CN107195759A - A kind of LED filament and LED - Google Patents
A kind of LED filament and LED Download PDFInfo
- Publication number
- CN107195759A CN107195759A CN201710590368.1A CN201710590368A CN107195759A CN 107195759 A CN107195759 A CN 107195759A CN 201710590368 A CN201710590368 A CN 201710590368A CN 107195759 A CN107195759 A CN 107195759A
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- 239000000758 substrate Substances 0.000 claims abstract description 61
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- -1 chip Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000001788 irregular Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a kind of LED filament and LED, it is related to appliance field.Wherein LED filament, including substrate, chip, metal contact wires and pin, chip and substrate connection, metal contact wires are connected with chip, through hole is provided with substrate, pin includes pin body and fixed part, and pin body passes through through hole, and be fixedly connected with substrate, the part that the side of pin body passes through hole is connected with fixed part.In the present invention, one end of pin body is connected with fixed part, and the other end passes through through hole, make after LED filament is powered, because the temperature rise of pad causes the solder of pad to melt, pin will not also disconnect with substrate, LED filament normal work can be made, so as to improve the life-span of LED filament.The LED that the present invention is provided applies LED filament, so as to also improve the service life of LED.
Description
Technical field
The present invention relates to appliance field, in particular to a kind of LED filament and LED.
Background technology
LED is the abbreviation of English light emitting diode (light emitting diode), is that one kind can be converted electrical energy into
For the semiconductor devices of the solid-state of visible ray, electricity directly can be converted into light by it.It is related to mobile phone, desk lamp, family with field
In terms of the daily household electrical appliances such as electricity and machinery production.LED is as a kind of new lighting source, with energy-conservation, health, environmental protection and life-span
Long distinguishing feature, receives the favor of numerous people and vigorously supporting for country.
In the LED of prior art, LED filament is with pin by being welded to connect.But LED filament is in use,
The temperature of LED flexibility filaments and pin weld can continue to raise, and after temperature rise, solder may melt, so as to cause LED
Come off and disconnect between filament and pin, LED filament is disconnected with miscellaneous part, result in LED filament can not be normal
It is luminous, so as to reduce the service life of LED filament.
The content of the invention
It is an object of the invention to provide a kind of LED filament, it is intended to the service life for improving LED filament.
It is an object of the invention to provide a kind of LED, it is intended to the service life for improving LED.
The present invention provides a kind of technical scheme：
Set on a kind of LED filament, including substrate, chip and pin, the chip and the substrate connection, the substrate
There is through hole, the pin includes pin body and fixed part, and the pin body passes through the through hole, and is welded with the substrate
Connect, the part that the side of the pin body passes the through hole is connected with the fixed part, the Breadth Maximum of the fixed part
More than the Breadth Maximum of the through hole.
Further, in preferred embodiments of the present invention, the fixed part is bending structure.
Further, in preferred embodiments of the present invention, the fixed part is seven fonts or T fonts.
Further, in preferred embodiments of the present invention, the fixed part is held in institute close to the side of the substrate
State substrate.
Further, in preferred embodiments of the present invention, the pin body is welded with the substrate both sides.
Further, in preferred embodiments of the present invention, the pin body has big end and a small end, the big end with
The fixed part connection, the diameter of the pin body is gradually reduced by the big end to the small end.
Further, in preferred embodiments of the present invention, the periphery of the pin body and the inwall of the through hole
Match somebody with somebody.
Further, in preferred embodiments of the present invention, the pin body is interference fitted with the through hole.
Further, in preferred embodiments of the present invention, the LED filament also includes adhesive layer, the adhesive layer bag
Wrap up in the chip and the substrate.
A kind of LED, including LED filament, the LED filament include substrate, chip, metal contact wires and pin, described
Chip and the substrate connection, the metal contact wires are connected with the chip, and through hole, the pin are provided with the substrate
Including pin body and fixed part, the pin body passes through the through hole, and is fixedly connected with the substrate, the pin sheet
The part that body passes the through hole is connected with the fixed part.
The LED filament and the beneficial effect of LED that the present invention is provided be：In the present invention, one end of pin body is with consolidating
Portion's connection is determined, the other end passes through through hole, makes after LED filament is powered, because the temperature rise of pad causes the weldering of pad
Material melts, and pin will not also disconnect with substrate, can make LED filament normal work, so as to improve the life-span of LED filament.This
The LED that invention is provided applies LED filament, so as to also improve the service life of LED.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be attached to what is used required in embodiment
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore is not construed as pair
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is the structural representation for the LED filament that the embodiment of the present invention one is provided.
Fig. 2 is the local structural representation at II in the Fig. 1 of the embodiment of the present invention one.
Fig. 3 is the structural representation of the substrate for the LED filament that the embodiment of the present invention one is provided.
Fig. 4 is the structural representation of the pin for the LED filament that the embodiment of the present invention one is provided.
Icon：100-LED filaments；110- substrates；112- through holes；120- chips；130- pins；132- pin bodies；
134- fixed parts；140- metal contact wires；150- adhesive layers.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.The present invention implementation being generally described and illustrated herein in the accompanying drawings
The component of example can be arranged and designed with a variety of configurations.
Therefore, the detailed description of embodiments of the invention below to providing in the accompanying drawings is not intended to limit claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiment in the present invention, this area is common
The every other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model that the present invention is protected
Enclose.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it further need not be defined and explained in subsequent accompanying drawing.
In the description of the invention, it is to be understood that the orientation or position of the instruction such as term " on ", " under ", " outer " are closed
It is that for based on orientation shown in the drawings or position relationship, or the orientation usually put when using of the invention product or position are closed
System, or the orientation that usually understands of those skilled in the art or position relationship, are for only for ease of the description present invention and simplify
Description, rather than indicate or imply that the equipment or element of meaning must have specific orientation, with specific azimuth configuration and behaviour
Make, therefore be not considered as limiting the invention.
In the description of the invention, in addition it is also necessary to explanation, unless otherwise clearly defined and limited, term " setting ",
" installation ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or one
Connect body；Can be mechanical connection or electrical connection；Can be joined directly together, can also be indirect by intermediary
It is connected, can is the connection of two element internals.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
Embodiment one
Referring to Fig. 1, present embodiments providing a kind of LED filament 100, the LED filament 100 that the present embodiment is provided can be carried
The service life of high LED filament 100.
In the present embodiment, LED filament 100 includes substrate 110, chip 120, metal contact wires 140, pin 130 and envelope
Glue-line 150, chip 120 is connected with substrate 110, and metal contact wires 140 are connected with chip 120, and pin 130 is fixed with substrate 110
Connection.The parcel of adhesive layer 150 chip 120, substrate 110 and metal contact wires 140.
It should be noted that in the present embodiment, chip 120 is connected by metal contact wires 140 with substrate 110, still
Not limited to this, in other embodiments of the invention, chip 120 directly can be connected with substrate 110, the upside-down mounting of chip 120, chip
120 positive pole and negative pole is directly connected with substrate 110.The scheme being equal with the present embodiment, can reach the effect of the present embodiment
, within the scope of the present invention.
Fig. 2 and Fig. 3 are referred to, in the present embodiment, through hole 112 is provided with substrate 110, pin 130 passes through through hole 112
It is fixedly connected with substrate 110.
In the present embodiment, two through holes 112 are provided with substrate 110, two through holes 112 are separately positioned on substrate 110
Two ends.
It should be noted that in the present embodiment, two through holes 112 are separately positioned on the two ends of substrate 110, but do not limit
In this, in other embodiments of the invention, two through holes 112 can be located at the optional position of substrate 110, with the present embodiment etc.
Same scheme, can reach the effect of the present embodiment, within the scope of the present invention.
In the present embodiment, pin 130 is two, pin 130 through a through hole 112 with it is substantially stationary.
Referring to Fig. 4, in the present embodiment, pin 130 includes pin body 132 and fixed part 134, pin body 132
Through through hole 112, it is fixedly connected with substrate 110, the side of pin body 132 passes the part of through hole 112 and fixed part 134 connects
Connect.
Preferably, the periphery of pin body 132 is matched with the inwall of through hole 112.I.e. in the present embodiment, pin body
132 periphery and the interior contact of through hole 112.
In the present embodiment, pin body 132 is interference fitted with through hole 112.Pin body 132 and through hole 112 can be made
Engaging, makes pin body 132 be fixed with through hole 112.
It should be noted that in the present embodiment, pin body 132 is interference fitted with through hole 112, but not limited to this,
In other embodiments of the invention, pin body 132 can coordinate with the gap of through hole 112, the scheme being equal with the present embodiment,
The effect of the present embodiment can be reached, within the scope of the present invention.
In the present embodiment, the Breadth Maximum of fixed part 134 is more than the Breadth Maximum of through hole 112.Fixed part 134 can be
The shape or irregular shape of the shape of rule, or irregular shape, either rule, fixed part 134 may
There are multiple width, the Breadth Maximum of fixed part 134 refers to width scales maximum in the width dimensions of fixed part 134.
Be readily appreciated that, the shape of through hole 112 is probably rule, it is also possible to irregular, no matter the shape of through hole 112
When rule or it is irregular, through hole 112 may all have multiple width, and the Breadth Maximum of through hole 112 refers to the width of through hole 112
Spend width scales maximum in size.
The Breadth Maximum of fixed part 134 is more than the Breadth Maximum of through hole 112.Pin body 132 is set to pass through after through hole 112,
Fixed part 134 cannot pass through through hole 112, so that the two ends of pin body 132 are located at the both sides of substrate 110 respectively.Make to draw
Pin 130 is not easy to come off with substrate 110.
In this embodiment, fixed part 134 is bending structure.
It should be noted that in the present embodiment, fixed part 134 is bending structure, but not limited to this, the present invention's
In other embodiment, fixed part 134 can be other structures, such as spherical, the scheme being equal with the present embodiment, Neng Gouda
To the effect of the present embodiment, within the scope of the present invention.
In the present embodiment, fixed part 134 is T fonts.
It should be noted that in the present embodiment, fixed part 134 is T fonts, but not limited to this, in its of the present invention
In his embodiment, fixed part 134 can also be for other shapes such as seven fonts, and the scheme being equal with the present embodiment can reach this
The effect of embodiment, within the scope of the present invention.
In the present embodiment, fixed part 134 is held in substrate 110 close to the side of substrate 110, i.e., in the present embodiment,
Fixed part 134 is supported close to the side of substrate 110 with substrate 110.
It should be noted that in the present embodiment, fixed part 134 is held in substrate 110 close to the side of substrate 110, but
This is not limited to, in other embodiments of the invention, fixed part 134 can not be supported with substrate 110, be equal with the present embodiment
Scheme, the effect of the present embodiment can be reached, within the scope of the present invention.
In the present embodiment, pin body 132 has big end and small end, and big end is connected with fixed part 134, pin body
132 diameter is gradually decreased by big hold to small end.Pin body 132 can be made during being threaded through, gradually with through hole
112 lockings.
In the present embodiment, pin body 132 is fixedly connected by way of welding with substrate 110.
Preferably, in the present embodiment, pin body 132 is fixedly connected by the welding manner of scolding tin with substrate 110.I.e.
Scolding tin makes pin body 132 be fixed with substrate 110 at through hole 112.
In the present embodiment, in the both sides scolding tin of substrate 110, i.e., both sides are covered.Pin body can be fixed from both sides
132, improve the fixed effect of pin 130.
It should be noted that in the present embodiment, in the both sides scolding tin of substrate 110, but not limited to this, the present invention's
In other embodiment, can substrate 110 side scolding tin, i.e., unilateral scolding tin, the scheme being equal with the present embodiment can reach
The effect of the present embodiment, within the scope of the present invention.
In the present embodiment, adhesive layer 150 is uniformly mixed by fluorescent material and glue.
It should be noted that in the present embodiment, adhesive layer 150 is uniformly mixed by fluorescent material and glue, still
Not limited to this, in other embodiments of the invention, adhesive layer 150 can be made up of transparent adhesive tape, or are made up of vaporific glue.With
The equivalent scheme of the present embodiment, can reach the effect of the present embodiment, within the scope of the present invention.
The operation principle for the LED filament 100 that the present embodiment is provided：In the present embodiment, one end of pin body 132 is with consolidating
Determine portion 134 to connect, the other end passes through through hole 112, the maximum gauge of fixed part 134 is more than the maximum gauge of through hole 112 so that Gu
Determine portion 134 and cannot pass through through hole 112, after the energization of LED filament 100, because the temperature rise of pad causes pad
Solder melt, pin 130 will not also disconnect with substrate 110.
In summary, the LED filament 100 that the present embodiment is provided, in the present embodiment, one end of pin body 132 is with consolidating
Determine portion 134 to connect, the other end passes through through hole 112, the maximum gauge of fixed part 134 is more than the maximum gauge of through hole 112 so that Gu
Determine portion 134 and cannot pass through through hole 112, after the energization of LED filament 100, because the temperature rise of pad causes pad
Solder melt, pin 130 will not also disconnect with substrate 110, can make the normal work of LED filament 100, so as to improve LED
The life-span of filament 100.
Embodiment two
A kind of LED (not shown) is present embodiments provided, the LED that the present embodiment is provided can improve making for LED
Use the life-span.
In the present embodiment, LED includes LED filament 100 and the circuit board (not shown) that embodiment one is provided, pin
130 one end away from fixed part 134 are connected with circuit board.
To briefly describe, the present embodiment does not refer to part, refer to embodiment one.
The operation principle for the LED that the present embodiment is provided：In the present embodiment, one end of pin body 132 and fixed part
134 connections, the other end passes through through hole 112, and the maximum gauge of fixed part 134 is more than the maximum gauge of through hole 112 so that fixed part
134 cannot pass through through hole 112, after the energization of LED filament 100, because the temperature rise of pad causes the weldering of pad
Material melts, and pin 130 will not also disconnect with substrate 110.
In summary, the LED that the present embodiment is provided, in the present embodiment, one end of pin body 132 and fixed part
134 connections, the other end passes through through hole 112, and the maximum gauge of fixed part 134 is more than the maximum gauge of through hole 112 so that fixed part
134 cannot pass through through hole 112, after the energization of LED filament 100, because the temperature rise of pad causes the weldering of pad
Material melts, and pin 130 will not also disconnect with substrate 110, can make the normal work of LED filament 100, so as to improve LED
Life-span.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (10)
1. a kind of LED filament, it is characterised in that including substrate, chip and pin, the chip and the substrate connection are described
Be provided with through hole on substrate, the pin includes pin body and fixed part, the pin body passes through the through hole, and with institute
Substrate welding is stated, the part that the side of the pin body passes the through hole is connected with the fixed part, the fixed part
Breadth Maximum is more than the Breadth Maximum of the through hole.
2. LED filament according to claim 1, it is characterised in that the fixed part is bending structure.
3. LED filament according to claim 2, it is characterised in that the fixed part is seven fonts or T fonts.
4. LED filament according to claim 1, it is characterised in that the fixed part is supported close to the side of the substrate
In the substrate.
5. the LED filament according to claim any one of 1-4, it is characterised in that the pin body and the substrate two
Weld side.
6. LED filament according to claim 1, it is characterised in that the pin body has big end and small end, described big
End is connected with the fixed part, and the diameter of the pin body is gradually reduced by the big end to the small end.
7. LED filament according to claim 1, it is characterised in that the periphery of the pin body is interior with the through hole
Wall is matched.
8. LED filament according to claim 7, it is characterised in that the pin body is interference fitted with the through hole.
9. LED filament according to claim 1, it is characterised in that the LED filament also includes adhesive layer, the sealing
Layer wraps up the chip and the substrate.
10. a kind of LED, it is characterised in that including the LED filament as described in claim any one of 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590368.1A CN107195759A (en) | 2017-07-19 | 2017-07-19 | A kind of LED filament and LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590368.1A CN107195759A (en) | 2017-07-19 | 2017-07-19 | A kind of LED filament and LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107195759A true CN107195759A (en) | 2017-09-22 |
Family
ID=59883849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710590368.1A Pending CN107195759A (en) | 2017-07-19 | 2017-07-19 | A kind of LED filament and LED |
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| Country | Link |
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| CN (1) | CN107195759A (en) |
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-
2017
- 2017-07-19 CN CN201710590368.1A patent/CN107195759A/en active Pending
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| Title |
|---|
| 李文军主编: "《电工基本技能应用于实践》", 北京理工大学出版社, pages: 126 * |
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Application publication date: 20170922 |