CN107153592A - Electronic installation and its power management method - Google Patents
Electronic installation and its power management method Download PDFInfo
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- CN107153592A CN107153592A CN201610114862.6A CN201610114862A CN107153592A CN 107153592 A CN107153592 A CN 107153592A CN 201610114862 A CN201610114862 A CN 201610114862A CN 107153592 A CN107153592 A CN 107153592A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R21/00—Arrangements for measuring electric power or power factor
- G01R21/02—Arrangements for measuring electric power or power factor by thermal methods, e.g. calorimetric
Abstract
The present invention on a kind of power management method of electronic installation, including：Sense sensing temperature；Normal temperature parameter group and higher temperature parameter group are captured, operation power when wherein the processor of electronic installation is run using higher temperature parameter group is more than operation power when being run using normal temperature parameter group；When judging that sensing temperature is not more than high temperature critical value, current parameter group is replaced to run processor with normal temperature parameter group；When judging that sensing temperature is more than high temperature critical value, current parameter group is replaced to run processor with higher temperature parameter group.The present invention can effectively play the complete efficiency of processor, and can effectively solve the problem of processor efficiency is not enough under high temperature.
Description
【Technical field】
The present invention is relevant with device and method, particularly with regard to electronic installation and its power management method.
【Background technology】
Strong electronic installation (such as various military-industry rule notebook computer, tablet PC or Wearable)
Mainly be designed in extreme environment (such as desert or polar region), and possess high temperature resistant, it is low temperature resistant,
It is dust-proof, anti-to hit the characteristic such as shockproof.In addition, compared to general electronic installation, (operating temperature range is about to take the photograph
0 degree to 45 degree of family name), the electronic building brick (such as processor, hard disk or internal memory) that strong electronic installation is configured
Due to special hardware framework (such as zone of heating and high efficiency heat radiation device), with wider array of operating temperature model
Enclose (such as Celsius subzero 40 to 60 degree Celsius).
Though existing strong electronic installation has been applicable under hot environment, however, when actual under high temperature
During operation, existing strong electronic installation is with temperature increase stepwise with identical processor limitation side
Formula progressively suppresses the efficiency (such as temperature often increases by 5 degree Celsius, that is, reduces highest frequency 100MHz) of processor,
Operation power (heat energy produced by reducing) is reduced by reducing the efficiency of processor, and then avoids hot overload.
Above-mentioned suppression mechanism can significantly suppress processor efficiency at high temperature, so that existing strong is electric
Sub-device is not good in the efficiency of processor under high temperature.
In addition, when the operating temperature for being in (such as Celsius 45 degree) but processor under high temperature is hot super not up to that can cause
During critical-temperature (such as Celsius 60 degree) of load, existing strong electronic installation can still perform above-mentioned suppression automatically
Making mechanism (such as temperature of processor exceedes 40 degree Celsius and starts progressively to suppress processor efficiency), this causes processing
The efficiency of device is suppressed and can not effectively play complete efficiency too early.
In addition, existing strong electronic installation under normal temperature or high temperature with identical suppressor mode in all (being adjusted
Whole identical setup parameter) carry out the efficiency of control processor, it is impossible to processor is effectively played complete efficiency.
【The content of the invention】
The main object of the present invention, is to provide a kind of electronic installation and its power management method, can be according to sense
Testing temperature carrys out control processor using different processor limitation modes, and the processor effect under high temperature is lifted whereby
Energy.
For up to above-mentioned purpose, the present invention provides a kind of electronic installation, including：Sense a temperature of a sensing temperature
Spend sensor, one normal temperature parameter group of storage, an internal memory of a higher temperature parameter group and a high temperature critical value and electrically
Connect the temperature sensor and a processor of the internal memory.The normal temperature parameter group and the higher temperature parameter group are right respectively
Different processors are answered to limit mode.The processor when judging that the sensing temperature is not more than the high temperature critical value,
Captured from the internal memory and replace current parameter group to limit mode with different processors with the normal temperature parameter group
Operation, and when judging that the sensing temperature is more than the high temperature critical value, capture and replaced with the higher temperature parameter group
Current parameter group is run to limit mode with different processors, and wherein the processor uses the higher temperature parameter
Hot operation power during group operation is more than normal temperature operation power when being run using the normal temperature parameter group.
The present invention also provides a kind of power management method, applies to an electronic installation, including：A) via a temperature
Spend sensor and sense a sensing temperature；B) a normal temperature parameter group and a higher temperature parameter group are captured from an internal memory, its
In the normal temperature parameter group and the higher temperature parameter group correspond to different processors limitation modes, and the electronics respectively
Hot operation power when one processor of device is run using the higher temperature parameter group is more than is joined using the normal temperature
Normal temperature operation power when array is run；C) when judging that the sensing temperature is not more than a high temperature critical value,
Replace current parameter group to run the processor in different processor limitation modes with the normal temperature parameter group；
And d) replace current parameter when judging that the sensing temperature is more than the high temperature critical value with the higher temperature parameter group
Group runs the processor to limit mode with different processors, to lift the operation power of the processor as this
Hot operation power.
The present invention can effectively play the complete efficiency of processor, and can effectively solve under high temperature processor efficiency not
Sufficient the problem of.
【Brief description of the drawings】
Fig. 1 is the electronic installation Organization Chart of the first specific embodiment of the invention.
Fig. 2 is the electronic installation Organization Chart of the second specific embodiment of the invention.
Fig. 3 is the Poewr control method flow chart of the first specific embodiment of the invention.
Fig. 4 is the Poewr control method flow chart of the second specific embodiment of the invention.
Fig. 5 is the Poewr control method flow chart of the 3rd specific embodiment of the invention.
【Embodiment】
Hereby the just preferred embodiment of the present invention, coordinates schema, describes in detail as after.
Continue referring to Fig. 1, being the electronic installation Organization Chart of the first specific embodiment of the invention.Disclosed herein
A kind of electronic installation 1 (such as notebook computer, personal computer, tablet PC or Wearable device) is main
To include the temperature sensor 10 to sensing temperature, the internal memory 12 to store data and be electrically connected with above-mentioned
Component and the processor 14 to control electronic installation 1.
Temperature sensor 10 can sense sensing temperature.It is preferred that temperature sensor 10 can sense electronics dress simultaneously
The surface temperature of the environment temperature outside 1 and the processor 14 of inside is put, and according to the environment temperature sensed
And surface temperature calculates sensing temperature.For example, the computable ring border temperature of temperature sensor 10 and surface temperature
The mean temperature or temperature difference of degree, and it is used as sensing temperature.
In another embodiment of the present invention, electronic installation 1 also include casing 16, temperature of plate sensor 10,
Internal memory 12 and processor 14 simultaneously provide protection.Also, temperature sensor 10 is arranged in casing 16 and away from place
Manage the position of device 14 (as both are respectively arranged at the two ends of the interior diagonal line of casing 16).Whereby, can effectively it keep away
Exempting from sensor operation heat produced by processor 14 of temperature sensor 10 influences, and can more accurately measure ring
Border temperature.
Internal memory 12 stores some parameter groups.Specifically, each parameter group includes an at least setup parameter respectively,
Each setup parameter is used for (preceding with the efficiency and operation power of different processor limitation mode control processors 14
State efficiency to be generally directly proportional to operation power).Therefore, when the value of setup parameter (such as highest frequency) changes (such as
It is changed into 200MHz from 100MHz) when, processor 14 can be made to provide different grades of efficiency and operation power (place
Manage the lifting processing speed of device 14 but increase operation power).
For example, when setup parameter is the first power limit parameter (CPU Power Limit 1, PL1)
When (by taking PL1=2W as an example), processor 14 can in the way of limiting long-time power by processor 14 it is long when
Between (long duration) operation Power Control in below 2W, but not the other specification of limitation processor 14
Value (such as frequency, startup core number, short time operation power or thermal control temperature).
When setup parameter is the second power limit parameter (CPU Power Limit 2, PL1) (with PL2=2.5W
Exemplified by), processor 14 can be in the way of limiting short time power by the short time (short of processor 14
Duration) operation Power Control is in below 2.5W, but not limits the other specification value of processor 14.
When setup parameter is frequency parameter (speed step) (by taking speed step=800MHz as an example),
Processor 14 can in the way of limiting highest frequency by the control of the highest frequency of processor 14 800MHz with
Under, but not the other specification value of limitation processor 14.
When setup parameter is thermal control circuit parameter (Thermal Control Circuit, TCC) (with
Exemplified by TCC=10), processor 14 can be in the way of limiting radiating start-up temperature by the forced heat radiation of processor 14
The start-up temperature of mechanism is set below the temperature of 10 degree Celsius of critical-temperature, but not limits processor 14
Other specification value, wherein critical-temperature do not result in the maximum temperature of the heat overload of processor 14, such as 100° centigrade.
Though it is noted that in described above, only with the first power limit parameter, the second power limit
Illustrated exemplified by parameter, frequency parameter and thermal control circuit parameter, but should not be as limit.Institute of the present invention
The setup parameter for any processor that tool usually intellectual can know, is similarly contained in category technical field
In the scope of the present invention.
In the present embodiment, some parameter groups that internal memory 12 is stored at least include one group of normal temperature parameter group 120 and one
Group higher temperature parameter group 122, and internal memory 12 also stores high temperature critical value 124 (such as Celsius 40 degree), wherein high
Warm critical value 124 can be to be preset or user's sets itself before dispatching from the factory.
Processor 14 obtains sensing temperature from temperature sensor 10, and in judging that sensing temperature is not more than high temperature and faces
During dividing value 124, normal temperature parameter group 120 is captured from internal memory 12, and replaces with normal temperature parameter group 120 current parameter
Group is run to limit mode with different processors.Conversely, processor 14 judges that sensing temperature is faced more than high temperature
During dividing value 124, higher temperature parameter group 122 is captured from internal memory 12, and replaces with higher temperature parameter group 122 current parameter
Group is run to limit mode with different processors.It is preferred that processor 14 is run using higher temperature parameter group 122
When operation power (hereinafter referred to as hot operation power) be more than operation when being run using normal temperature parameter group 120
Power (hereinafter referred to as normal temperature operation power).
It is noted that the value of each setup parameter included by the higher temperature parameter group 122 of the present invention is according to processing
The radiating start-up temperature of device 14 is planned calculating.In other words, though the present invention is handled in lifting under high temperature
The operation power of device 14, but because the value of setup parameter is calculated by planning, processor 14 is corresponding in performing
When processor limits mode and makes operation power ascension, the temperature control of processor 14 can be opened in radiating simultaneously
In dynamic temperature, and the overload of the heat of processor 14 can be avoided or burnt.
The present invention, to lift efficiency, can be handled effectively in performance through the operation power due to lifting processor under high temperature
The complete efficiency of device, and can effectively solve the problem of processor efficiency is not enough under high temperature.
The present invention directly replaces current parameter group via the parameter group that mode is limited with correspondence different processor,
Processor can be made rapidly effectively to adjust operation power according to temperature change, and processor can be prevented effectively from
Complete efficiency can not be played because efficiency is suppressed too early.
In another embodiment of the present invention, parameter type and the higher temperature parameter group 122 of normal temperature parameter group 120
Parameter type is different.
For example, normal temperature parameter group 120 can include the first power limit parameter simultaneously and the second power limit is joined
Several two kinds of setup parameters, higher temperature parameter group 122 can include frequency parameter simultaneously and two kinds of thermal control circuit parameter is set
Determine parameter.In other words, the setup parameter included by normal temperature parameter group 120 and higher temperature parameter group 122 is not all
Together.Whereby, when processor 14 is run using normal temperature parameter group 120, can via limit simultaneously for a long time/it is short
The mode of the temporal power upper limit comes controlled efficiency and operation power；When processor 14 is transported using higher temperature parameter group 122
During row, the different another processor of mode can be limited via the processor from being previously used and limits mode (i.e.
While the mode of limit frequency and the start-up temperature that radiates) come controlled efficiency and operation power.
In another example, normal temperature parameter group 120 is joined including the first power limit parameter and thermal control circuit simultaneously
Several two kinds of setup parameters, higher temperature parameter group 122 is simultaneously including the two kinds of settings of frequency parameter and thermal control circuit parameter
Parameter.In other words, normal temperature parameter group 120 is different from the setup parameter part included by higher temperature parameter group 122.
Whereby, when processor 14 is run using normal temperature parameter group 120, via limitation long-time power simultaneously and it can dissipate
The mode of thermal starting temperature comes controlled efficiency and operation power；When processor 14 is run using higher temperature parameter group 122
When, the different another different processor of mode can be limited via the processor from being previously used and limits mode
(i.e. the mode of limit frequency and the start-up temperature that radiates simultaneously) comes controlled efficiency and operation power.
In another example, normal temperature parameter group 120 only includes a kind of first setup parameter of power limit parameter, high
Warm parameter group 122 only includes a kind of setup parameter of frequency parameter.In other words, normal temperature parameter group 120 and high temperature
Setup parameter included by parameter group 122 is all different.Whereby, when processor 14 uses normal temperature parameter group 120
During operation, controlled efficiency and operation power can be come via the mode of limitation long-time power；When processor 14 makes
When being run with higher temperature parameter group 122, can via from the processor that is previously used limit mode it is different it is another not
Same processor limitation mode (i.e. the mode of limit frequency) comes controlled efficiency and operation power.
It is noted that when electronic installation 1 is in normal temperature environment, user is accustomed to the hand of electronic installation 1
Hold or be positioned on thigh.In above-mentioned situation, because electronic installation 1 directly contacts user's skin, electronics
The temperature change (the predominantly temperature change of processor 14) of device 1 can influence Consumer's Experience (to work as electronics
When the temperature of device 1 is too high or hurriedly rises, user may be scalded).
Therefore, above-mentioned example of the invention carrys out control processor when normal temperature via the mode of direct limitation power
14 operation power, can efficiently and accurately control processor 14 (and electronic installation 1) temperature, and can keep away
Exempt from because processor 14 (and electronic installation 1) temperature is too high or hurriedly rises and forms not good user's experience.
Also, when electronic installation 1 is in hot environment, electronic installation 1 is positioned on table by user's custom.
In above-mentioned situation, because electronic installation 1 will not contact user's skin, therefore the temperature change of electronic installation 1
Consumer's Experience will not be directly affected.Conversely, now the efficiency of processor 14 will significantly affect user's experience (such as
When processor 14 is via efficiency is suppressed to control temperature, user will be clearly felt that the processing speed of electronic installation 1
Degree is slack-off).
Therefore, above-mentioned example of the invention carrys out control processor when high temperature via the mode of direct limit frequency
14 efficiency, can efficiently and accurately control processor 14 efficiency, and can avoid because ahead of time or at extra-inhibitory
Manage the efficiency of device 14 and form not good user's experience.
Continue referring to Fig. 2, being the electronic installation Organization Chart of the second specific embodiment of the invention.The electricity of the present embodiment
Sub-device 2, temperature sensor 20, internal memory 22, processor 24, casing 26, normal temperature parameter group 220, high temperature
Parameter group 222 and high temperature critical value 224 respectively with the electronic installation 1 of first embodiment, temperature sensor 10, interior
Deposit 12, processor 14, casing 16, normal temperature parameter group 120, higher temperature parameter group 122 and the phase of high temperature critical value 124
With or it is similar, repeated no more in this, the only place different to two embodiments is illustrated below.
In the present embodiment, further one group of cold-starting setup parameter value 226 of storage and low temperature are critical for internal memory 22
Value 228 (such as Celsius 0 degree), wherein normal temperature parameter group 220, higher temperature parameter group 222 and cold-starting parameter group 226
Different processor limitation modes are corresponded to respectively, and low temperature critical value 228 is less than high temperature critical value 224.
Also, processor 24 captures low temperature when judging that sensing temperature is less than low temperature critical value 228 from internal memory 22
Start-up parameter group 226, and replace current parameter group to come with different processors with cold-starting parameter group 226
Limitation mode is run.
It is preferred that startup power when processor 24 is run using cold-starting parameter group 226 is (hereinafter referred to as low
Startup temperature power) it is less than normal temperature operation power when being run using normal temperature parameter group 220.
It is noted that under low temperature environment, the battery (figure is not indicated) of electronic installation 2 may be because of electric discharge
Efficiency is low and can not provide enough voltage to start processor 24.The present invention is joined via using cold-starting
Array 226 limits the efficiency of processor 24, so that processor 24 only needs less cold-starting power to open
It is dynamic, can be effective in starting processor 24 under low temperature environment.
In another embodiment of the present invention, internal memory 22 further stores one group of low-temperature operation parameter group 230, its
Middle normal temperature parameter group 220, higher temperature parameter group 220, cold-starting parameter group 226 and low-temperature operation parameter group 230
Different processor limitation modes are corresponded to respectively.
Also, processor 24 under low temperature using cold-starting parameter group 226 in being run and judge that warming-up is finished (such as
It is more than the warm-up period 232 prestored in the run time under low temperature, or, the temperature of processor 24 or battery is big
In warming-up temperature) when, low-temperature operation parameter group 230 is captured from internal memory 22, and with low-temperature operation parameter group 230
The current parameter group (i.e. cold-starting parameter group 226) of substitution, to be run in different processor limitation modes,
Operation power when wherein processor 24 is run using low-temperature operation parameter group 230 (is hereinafter referred to as cold operation work(
Rate) it is more than cold-starting power when being run using cold-starting parameter group 226.
It is noted that after warming-up is finished, the discharging efficiency of the battery of electronic installation 2 has been lifted,
And enough voltage can be provided and carry out normal operation processor 24.The present invention is via with the higher low temperature of correspondence power
The relatively low cold-starting parameter group 226 of the substitution correspondence power of operational factor group 230, to make processor 24 with difference
Processor limitation mode run, can under low temperature environment effectively lifting processor 24 efficiency.
In another embodiment of the present invention, the also drawing including electrically connected processing device 24 of electronic installation 1 is handled
Device 28.Also, processor 24 in detect process resource it is not enough when, can distribute currently processed work to drawing at
Manage device 28.
Specifically, (normal temperature parameter group is such as used when processor 24 limits mode with foregoing any processor
220th, higher temperature parameter group 222, cold-starting parameter group 226 or low-temperature operation parameter group 230) operation, and place
When the efficiency for managing device 24 is fully loaded with (such as utilization rate of processor 24 is 80%-100%), processor 24 can be distributed
In currently processed/pending work is to painting processor 28.Whereby, the present invention can effectively reduce processor 24
Utilization rate, and then reduce the power and temperature of processor 24.Also, the present invention is via using painting processor
28 coprocessors 24 are handled, and can lift electronics on the premise of the power and temperature of processor 24 is not increased
The overall efficiency of device 2.
In another embodiment of the present invention, processor 24 also includes thermal control circuit (TCC) module 240.
Thermal control module 240 enforces cooling mechanism (as forced when decision processor 24 reaches radiating start-up temperature
Reduce highest frequency).
It is preferred that foregoing each parameter group includes different thermal control circuit parameters (with normal temperature thermal control electricity respectively
Road parameter, high temperature thermal control circuit parameter, cold-starting thermal control circuit parameter and cold operation thermal control electricity
Exemplified by the parameter of road).Also, can be according to corresponding thermal control when processor 24 is run using different parameter groups
Circuit parameter processed sets radiating start-up temperature.Whereby, the present invention can make the radiating start-up temperature of cooling mechanism
More meet current environmental temperature, and can be prevented effectively from because cooling mechanism starts too early and suppresses the efficiency of processor 24
And cause user's experience not good, or cause processor 24 to burn because cooling mechanism starts too late.
Continue referring to Fig. 3, being the Poewr control method flow chart of the first specific embodiment of the invention.It is of the invention each
Electronic installation 2 shown in the main electronic installation 1 or Fig. 2 as shown in Figure 1 of the Poewr control method of implementation is subject to
Realize.For convenience of description, in follow-up explanation, it will be illustrated with the electronic installation 2 shown in Fig. 2.More
Further, the internal memory 22 of electronic installation 2 is also stored in computer program 234, computer program 234 and stored
There is the executable program code of processor 24.After computer program 234 is performed by processor 24, this can be achieved
Invent the Poewr control method of each implementation.Specifically, the Poewr control method of the present embodiment comprises the following steps.
Step S10：Electronic installation 2 senses sensing temperature via temperature sensor 20.It is preferred that electronic installation 2
The temperature of position of the inside of electronic installation 2 away from processor 24 is sensed, and is used as sensing temperature.
Step S12：Electronic installation 2 captures normal temperature parameter group 220 and higher temperature parameter group 222 from internal memory 22, wherein
Hot operation power when the processor 24 of electronic installation 2 is run using higher temperature parameter group 222, which is more than, uses normal temperature
Normal temperature operation power when parameter group 220 is run.Also, normal temperature parameter group 220 and higher temperature parameter group 222 are distinguished
The different processor limitation mode of correspondence.It is preferred that the parameter type of normal temperature parameter group 220 and higher temperature parameter group
222 parameter type is different.Specifically, the parameter type of the setup parameter included by normal temperature parameter group 220 with
The parameter type of setup parameter included by higher temperature parameter group 222 is whole/partly different.
For example, normal temperature parameter group 220 includes the first power limit parameter, and higher temperature parameter group 222 is included not
The frequency parameter of same parameter type.
Step S14：Electronic installation 2 judges whether sensing temperature is more than the high temperature critical value 224 of acquiescence.If judging
Sensing temperature is not more than high temperature critical value 224, then performs step S16.If judging, sensing temperature is faced more than high temperature
Dividing value 224, performs step S18.
Step S16：Electronic installation 2 replaces current parameter group to come with different processors with normal temperature parameter group 220
Limitation mode (being such as changed to directly limit power mode by the mode for directly limiting efficiency) runs processor 24.
Step S18：Electronic installation 2 replaces current parameter group to come with different processors with higher temperature parameter group 222
Limitation mode (mode that directly limitation efficiency is such as changed to by directly limiting power mode) operation processor 24,
To lift the operation power of processor 24 as hot operation power, and then lift effect of the processor 24 in high temperature
Energy.
Step S20：Whether electronic installation 2 is detected is closed (such as user closes electronic installation 2).If being closed,
Then terminate Poewr control method.Otherwise, step S10 is performed again.
Continue referring to Fig. 4, being the Poewr control method flow chart of the second specific embodiment of the invention.The present embodiment
Poewr control method comprise the following steps.
Step S300：The surface temperature of the sense ambient temperature of electronic installation 2 and processor 24.It is preferred that electronics
Device 2 can distinguish sense ambient temperature and surface temperature via two groups of temperature sensors 20, or via single temperature
Spend sensor 20 sense ambient temperature and surface temperature simultaneously.
For example, electronic installation 2 can be in before starting or when just starting, via 20 pairs of places of temperature sensor
Environment is sensed to obtain environment temperature.Also, in starting after a period of time, passed via identical temperature
Sensor 20 is sensed to obtain surface temperature to the surface of processor 24.
Step S302：Electronic installation 2 calculates sensing temperature according to environment temperature and surface temperature.It is preferred that electric
Sub-device 2 is weighted average computation to environment temperature and surface temperature, to obtain sensing temperature.
Step S304：Electronic installation 2 captures normal temperature parameter group 220 and higher temperature parameter group 222 from internal memory 22.
Step S306：Electronic installation 2 judges whether sensing temperature is more than high temperature critical value 224.If so, then holding
Row step S310.Otherwise, step S308 is performed.
Step S308：Electronic installation 2 runs processor 24 using normal temperature parameter group 220.
Step S310：Electronic installation 2 runs processor 24 using higher temperature parameter group 222.
Step S312：Whether the detecting of electronic installation 2 process resource is not enough.Specifically, electronic installation 2 is detected
Whether the utilization rate of current processor 24 is too high, or whether the temperature of processor 24 is too high or increase too fast.If
It is then to judge inadequate resource, and performs step S314.Otherwise, step S316 is performed.
Step S314：The currently processed work of the distribution processor 24 of electronic installation 2 is to painting processor 28.More enter
One step, electronic installation 2 can also distribute the currently processed work of processor 24 to outside processor (such as high in the clouds
Processor, figure is not indicated) or postponement process part work.
Though it is noted that in the present embodiment, when using higher temperature parameter group 222 to run processor 24
Work distribution function (step S312-S314) is just performed, but is not limited.In other embodiment,
(step S308) work distribution function can be just performed only when using normal temperature parameter group 220 to run processor 24,
Or, normality execution work distribution function when processor 24 is run.
Step S316：The setting radiating start-up temperature of electronic installation 2.Specifically, normal temperature parameter group 220 includes
Normal temperature thermal control circuit (TCC) parameter, higher temperature parameter group 222 includes high temperature thermal control circuit (TCC) parameter.
If the currently used operation of normal temperature parameter group 220 processor 24 of electronic installation 2, according to normal temperature thermal control circuit ginseng
Number setting radiating start-up temperature；If the currently used operation of higher temperature parameter group 222 processor 24 of electronic installation 2,
According to high temperature thermal control circuit parameter setting radiating start-up temperature.
Or, radiating start-up temperature also can be directly set as that the predetermined default value of user (is such as taken the photograph by electronic installation 2
80 degree of family name).
Step S318：Whether the temperature of the decision processor 24 of electronic installation 2 reaches radiating start-up temperature.If so,
Then perform step S320.Otherwise, step S322 is performed.
Step S320：Electronic installation 2 enforces cooling mechanism.It is preferred that foregoing cooling mechanism gently drops
The voltage of low processor 24, reduces its frequency, and then reach the purpose of radiating whereby.
Step S322：Whether electronic installation 2 is detected is closed (such as user closes electronic installation 2).If being closed,
Then terminate Poewr control method.Otherwise, step S300 is performed again.
Continue referring to Fig. 5, being the Poewr control method flow chart of the 3rd specific embodiment of the invention.The present embodiment
Poewr control method comprise the following steps.
Step S50：Electronic installation 2 senses sensing temperature.
Step S52：Electronic installation 2 captures multiple parameters group from internal memory 22, and (such as normal temperature parameter group 220, high temperature are joined
Array 222, cold-starting parameter group 224 and low-temperature operation parameter group 230).
Step S54：Electronic installation 2 judges whether sensing temperature is more than high temperature critical value 224.If so, performing step
Rapid S56.Otherwise, step S58 is performed.
Step S56：Electronic installation 2 is when judging that sensing temperature is more than high temperature critical value 224, into high temperature mode
And replace current parameter group to use the processor for being applied to high temperature to limit mode using higher temperature parameter group 222
To run processor 24.
Step S58：Electronic installation 2 determines whether whether sensing temperature is less than low temperature critical value 228.If so,
Perform step S62.Otherwise, step S60 is performed.
Step S60：Electronic installation 2 is in judging that sensing temperature is not more than high temperature critical value 224 and faces not less than low temperature
During dividing value 228, replace current parameter group into normal temperature pattern and using normal temperature parameter group 220 and be applicable with using
Processor 24 is run in the processor limitation mode of normal temperature.
Step S62：Electronic installation 2 is when judging to be less than low temperature critical value 228, into low temperature mode and using low
Startup temperature parameter group 226 replaces current parameter group to limit mode using the processor suitable for low temperature to transport
Row processor 24, to start and run processor 24 using low power mode.
Step S64：Electronic installation 2 judges whether that warming-up is finished.Specifically, electronic installation 2 is according to processor
Whether 24 start up to warm-up period 232, or whether the battery of electronic installation 2 or the temperature of processor 24 are more than silent
The warming-up temperature recognized, to judge whether that warming-up is finished.If so, then performing step S66.Otherwise, step is performed
S62。
Step S66：Electronic installation 2 is replaced currently after judging that warming-up is finished using low-temperature operation parameter group 230
The cold-starting parameter group 226 used in different processor limitation modes runs processor 24, with via
Power limit is improved to improve the efficiency of processor 24.
Step S68：Whether electronic installation 2 is detected is closed (such as user closes electronic installation 2).If being closed,
Then terminate Poewr control method.Otherwise, step S50 is performed again.
The foregoing is only the present invention preferred embodiments, it is non-thus i.e. limit to the present invention the scope of the claims,
Therefore be similarly all included within the scope of the present invention with the equivalence changes carried out by present invention such as, close
Give Chen Ming.
Claims (20)
1. a kind of electronic installation, it is characterised in that including：
One temperature sensor, senses a sensing temperature；
One internal memory, wherein one normal temperature parameter group of storage, a higher temperature parameter group and a high temperature critical value, the normal temperature
Parameter group and the higher temperature parameter group correspond to different processor limitation modes respectively；And
One processor, is electrically connected with the temperature sensor and the internal memory, in judging that the sensing temperature is not more than this
During high temperature critical value, capture the normal temperature parameter group to replace current parameter group to come with different places from the internal memory
Reason device limitation mode is run, and when judging that the sensing temperature is more than the high temperature critical value, captures high temperature ginseng
Array is run with replacing current parameter group in different processor limitation modes, and wherein the processor is used
The hot operation power when higher temperature parameter group is run is more than normal temperature when being run using the normal temperature parameter group
Run power.
2. electronic installation as claimed in claim 1, it is characterised in that the temperature sensor senses an environment
One surface temperature of temperature and the processor, and calculate the sensing temperature according to the environment temperature and the surface temperature
Degree.
3. electronic installation as claimed in claim 1, it is characterised in that the electronic installation also includes a casing,
The temperature sensor, the internal memory and the processor are coated, the temperature sensor is arranged in the casing and remote
The position of the processor.
4. electronic installation as claimed in claim 1, it is characterised in that the parameter type of the normal temperature parameter group
It is different from the parameter type of the higher temperature parameter group.
5. electronic installation as claimed in claim 4, it is characterised in that the normal temperature parameter group includes one first
Power limit parameter, the higher temperature parameter group includes a frequency parameter.
6. electronic installation as claimed in claim 1, it is characterised in that the electronic installation also includes
One painting processor, is electrically connected with the processor, and the processor is when process resource is not enough, and distribution is worked as
Pre-treatment, which works, gives the painting processor.
7. electronic installation as claimed in claim 1, it is characterised in that the processor also includes a thermal control
Circuit module, a cooling mechanism is enforced when judging that the processor reaches a radiating start-up temperature.
8. electronic installation as claimed in claim 7, it is characterised in that the normal temperature parameter group includes a normal temperature
Thermal control circuit parameter, the higher temperature parameter group includes a high temperature thermal control circuit parameter, and the processor is in judgement
When the sensing temperature is not more than the high temperature critical value, according to the normal temperature thermal control circuit parameter setting, the radiating is opened
Dynamic temperature, and when judging that the sensing temperature is more than the high temperature critical value, according to high temperature thermal control circuit ginseng
Number sets the radiating start-up temperature.
9. electronic installation as claimed in claim 1, it is characterised in that the internal memory also stores a cold-starting
Parameter group and a low temperature critical value, the normal temperature parameter group, the higher temperature parameter group and the cold-starting parameter component
Dui Ying be not different processor limitation mode, the low temperature critical value be less than the high temperature critical value, the processor in
When judging that the sensing temperature is less than the low temperature critical value, capture and replaced currently with the cold-starting parameter group
Parameter group is run to limit mode with different processors, and wherein the processor uses the cold-starting parameter group
Cold-starting power during operation is less than the normal temperature and runs power.
10. electronic installation as claimed in claim 9, it is characterised in that the internal memory also stores a cold operation
Parameter group, the normal temperature parameter group, the higher temperature parameter group, the cold-starting parameter group and the low-temperature operation parameter
Group corresponds to different processors limitation modes respectively, the processor in using cold-starting parameter group operation and
When judging that warming-up is finished, capture and replace the cold-starting parameter group to come with difference with the low-temperature operation parameter group
Processor limitation mode run, wherein the processor using the low-temperature operation parameter group run when a low temperature
Run power and be more than the cold-starting power.
11. a kind of power management method, applies to an electronic installation, it is characterised in that including：
A) sensing temperature is sensed via a temperature sensor；
B) a normal temperature parameter group and a higher temperature parameter group, wherein the normal temperature parameter group and the height are captured from an internal memory
Warm parameter group corresponds to different processors limitation modes respectively, and the processor use of the electronic installation should
The normal temperature that hot operation power when higher temperature parameter group is run is more than when being run using the normal temperature parameter group is transported
Row power；
C) when judging that the sensing temperature is not more than a high temperature critical value, replaced currently with the normal temperature parameter group
Parameter group runs the processor to limit mode with different processors；And
D) when judging that the sensing temperature is more than the high temperature critical value, current ginseng is replaced with the higher temperature parameter group
Array in different processor limitation modes runs the processor, using lifted the operation power of the processor as
The hot operation power.
12. power management method as claimed in claim 11, it is characterised in that step a senses an environment
One surface temperature of temperature and the processor, and calculate the sensing temperature according to the environment temperature and the surface temperature
Degree.
13. power management method as claimed in claim 11, it is characterised in that step a senses the electronics
The temperature of position away from the processor inside device, and it is used as the sensing temperature.
14. power management method as claimed in claim 11, it is characterised in that the ginseng of the normal temperature parameter group
Several classes of types are different from the parameter type of the higher temperature parameter group.
15. power management method as claimed in claim 14, it is characterised in that the normal temperature parameter group includes
One first power limit parameter, the higher temperature parameter group includes a frequency parameter.
16. power management method as claimed in claim 11, it is characterised in that also include in after step d
Step d1：When process resource deficiency is detected, the currently processed work of the processor is distributed to the electronic installation
A painting processor.
17. power management method as claimed in claim 11, it is characterised in that also including a step e：In
Judge to enforce a cooling mechanism when processor reaches a radiating start-up temperature.
18. power management method as claimed in claim 17, it is characterised in that the normal temperature parameter group includes
One normal temperature thermal control circuit parameter, the higher temperature parameter group includes a high temperature thermal control circuit parameter, step c bags
Include a step c1：According to the normal temperature radiating start-up temperature parameter setting radiating start-up temperature, step d includes
One step d1：According to the high temperature thermal control circuit parameter setting radiating start-up temperature.
19. power management method as claimed in claim 11, it is characterised in that also captured in step b
One cold-starting parameter group and a low temperature critical value, wherein the low temperature critical value are less than the high temperature critical value, should
Cold-starting power when processor is run using the cold-starting parameter group is less than the normal temperature and runs power,
And the normal temperature parameter group, the higher temperature parameter group and the cold-starting parameter group correspond to different processors respectively
Limitation mode；The power management method also includes a step f：In judge the sensing temperature be less than the low temperature it is critical
During value, replace current parameter group to run in different processor limitation modes with the cold-starting parameter group
The processor.
20. power management method as claimed in claim 19, it is characterised in that also captured in step b
Low temperature when one low-temperature operation parameter group, the wherein electronic installation are run using the low-temperature operation parameter group is transported
Row power is more than the cold-starting power, the normal temperature parameter group, the higher temperature parameter group, the cold-starting parameter
Group and the low-temperature operation parameter group correspond to different processor limitation modes respectively；The power management method is in this
Also include a step g after step f：When judging that the processor warming-up is finished, taken with the low-temperature operation parameter group
The processor is run in different processor limitation modes for the cold-starting parameter group.
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