CN107197593A - A kind of flexible PCB and preparation method thereof - Google Patents
A kind of flexible PCB and preparation method thereof Download PDFInfo
- Publication number
- CN107197593A CN107197593A CN201610147257.9A CN201610147257A CN107197593A CN 107197593 A CN107197593 A CN 107197593A CN 201610147257 A CN201610147257 A CN 201610147257A CN 107197593 A CN107197593 A CN 107197593A
- Authority
- CN
- China
- Prior art keywords
- ground plane
- flexible pcb
- stiffening plate
- mask
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The present invention relates to flexible PCB field, more particularly to a kind of flexible PCB and preparation method thereof, including：Base material, with a upper surface and the lower surface relative to the upper surface；On ground plane, the upper surface for being arranged on the base material；Stiffening plate, is arranged on the ground plane, at least ground plane described in covering part；On conductive pad, the lower surface for being arranged on the base material；Wherein, the surface that the ground plane is covered by the stiffening plate is solid plane, and power is pasted between the ground plane and the stiffening plate to be lifted.The flexible PCB of the present invention is at the conductive pad back side by the way of solid ground layer so that stiffening plate is fitted even closer well-balanced with ground plane, increases the adhesion of stiffening plate, makes stiffening plate difficult for drop-off.Conductive pad plug number of times is also increased simultaneously, it is cost-effective, improve product yield.
Description
Technical field
The present invention relates to flexible PCB field, more particularly to a kind of flexible PCB and its preparation
Method.
Background technology
Flexible PCB is also known as " soft board ", is the printed circuit being made of flexible insulating substrate.
Flexible circuit provides excellent electrical property, can meet smaller and more high-density installation design need
Will, it helps reduce assembling procedure and enhancing reliability.Flexible PCB can with free bend,
Winding, folding, can bear millions of secondary dynamic bendings without damaging wire, can be according to sky
Between layout requirements arbitrarily arrange, and arbitrarily moved and flexible in three dimensions, so as to reach first device
The integration that part is assembled and wire is connected；Flexible PCB can be substantially reduced the volume of electronic product
And weight, the need for applicable electronic product develops to high density, miniaturization, highly reliable direction.
But, traditional flexible PCB is in the design aspect existing defects of splicing fingers, golden hand
Refer to grafting insecure, reduce the service life of golden finger, cause the waste of resource and cost.
The content of the invention
In view of the shortcomings of the prior art, the embodiment of the present invention provides a kind of flexible PCB, including：
Base material, with a upper surface and the lower surface relative to the upper surface；Ground plane, is set
On the upper surface of the base material；Stiffening plate, is arranged on the ground plane, at least covering part
Divide the ground plane；On conductive pad, the lower surface for being arranged on the base material；Wherein, it is described
The surface that ground plane is covered by the stiffening plate is solid plane.
The present invention also provides a kind of preparation method of flexible PCB, it is characterised in that including：
One insulating substrate is provided, and the base material has a upper surface and relative to the upper surface
Lower surface；The first metallic film is formed in the upper surface of the base material, under the base material
Surface forms the second metallic film；Pattern is carried out to first metallic film using the first mask
Change is handled, to form the ground plane with solid construction on the base material；Covered using second
Film carries out patterned process to second metallic film, and metallization covering is patterned
The surface of second metallic film exposure after processing, to form conductive under the base material
Pad；And a stiffening plate is pasted on the ground plane.
Above-mentioned technical proposal has the following advantages that or beneficial effect：One kind that the present invention is provided is flexible
Circuit board and preparation method thereof, the shape of the ground plane by changing the flexible PCB conductive pad back side
Shape, at the conductive pad back side by the way of solid ground layer so that ground plane uniform ground.
When covering stiffening plate, stiffening plate is fitted even closer well-balanced with flexible PCB, increases reinforcement
The adhesion of plate, makes stiffening plate difficult for drop-off.Increase conductive pad plug number of times simultaneously, save into
This, improves product yield.
Brief description of the drawings
With reference to appended accompanying drawing, more fully to describe embodiments of the invention.However, appended
Accompanying drawing is merely to illustrate and illustrated, and is not meant to limit the scope of the invention.
Fig. 1 is the sectional view of the flexible PCB of the embodiment of the present invention one；
Fig. 2 is the three-dimensional structure diagram of the flexible PCB of the embodiment of the present invention one；
Fig. 3 is the sectional view of the flexible PCB of the embodiment of the present invention two；
Fig. 4 is the method flow diagram that the present invention prepares flexible PCB in embodiment one.
Embodiment
Below in conjunction with accompanying drawing, the technical scheme in the embodiment of the present invention is carried out clear, complete
Ground is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than
Whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having
The every other embodiment obtained on the premise of making creative work, belongs to guarantor of the present invention
The scope of shield.
It should be noted that in the case where not conflicting, embodiment and embodiment in the present invention
In feature can be mutually combined.
Embodiment one：
Flexible PCB in the embodiment of the present invention, as shown in figure 1, including：
Base material 11, with a upper surface and the lower surface relative to the upper surface；Ground plane
12, on the upper surface for being arranged on base material 11；Stiffening plate 13, is arranged on ground plane 12,
And at least ground plane described in covering part；And conductive pad 14, it is arranged on the following table of base material 11
On face.Wherein, ground plane 12 is chosen as metal material, such as copper；Stiffening plate 13 is chosen as
Polyimides (PI) stiffening plate；The material of conductive pad 14 is chosen as copper, nickel or gold or is
Include the alloy material of at least one of copper, nickel and gold metal.
It should be noted that the upper surface and lower surface of base material 11 is only area in the present embodiment
It is divided to a kind of expression method in two faces opposing upper and lower of base material 11, in practice, connects
Stratum 12 and conductive pad 14 can be respectively arranged on any one face of base material 11, as long as protecting
The base material 11 for demonstrate,proving isolation material keeps apart ground plane 12 and conductive pad 14.
As an optional embodiment, as shown in Fig. 2 ground plane 12 is close to stiffening plate 13
One side on, the part for being reinforced the covering of plate 13 is the smooth solid layer in surface.So viscous
During reinforcing plate 13, the contact area of stiffening plate 13 and ground plane 12 increases, and fits more
Step up close well-balanced, increase the adhesion of stiffening plate 13, make stiffening plate 13 difficult for drop-off.Separately
Outside, in the one side that ground plane 12 is contacted with stiffening plate 13, it is not reinforced plate 13 and covers
The bending place of part (not indicated in figure) especially ground plane 12 could be arranged to grid knot
Structure.
Optionally, between ground plane 12 and stiffening plate 13, it is provided with a layers of two-sided (figure
In do not indicate), ground plane 12 and stiffening plate 13 are pasted together by the layers of two-sided.Its
In, the layers of two-sided can be upper strata glue-line, middle polyimides (PI) layer, lower floor's glue-line
Combining structure.
As an optional embodiment, on conductive pad 14, a strata can also be set
Acid imide (PI) layer is used to protect conductive pad 14, and conductive pad 14 is pasted onto again by glue-line
On.
Embodiment two：
Flexible PCB in the present embodiment, its structure sheaf sets consistent with embodiment one, herein
Repeat no more.Difference part is：
The part of the correspondence of ground plane 12 stiffening plate 13 is smooth solid in surface in embodiment one
Layer, and ground plane 12 does not correspond to the part (being not drawn into Fig. 1 and Fig. 2) of stiffening plate 13
The bending place of especially ground plane 12 could be arranged to network.
And in the present embodiment, with reference to Fig. 3, ground plane 22 can be set to and stiffening plate
23 one sides pasted for solid surfaces (such as solid copper) and ground plane 22 not with stiffening plate 23
The another side (namely ground plane 22 contacted with substrate 21 one side) of contact is the grid of hollow out
Structure.
In addition, the ground plane of the flexible PCB of the present invention also has a variety of change set-up modes.Only
It is solid surfaces, remaining position of ground plane with stiffening plate location for paste to ensure ground plane
It is set to hollow out network.
Embodiment three：
Reference picture 4, the present embodiment provides the method for preparing the flexible PCB in embodiment one,
Including：
The base material 11 of an isolation material is provided, the base material 11 has a upper surface and relative to upper
The lower surface on surface；Also truthfully apply described in example one, herein the upper surface of base material 11 and
Lower surface is only a kind of expression method in two faces opposing upper and lower for distinguishing base material 11, Yu Shi
During border is used, follow-up ground plane 12 and conductive pad 14 can be prepared in any of base material 11 respectively
On one face, as long as ensureing that base material 11 opens ground plane 12 and the isolation of conductive pad 14.
Then, the first metallic film, the following table in base material 11 are formed in the upper surface of base material 11
Face forms the second metallic film；Further, the first metallic film is carried out using the first mask
Patterned process, to form the ground plane 12 with solid construction on base material 11；Utilize
Second mask carries out patterned process to the second metallic film, and metallization covering is through pattern
The surface of the second metallic film exposure after change processing, to form conductive pad under base material 11
14；Finally a stiffening plate 13 is pasted on ground plane 12.
Wherein, the step of carrying out patterned process to the first metallic film using the first mask is specific
Including：By the first mask concora crush to play line transitions and follow-up on the first metallic film
Hinder etching action；Use UV light sources by light shield to the mask of part first be exposed processing with
Figure (i.e. circuit) on light shield is transferred on the first mask；The irradiated area of UV light sources
After the first mask polymerization hardening on domain, using developing process, washed through imaging specific liquid medicine
Except the first unexposed mask, with the metallic film of expose portion first；Again with after development
One mask is mask, and etching removes the metallic film of part first of exposure in previous step, makes to be not required to
The first metal film layer wanted is removed；Finally divest the first mask after development and expose remaining the
One metallic film, these remaining first metallic films are to constitute metallic circuit, namely are formed above-mentioned
Ground plane 12.As an optional embodiment, the effect of the first mask herein is transfer
Circuit and etching when prevent needed for circuit be etched, first mask can be dry film.
Consistent with embodiment one as an optional embodiment, ground plane 12 is real herein
Core structure, material is chosen as metallic copper.
Equally, carry out patterned process to the second metallic film to form conduction using the second mask
The step of the step of pad 14 is with above-mentioned formation ground plane 12 are consistent, and here is omitted.Difference
Place be, finally divest development after the second mask expose remaining second metallic film (this
The second metallic film after a little remaining second metallic films namely patterned processing) after, increase
Metallization is added on remaining second metallic film to cover after the patterned processing
The step of two metallic films, ultimately form conductive pad 14.Why in remaining second metal foil
Metallization on film, is because to make the convenient use of conductive pad 14, no longer covering is mended thereon
Strong plate, metallization can prevent conductive pad 14 from aoxidizing.As an optional embodiment,
The metal material plated herein can be nickel gold.
As an optional embodiment, the step of flexible PCB is prepared herein also includes：Shape
Into after above-mentioned ground plane 12, a two-sided glue material is set on ground plane 12, stiffening plate 13 leads to
The two-sided glue material is crossed to be pasted onto on ground plane 12.Wherein, it is consistent with embodiment one, double faced adhesive tape
Material can be upper strata glue-line, middle polyimides (PI) layer, the combining structure of lower floor's glue-line；
The material of stiffening plate 14 is chosen as polyimides.
As further alternative embodiment, after conductive pad 14 is formed, it can led by glue material
A polyimide layer is pasted in electrical pad 14, to play a part of protecting conductive pad 14.
As an optional embodiment, the first above-mentioned mask and the material of the second mask
For dry film.
The present embodiment by ground plane be designed as solid ground layer (could be arranged to only with stiffening plate pair
Should be partly solid construction, or overall is solid construction) so that ground plane and stiffening plate
Contact area increase, as shown in Fig. 2 due to ground plane uniform ground, consistency of thickness, no
Low, the rough phenomenon of height occurs, in lamination reinforcement plate, the two can be very
It is tightly bonded together, increases the adhesion of stiffening plate, designs simple and convenient.
In addition, preparing embodiment two and the method for the flexible PCB in remaining alternate embodiment
Similar with the present embodiment, the present invention is repeated no more to this.
In summary, a kind of flexible PCB that the present invention is provided and preparation method thereof, by changing
Become the shape of the ground plane at the flexible PCB conductive pad back side, connect at the conductive pad back side using solid
The mode on stratum so that ground plane uniform ground.When covering stiffening plate, stiffening plate and flexibility
Circuit board is fitted even closer well-balanced, is increased the adhesion of stiffening plate, is made stiffening plate be difficult to take off
Fall.Increase conductive pad plug number of times simultaneously, it is cost-effective, improve product yield.
It should be appreciated by those skilled in the art that those skilled in the art combine prior art and
Above-described embodiment can realize various change example, and such change case has no effect on the reality of the present invention
Matter content, will not be described here.
Presently preferred embodiments of the present invention is described above.It is to be appreciated that of the invention
Above-mentioned particular implementation is not limited to, wherein the equipment and structure be not described in detail to the greatest extent should
It is interpreted as being practiced with the common mode in this area；It is any to be familiar with those skilled in the art
Member, without departing from the scope of the technical proposal of the invention, all using the method for the disclosure above
Many possible variations and modification are made to technical solution of the present invention with technology contents, or are revised as
The equivalent embodiment of equivalent variations, this has no effect on the substantive content of the present invention.Therefore, it is every
Without departing from the content of technical solution of the present invention, the technical spirit according to the present invention is to above example
Any simple modifications, equivalents, and modifications done, still fall within technical solution of the present invention guarantor
In the range of shield.
Claims (20)
1. a kind of flexible PCB, it is characterised in that including：
Base material, with a upper surface and the lower surface relative to the upper surface；
On ground plane, the upper surface for being arranged on the base material；
Stiffening plate, is arranged on the ground plane, at least ground plane described in covering part；
On conductive pad, the lower surface for being arranged on the base material；
Wherein, the surface that the ground plane is covered by the stiffening plate is solid plane.
2. flexible PCB according to claim 1, it is characterised in that the ground connection
The solid plane of layer is flat surface.
3. flexible PCB according to claim 1, it is characterised in that the ground connection
The surface that layer is not covered by the stiffening plate is network.
4. flexible PCB according to claim 1, it is characterised in that the ground connection
The material of layer is copper.
5. flexible PCB according to claim 1, it is characterised in that also include：
Two-sided glue material, the stiffening plate by the two-sided glue material be pasted on the ground plane it
On.
6. flexible PCB according to claim 5, it is characterised in that described two-sided
Glue material includes the first glue-line, the second glue-line and is arranged at first glue-line and second glue-line
Between the first protective layer；
Wherein, first protective layer is pasted by first glue-line and the stiffening plate, institute
The first protective layer is stated to paste by second glue-line and the ground plane.
7. flexible PCB according to claim 6, it is characterised in that described first
The material of protective layer is polyimides.
8. flexible PCB according to claim 1, it is characterised in that the reinforcement
Plate is polyimides stiffening plate.
9. flexible PCB according to claim 1, it is characterised in that the conduction
The material of pad is copper, nickel or gold；Or
The material of the conductive pad is to include the alloy material of at least one of copper, nickel and gold metal
Material.
10. flexible PCB according to claim 1, it is characterised in that also include：
Second protective layer, is pasted on the conductive pad by the 3rd glue-line.
11. flexible PCB according to claim 10, it is characterised in that described
The material of two protective layers is polyimides.
12. a kind of preparation method of flexible PCB, it is characterised in that including：
One insulating substrate is provided, and the base material has a upper surface and relative to the upper surface
Lower surface；
The first metallic film, the lower surface shape in the base material are formed in the upper surface of the base material
Into the second metallic film；
Patterned process is carried out to first metallic film using the first mask, with the base
The ground plane with solid construction is formed on material；
Patterned process is carried out to second metallic film using the second mask, and plates metal material
The surface of second metallic film exposure after the patterned processing of material covering, with the base
Conductive pad is formed under material；And
One stiffening plate is pasted on the ground plane.
13. preparation method according to claim 12, it is characterised in that described first
Mask is dry film.
14. preparation method according to claim 13, it is characterised in that utilize first
The step of mask carries out patterned process to first metallic film includes：
By the dry film concora crush on first metallic film；
Ultraviolet source is used to be exposed processing to the part dry film will be described by light shield
On pattern transfer to first metallic film on light shield；
Unexposed dry film is removed with the first metal foil described in expose portion using developing process
Film；
Using the dry film after development as mask, etching removes part first metal of above-mentioned exposure
After film, divest the dry film after the development to form the ground plane.
15. preparation method according to claim 12, it is characterised in that utilize second
The step of mask carries out patterned process to second metallic film includes：
By the second mask concora crush on second metallic film；
Use ultraviolet source by light shield the second mask described to part be exposed processing with incite somebody to action
On pattern transfer to second metallic film on the light shield；
The second unexposed mask is removed with the second gold medal described in expose portion using developing process
Belong to film；
Using the second mask after development as mask, etching removes the part described second of above-mentioned exposure
After metallic film, divest the second mask after the development to form after patterned processing
Two metallic films；
Metallization covers the second metallic film after the patterned processing, to be formed
State conductive pad.
16. preparation method according to claim 15, it is characterised in that the metal
Material is nickel gold.
17. preparation method according to claim 12, it is characterised in that the preparation
Method also includes：
In setting a two-sided glue material on the ground plane, the stiffening plate passes through the two-sided glue material
It is pasted onto on the ground plane.
18. preparation method according to claim 12, it is characterised in that the reinforcement
The material of plate is polyimides.
19. preparation method according to claim 12, it is characterised in that the preparation
Method also includes：
In setting one the 3rd glue material on the conductive pad, by the 3rd glue material in the conduction
The second protective layer is pasted on pad.
20. preparation method according to claim 19, it is characterised in that described second
The material of protective layer is polyimides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610147257.9A CN107197593B (en) | 2016-03-15 | 2016-03-15 | A kind of flexible circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610147257.9A CN107197593B (en) | 2016-03-15 | 2016-03-15 | A kind of flexible circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107197593A true CN107197593A (en) | 2017-09-22 |
| CN107197593B CN107197593B (en) | 2019-09-24 |
Family
ID=59870724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610147257.9A Active CN107197593B (en) | 2016-03-15 | 2016-03-15 | A kind of flexible circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN107197593B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113015314A (en) * | 2019-12-20 | 2021-06-22 | 上银科技股份有限公司 | Circuit board device |
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| CN101636037A (en) * | 2008-07-25 | 2010-01-27 | 比亚迪股份有限公司 | Flexible printed circuit board |
| CN101795543A (en) * | 2010-03-25 | 2010-08-04 | 淳华科技(昆山)有限公司 | Method for manufacturing gold finger |
| TWM395239U (en) * | 2010-06-03 | 2010-12-21 | Tennrich Internat Crop | Flexible flat cable |
| CN202190458U (en) * | 2011-08-30 | 2012-04-11 | 上海天马微电子有限公司 | Flexible printed circuit board |
| CN104427783A (en) * | 2013-08-19 | 2015-03-18 | 宏启胜精密电子(秦皇岛)有限公司 | A flexible printed circuit board having golden fingers and manufacturing method thereof |
| CN204652769U (en) * | 2015-04-29 | 2015-09-16 | 广州恒利达电路有限公司 | A kind of flexible circuit board of touch-screen |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1154487A (en) * | 1994-10-21 | 1997-07-16 | 株式会社日立制作所 | Liquid crystal display device with reduced frame portion surrounding display area |
| CN101022696A (en) * | 2006-02-16 | 2007-08-22 | 华通电脑股份有限公司 | Multilayer circuit board with net grounded side characteristic impedance control method and structure |
| CN101119614A (en) * | 2006-07-31 | 2008-02-06 | 比亚迪股份有限公司 | Pattern electroplating method for two-sided and multi-layer flexible printed circuit board |
| CN101636037A (en) * | 2008-07-25 | 2010-01-27 | 比亚迪股份有限公司 | Flexible printed circuit board |
| CN101795543A (en) * | 2010-03-25 | 2010-08-04 | 淳华科技(昆山)有限公司 | Method for manufacturing gold finger |
| TWM395239U (en) * | 2010-06-03 | 2010-12-21 | Tennrich Internat Crop | Flexible flat cable |
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| CN104427783A (en) * | 2013-08-19 | 2015-03-18 | 宏启胜精密电子(秦皇岛)有限公司 | A flexible printed circuit board having golden fingers and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113015314A (en) * | 2019-12-20 | 2021-06-22 | 上银科技股份有限公司 | Circuit board device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107197593B (en) | 2019-09-24 |
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Address after: 201506, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201506, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |