CN107170663A - A kind of method that chip is taken out from packaging body - Google Patents
A kind of method that chip is taken out from packaging body Download PDFInfo
- Publication number
- CN107170663A CN107170663A CN201610121476.XA CN201610121476A CN107170663A CN 107170663 A CN107170663 A CN 107170663A CN 201610121476 A CN201610121476 A CN 201610121476A CN 107170663 A CN107170663 A CN 107170663A
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- CN
- China
- Prior art keywords
- chip
- packaging body
- packaging
- casting
- rinsing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
Abstract
The invention discloses a kind of method that chip is taken out from packaging body, including：The seal cover board of packaging body is removed, the bottom of packaging body by bonding die glue on packaging frame, and packaging frame provided with chip is provided with, and seal cover board is arranged at the top of packaging body；Resin by injection and solidify into packaging body, plastic packaging is carried out to packaging body and casting is formed；Processing is ground to the bottom of the casting after plastic packaging, the packaging frame of package bottom is removed；The casting after grinding is heated in preset temperature range, takes chip；The chip to taking carries out taking out the chip after rinsing after strong acid rinsing, preset time.This method need not be heated to too high-temperature, and chip can be just taken out from packaging body；And the acid treatment time is shorter, pad will not be corroded, chip can be fully taken out, chip can also carry out secondary encapsulation.
Description
Technical field
The present invention relates to ic manufacturing technology field, in particular it relates to which a kind of take out core from packaging body
The method of piece.
Background technology
Chip is as the core component of product, and its performance and quality play most important to product final mass
Influence.Need to carry out accident analysis during chip design stage or use, after failure of chip, lead to
Permanent current journey is first progress electrical property failure analysis, then implements physical failure analysis according to initial analysis conclusion,
Need to destroy packaging body or chip during physical failure analysis, to observe position and the phenomenon of failure.
In development, in order to save cost, frequently with MPW (MPW, Multi Project Wafer)
Form carries out flow, and chip is just particularly precious less due to quantity, or under some specific failure conditions,
Need using being repaired to circuit and to chip progress secondary encapsulation, often through technological means by chip
Taken out from packaging body, and do not destroy aluminum pad, it is ensured that chip can carry out secondary encapsulation.
Generally carried out from the method for packaging body coring piece by heating or acid corrosion, chip gone into encapsulation first,
Chip is exposed with framework, then according to the different processing mode of bonding die material different choice.For
The encapsulation of bonding die is carried out using eutectic material or conducting resinl, usual method is that packaging body is put into warm table
On, (about 400 DEG C or so) make chip and framework apart at high temperature.For being carried out using Ag slurries
For the encapsulation of bonding die, usual method is by concentrated sulfuric acid ebuillition of heated, by packaging body quickly in boiling sulfuric acid
It is middle to be infiltrated, make the concentrated sulfuric acid and Ag starch react after bonding force rapid decrease so that chip is from frame
Depart from frame.
For the encapsulation of above-mentioned the first situation, i.e. eutectic material or conductive silver paste bonding die, generally will
Packaging body, which is put into the method handled on closed furnace, to be needed chip being heated to more than 380 DEG C, or even 400 DEG C,
Because degeneration occurs in chip at high temperature, although institute can ensure chip well-tended appearance in this way,
It is the risk that there is chip characteristics deterioration.
For second above-mentioned of situation, remove after seal cover board, chip is carried out using the boiling concentrated sulfuric acid
(according to circumstances, probably needing dozens of minutes) corrodes for a long time.The concentrated sulfuric acid need to be by during such a method is implemented
The purpose for reaching corrosion is penetrated into the gap for passing through slowly chip and ceramic bases of step, and the time is longer, and
The long time can cause aluminium PAD to corrode, it is impossible to carry out secondary binding.
The content of the invention
The present invention be in order to overcome prior art from packaging body take out chip when may damage the defect of chip,
According to an aspect of the present invention, a kind of method that chip is taken out from packaging body is proposed.
A kind of method that chip is taken out from packaging body provided in an embodiment of the present invention, including：
The seal cover board of packaging body is removed, the bottom of packaging body is provided with logical on packaging frame, and packaging frame
Bonding die glue is crossed provided with chip, seal cover board is arranged at the top of packaging body；
Resin by injection and solidify into packaging body, plastic packaging is carried out to packaging body and casting is formed；
Processing is ground to the bottom of the casting after plastic packaging, the packaging frame of package bottom is removed；
The casting after grinding is heated in preset temperature range, takes chip；
The chip to taking carries out taking out the chip after rinsing after strong acid rinsing, preset time.
In the above-mentioned technical solutions, the seal cover board of packaging body is removed, including：Removed and encapsulated using blade
The seal cover board of body.
In the above-mentioned technical solutions, resin is epoxy resin.
In the above-mentioned technical solutions, plastic packaging is being carried out to packaging body and formed after casting step, in addition to：
Vacuumize process is carried out to casting.
In the above-mentioned technical solutions, processing is ground to the bottom of the casting after plastic packaging, including：
Processing is ground to the bottom of the casting after plastic packaging using autogenous mill and/or diamond disk；
After the packaging frame of bottom of preset thickness is removed, fine grinding processing is carried out using diamond sand paper,
Until removing the packaging frame of package bottom completely.
In the above-mentioned technical solutions, the higher limit of preset temperature range is not more than 200 degrees Celsius.
In the above-mentioned technical solutions, the casting after grinding is heated in preset temperature range,
Including：
The casting after grinding is heated in preset temperature range using heat gun.
In the above-mentioned technical solutions, strong acid is the fuming nitric aicd of boiling, and the span of preset time is 5
- 60 seconds seconds.
In the above-mentioned technical solutions, the chip after rinsing is taken out, in addition to：After acetone cleaning and rinsing
Chip.
A kind of method that chip is taken out from packaging body provided in an embodiment of the present invention, by being molded, grinding,
Heat treatment, acid treatment this series of steps, it is not necessary to be heated to too high-temperature, can just be taken out from packaging body
Chip；And the acid treatment time is shorter, pad will not be corroded, treatment effect, can be fully than more consistent
Chip is taken out, chip can also carry out secondary encapsulation.Moreover, especially for large chip (such as larger than 10mm2)
For, this method advantageously, can be reduced effectively due in the excessive caused processing procedure of adhesive strength
The physical damage caused to chip.Meanwhile, the temperature heated using heat gun is relatively low, so as to alleviate core
The fire damage that piece is subject to；By grinding technics, shorten the processing time of acid treatment step, improve people
Security during member's processing, is prevented effectively from strong acid corrosion chip.The chip taken out by this method can expire
Sufficient secondary encapsulation requirement, effectively reduces damage of the handling process to chip.
Other features and advantages of the present invention will be illustrated in the following description, also, partly from froming the perspective of
Become apparent, or understood by implementing the present invention in bright book.The purpose of the present invention is excellent with other
Point can be by specifically noted structure in the specification, claims and accompanying drawing write come real
Now and obtain.
Below by drawings and examples, technical scheme is described in further detail.
Brief description of the drawings
Accompanying drawing is used for providing a further understanding of the present invention, and constitutes a part for specification, with
Embodiments of the invention are used to explain the present invention together, are not construed as limiting the invention.In accompanying drawing
In：
Fig. 1 is the method flow diagram in the embodiment of the present invention from packaging body taking-up chip；
Fig. 2 is the structural representation of single layer of chips in the embodiment of the present invention；
Fig. 3 is the schematic diagram after the seal cover board of single layer of chips removal packaging body in the embodiment of the present invention；
Fig. 4 is the schematic diagram after single layer of chips resin by injection in the embodiment of the present invention；
Fig. 5 removes the schematic diagram after bottom package framework for single layer of chips in the embodiment of the present invention；
Fig. 6 takes the schematic diagram of the chip for single layer of chips in the embodiment of the present invention；
Fig. 7 is the schematic diagram after single layer of chips strong acid rinsing in the embodiment of the present invention；
Fig. 8 is the structural representation of multilayer chiop in the embodiment of the present invention；
Fig. 9 is the schematic diagram after the seal cover board of multilayer chiop removal packaging body in the embodiment of the present invention；
Figure 10 is the schematic diagram after multilayer chiop resin by injection in the embodiment of the present invention；
Figure 11 removes the schematic diagram after bottom package framework for multilayer chiop in the embodiment of the present invention；
Figure 12 takes the schematic diagram of the chip for multilayer chiop in the embodiment of the present invention；
Figure 13 is the schematic diagram after multilayer chiop strong acid rinsing in the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawings, the embodiment to the present invention is described in detail, it is to be understood that this
The protection domain of invention is not limited by embodiment.
According to embodiments of the present invention there is provided a kind of method that chip is taken out from packaging body, Fig. 1 is the party
The flow chart of method, specifically includes step 101-105：
Step 101：The seal cover board of packaging body is removed, the bottom of packaging body is provided with packaging frame, and encapsulation
Chip is provided with by bonding die glue on framework, seal cover board is arranged at the top of packaging body.
In embodiments of the present invention, packaging body uses metal or ceramic package framework 10, and bonding die glue 20 is specific
Can be using silver paste, eutectic solder or conducting resinl etc..Referring specifically to shown in Fig. 2, packaging body uses metal
The pad 50 and packaging frame 10 of chip 40 are electrically connected by line 30 (Au/AI/Cu lines), are adopted
Body is packaged with the seal cover board 60 of metal or ceramics to seal.The packaging frame 10 of bottom, top
Seal cover board 60 and the framework complete seal of the surrounding packaging body.
Specifically, removing the seal cover board 60 of packaging body using blade, 23# can be used as the case may be
Knife blade is operated.The schematic diagram removed after the seal cover board of packaging body is shown in Figure 3.
Step 102：Resin by injection and solidify into packaging body, plastic packaging is carried out to packaging body and casting is formed.
In the embodiment of the present invention, after seal cover board is removed, you can so that into packaging body, resin by injection 70 is simultaneously
Solidify the resin 70, the resin 70 is preferably epoxy resin.Plastic packaging is carried out to packaging body by resin by injection
And form casting.Solidify post package body schematic diagram shown in Figure 4.
Meanwhile, vacuumize process also is carried out to casting after plastic packaging, so that casting is in high vacuum
Under environment, this is conducive to excluding the air in epoxy resin, and makes epoxy resin filling uniform.Afterwards,
Casting is solidified into certain time, about 8-12 hours.
Step 103：Processing is ground to the bottom of the casting after plastic packaging, the encapsulation of package bottom is removed
Framework.
Specifically, being ground using autogenous mill and/or diamond disk to the bottom of the casting after plastic packaging
Processing；(when such as will be close to silver paste), particle be utilized after the packaging frame of bottom of preset thickness is removed
The diamond sand paper that diameter is about 0.5um carries out fine grinding processing, until removing the envelope of package bottom completely
Frame up frame.The schematic diagram for removing bottom package framework is shown in Figure 5.Existing usual method according to from
Top is handled chip to the order of bottom treatment；And method provided in an embodiment of the present invention is to go
After closure, chip is protected by injection molding manner, then started with from base of frame, by going
Except under(-)chassis exposes chip.
Step 104：The casting after grinding is heated in preset temperature range, takes chip.
Specifically, the higher limit of preset temperature range is not more than 200 degrees Celsius.It can be existed using heat gun
The casting after grinding is heated in preset temperature range, ceramics and chip out of epoxy resin
Take out.Heating-up temperature (about 380 DEG C even 400 DEG C of the temperature of heat gun heating compared to common process
More than) much lower, only about 150 DEG C or so, the time only needs 10~15 seconds.Fig. 6 schematically shows
Go out to take the chip.
For flush system multi-chip package, the framework base material for being generally used for placing multiple chips is in same height
Degree, can once be cut out by this method.But for the lead frame of particular design, chip placement
Framework base material highly there may be difference, then need to continue repeat step 104, step after segment chip is taken out
Rapid 105, until all chips are taken out one by one., can be by multiple bondings for folded envelope formula multi-chip package
Chip together disposably takes out.
Step 105：The chip to taking carries out taking out the chip after rinsing after strong acid rinsing, preset time.
Floated about 30 seconds specifically, the chip that will be taken and be put into the fuming nitric aicd of boiling, removal is not ground
Clean silver paste and resin, and clean up chip using acetone.In this step, with boiling fuming nitric aicd
Processing time it is very short, pad 50 can be avoided to be corroded.Fig. 7 shows the schematic diagram for the chip that processing is completed.
A kind of method that chip is taken out from packaging body provided in an embodiment of the present invention, by being molded, grinding,
Heat treatment, acid treatment this series of steps, it is not necessary to be heated to too high-temperature, can just be taken out from packaging body
Chip；And the acid treatment time is shorter, pad will not be corroded, treatment effect, can be fully than more consistent
Chip is taken out, chip can also carry out secondary encapsulation.Moreover, especially for large chip (such as larger than 10mm2)
For, this method advantageously, can be reduced effectively due in the excessive caused processing procedure of adhesive strength
The physical damage caused to chip.Meanwhile, the temperature heated using heat gun is relatively low, so as to alleviate core
The fire damage that piece is subject to；By grinding technics, shorten the processing time of acid treatment step, improve people
Security during member's processing, is prevented effectively from strong acid corrosion chip.The chip taken out by this method can expire
Sufficient secondary encapsulation requirement, effectively reduces damage of the handling process to chip.
Method provided in an embodiment of the present invention is also applied for laminated type multichip packaging structure, detailed process with
Single layer of chips is similar, and treatment effect is referring to Fig. 8-13.
The present invention can have a variety of various forms of embodiments, be combined above by taking Fig. 1-Figure 13 as an example attached
Figure is to technical scheme explanation for example, and this is not meant to the instantiation that the present invention is applied
Can only be confined in specific flow or example structure, one of ordinary skill in the art it is to be appreciated that
Specific embodiment presented above is some examples in a variety of its preferred usages, any this hair of embodiment
The embodiment of bright claim all should be within the scope of technical solution of the present invention be claimed.
Finally it should be noted that：The preferred embodiments of the present invention are the foregoing is only, limit is not used to
The system present invention, although the present invention is described in detail with reference to the foregoing embodiments, for this area
For technical staff, it can still modify to the technical scheme described in foregoing embodiments,
Or equivalent substitution is carried out to which part technical characteristic.Within the spirit and principles of the invention,
Any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection.
Claims (9)
1. a kind of method that chip is taken out from packaging body, it is characterised in that including：
The seal cover board of packaging body is removed, the bottom of the packaging body is provided with packaging frame, and the encapsulation
Chip is provided with by bonding die glue on framework, the seal cover board is arranged at the top of the packaging body；
Resin by injection and solidify into the packaging body, plastic packaging is carried out to the packaging body and casting is formed；
Processing is ground to the bottom of the casting after plastic packaging, the encapsulation of the package bottom is removed
Framework；
The casting after grinding is heated in preset temperature range, takes the chip；
The chip to taking carries out taking out the chip after rinsing after strong acid rinsing, preset time.
2. according to the method described in claim 1, it is characterised in that the closure for removing packaging body
Plate, including：
The seal cover board of packaging body is removed using blade.
3. according to the method described in claim 1, it is characterised in that the resin is epoxy resin.
4. according to the method described in claim 1, it is characterised in that the packaging body is carried out described
Plastic packaging is simultaneously formed after casting step, in addition to：
Vacuumize process is carried out to the casting.
5. according to the method described in claim 1, it is characterised in that the casting to after plastic packaging
Bottom be ground processing, including：
Place is ground to the bottom of the casting after plastic packaging using autogenous mill and/or diamond disk
Reason；
After the packaging frame of bottom of preset thickness is removed, fine grinding processing is carried out using diamond sand paper,
Until removing the packaging frame of the package bottom completely.
6. according to the method described in claim 1, it is characterised in that the upper limit of the preset temperature range
Value is not more than 200 degrees Celsius.
7. method according to claim 6, it is characterised in that described right in preset temperature range
Casting after grinding is heated, including：
The casting after grinding is heated in preset temperature range using heat gun.
8. according to the method described in claim 1, it is characterised in that the strong acid is the smoke nitre of boiling
Acid, the span of the preset time is -60 seconds 5 seconds.
9. method according to claim 8, it is characterised in that the chip after the taking-up rinsing,
Also include：
Utilize the chip after acetone cleaning and rinsing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610121476.XA CN107170663A (en) | 2016-03-03 | 2016-03-03 | A kind of method that chip is taken out from packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610121476.XA CN107170663A (en) | 2016-03-03 | 2016-03-03 | A kind of method that chip is taken out from packaging body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107170663A true CN107170663A (en) | 2017-09-15 |
Family
ID=59848470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610121476.XA Pending CN107170663A (en) | 2016-03-03 | 2016-03-03 | A kind of method that chip is taken out from packaging body |
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| Country | Link |
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| CN (1) | CN107170663A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108090250A (en) * | 2017-11-24 | 2018-05-29 | 温州大学 | A kind of method and system for assessing integrated antenna package thermal damage |
| CN112735981A (en) * | 2020-12-29 | 2021-04-30 | 北京振兴计量测试研究所 | Unsealing method of metal ceramic packaged crystal oscillator for chip injection molding packaging |
| CN114927408A (en) * | 2022-05-19 | 2022-08-19 | 深圳市东方聚成科技有限公司 | Nondestructive chip separation and packaging test recycling method for electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104008956A (en) * | 2014-06-06 | 2014-08-27 | 航天科工防御技术研究试验中心 | Unsealing method for flip chip device |
| CN104599997A (en) * | 2015-01-30 | 2015-05-06 | 工业和信息化部电子第五研究所 | Unpacking method of plastic-packed metal wire bonding device |
| CN104810240A (en) * | 2014-01-23 | 2015-07-29 | 北大方正集团有限公司 | De-encapsulation method of TO-type encapsulation device |
-
2016
- 2016-03-03 CN CN201610121476.XA patent/CN107170663A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810240A (en) * | 2014-01-23 | 2015-07-29 | 北大方正集团有限公司 | De-encapsulation method of TO-type encapsulation device |
| CN104008956A (en) * | 2014-06-06 | 2014-08-27 | 航天科工防御技术研究试验中心 | Unsealing method for flip chip device |
| CN104599997A (en) * | 2015-01-30 | 2015-05-06 | 工业和信息化部电子第五研究所 | Unpacking method of plastic-packed metal wire bonding device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108090250A (en) * | 2017-11-24 | 2018-05-29 | 温州大学 | A kind of method and system for assessing integrated antenna package thermal damage |
| CN108090250B (en) * | 2017-11-24 | 2021-04-27 | 温州大学 | Method and system for evaluating heat damage of integrated circuit package |
| CN112735981A (en) * | 2020-12-29 | 2021-04-30 | 北京振兴计量测试研究所 | Unsealing method of metal ceramic packaged crystal oscillator for chip injection molding packaging |
| CN114927408A (en) * | 2022-05-19 | 2022-08-19 | 深圳市东方聚成科技有限公司 | Nondestructive chip separation and packaging test recycling method for electronic device |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170915 |
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| RJ01 | Rejection of invention patent application after publication |