现为坚固的。
本发明的组成基板尤其适于将向下指向的锁定元件和/或向上指向的锁定元件制成为基本上坚固的。这提供了甚至可增强锁定强度的优点。
向下指向的锁定元件和向上指向的锁定元件可以均设置有锁定表面，锁定表面在两个这种地板镶板的耦接状态中配合。在锁定表面在两个这种地板镶板的耦接状态中配合的情况下，这些锁定表面优选限定定位成竖直的或者与竖直面偏离不超过45度的切线。因此，优点是得到能够提供强水平锁定，这对于耦接的总强度有益。
为了仍提高安装的平顺性，上钩形部分的近端和/或下钩形部分的远端优选没有锁定部分。在两个这种地板镶板的耦接状态中，下钩形部分的远端甚至优选与相对地板镶板分开，这提供了当执行耦接运动时能够为下钩形部分的唇缘可能的向外弯曲提供足够的空间的优点。
特别有利地是，将锁定部分形成为在所述向下运动期间通过卡扣作用彼此前后接合的部件，并且更特别地，将它们在组成基板的材料中形成为单一件。即，使得组成基板示出优异的特征以便当执行耦接运动时将这种卡扣部分平顺地彼此前后定位。
优选地，甚至前述耦接部分基本上用地板镶板的材料来实现，并且更特别地被实现在所述组成基板中，并且优选地，被实现为完全与组成基板成单一件。
地板镶板可以是矩形的，要么是长方形的要么是正方形的，其中，所述两个相对边缘形成第一对相对边缘且彼此分隔开，地板镶板包括第二对相对边缘，第二对相对边缘还包括耦接部分，该耦接部分允许在位于地板镶板的平面中且垂直于相应边缘的第一方向上进行锁定以及允许在垂直于地板镶板的平面的第二方向上进行锁定。
本发明具体涉及这样的地板镶板，其中，第二对相对边缘上的耦接部分被构造为使得两个这种地板镶板可通过一个地板镶板相对于另一个地板镶板的转动运动在该第二对相对边缘处耦接，以这种方式使得多个这种地板镶板可通过所谓的“向下折叠”技术进行耦接。上文中提到的优点将清楚可见，特别是向下折叠式的这种地板镶板。
优选地，第二对相对边缘上的所述耦接部分在地板镶板本身的材料中实现，并且更特别地被实现在所述组成基板中，并且优选地被实现为完全与组成基板成单一件。
地板镶板优选是长方形的，其中，第一对相对边缘形成地板镶板的短边并且第二对相对边缘形成地板镶板的长边。
在可替换方案中，地板镶板是长方形的，其中，第一对相对边缘形成地板镶板的长边并且第二对相对边缘形成地板镶板的短边。
应注意“组成基板”应当理解为成单一件生产的组成基板。除此之外，应注意，组成基板的基板层因此还可以实现为多层。在这种基板层实现为多层的情况下，多层基板层的这些层尤其彼此相似，在这层意义上，它们由基本上相同的材料构成和/或具有相同的组分。
还应注意的是，锁定表面不必必须是平坦的而是也可以例如是弯曲的或弯折的。在这些锁定表面弯曲的情况下，在它们在耦接状态中配合的情况下，这些锁定表面可限定一条以上的切线，然而，根据六个方面中的每一个，它们必须限定水平的或者与水平面偏离不超过50度的至少一条切线。
应注意“坚固的(massive，结实的，实心的)”必须理解为没有提供弱化部分和/或凹部以便允许一定变形。本文中，还应注意“基本坚固的”是指尽管不排除这种弱化部分和/或凹部，但它们仅在其所设置的部件上延伸较小程度。
应注意“一个直接位于另一个上方的层”并不排除这些层之间存在可能的胶水。
附图说明
为了更好地表现本发明的特征，在下文中，作为没有任何限制性特征的实例，参考附图描述了一些优选实施方式，附图中：
图1以顶视图示出了根据本发明的地板镶板；
图2示出了根据图1中的线II-II的截面，然而，处于两个这种地板镶板的耦接状态，其可被视为至少独立方面1、2、3、4和5的实施方式；
图3示出了图2的变型，其可被视为至少独立方面1、2、3、4和6的实施方式；
图4示出了根据图1中的线IV-IV的截面，然而，处于两个这种地板镶板的耦接状态，
图5示出了如何通过所谓的“向下折叠”技术来耦接这种地板镶板；
具体实施方式
图1示出了根据本发明的地板镶板1。地板镶板1包括至少两个相对边缘3、4上的耦接部分5、6。
图2示出了根据图1中的线II-II的截面，然而，处于两个这种地板镶板1的耦接状态。地板镶板1包括组成基板2，该组成基板在该实例中被实现为坚固的。地板镶板1的厚度T小于10mm并且更好地为8mm量级或更薄。
耦接部分5、6基本上由组成基板2的材料实现并与其一体形成。
耦接部分5、6允许两个这种地板镶板1可通过一个地板镶板1相对于另一地板镶板1的向下运动M而彼此耦接。在耦接状态中，耦接部分5、6形成第一锁定系统和第二锁定系统，第一锁定系统在位于地板镶板1的平面中且垂直于上述边缘3、4的第一方向H上实现锁定，并且第二锁定系统在横向于地板镶板1的平面的第二方向V上实现锁定。
第一锁定系统由位于边缘4上的向上指向的下钩形部分7以及位于相对边缘3上的向下指向的上钩形部分8形成。钩形部分7、8可通过向下运动M而彼此前后接合。下钩形部分7由具有向上指向的锁定元件10的唇缘9构成，而上钩形部分8由具有向下指向的锁定元件12的唇缘11构成。
锁定元件10和12被制造成坚固的。
第二锁定系统包括锁定部分13、14，该锁定部分分别位于下钩形部分7的近端附近和上钩形部分8的远端附近。
锁定部分13、14被制造为在所述向下运动M期间通过卡扣作用而彼此前后接合的部件，其中，将这些锁定部分13、14在组成基板2的材料中制造成单一件。
正如上钩形部分8的近端那样，下钩形部分7的远端没有锁定部分。这里，下钩形部分7的远端与相对的地板镶板1或相对边缘3分开一空间S。
组成基板2由两个基板层15、16构成，即，基于合成材料的第一基板层15和位于其上的第二基板层16。第二基板层16的厚度D1为至少0.5mm并且优选为至少1mm。第一基板层15的密度D2为至少3mm，优选为至少4mm并且更优选为至少5mm。
基板层15、16可示出以下特征中的一个或多个：
-第一基板层15的密度与第二基板层16的密度不同，并且优选地，第二基板层16具有比第一基板层15高的密度；
-第一基板层15是发泡的并且优选是闭孔型的并且更优选是所谓的硬质泡沫型，并且优选地，第二基板层不是发泡的或者发泡程度比第一基板层15小；
-第一基板层15被挤压；和/或
-基板层15、16两者彼此粘合，优选地通过防水胶彼此粘合。
在第一基板层15是发泡的情况下，该第一基板层15可逐渐发泡，其中发泡的程度例如在向下或向上的方向上增大。
基板层15、16可以如上面在介绍中描述地实现。
锁定部分13、14设置有锁定表面17、18，在此，在锁定表面在两个这种地板镶板1的耦接状态中配合的情况下，该锁定表面限定水平的或者与水平面偏离不超过50度的切线R。在这里所示出的实例中，切线R与水平面偏离大约25度。
锁定表面17、18定位为更靠近第一基板层15的上侧，而不是更靠近第一基板层15的下侧。在这里示出的实例中，锁定表面17、18完全位于第一基板层15中。
向上指向的锁定元件10和向下指向的锁定元件12设置有锁定表面19、20。这些锁定表面19、20在两个这种地板镶板1的耦接状态中配合并防止地板镶板1在方向H上移开或者至少对抗地板镶板的这种移开。
这样，在锁定表面19、20在两个这种地板镶板1的耦接状态中配合的情况下，锁定表面限定定位成竖直的并且与竖直面偏离不超过45度的切线R1。在该实例中，切线R1定位成竖直的。
由在两个这种耦接的地板镶板1之间形成的竖直封闭面V1与穿过锁定表面19、20在耦接状态中接触的区域中心的竖直面V2之间的水平距离形成的锁定距离A小于1cm，优选地小于5mm，并且更优选地小于3mm。
地板镶板1还包括顶层21，在这个实施例中，该顶层位于第二基板层16上方。顶层21可以如上文在介绍中描述地实现。
图3示出了图2的变型，其中，相似的部件或元件由与图2中相同的参考数字和字母表示。
如在图2中，图3中的组成基板2由两个基板层15、16构成，其可以如上文在介绍中描述地实现。
锁定部分13、14设置有锁定表面17、18，在锁定表面在两个这种地板镶板1的耦接状态中配合的情况下，该锁定表面限定水平的或者与水平面偏离不超过50度的切线R。在这里所示出的实例中，切线R与水平面偏离大约25度。
这样，在锁定表面19、20在两个这种地板镶板1的耦接状态中配合的情况下，锁定表面限定定位成竖直的或者与竖直面偏离不超过45度的切线R1。在该实例中，切线R1定位成竖直的。
锁定距离A小于1cm，优选地小于5mm，并且更优选地小于3mm。
然而，与图2中示出的相反，在图3中，锁定表面17、18位于第二基板层16中。然而，锁定表面定位为更靠近第一基板层15的下侧，而不是更靠近第一基板层15的上侧。
如在图1中示出的，地板镶板1是矩形的并且这里更具体地是长方形的。除了形成地板镶板1的一对短边的一对相对边缘3、4之外，地板镶板1还包括形成地板镶板1的一对长边的一对相对边缘22、23。
这对相对边缘22、23还包括耦接部分24、25。
图4示出了根据图1中的线IV-IV的截面，然而，处于两个这种地板镶板1的耦接状态。
耦接部分24、25允许在位于耦接的地板镶板1的平面中且垂直于相应边缘22、23的方向H上实现锁定，并且允许在垂直于耦接的地板镶板1的平面的方向V上实现锁定。
耦接部分24、25被配置成使得它们允许通过转动运动W耦接两个这种地板镶板1。
耦接部分24、25基本上由组成基板2的材料制造并制造成单一件。
耦接部分24、25基本上被制造成榫舌26和凹槽27，其设置有锁定部分28、29。这些锁定部分28、29防止耦接的地板镶板1根据方向H的移开或者至少对抗地板镶板1的这种移开。
图5示出了如何通过所谓的“向下折叠”技术来耦接图1的地板镶板1。在该图中，示出了部分完成的地板覆盖物，其中示出了一排已安装好的地板镶板1A和一排已安装好的地板镶板1B。地板镶板1C被安装在这排地板镶板1B中并因此必须耦接至地板镶板1A和1B。更具体地，地板镶板1C必须用其长边缘22耦接至地板镶板1A的长边缘23，并且必须用其短边缘3耦接至地板镶板1B的短边缘4。
通过从倾斜位置根据运动W向下转动地板镶板1C来进行向下折叠移动，在倾斜位置中，榫舌26已部分地被引入地板镶板1A的凹槽27中。利用这种运动，长边缘22、23彼此耦接，并且同时，短边缘3、4通过与转动运动W关联的向下运动M而被耦接。因此，换言之，在一个且相同的运动W中，地板镶板1在其长边缘22及其短边缘3处耦接至已安装好的地板镶板1A、1B。
本发明决不限于上述实施方式，相反，在不超过本发明的范围的情况下，可根据各种变型实现这种地板镶板。

Claims (26)

1.用于形成地板覆盖物的地板镶板，所述地板镶板(1)包括组成基板(2)；所述地板镶板(1)包括至少两个相对边缘(3、4)上的耦接部分(5、6)，所述耦接部分(5、6)允许两个所述地板镶板(1)能通过一个地板镶板(1)相对于另一地板镶板(1)的向下运动(M)彼此耦接；其中，在两个所述地板镶板(1)的耦接状态中，所述耦接部分(5、6)形成第一锁定系统，所述第一锁定系统在位于所述地板镶板(1)的平面中且垂直于所述两个相对边缘(3、4)的第一方向(H)上实现锁定，并且所述耦接部分形成第二锁定系统，所述第二锁定系统在横向于所述地板镶板(1)的平面的第二方向(V)上实现锁定；所述第一锁定系统至少由位于所述两个相对边缘(3、4)中的一个相对边缘(4)上的向上指向的下钩形部分(7)和位于所述两个相对边缘中的另一相对边缘(3)上的向下指向的上钩形部分(8)形成，所述下钩形部分(7)和所述上钩形部分(8)能通过所述向下运动(M)彼此前后接合；所述下钩形部分(7)由具有向上指向的锁定元件(10)的唇缘(9)构成，而所述上钩形部分(8)由具有向下指向的锁定元件(12)的唇缘(11)构成；所述第二锁定系统包括锁定部分(13、14)，所述锁定部分分别位于所述下钩形部分(7)的近端附近和所述上钩形部分(8)的远端附近；所述组成基板(2)至少由两个基板层(15、16)构成，即，基于合成材料的第一基板层(15)和直接位于所述第一基板层上的第二基板层(16)，所述第二基板层(16)的厚度(D1)为至少0.5mm；其特征在于，所述第一基板层(15)构造有所述地板镶板的多于一半的厚度；所述第一基板层(15)是发泡的；所述第一基板层(15)包含聚氯乙烯并且为刚性类型的，并且因此不包含增塑剂或者包含低于20phr的量的增塑剂；所述第二基板层(16)包含聚氯乙烯和大于15phr的量的增塑剂；所述锁定部分(13、14)设置有锁定表面(17、18)，在所述锁定表面在两个所述地板镶板(1)的耦接状态中配合的情况下，所述锁定表面限定水平的或与水平面偏离不超过50度的切线(R)；并且无论所述锁定表面是否位于所述第二基板层(16)中，所述锁定表面(17、18)定位为更靠近所述第一基板层(15)的上侧，而不是更靠近所述第一基板层(15)的下侧。
2.用于形成地板覆盖物的地板镶板，所述地板镶板(1)包括组成基板(2)；所述地板镶板(1)包括至少两个相对边缘(3、4)上的耦接部分(5、6)，所述耦接部分(5、6)允许两个所述地板镶板(1)能通过一个地板镶板(1)相对于另一地板镶板(1)的向下运动(M)彼此耦接；其中，在两个所述地板镶板(1)的耦接状态中，所述耦接部分(5、6)形成第一锁定系统，所述第一锁定系统在位于所述地板镶板(1)的平面中且垂直于所述两个相对边缘(3、4)的第一方向(H)上实现锁定，并且所述耦接部分形成第二锁定系统，所述第二锁定系统在横向于所述地板镶板(1)的平面的第二方向(V)上实现锁定；所述第一锁定系统至少由位于所述两个相对边缘(3、4)中的一个相对边缘(4)上的向上指向的下钩形部分(7)和位于所述两个相对边缘(3、4)中的另一相对边缘(3)上的向下指向的上钩形部分(8)形成，所述下钩形部分(7)和所述上钩形部分(8)能通过所述向下运动(M)彼此前后接合；所述下钩形部分(7)由具有向上指向的锁定元件(10)的唇缘(9)构成，而所述上钩形部分(8)由具有向下指向的锁定元件(12)的唇缘(11)构成；所述第二锁定系统包括锁定部分(13、14)，所述锁定部分分别位于所述下钩形部分(7)的近端附近和所述上钩形部分(8)的远端附近；其中，所述组成基板(2)至少由两个基板层(15、16)构成，即，基于合成材料的第一基板层(15)和直接位于所述第一基板层上的第二基板层(16)，所述第二基板层(16)的厚度(D1)为至少0.5mm；其特征在于，所述第一基板层(15)构造有所述地板镶板的多于一半的厚度；所述第一基板层(15)是发泡的；所述第一基板层(15)包含聚氯乙烯并且为刚性类型的，并且因此不包含增塑剂或者包含低于20phr的量的增塑剂；所述第二基板层(16)包含聚氯乙烯和大于15phr的量的增塑剂；所述锁定部分(13、14)设置有锁定表面(17、18)，在所述锁定表面在两个所述地板镶板(1)的耦接状态中配合的情况下，所述锁定表面限定水平的或与水平面偏离不超过50度的切线(R)；所述锁定表面(17、18)至少部分地位于所述第一基板层(15)中；所述向上指向的锁定元件(10)和所述向下指向的锁定元件(12)均设置有锁定表面(19、20)，所述锁定表面(19、20)在两个所述地板镶板(1)的耦接状态中配合；并且锁定距离(A)小于1cm，所述锁定距离(A)由在耦接状态中的两个所述地板镶板(1)之间形成的竖直封闭面(V1)与穿过所述向上指向的锁定元件(10)的锁定表面和所述向下指向的锁定元件(12)的锁定表面在耦接状态中彼此接触的区域中心的竖直面(V2)之间的水平距离形成。
3.用于形成地板覆盖物的地板镶板，所述地板镶板(1)包括组成基板(2)；所述地板镶板(1)包括至少两个相对边缘(3、4)上的耦接部分(5、6)，所述耦接部分(5、6)允许两个所述地板镶板(1)能通过一个地板镶板(1)相对于另一地板镶板(1)的向下运动(M)彼此耦接；其中，在两个所述地板镶板(1)的耦接状态中，所述耦接部分(5、6)形成第一锁定系统，所述第一锁定系统在位于所述地板镶板(1)的平面中且垂直于所述两个相对边缘(3、4)的第一方向(H)上实现锁定，并且所述耦接部分形成第二锁定系统，所述第二锁定系统在横向于所述地板镶板(1)的平面的第二方向(V)上实现锁定；所述第一锁定系统至少由位于所述两个相对边缘(3、4)中的一个相对边缘(4)上的向上指向的下钩形部分(7)和位于所述两个相对边缘(3、4)中的另一相对边缘(3)上的向下指向的上钩形部分(8)形成，所述下钩形部分(7)和所述上钩形部分(8)能通过所述向下运动(M)彼此前后接合；所述下钩形部分(7)由具有向上指向的锁定元件(10)的唇缘(9)构成，而所述上钩形部分(8)由具有向下指向的锁定元件(12)的唇缘(11)构成；所述第二锁定系统包括锁定部分(13、14)，所述锁定部分分别位于所述下钩形部分(7)的近端附近和所述上钩形部分(8)的远端附近；所述组成基板(2)至少由两个基板层(15、16)构成，即，基于合成材料的第一基板层(15)和直接位于所述第一基板层上的第二基板层(16)，所述第二基板层(16)的厚度为至少0.5mm；其特征在于，所述第一基板层(15)构造有所述地板镶板的多于一半的厚度；所述第一基板层(15)是发泡的；所述第一基板层(15)包含聚氯乙烯并且为刚性类型的，并且因此不包含增塑剂或者包含低于20phr的量的增塑剂；所述第二基板层(16)包含聚氯乙烯和大于15phr的量的增塑剂；所述锁定部分(13、14)设置有锁定表面(17、18)，在所述锁定表面在两个所述地板镶板(1)的耦接状态中配合的情况下，所述锁定表面限定水平的或与水平面偏离不超过50度的切线(R)；并且所述锁定表面(17、18)至少部分地位于所述第二基板层(16)中。
4.根据权利要求1至3中任一项所述的地板镶板，其特征在于，所述第一基板层(15)包括填充物。
5.根据权利要求1至3中任一项所述的地板镶板，其特征在于，所述第一基板层(15)的厚度(D2)为至少3mm。
6.根据权利要求1至3中任一项所述的地板镶板，其特征在于，所述第二基板层(16)包括填充物。
7.根据权利要求1至3中任一项所述的地板镶板，其特征在于，所述地板镶板(1)包括顶层(21)，所述顶层包括以下特征中的一种或以下特征的组合：
所述顶层(21)包括至少一个装饰层；
所述顶层(21)包括至少一个半透明或透明的耐磨层。
8.根据权利要求1至3中任一项所述的地板镶板，其特征在于，所述耦接部分(5、6)在所述地板镶板(1)本身的材料中实现。
9.根据权利要求1至3中任一项所述的地板镶板，其特征在于，所述地板镶板(1)是要么是长方形的要么是正方形，其中，所述两个相对边缘(3、4)形成第一对相对边缘(3、4)且彼此分隔开，所述地板镶板(1)包括第二对相对边缘(22、23)；所述第二对相对边缘(22、23)还包括耦接部分(24、25)，所述第二对相对边缘的所述耦接部分(24、25)允许在位于所述地板镶板(1)的平面中且垂直于所述第二对相对边缘(22、23)的第一方向(H)上进行锁定并允许在垂直于所述地板镶板(1)的平面的第二方向(V)上进行锁定。
10.根据权利要求9所述的地板镶板，其特征在于，所述第二对相对边缘(22、23)上的所述耦接部分(24、25)被构造为使得两个所述地板镶板(1)能通过一个地板镶板(1)相对于另一个地板镶板(1)的转动运动(W)在所述第二对相对边缘(22、23)处耦接，以这种方式使得多个所述地板镶板(1)能通过所谓的“向下折叠”技术进行耦接。
11.根据权利要求1至3中任一项所述的地板镶板，其特征在于，所述第二基板层(16)的厚度(D1)为至少1mm。
12.根据权利要求1至3中任一项所述的地板镶板，其特征在于，所述第一基板层(15)为闭孔型的。
13.根据权利要求12所述的地板镶板，其特征在于，所述第一基板层(15)为所谓的硬质泡沫型。
14.根据权利要求1至3中任一项所述的地板镶板，其特征在于，所述第二基板层(16)不是发泡的或者发泡程度比所述第一基板层(15)小。
15.根据权利要求2所述的地板镶板，其特征在于，所述锁定表面全部位于所述第一基板层中。
16.根据权利要求2所述的地板镶板，其特征在于，所述锁定距离(A)小于5mm。
17.根据权利要求16所述的地板镶板，其特征在于，所述锁定距离(A)小于3mm。
18.根据权利要求3所述的地板镶板，其特征在于，所述锁定表面全部位于所述第二基板层中。
19.根据权利要求4所述的地板镶板，其特征在于，所述第一基板层(15)中包括的填充物为白垩和/或石灰石。
20.根据权利要求5所述的地板镶板，其特征在于，所述第一基板层(15)的厚度(D2)为至少4mm。
21.根据权利要求20所述的地板镶板，其特征在于，所述第一基板层(15)的厚度(D2)为至少5mm。
22.根据权利要求6所述的地板镶板，其特征在于，所述第二基板层(16)包括的填充物为白垩和/或石灰石。
23.根据权利要求7所述的地板镶板，其特征在于，所述至少一个装饰层是印刷物的形式。
24.根据权利要求7所述的地板镶板，其特征在于，所述至少一个装饰层设置于箔或膜上。
25.根据权利要求8所述的地板镶板，其特征在于，所述耦接部分被实现在所述组成基板(2)中。
26.根据权利要求8所述的地板镶板，其特征在于，所述耦接部分被实现为完全与所述组成基板成单一件。
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US10407921B2 (en) 2019-09-10
CN111502172A (zh) 2020-08-07
CN111502173B (zh) 2021-08-27
US20180002935A1 (en) 2018-01-04
EP3741926A1 (en) 2020-11-25
US11634912B2 (en) 2023-04-25
ES2826556T3 (es) 2021-05-18
CN111502172B (zh) 2021-08-24
US20180334812A1 (en) 2018-11-22
US20190390467A1 (en) 2019-12-26
US20200308849A1 (en) 2020-10-01
CN111502173A (zh) 2020-08-07
US20230228101A1 (en) 2023-07-20
US11021881B2 (en) 2021-06-01
WO2016113676A1 (en) 2016-07-21
EP3245352A1 (en) 2017-11-22
US10745922B2 (en) 2020-08-18
CN107208427A (zh) 2017-09-26
US20210246669A1 (en) 2021-08-12
EP3245352B1 (en) 2020-08-19

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Patentee after: UNILIN, BVBA

Address before: Luxemburg Belt long day

Patentee before: FLOORING INDUSTRIES LTD.,S.A.R.L.

EM01 Change of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20230919

Contract record no.: X2023990000552

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20230918

Contract record no.: X2021990000331

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

EM01 Change of recordation of patent licensing contract

Change date: 20230925

Contract record no.: X2023990000603

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20230925

Contract record no.: X2022990000458

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20230925

Contract record no.: X2022990000106

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

EM01 Change of recordation of patent licensing contract
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Application publication date: 20170926

Assignee: Chongnuo (Shandong) new material Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: X2023990000836

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20230927

EE01 Entry into force of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20231010

Contract record no.: X2022990000381

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231010

Contract record no.: X2021990000745

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231010

Contract record no.: X2021990000309

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

EM01 Change of recordation of patent licensing contract
EC01 Cancellation of recordation of patent licensing contract

Assignee: Changzhou Xinou New Material Technology Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: X2021990000222

Date of cancellation: 20231013

EC01 Cancellation of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20231026

Contract record no.: X2023990000221

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231023

Contract record no.: X2022990000529

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231026

Contract record no.: X2021990000590

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231023

Contract record no.: X2021990000182

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231026

Contract record no.: 2017990000137

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

EC01 Cancellation of recordation of patent licensing contract
EC01 Cancellation of recordation of patent licensing contract

Assignee: Henan Ziteng Decoration Material Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: X2021990000591

Date of cancellation: 20231101

Assignee: Changzhou Senhong Decoration Materials Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|Unilin Nordic Co.|UNILIN, BVBA

Contract record no.: 2017990000272

Date of cancellation: 20231101

EM01 Change of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20231101

Contract record no.: X2021990000663

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: Anhui Yangzi Meijia New Material Technology Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: X2020990000174

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20231107

EM01 Change of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20231107

Contract record no.: X2023990000306

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231109

Contract record no.: X2021990000594

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: Unilin Nordic Co.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor before: Unilin Nordic Co.

EM01 Change of recordation of patent licensing contract

Change date: 20231114

Contract record no.: X2021990000749

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

EM01 Change of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: Jiangsu forever ground decoration material Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA|Unilin Nordic Co.

Contract record no.: 2017990000405

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20231121

EM01 Change of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20231121

Contract record no.: 2019990000258

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor before: Unilin Beheer B.V.

EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: Zhangjiagang emperor crown Technology Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: X2022990000115

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20231130

Application publication date: 20170926

Assignee: WUXI ZHONGDE NEW DECORATION MATERIAL CO.,LTD.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2017990000298

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20231130

Application publication date: 20170926

Assignee: Jiangsu Zhongxin home furnishing New Material Co.,Ltd.|Changzhou Zhongxin Holdings Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2017990000216

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20231130

EE01 Entry into force of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20231130

Contract record no.: X2021990000592

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231130

Contract record no.: X2021990000337

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: Unilin Nordic Co.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor before: Unilin Nordic Co.

Change date: 20231130

Contract record no.: 2017990000489

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: Unilin Nordic Co.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor before: Unilin Nordic Co.

EM01 Change of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20231208

Contract record no.: X2021990000066

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231208

Contract record no.: 2019990000035

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor before: Unilin Beheer B.V.

EM01 Change of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: YAOLONG BAMBOO & WOOD PRODUCTS Co.,Ltd.|ZHEJIANG CHANGXING SENDA BAMBOO & WOOD PRODUCTS Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2017990000342

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20231211

Application publication date: 20170926

Assignee: Ji'nan Ming Ming wood industry Co., Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2016990000242

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20231212

Application publication date: 20170926

Assignee: Darde Flooring Development (JiangSu) Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2015990000520

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20231211

EM01 Change of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20231212

Contract record no.: X2022990000466

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231211

Contract record no.: X2020990000008

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor before: Unilin Beheer B.V.

Change date: 20231211

Contract record no.: X2019990000114

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor before: Unilin Beheer B.V.

EM01 Change of recordation of patent licensing contract

Change date: 20231214

Contract record no.: 2019990000207

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor before: Unilin Beheer B.V.

EM01 Change of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: Jiangsu zhengdazhu Material Technology Co.,Ltd.|WUXI BODA BAMBOO AND WOOD INDUSTRIAL Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2017990000178

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20231222

Application publication date: 20170926

Assignee: Jiangsu Dike New Material Technology Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: X2023990000986

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20231222

EM01 Change of recordation of patent licensing contract

Change date: 20231222

Contract record no.: X2022990000870

Assignor after: Floor industry Co., Ltd., Unilin Co.,Ltd.

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20231222

Contract record no.: X2019990000022

Assignor after: Floor industry Co., Ltd., Unilin Co.,Ltd.

Assignor before: Flooring Industry Limited, Unilin Manages Private Companies

EM01 Change of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: Jiangsu Zhiyuan New Material Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: X2020990000573

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20240104

EE01 Entry into force of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20240105

Contract record no.: X2023990000551

Assignor after: Floor industry Co., Ltd.

Assignor after: Unilin Co.,Ltd.

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20240105

Contract record no.: X2022990000322

Assignor after: Floor industry Co., Ltd.

Assignor after: Unilin Co.,Ltd.

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Change date: 20240104

Contract record no.: X2019990000102

Assignor after: Floor industry Co., Ltd.

Assignor after: Unilin Co.,Ltd.

Assignor before: Flooring Industry Limited

Assignor before: Unilin Manages Private Companies

Change date: 20240105

Contract record no.: 2018990000230

Assignor after: Floor industry Co., Ltd.

Assignor after: Unilin Co.,Ltd.

Assignor before: Flooring Industry Limited

Assignor before: Unilin Manages Private Companies

EM01 Change of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: ALMATY (DALIAN) WOOD CO.,LTD.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2019990000259

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20240115

EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: ZHEJIANG LIDU NEW MATERIAL CO.,LTD.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: X2024990000047

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20240125

EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: Zhejiang Yongyu household Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2017990000458

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20240202

EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: Zhejiang Jumeijia Technology Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA|Unilin Nordic Co.

Contract record no.: 2017990000263

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20240208

EM01 Change of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20240208

Contract record no.: X2019990000086

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor before: Unilin Beheer B.V.

EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: CHUZHOU RUNLIN WOOD Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2018990000127

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20240513

EE01 Entry into force of recordation of patent licensing contract
EM01 Change of recordation of patent licensing contract

Change date: 20240513

Contract record no.: X2019990000187

Assignee after: Hubei Palm Tree New Materials Co.,Ltd.

Assignee before: Hubei Brown Tongshu New Material Co.,Ltd.

Change date: 20240513

Contract record no.: X2019990000187

Assignor after: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor after: UNILIN, BVBA

Assignor before: FLOORING INDUSTRIES LTD.,S.A.R.L.

Assignor before: Unilin Beheer B.V.

EM01 Change of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: Fujian wonder bamboo Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2018990000117

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20240516

EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: Zhejiang Yunqi Industrial Co.,Ltd.

Assignor: UNILIN, BVBA

Contract record no.: X2024990000252

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20240528

Application publication date: 20170926

Assignee: FUJIAN CHIYU DECORATION MATERIAL Co.,Ltd.

Assignor: FLOORING INDUSTRIES LTD.,S.A.R.L.|UNILIN, BVBA

Contract record no.: 2018990000079

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20240528

EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20170926

Assignee: Changzhou Penggu Decoration Materials Co.,Ltd.

Assignor: UNILIN, BVBA

Contract record no.: X2024990000261

Denomination of invention: Floor panels used to form floor coverings

Granted publication date: 20200512

License type: Common License

Record date: 20240531