CN107155039A - Imaging modules and electronic installation - Google Patents
Imaging modules and electronic installation Download PDFInfo
- Publication number
- CN107155039A CN107155039A CN201610120830.7A CN201610120830A CN107155039A CN 107155039 A CN107155039 A CN 107155039A CN 201610120830 A CN201610120830 A CN 201610120830A CN 107155039 A CN107155039 A CN 107155039A
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- China
- Prior art keywords
- imaging modules
- dispensing hole
- modules
- cover body
- camera
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- 238000003384 imaging method Methods 0.000 title claims abstract description 84
- 238000009434 installation Methods 0.000 title claims abstract description 52
- 239000000084 colloidal system Substances 0.000 claims abstract description 33
- 239000003292 glue Substances 0.000 claims abstract description 15
- 238000007639 printing Methods 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims 1
- 229920000297 Rayon Polymers 0.000 abstract description 10
- 230000003287 optical effect Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention discloses a kind of imaging modules and electronic installation, imaging modules include:Flexible PCB, flexible PCB includes module installation portion and connects the connector installation portion of module installation portion;At least two camera modules, at least two camera modules are arranged on module installation portion, and the first gap, the focal length all same of at least two camera modules are formed between at least two camera modules;Cover body, cover body is located at least two camera modules, and the second gap is formed between cover body and camera module, and cover body offers spaced first dispensing hole and the second dispensing hole, and the first dispensing hole corresponds to the first gap, the second dispensing hole the second gap of correspondence;The colloid in the first gap and the second gap is arranged on, colloid connects at least two camera modules and cover body.In above-mentioned imaging modules, so that viscose glue can fill gap, and then at least two camera modules will can be securely fixed in viscose glue o'clock to the first dispensing hole and the second dispensing hole on cover body.
Description
Technical field
The present invention relates to camera technology field, more particularly to a kind of imaging modules and a kind of electronic installation.
Background technology
As people improve to the quality requirement of shooting image, dual camera shooting technology arises at the historic moment.For
Ensure quality of taking pictures, the optical axises of two camera modules of dual camera module be arranged in parallel.Meanwhile, it is
Strengthen the intensity of dual camera module and when dual camera module falls, prevent the optical axis of camera module
Shift, two camera modules are typically fixed together by cover body.Therefore, how to utilize cover body will
Two camera modules are rigidly secured together as urgent problem to be solved.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art.Therefore, the present invention is carried
For a kind of imaging modules and a kind of electronic installation.
The imaging modules of embodiment of the present invention, including:Flexible PCB, the flexible PCB includes
The connector installation portion of module installation portion and the connection module installation portion;At least two camera modules, institute
State at least two camera modules to be arranged on the module installation portion, between at least two camera module
It is formed with the first gap, the focal length all same of at least two camera module;Cover body, the cover body cover
It is located at least two camera module, is formed between the cover body and at least camera module
Two gaps, the cover body offers spaced first dispensing hole and the second dispensing hole, at described first point
Glue hole corresponds to first gap, the second dispensing hole correspondence second gap;It is arranged on described
Colloid in first gap and second gap, the colloid connect at least two camera module and
The cover body..
In the imaging modules of embodiment of the present invention, the first dispensing hole corresponds to the first gap, the second dispensing
Hole corresponds to the second interval so that imaging modules in an assembling process, can be by viscose glue o'clock to the first dispensing
So that viscose glue can fill gap in hole and the second dispensing hole, so at least two camera modules are solid securely
Be scheduled on cover body, meanwhile, at least two camera modules of focal length all same can also reduce imaging modules into
This.
In some embodiments, the flexible PCB includes connecting portion, and the connecting portion connection is described
Module installation portion and the connector installation portion.
In some embodiments, the first dispensing hole is in strip.
In some embodiments, the width in the first dispensing hole is 0.5 ± 0.1mm, described first
The length in dispensing hole is more than or equal to 1.5mm.
In some embodiments, the width in the first dispensing hole is 0.5 ± 0.1mm, described first
The length in dispensing hole is 8.4 ± 0.1mm.
In some embodiments, the width in the first dispensing hole is 0.5mm, the first dispensing hole
Length be 8.4mm.
In some embodiments, the first dispensing hole is more than to the distance of the long side wall of the cover body
0.45mm。
In some embodiments, the first dispensing hole includes elongate aperture and is connected to the strip
Two stomidiums at the two ends in hole, the size of width of the stomidium along the elongate aperture is more than described
The width of elongate aperture;The elongate aperture corresponds to two side walls of two camera modules;Each
The stomidium corresponds to two corner locations of two camera modules.
In some embodiments, the width of the elongate aperture is 0.5 ± 0.1mm, the strip
The length in hole is more than or equal to 1.5mm.
In some embodiments, the width of the elongate aperture is 0.5 ± 0.1mm, the strip
The length in hole is 8.4 ± 0.1mm.
In some embodiments, the width of the elongate aperture is 0.5mm, the length of the elongate aperture
Spend for 8.4mm.
In some embodiments, the distance of the elongate aperture to the long side wall of the cover body is more than
0.45mm。
In some embodiments, the stomidium triangular shape.
In some embodiments, the second dispensing hole includes multiple cylindrical bores, the multiple cylinder
Shape hole is distributed in the different set position of the cover body.
In some embodiments, the aperture of the cylindrical bore is 1 ± 0.1mm.
In some embodiments, the aperture of the cylindrical bore is 1mm.
In some embodiments, the cover body include around at least two camera module framework and
The top cover being connected with the framework, the top cover is consolidated by the colloid and at least two camera module
Fixed connection.
In some embodiments, the first dispensing hole is single dispensing hole, the second dispensing hole bag
Four cylindrical bores are included, four cylindrical bores are respectively distributed to four corner locations of the top cover.
In some embodiments, the imaging modules include printed circuit board (PCB), each camera module
The imaging sensor being electrically connected with the printed circuit board and with the printed circuit board (PCB) including setting,
The printed circuit board (PCB) is arranged on the module installation portion and is electrically connected with the module installation portion, institute
Imaging modules are stated including electric connection pad, the electric connection pad be arranged on the module installation portion with it is described
Between printed circuit board (PCB) and it is electrically connected with the module installation portion and the printed circuit board (PCB).
The electronic installation of embodiment of the present invention, including the as above imaging modules described in any embodiment.
In above-mentioned electronic installation, the first dispensing hole corresponds to the first gap, and the second dispensing hole corresponds to second
Interval so that imaging modules in an assembling process, can be by viscose glue o'clock to the first dispensing hole and the second dispensing
So that viscose glue can fill gap in hole, and then at least two camera modules are securely fixed on cover body,
Meanwhile, at least two camera modules of focal length all same can also reduce the cost of imaging modules.
The additional aspect and advantage of the present invention will be set forth in part in the description, partly by from following
Become obvious in description, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is retouched from reference to accompanying drawings below to embodiment
It will be apparent and be readily appreciated that in stating, wherein:
Fig. 1 is the schematic perspective view of the imaging modules of embodiment of the present invention.
Fig. 2 is the decomposed schematic diagram of the imaging modules of embodiment of the present invention.
Fig. 3 is the floor map of the imaging modules of embodiment of the present invention.
Fig. 4 is another schematic perspective view of the imaging modules of embodiment of the present invention.
Fig. 5 is the decomposing schematic representation of the imaging modules of embodiment of the present invention.
Fig. 6 is the diagrammatic cross-section of the imaging modules of embodiment of the present invention.
Fig. 7 is the enlarged diagram of the VII parts of the imaging modules in Fig. 6.
Fig. 8 is the enlarged diagram of the VIII parts of the imaging modules in Fig. 6.
Fig. 9 is the floor map of the cover body of the imaging modules of embodiment of the present invention.
Figure 10 is the schematic perspective view of the cover body of the imaging modules of embodiment of the present invention.
Figure 11 is another floor map of the cover body of the imaging modules of embodiment of the present invention.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings,
Wherein same or similar label represents same or similar element or with same or like from beginning to end
The element of function.The embodiment described below with reference to accompanying drawing is exemplary, is only used for explaining this
Invention, and be not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length
Degree ", " width ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " water
It is flat ", " top ", " bottom ", " interior ", " outer ", " clockwise ", the orientation or position pass of the instruction such as " counterclockwise "
It is to be retouched based on orientation shown in the drawings or position relationship, to be for only for ease of the description present invention and simplification
State, rather than indicate or imply that the device or element of meaning there must be specific orientation, with specific side
Position construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " the
Two " are only used for describing purpose, and it is not intended that indicating or implying relative importance or implicit indicate institute
The quantity of the technical characteristic of instruction.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more feature.In the description of the invention, " multiple " are meant that
Two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term
" installation ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or
It is detachably connected, or is integrally connected;Can be mechanical connection or electrical connection or can be mutual
Communication;Can be joined directly together, can also be indirectly connected to by intermediary, can be in two elements
The connection in portion or the interaction relationship of two elements.For the ordinary skill in the art, may be used
To understand the concrete meaning of above-mentioned term in the present invention as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on "
Or it " under " can directly be contacted including the first and second features, the first and second features can also be included
It is not direct contact but by the other characterisation contact between them.Moreover, fisrt feature is second
Feature " on ", " top " and it is " above " include fisrt feature directly over the second feature and tiltedly on
Side, or fisrt feature level height is merely representative of higher than second feature.Fisrt feature is in second feature " it
Under ", " lower section " and " following " fisrt feature that includes directly over second feature and oblique upper, or only
Only represent that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the difference of the present invention
Structure.In order to simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.
Certainly, they are only merely illustrative, and purpose does not lie in the limitation present invention.In addition, the present invention can be
Repeat reference numerals and/or reference letter in different examples, this repetition are for simplified and clear mesh
, the relation between discussed various embodiments itself are not indicated and/or are set.In addition, this hair
The example of the bright various specific techniques provided and material, but those of ordinary skill in the art can anticipate
Know the application of other techniques and/or the use of other materials.
It please join Fig. 1, Fig. 2 and Fig. 3, the imaging modules 100 of embodiment of the present invention include flexible circuit
Plate 10, at least two camera modules 20, cover body 30 and colloid 40.
Flexible PCB 10 includes module installation portion 12 and the connector of connection module installation portion 12 is installed
Portion 14.
At least two camera modules 20 are arranged on module installation portion 12, at least two camera modules 20
Between be formed with the first gap 50, the focal length all same of at least two camera modules 10.
Cover body 30 is located at least two camera modules 20, shape between cover body 30 and camera module 20
Into there is the second gap 51, cover body 30 offers the spaced dispensing hole of first dispensing hole 32 and second
33, the first dispensing hole 32 corresponds to the first gap 50, the second dispensing hole 33 the second gap 51 of correspondence.
Colloid 40 is arranged in the first gap 50 and the second gap 51, and the connection of colloid 40 at least two is taken the photograph
As module 20 and cover body 30.
Therefore, in the imaging modules 100 of embodiment of the present invention, the first dispensing hole 32 corresponds to first
Gap 50, the second dispensing hole 33 corresponds to the second interval 51 so that imaging modules 100 are in assembling process
In, can by viscose glue o'clock to the first dispensing hole 32 and the second dispensing hole 33 so that viscose glue can fill gap,
And then at least two camera modules 20 are securely fixed on cover body 30, meanwhile, focal length all same
At least two camera modules 20 can also reduce the cost of imaging modules 100.
Further, two camera modules 10 are arranged on same module installation portion 12, module installation portion
12 need not be manufactured into smaller size, and then reduce the manufacturing cost of module installation portion 12.
Specifically, in present embodiment, the quantity of camera module 20 is two.
In one example, when imaging modules 100 are assembled, first by two 20 points of camera modules
It is not fixed on module installation portion 12, then robotic arm grips one of camera module 20,
The position of another camera module 20 is adjusted so that the optical axis of two camera modules 20 by manipulator afterwards
It is parallel, and two camera modules 20 are towards the same side.
Further, Fig. 1 and Fig. 5 please be join, in the present embodiment, flexible PCB includes connecting portion
16, connecting portion 16 connects module installation portion 12 and connector installation portion 14.Therefore, module installation portion
12nd, connector installation portion 14 and connecting portion 16 form overall single structure, reduce flexible PCB
10 manufacturing cost.
In present embodiment, Fig. 9 please be join, the first dispensing hole 32 is single dispensing hole, and it includes strip
Shape hole 34 and be connected to elongate aperture 34 two ends two stomidiums 36, stomidium 36 is along elongate aperture 34
Width size be more than elongate aperture 34 width.
Incorporated by reference to Fig. 3, elongate aperture 34 corresponds to two side walls of two camera modules 20.Each end
Hole 36 corresponds to two corner locations 20a, 20b of two camera modules 20.
Therefore, on the one hand, colloid 40 is entered in the middle of two camera modules 20 by elongate aperture 34
Between gap, make colloid 40 connect two camera modules 30 center side wall and cover body 30;It is another
Aspect, colloid 40 entered by two stomidiums 36 two camera modules 20 two corner location 20a,
Gap between 20b and cover body 30, make colloid 40 connect two camera modules 20 corner side wall and
Cover body 30.In this way, improving the connection that two camera modules 20 are fixed on cover body 30 by colloid 40
Intensity.
Meanwhile, the size of width of the stomidium 36 along elongate aperture 34 is more than the width of elongate aperture 34
Degree so that two camera modules 20 are in corner location 20a, 20b and the colloid of the formation T-shaped of cover body 30
Connecting portion, further improves the bonding strength of two camera modules 20 and cover body 30.
In present embodiment, Fig. 9 please be join, the width W of elongate aperture 34 is 0.5 ± 0.1mm, preferably
For 0.5mm.
When the width of elongate aperture 34 is less than range above, this is not easy dispensing and easy excessive glue;When
When the width of elongate aperture 34 is more than range above, this can cause the intensity of cover body 30 relatively low;Work as strip
When the width in shape hole 34 is 0.5mm, colloid 40 is easily advanced into the first dispensing hole 32.
The length L of elongate aperture 34 is 8.4 ± 0.1mm, preferably 8.4mm.
When the length of elongate aperture 34 is less than range above, this is not easy dispensing and easy excessive glue;When
When the length of elongate aperture 34 is more than range above, this can cause the intensity of cover body 30 relatively low;Work as strip
When the length in shape hole 34 is 8.4mm, colloid 40 is not easy to overflow outside the first dispensing hole 32.
In some embodiments, the width W of elongate aperture 34 is 0.5 ± 0.1mm, elongate aperture
34 length L is more than or equal to 1.5mm.
In the present embodiment, Fig. 9, the distance of the long side wall of elongate aperture 34 to cover body 30 please be join
H is more than 0.45mm.
In present embodiment, the triangular shape of stomidium 36.The stomidium 36 of triangular shape is advantageously formed
The colloid 40 of respective shapes so that the connection of two camera modules 20 and cover body 30 is more firm.
In some embodiments, Figure 11 please be join, the first dispensing hole 130 is in strip.Further,
The width W1 in the first dispensing hole 130 is the dispensing hole 130 of 0.5 ± 0.1mm, preferably 0.5mm, first
Length L1 be 8.4 ± 0.1mm, preferably 8.4mm.
In some embodiments, the width W1 in the first dispensing hole 130 is 0.5 ± 0.1mm, first
The length L1 in dispensing hole is more than or equal to 1.5mm.
In some embodiments, Figure 11 please be join, the long side wall in the first dispensing hole 130 to cover body
It is more than 0.45mm apart from H1.
In the present embodiment, the second dispensing hole 33 includes multiple cylindrical bores 37, multiple cylindrical bores
37 are distributed in the different set position of cover body 30.
Specifically, incorporated by reference to Fig. 5 and Figure 10, in the present embodiment, cover body 30 is substantially in cuboid
Shape.Cover body 30 includes the framework 38 and the top cover that is connected with framework 38 around two camera modules 20
39, top cover 39 is fixedly connected by colloid 40 with two camera modules 20.
The quantity of cylindrical bore 37 is four, and four cylindrical bores 37 are respectively distributed to the four of top cover 39
Individual corner location.So the distribution of colloid 40 can be made more reasonable, improve the connection shooting mould of colloid 40
Group 20 and the bonding strength of cover body 30.
In addition, top cover 39 offers two light holes 391, two camera modules 20 pass through two respectively
Light hole 391 exposes.
It should be noted that in present embodiment, two equal cylindrical forms of light hole 391.At other
In embodiment, depending on the shape of two light holes can be distinguished specifically.Therefore, the thang-kng of present embodiment
The shape in hole is not considered as limiting the invention.
In present embodiment, the aperture of cylindrical bore 37 is 1 ± 0.1mm, preferably, cylindrical bore
37 aperture is 1mm.
When the aperture of cylindrical bore 37 is less than range above, this is not easy dispensing and easy excessive glue;When
When the aperture of cylindrical bore 37 is more than range above, this can cause the intensity of cover body 30 relatively low;Work as cylinder
When the aperture in shape hole 37 is 1mm, colloid 40 is not easy to overflow outside cylindrical bore 37 and be easily accessible circle
In cylinder hole 37.
It please join in Fig. 8, present embodiment, the second gap 51 includes side clearance 53 and top gap 55, side
Gap 53 is formed between the inner surface of framework 38 and the lateral surface of camera module 20, pushes up gap 55
Formed between the inner surface of top cover 39 and the outer top surface of camera module 20.The connection of side clearance 53 top
Gap 55 simultaneously connects the second dispensing hole 33 jointly, is, for example, directly to connect the second dispensing hole 33.
Therefore, when colloid 40 enters the second interval 51 from the second dispensing hole 33, a part of colloid 40
Flow into side clearance 53, another part colloid 40 flows into top gap 55 so that colloid 40 is from different azimuth
Camera module 20 is bonded in cover body 30.After colloid 40 solidifies, colloid 40 is by camera module
20 are securely fixed in cover body 30.
Fig. 5, Fig. 6 and Fig. 7 are referred to, in the present embodiment, imaging modules 100 include printing electricity
Road plate 21 (Printed Circuit Board, PCB), each camera module 20 includes imaging sensor 22.
The sensing face of two imaging sensors 22 is towards the same side.Printed circuit board (PCB) 21 is arranged on module installation portion
It is electrically connected with 12 and with module installation portion 12.Imaging sensor 22 is arranged on printed circuit board (PCB) 21
And be electrically connected with printed circuit board (PCB) 21.In the present embodiment, two camera modules 20 share one
Printed circuit board (PCB) 21.
In this way, imaging sensor 22 can obtain the image of object, and image is passed through into printed circuit board (PCB) 21
And flexible PCB 10 reaches external device (ED).
Specifically, imaging sensor 22 can use complementary metal oxide semiconductor (Complementary
Metal Oxide Semiconductor, CMOS) CIS or charge coupled cell
(Charge-coupled Device, CCD) CIS.
In present embodiment, Fig. 7 please be join, imaging modules 100 include electric connection pad 52, are electrically connected with
Pad 52 is arranged between module installation portion 12 and printed circuit board (PCB) 21 and is electrically connected with module installation portion 12
With printed circuit board (PCB) 21.
It is electrically connected with this way, electric connection pad 52 is realized between flexible PCB 10 and camera module 20
And communication.For example, electric connection pad 52 can use conducting resinl.
Incorporated by reference to Fig. 5, in present embodiment, camera module 20 includes being arranged on printed circuit board (PCB) 21
And positioned at the camera lens module 23 of the top of imaging sensor 22.
In this way, camera lens module 23 can make imaging sensor 22 obtain quality preferably image, so as to carry
The shooting quality of high imaging modules 100.
In present embodiment, camera lens module 23 includes camera lens 231 and voice coil motor 232, voice coil motor
232 include housing 2321, and camera lens 231 is arranged in housing 2321, and the first gap 50 is formed at two
Between two housings 2321 of camera module, the second gap is formed at two between housing and cover body.
Voice coil motor 232 can drive optical axis direction of the camera lens 231 along camera lens 231 to move to adjust camera lens
The distance between 231 and imaging sensor 22, and then the auto-focusing of imaging modules 100 is realized, make
Imaging modules 100 obtain quality preferably image.Further, camera lens 231 and imaging sensor 22
Between be provided with optical filter 24.Optical filter 24 can filter the light of predeterminated frequency so that image sensing
Device 22 is according to the light formation preferably image after filtering.
It is preferred that optical filter 24 is cutoff filter.In this way, cutoff filter 24 can be with
Filter infrared ray, it is to avoid the image fault of imaging sensor 22.Light sequentially pass through light hole 391,
Imaging sensor 22 is reached after camera lens 231 and optical filter 24, imaging sensor 22 is so as to collecting
External image.
Specifically, camera lens module 23 also includes pedestal 233, and pedestal 233 opens up fluted 2331, recessed
The bottom surface of groove 2331 offers through hole 2332.Optical filter 24 is arranged in groove 2331 and is supported on recessed
On the bottom surface of groove 2331, the light filtered by optical filter 24 can reach image by through hole 2332
Sensor 22.
Housing 2321 can be connected on pedestal 233 by the first cushion rubber 54.Pedestal 233 can pass through second
Cushion rubber 56 is connected on printed circuit board (PCB) 21.
Take for convenience optical filter 24, link slot 2333, link slot 2333 are offered on pedestal 233
Communication groove 2331.
In present embodiment, Fig. 4 please be join, imaging modules 100 include connector 58, and connector 58 is set
Put on connector installation portion 14 and be electrically connected with connector installation portion 14.
In this way, imaging modules 100 can be quickly installed on electronic equipment by connector 58.
In present embodiment, it is preferred that the light shaft coaxle of light hole 391 and camera lens 231 is set.
Further, imaging modules 100 also include reinforcing plate 60, and two module installation portions 12 are fixed on
In reinforcing plate 60.
In this way, reinforcing plate 60 can further fix the position of two camera modules 20, imaging modules are improved
The ability of 100 anti-collision, and then improve shooting quality.
In present embodiment, imaging modules 100 also include anti electromagnetic wave disruption member 70, and reinforcing plate 60 is set
Put in anti electromagnetic wave disruption member 70.Anti electromagnetic wave disruption member 70 can prevent imaging modules 100 by electricity
The interference of magnetic wave, it is ensured that imaging modules 100 obtain quality preferably image.Anti electromagnetic wave disruption member 70
It can be for example made of metal material.
It should be noted that above-mentioned Fig. 3, Fig. 5 and Fig. 6 do not show colloid 40 to clearly show that
Relation between other elements.But, those skilled in the art can pass through Fig. 1 and Fig. 2 and corresponding text
Word description, is well understood position of the colloid 40 in Fig. 3, Fig. 5 and Fig. 6.In addition, Fig. 2
Part colloid 40 is eliminated, for example, eliminating the colloid 40 in the second dispensing hole 33.
The electronic installation of embodiment of the present invention includes the imaging modules of any of the above-described embodiment.Electronics is filled
Put e.g. mobile phone, tablet personal computer etc..
Therefore, in an electronic, the first dispensing hole corresponds to the first gap, and the second dispensing hole corresponds to
Second interval so that imaging modules in an assembling process, can be by viscose glue o'clock to the first dispensing hole and second
So that viscose glue can fill gap in dispensing hole, and then at least two camera modules are securely fixed in cover body
On, meanwhile, at least two camera modules of focal length all same can also reduce the cost of imaging modules.
In the description of this specification, reference term " embodiment ", " some embodiments ", " show
The description of meaning property embodiment ", " example ", " specific example " or " some examples " etc. means to combine institute
Specific features, structure, material or the feature for stating embodiment or example description are contained in the present invention extremely
In few an embodiment or example.In this manual, to the schematic representation of above-mentioned term not necessarily
Refer to identical embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can in an appropriate manner be combined in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, one of ordinary skill in the art can be with
Understand:These embodiments can be carried out in the case where not departing from the principle and objective of the present invention a variety of
Change, modification, replacement and modification, the scope of the present invention is limited by claim and its equivalent.
Claims (21)
1. a kind of imaging modules, it is characterised in that including:
Flexible PCB, the flexible PCB includes module installation portion and connects the module installation portion
Connector installation portion;
At least two camera modules, at least two camera module is arranged on the module installation portion,
The first gap, the focal length of at least two camera module are formed between at least two camera module
All same;
Cover body, the cover body is located at least two camera module, the cover body with it is described at least
The second gap is formed between camera module, the cover body offers spaced first dispensing hole and
Two dispensing holes, the first dispensing hole corresponds to first gap, and the second dispensing hole correspondence is described
Second gap;
It is arranged on the colloid in first gap and second gap, described in the colloid connection at least
Two camera modules and the cover body.
2. imaging modules as claimed in claim 1, it is characterised in that the quantity of the camera module
For two.
3. imaging modules as claimed in claim 1, it is characterised in that the flexible PCB includes
Connecting portion, the connecting portion connects the module installation portion and the connector installation portion.
4. imaging modules as claimed in claim 1, it is characterised in that the first dispensing hole is in length
Strip.
5. imaging modules as claimed in claim 4, it is characterised in that the width in the first dispensing hole
Spend for 0.5 ± 0.1mm, the length in the first dispensing hole is more than or equal to 1.5mm.
6. imaging modules as claimed in claim 4, it is characterised in that the width in the first dispensing hole
Spend for 0.5 ± 0.1mm, the length in the first dispensing hole is 8.4 ± 0.1mm.
7. imaging modules as claimed in claim 4, it is characterised in that the width in the first dispensing hole
Spend for 0.5mm, the length in the first dispensing hole is 8.4mm.
8. imaging modules as claimed in claim 1, it is characterised in that the first dispensing hole to institute
The distance for stating the long side wall of cover body is more than 0.45mm.
9. imaging modules as claimed in claim 2, it is characterised in that the first dispensing hole includes
Elongate aperture and be connected to the elongate aperture two ends two stomidiums, the stomidium is along the strip
The size of the width in hole is more than the width of the elongate aperture;
The elongate aperture corresponds to two side walls of two camera modules;
Each stomidium corresponds to two corner locations of two camera modules.
10. imaging modules as claimed in claim 9, it is characterised in that the width of the elongate aperture
For 0.5 ± 0.1mm, the length of the elongate aperture is more than or equal to 1.5mm.
11. imaging modules as claimed in claim 9, it is characterised in that the width of the elongate aperture
For 0.5 ± 0.1mm, the length of the elongate aperture is 8.4 ± 0.1mm.
12. imaging modules as claimed in claim 9, it is characterised in that the width of the elongate aperture
For 0.5mm, the length of the elongate aperture is 8.4mm.
13. imaging modules as claimed in claim 9, it is characterised in that the elongate aperture is described in
The distance of the long side wall of cover body is more than 0.45mm.
14. imaging modules as claimed in claim 9, it is characterised in that the stomidium triangular shape.
15. imaging modules as claimed in claim 1, it is characterised in that the second dispensing hole includes
Multiple cylindrical bores, the multiple cylindrical bore is distributed in the different set position of the cover body.
16. imaging modules as claimed in claim 15, it is characterised in that the hole of the cylindrical bore
Footpath is 1 ± 0.1mm.
17. imaging modules as claimed in claim 15, it is characterised in that the hole of the cylindrical bore
Footpath is 1mm.
18. imaging modules as claimed in claim 1, it is characterised in that the cover body includes surrounding institute
The top cover stated the framework of at least two camera modules and be connected with the framework, the top cover passes through the glue
Body is fixedly connected with least two camera module.
19. imaging modules as claimed in claim 18, it is characterised in that the first dispensing hole is
Single dispensing hole, the second dispensing hole includes four cylindrical bores, and four cylindrical bores are divided respectively
Four corner locations of the cloth in the top cover.
20. imaging modules as claimed in claim 1, it is characterised in that the imaging modules include print
Printed circuit board, each camera module includes setting on the printed circuit board and electric with the printing
The imaging sensor that road plate is electrically connected with, the printed circuit board (PCB) be arranged on the module installation portion and with
The module installation portion is electrically connected with, and the imaging modules include electric connection pad, the electric connection pad
It is arranged between the module installation portion and the printed circuit board (PCB) and is electrically connected with the module installation portion
With the printed circuit board (PCB).
21. a kind of electronic installation, it is characterised in that including as described in claim any one of 1-20
Imaging modules.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610120830.7A CN107155039A (en) | 2016-03-03 | 2016-03-03 | Imaging modules and electronic installation |
PCT/CN2016/090053 WO2017148072A1 (en) | 2016-03-03 | 2016-07-14 | Imaging module and electronic device |
PCT/CN2016/090054 WO2017148073A1 (en) | 2016-03-03 | 2016-07-14 | Imaging module and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610120830.7A CN107155039A (en) | 2016-03-03 | 2016-03-03 | Imaging modules and electronic installation |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107155039A true CN107155039A (en) | 2017-09-12 |
Family
ID=59791663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610120830.7A Withdrawn CN107155039A (en) | 2016-03-03 | 2016-03-03 | Imaging modules and electronic installation |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107155039A (en) |
-
2016
- 2016-03-03 CN CN201610120830.7A patent/CN107155039A/en not_active Withdrawn
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Application publication date: 20170912 |