CN107153592B - Electronic device and power management method thereof - Google Patents
Electronic device and power management method thereof Download PDFInfo
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- CN107153592B CN107153592B CN201610114862.6A CN201610114862A CN107153592B CN 107153592 B CN107153592 B CN 107153592B CN 201610114862 A CN201610114862 A CN 201610114862A CN 107153592 B CN107153592 B CN 107153592B
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Abstract
The invention relates to a power management method of an electronic device, which comprises the following steps: sensing the sensed temperature; capturing a normal temperature parameter set and a high temperature parameter set, wherein the operating power of a processor of the electronic device when the processor uses the high temperature parameter set is greater than the operating power when the processor uses the normal temperature parameter set; when the sensing temperature is judged to be not more than the high-temperature critical value, replacing the current parameter group with the normal-temperature parameter group to run the processor; and when the sensed temperature is judged to be larger than the high-temperature critical value, replacing the current parameter group with the high-temperature parameter group to run the processor. The invention can effectively exert the complete efficiency of the processor and can effectively solve the problem of insufficient efficiency of the processor at high temperature.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to an electronic device and a power management method thereof.
[ background of the invention ]
The strong electronic device (such as various military notebook computers, tablet computers or wearable devices) is mainly designed for use in extreme environments (such as deserts or polar regions), and has the characteristics of high temperature resistance, low temperature resistance, dust prevention, collision prevention, shock prevention and the like. In addition, compared to a typical electronic device (operating temperature range is about 0 to 45 degrees celsius), the electronic device configured with a robust electronic device (such as a processor, a hard disk, or a memory) has a wider operating temperature range (such as 40 to 60 degrees celsius) due to its special hardware architecture (such as a heating layer and a high efficiency heat dissipation device).
Although the conventional robust electronic device is already suitable for high temperature environments, when the device actually operates at high temperature, the conventional robust electronic device gradually inhibits the performance of the processor in the same processor limiting manner in a stepwise manner as the temperature increases (for example, the maximum frequency is reduced by 100MHz when the temperature increases by 5 degrees celsius), and reduces the operating power (i.e., reduces the generated heat energy) by reducing the performance of the processor, thereby avoiding thermal overload.
The above-mentioned suppression mechanism can significantly suppress the processor performance at high temperature, so that the performance of the processor at high temperature in the conventional robust electronic device is not good.
In addition, when the processor is at a high temperature (e.g., 45 degrees celsius) but the operating temperature of the processor does not reach a critical temperature (e.g., 60 degrees celsius) that may cause thermal overload, the conventional robust electronic device still automatically performs the above-mentioned throttling mechanism (e.g., gradually throttling the processor performance when the processor temperature exceeds 40 degrees celsius), which causes the processor performance to be throttled too early to effectively achieve full performance.
In addition, the conventional robust electronic device controls the performance of the processor in the same inhibition manner (i.e., adjusting the same setting parameters) at normal temperature or high temperature, and thus the processor cannot effectively exert the complete performance.
[ summary of the invention ]
The present invention is directed to an electronic device and a power management method thereof, which can control a processor in different processor limiting manners according to a sensed temperature, thereby improving the performance of the processor at a high temperature.
To achieve the above object, the present invention provides an electronic device, comprising: the temperature sensor comprises a temperature sensor for sensing temperature, a memory for storing a normal temperature parameter group, a high temperature parameter group and a high temperature critical value, and a processor electrically connected with the temperature sensor and the memory. The normal temperature parameter set and the high temperature parameter set correspond to different processor limiting modes respectively. The processor retrieves the normal temperature parameter group from the memory to replace the current parameter group to operate in different processor limiting modes when judging that the sensed temperature is not greater than the high temperature critical value, and retrieves the high temperature parameter group to replace the current parameter group to operate in different processor limiting modes when judging that the sensed temperature is greater than the high temperature critical value, wherein a high temperature operating power of the processor when using the high temperature parameter group is greater than a normal temperature operating power of the processor when using the normal temperature parameter group.
The invention also provides a power management method applied to an electronic device, comprising the following steps: a) sensing a sensed temperature via a temperature sensor; b) capturing a normal temperature parameter set and a high temperature parameter set from a memory, wherein the normal temperature parameter set and the high temperature parameter set respectively correspond to different processor limiting modes, and a high temperature operating power of a processor of the electronic device when the processor operates by using the high temperature parameter set is greater than a normal temperature operating power when the processor operates by using the normal temperature parameter set; c) when the sensed temperature is judged to be not more than a high-temperature critical value, replacing the current parameter group with the normal-temperature parameter group to operate the processor in different processor limiting modes; and d) when the sensed temperature is judged to be larger than the high-temperature critical value, replacing the current parameter group with the high-temperature parameter group to operate the processor in different processor limiting modes so as to promote the operating power of the processor to be the high-temperature operating power.
The invention can effectively exert the complete efficiency of the processor and can effectively solve the problem of insufficient efficiency of the processor at high temperature.
[ description of the drawings ]
Fig. 1 is a diagram of an electronic device according to a first embodiment of the invention.
FIG. 2 is a diagram of an electronic device according to a second embodiment of the present invention.
Fig. 3 is a flowchart of a power control method according to a first embodiment of the invention.
Fig. 4 is a flowchart of a power control method according to a second embodiment of the invention.
Fig. 5 is a flowchart of a power control method according to a third embodiment of the invention.
[ detailed description ] embodiments
A preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a schematic diagram of an electronic device according to a first embodiment of the invention. The present invention discloses an electronic device 1 (such as a notebook computer, a personal computer, a tablet computer or a wearable device), which mainly comprises a temperature sensor 10 for sensing temperature, a memory 12 for storing data, and a processor 14 electrically connected to the above components and used for controlling the electronic device 1.
The temperature sensor 10 may sense a sensed temperature. Preferably, the temperature sensor 10 can simultaneously sense the ambient temperature outside the electronic device 1 and the surface temperature of the internal processor 14, and calculate the sensed temperature according to the sensed ambient temperature and the sensed surface temperature. For example, the temperature sensor 10 may calculate an average temperature or a temperature difference of the ambient temperature and the surface temperature as the sensed temperature.
In another embodiment of the present invention, the electronic device 1 further includes a casing 16, which encloses and protects the temperature sensor 10, the memory 12 and the processor 14. Also, the temperature sensor 10 is disposed within the housing 16 at a location remote from the processor 14 (e.g., disposed at each end of a diagonal line within the housing 16). Therefore, the sensing action of the temperature sensor 10 can be effectively prevented from being influenced by the heat generated by the processor 14, and the ambient temperature can be measured more accurately.
The memory 12 stores a number of parameter sets. Specifically, each of the parameter sets includes at least one setting parameter, and each setting parameter is used to control the performance and the operating power of the processor 14 in different processor limit manners (the performance is generally proportional to the operating power). Thus, when the value of the setting parameter (e.g., the highest frequency) is changed (e.g., from 100MHz to 200MHz), the processor 14 may be enabled to provide different levels of performance and operating power (the processor 14 increases the processing speed but increases the operating power).
For example, when the setting parameter is the first Power Limit parameter (CPU Power Limit 1, PL1) (for example, PL1 ═ 2W), the processor 14 controls the long-time running Power of the processor 14 to be less than 2W in a manner of limiting the long-time Power, but does not Limit other parameter values (such as frequency, number of activated cores, short-time running Power, or thermal control temperature) of the processor 14.
When the setting parameter is the second power limit parameter (CPU PowerLimit 2, PL1) (for example, PL2 ═ 2.5W), the processor 14 controls the short-time (short duration) operation power of the processor 14 to 2.5W or less so as to limit the short-time power, but does not limit the other parameter values of the processor 14.
When the parameter is set to be a frequency parameter (speed step) (for example, 800 MHz), the processor 14 controls the maximum frequency of the processor 14 to be below 800MHz in a manner of limiting the maximum frequency, but does not limit other parameter values of the processor 14.
When the parameter is set to Thermal Control Circuit (TCC) (as an example, TCC ═ 10), the processor 14 sets the start temperature of the forced heat dissipation mechanism of the processor 14 to a temperature that is 10 degrees below the critical temperature that does not cause the highest temperature of Thermal overload of the processor 14, such as 100 degrees celsius, in a manner that limits the heat dissipation start temperature, but does not limit other parameter values of the processor 14.
It should be noted that, although the first power limiting parameter, the second power limiting parameter, the frequency parameter and the thermal control circuit parameter are only used as examples in the above description, the present invention should not be limited thereto. Any setting parameters of the processor known to one of ordinary skill in the art are also included in the scope of the present invention.
In the present embodiment, the parameter sets stored in the memory 12 at least include a set of normal temperature parameter sets 120 and a set of high temperature parameter sets 122, and the memory 12 further stores a high temperature threshold 124 (e.g. 40 degrees celsius), wherein the high temperature threshold 124 may be preset before factory shipment or set by a user.
The processor 14 obtains the sensed temperature from the temperature sensor 10, retrieves the normal temperature parameter set 120 from the memory 12 when the sensed temperature is not greater than the high temperature threshold 124, and uses the normal temperature parameter set 120 to replace the current parameter set to operate in different processor limiting manners. Otherwise, when the processor 14 determines that the sensed temperature is greater than the high temperature threshold 124, the high temperature parameter set 122 is retrieved from the memory 12, and the high temperature parameter set 122 is used to replace the current parameter set to operate in different processor limiting modes. Preferably, the operating power of processor 14 when operating with high temperature parameter set 122 (hereinafter referred to as high temperature operating power) is greater than the operating power when operating with ambient temperature parameter set 120 (hereinafter referred to as ambient operating power).
It should be noted that the values of the setting parameters included in the high temperature parameter set 122 according to the present invention are calculated according to the heat dissipation start temperature of the processor 14. In other words, although the operating power of the processor 14 is increased at a high temperature, the operating power of the processor 14 can be controlled within the heat dissipation starting temperature when the processor 14 executes the corresponding processor limiting mode to increase the operating power due to the programmed calculation of the values of the setting parameters, so that the processor 14 can be prevented from being overloaded or burned.
The invention can improve the efficiency by improving the running power of the processor at high temperature, can effectively exert the complete efficiency of the processor and can effectively solve the problem of insufficient efficiency of the processor at high temperature.
The invention directly replaces the current parameter group with the parameter group corresponding to different processor limiting modes, can enable the processor to quickly and effectively adjust the running power according to the temperature change, and can effectively avoid the processor from being incapable of playing the complete efficiency because the efficiency is inhibited too early.
In another embodiment of the present invention, the parameter type of the normal temperature parameter set 120 is different from the parameter type of the high temperature parameter set 122.
For example, the normal temperature parameter set 120 may include both the first power limit parameter and the second power limit parameter, and the high temperature parameter set 122 may include both the frequency parameter and the thermal control circuit parameter. In other words, the normal temperature parameter group 120 and the high temperature parameter group 122 include different setting parameters. Thus, when the processor 14 operates using the normal temperature parameter set 120, the performance and the operating power can be controlled by limiting the upper limit of the long-time/short-time power at the same time; when the processor 14 is operating using the high temperature parameter set 122, performance and operating power may be controlled via another processor limitation that is different from the previously used processor limitation, i.e., a limitation of both frequency and heat sink activation temperature.
In another example, the normal temperature parameter set 120 includes both the first power limit parameter and the thermal control circuit parameter, and the high temperature parameter set 122 includes both the frequency parameter and the thermal control circuit parameter. In other words, the normal temperature parameter set 120 is partially different from the setting parameters included in the high temperature parameter set 122. Thus, when the processor 14 operates using the normal temperature parameter set 120, the performance and the operating power can be controlled by limiting the long-time power and the heat dissipation start temperature at the same time; when the processor 14 is operating using the high temperature parameter set 122, performance and operating power may be controlled via another different processor limit than previously used (i.e., a manner of limiting both frequency and heat sink activation temperature).
In another example, the normal temperature parameter set 120 includes only one setting parameter of the first power limiting parameter, and the high temperature parameter set 122 includes only one setting parameter of the frequency parameter. In other words, the normal temperature parameter group 120 and the high temperature parameter group 122 include different setting parameters. Thus, when the processor 14 operates using the normal temperature parameter set 120, the performance and the operating power can be controlled by limiting the long-time power; when the processor 14 is operating using the set of high temperature parameters 122, performance and operating power may be controlled via a different processor limit (i.e., a frequency limit) than was previously used.
It should be noted that, when the electronic device 1 is in the normal temperature environment, the user is used to hold the electronic device 1 by hand or place the electronic device on the thigh. In the above situation, since the electronic device 1 directly contacts the skin of the user, the temperature change of the electronic device 1 (mainly the temperature change of the processor 14) may affect the user experience (i.e. the user may be scalded when the temperature of the electronic device 1 is too high or sharp).
Therefore, the above example of the present invention controls the operating power of the processor 14 by directly limiting the power at room temperature, so as to effectively and accurately control the temperature of the processor 14 (and the electronic device 1), and avoid the bad user experience caused by the over-high or abrupt temperature rise of the processor 14 (and the electronic device 1).
Moreover, when the electronic device 1 is in a high temperature environment, the user is used to place the electronic device 1 on a desk. In the above situation, since the electronic device 1 does not contact the skin of the user, the temperature variation of the electronic device 1 does not directly affect the user experience. On the contrary, the performance of the processor 14 will significantly affect the user experience (e.g. when the processor 14 controls the temperature by suppressing the performance, the user will obviously feel that the processing speed of the electronic device 1 is slow).
Therefore, the above example of the present invention controls the performance of the processor 14 by directly limiting the frequency at high temperature, so as to effectively and accurately control the performance of the processor 14, thereby avoiding poor user experience due to early or excessive suppression of the performance of the processor 14.
Fig. 2 is a schematic diagram of an electronic device according to a second embodiment of the invention. The electronic device 2, the temperature sensor 20, the memory 22, the processor 24, the housing 26, the normal temperature parameter set 220, the high temperature parameter set 222, and the high temperature threshold 224 of the present embodiment are respectively the same as or similar to the electronic device 1, the temperature sensor 10, the memory 12, the processor 14, the housing 16, the normal temperature parameter set 120, the high temperature parameter set 122, and the high temperature threshold 124 of the first embodiment, and therefore, no description is provided herein, and only different portions of the two embodiments will be described below.
In the present embodiment, the memory 22 further stores a set of low temperature start setting parameter values 226 and a low temperature threshold 228 (e.g. 0 degree celsius), wherein the normal temperature parameter set 220, the high temperature parameter set 222 and the low temperature start parameter set 226 respectively correspond to different processor limiting methods, and the low temperature threshold 228 is smaller than the high temperature threshold 224.
Moreover, when the processor 24 determines that the sensed temperature is less than the low temperature threshold 228, it retrieves the low temperature start parameter set 226 from the memory 22, and uses the low temperature start parameter set 226 to replace the current parameter set to operate in different processor limiting modes.
Preferably, the startup power of processor 24 when operating with cold start parameter set 226 (hereinafter cold start power) is less than the cold operating power when operating with cold parameter set 220.
It is noted that in a low temperature environment, a battery (not shown) of the electronic device 2 may not provide enough voltage to start the processor 24 due to low discharge efficiency. The present invention limits the performance of the processor 24 by using the low temperature start parameter set 226, so that the processor 24 can be started with less low temperature start power, and the processor 24 can be effectively started in a low temperature environment.
In another embodiment of the present invention, the memory 22 further stores a set of low temperature operation parameter set 230, wherein the normal temperature parameter set 220, the high temperature parameter set 220, the low temperature start parameter set 226 and the low temperature operation parameter set 230 correspond to different processor limiting modes respectively.
And, when the processor 24 operates at a low temperature using the low temperature start parameter set 226 and determines that warm-up is completed (e.g., the operating time at the low temperature is greater than the pre-stored warm-up time 232, or the temperature of the processor 24 or the battery is greater than the warm-up temperature), retrieving the low temperature operating parameter set 230 from the memory 22, and replacing the current parameter set (i.e., the low temperature start parameter set 226) with the low temperature operating parameter set 230 to operate in a different processor limiting manner, wherein the operating power (hereinafter referred to as the low temperature operating power) of the processor 24 when operating using the low temperature operating parameter set 230 is greater than the low temperature start power when operating using the low temperature start.
It should be noted that after warm-up is completed, the discharging efficiency of the battery of the electronic device 2 is improved, and sufficient voltage is provided to operate the processor 24 normally. The present invention replaces the low temperature start parameter set 226 corresponding to the low power with the low temperature operation parameter set 230 corresponding to the high power to make the processor 24 operate in different processor limiting modes, thereby effectively improving the performance of the processor 24 in a low temperature environment.
In another embodiment of the present invention, the electronic device 1 further includes a graphic processor 28 electrically connected to the processor 24. Also, processor 24 may assign the current processing task to GPU 28 upon detecting a lack of processing resources.
Specifically, when the processor 24 is operating in any of the aforementioned processor limiting manners (e.g., using the normal temperature parameter set 220, the high temperature parameter set 222, the low temperature start parameter set 226, or the low temperature operation parameter set 230) and the performance of the processor 24 is fully loaded (e.g., the utilization rate of the processor 24 is 80% -100%), the processor 24 may allocate the current in-process/pending work to the graphics processor 28. Therefore, the invention can effectively reduce the utilization rate of the processor 24, thereby reducing the power and the temperature of the processor 24. Moreover, the present invention, through the use of the GPU 28 in conjunction with the processor 24, can improve the overall performance of the electronic device 2 without increasing the power and temperature of the processor 24.
In another embodiment of the present invention, processor 24 further includes a Thermal Control Circuit (TCC) module 240. The thermal control module 240 may enforce a thermal dissipation mechanism (e.g., enforce a lower peak frequency) when it determines that the processor 24 has reached the thermal dissipation initiation temperature.
Preferably, the aforementioned parameter sets respectively include different thermal control circuit parameters (for example, a normal temperature thermal control circuit parameter, a high temperature thermal control circuit parameter, a low temperature start thermal control circuit parameter, and a low temperature operation thermal control circuit parameter). Also, when the processor 24 is operating with different sets of parameters, the heat dissipation initiation temperature may be set in accordance with the corresponding thermal control circuit parameters. Therefore, the invention can make the heat radiation starting temperature of the heat radiation mechanism more accord with the current environment temperature, and can effectively avoid poor user experience caused by the early starting of the heat radiation mechanism and the inhibition of the efficiency of the processor 24 or the burning of the processor 24 caused by the late starting of the heat radiation mechanism.
Please refer to fig. 3, which is a flowchart illustrating a power control method according to a first embodiment of the present invention. The power control method according to each embodiment of the present invention is mainly implemented by the electronic apparatus 1 shown in fig. 1 or the electronic apparatus 2 shown in fig. 2. For convenience of description, the electronic device 2 shown in fig. 2 will be described in the following description. Further, the memory 22 of the electronic device 2 further stores a computer program 234, and the computer program 234 stores a program code executable by the processor 24. The power control method of embodiments of the present invention may be implemented when the computer program 234 is executed by the processor 24. Specifically, the power control method of the present embodiment includes the following steps.
Step S10: the electronic device 2 senses the sensed temperature via the temperature sensor 20. Preferably, the electronic device 2 senses a temperature inside the electronic device 2 at a location remote from the processor 24 as the sensed temperature.
Step S12: the electronic device 2 retrieves the normal temperature parameter set 220 and the high temperature parameter set 222 from the memory 22, wherein the high temperature operating power of the processor 24 of the electronic device 2 when operating with the high temperature parameter set 222 is greater than the normal temperature operating power of the processor when operating with the normal temperature parameter set 220. The normal temperature parameter set 220 and the high temperature parameter set 222 correspond to different processor limiting methods, respectively. Preferably, the parameter types of the normal temperature parameter set 220 are different from the parameter types of the high temperature parameter set 222. Specifically, the parameter types of the setting parameters included in the normal temperature parameter group 220 are completely or partially different from the parameter types of the setting parameters included in the high temperature parameter group 222.
For example, the normal temperature parameter set 220 includes a first power limit parameter, and the high temperature parameter set 222 includes frequency parameters of different parameter types.
Step S14: the electronic device 2 determines whether the sensed temperature is greater than a default high temperature threshold 224. If the sensed temperature is not greater than the high temperature threshold 224, step S16 is executed. If the sensed temperature is greater than the high temperature threshold 224, step S18 is executed.
Step S16: the electronic device 2 replaces the current parameter set with the normal temperature parameter set 220 to operate the processor 24 in a different processor limiting manner (e.g., changing from a direct limiting efficiency manner to a direct limiting power manner).
Step S18: the electronic device 2 replaces the current parameter set with the high temperature parameter set 222 to operate the processor 24 in a different processor limiting manner (e.g., a manner of directly limiting power is changed to directly limiting performance), so as to increase the operating power of the processor 24 to a high temperature operating power, thereby increasing the performance of the processor 24 at a high temperature.
Step S20: the electronic device 2 detects whether it is turned off (e.g., the user turns off the electronic device 2). If turned off, the power control method is ended. Otherwise, step S10 is executed again.
Please refer to fig. 4, which is a flowchart illustrating a power control method according to a second embodiment of the present invention. The power control method of the present embodiment includes the following steps.
Step S300: the electronic device 2 senses the ambient temperature and the surface temperature of the processor 24. Preferably, the electronic device 2 can sense the ambient temperature and the surface temperature respectively through two sets of temperature sensors 20, or sense the ambient temperature and the surface temperature simultaneously through a single temperature sensor 20.
For example, the electronic device 2 may sense the environment through the temperature sensor 20 to obtain the ambient temperature before or at the initial start-up. After a period of activation, the surface temperature is obtained by sensing the surface of the processor 24 with the same temperature sensor 20.
Step S302: the electronic device 2 calculates the sensed temperature based on the ambient temperature and the surface temperature. Preferably, the electronic device 2 performs a weighted average calculation on the ambient temperature and the surface temperature to obtain the sensed temperature.
Step S304: the electronic device 2 retrieves the normal temperature parameter set 220 and the high temperature parameter set 222 from the memory 22.
Step S306: the electronic device 2 determines whether the sensed temperature is greater than the high temperature threshold 224. If yes, go to step S310. Otherwise, step S308 is executed.
Step S308: the electronic device 2 runs the processor 24 using the ambient temperature parameter set 220.
Step S310: the electronic device 2 runs the processor 24 using the high temperature parameter set 222.
Step S312: the electronic device 2 detects whether the processing resources are insufficient. Specifically, the electronic device 2 detects whether the current usage rate of the processor 24 is too high, or whether the temperature of the processor 24 is too high or increases too fast. If yes, the resource is determined to be insufficient, and step S314 is executed. Otherwise, step S316 is performed.
Step S314: the electronic device 2 assigns the current processing work of the processor 24 to the graphics processor 28. Furthermore, the electronic device 2 may allocate the current processing task of the processor 24 to an external processor (such as a cloud processor, not shown) or suspend a part of the processing task.
It should be noted that, although the work distribution function is executed only when the processor 24 is operated by using the high temperature parameter set 222 in the present embodiment (steps S312 to S314), the present invention is not limited thereto. In other embodiments, the work distribution function may be executed only when the processor 24 is operated by using the normal temperature parameter set 220 (step S308), or may be executed normally when the processor 24 is operated.
Step S316: the electronic device 2 sets a heat radiation starting temperature. Specifically, the ambient temperature parameter set 220 includes ambient temperature Thermal Control Circuit (TCC) parameters and the high temperature parameter set 222 includes high temperature Thermal Control Circuit (TCC) parameters. If the electronic device 2 is currently running the processor 24 using the normal temperature parameter set 220, setting a heat dissipation starting temperature according to the normal temperature thermal control circuit parameters; if the electronic device 2 is currently running the processor 24 using the high temperature parameter set 222, the heat dissipation initiation temperature is set according to the high temperature thermal control circuit parameters.
Alternatively, the electronic device 2 may directly set the heat dissipation start temperature to a default value predetermined by the user (e.g., 80 degrees celsius).
Step S318: the electronic device 2 determines whether the temperature of the processor 24 reaches the heat dissipation start temperature. If yes, go to step S320. Otherwise, step S322 is executed.
Step S320: the electronic device 2 enforces a heat dissipation mechanism. Preferably, the heat dissipation mechanism gently reduces the voltage of the processor 24, thereby reducing the frequency thereof, and achieving the purpose of heat dissipation.
Step S322: the electronic device 2 detects whether it is turned off (e.g., the user turns off the electronic device 2). If turned off, the power control method is ended. Otherwise, step S300 is performed again.
Please refer to fig. 5, which is a flowchart illustrating a power control method according to a third embodiment of the present invention. The power control method of the present embodiment includes the following steps.
Step S50: the electronic device 2 senses the sensed temperature.
Step S52: the electronic device 2 retrieves a plurality of parameter sets (e.g., the normal temperature parameter set 220, the high temperature parameter set 222, the low temperature start parameter set 224, and the low temperature operation parameter set 230) from the memory 22.
Step S54: the electronic device 2 determines whether the sensed temperature is greater than the high temperature threshold 224. If yes, go to step S56. Otherwise, step S58 is executed.
Step S56: when the electronic device 2 determines that the sensed temperature is greater than the high temperature threshold 224, it enters the high temperature mode and uses the high temperature parameter set 222 to replace the current parameter set to operate the processor 24 in the processor limited mode suitable for high temperature.
Step S58: electronic device 2 further determines whether the sensed temperature is less than low temperature threshold 228. If yes, go to step S62. Otherwise, step S60 is executed.
Step S60: when the electronic device 2 determines that the sensed temperature is not greater than the high temperature threshold 224 and not less than the low temperature threshold 228, it enters the normal temperature mode and uses the normal temperature parameter set 220 to replace the current parameter set to operate the processor 24 in the processor limiting manner suitable for normal temperature.
Step S62: when the electronic device 2 determines that the low temperature is less than the low temperature threshold 228, it enters the low temperature mode and uses the low temperature start parameter set 226 to replace the current parameter set to operate the processor 24 in the low power mode by using the processor limit mode suitable for low temperature, so as to start and operate the processor 24.
Step S64: the electronic apparatus 2 determines whether the warm-up is completed. Specifically, the electronic device 2 determines whether the warm-up is completed according to whether the processor 24 is activated for the warm-up time 232 or whether the temperature of the battery of the electronic device 2 or the processor 24 is greater than a default warm-up temperature. If yes, go to step S66. Otherwise, step S62 is executed.
Step S66: after determining that warm-up is complete, the electronic device 2 uses the low temperature operation parameter set 230 to operate the processor 24 with different processor limits instead of the currently used low temperature start parameter set 226, so as to increase the performance of the processor 24 by increasing the power limit.
Step S68: the electronic device 2 detects whether it is turned off (e.g., the user turns off the electronic device 2). If turned off, the power control method is ended. Otherwise, step S50 is executed again.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that equivalent variations using the present invention are all included in the scope of the present invention, and it is obvious that the present invention is not limited thereto.
Claims (20)
1. An electronic device, comprising:
a temperature sensor for sensing a sensed temperature;
a memory for storing a normal temperature parameter set, a high temperature parameter set and a high temperature critical value, wherein the normal temperature parameter set and the high temperature parameter set respectively correspond to different processor limiting modes; and
and a processor electrically connected to the temperature sensor and the memory, for retrieving the normal temperature parameter set from the memory to replace a current parameter set to operate in different processor restriction modes when determining that the sensed temperature is not greater than the high temperature threshold, and for retrieving the high temperature parameter set to replace the current parameter set to operate in different processor restriction modes when determining that the sensed temperature is greater than the high temperature threshold, wherein a high temperature operating power of the processor when operating with the high temperature parameter set is greater than a normal temperature operating power of the processor when operating with the normal temperature parameter set.
2. The electronic device of claim 1, wherein the temperature sensor senses an ambient temperature and a surface temperature of the processor, and calculates the sensed temperature according to the ambient temperature and the surface temperature.
3. The electronic device of claim 1, further comprising a housing enclosing the temperature sensor, the memory, and the processor, wherein the temperature sensor is disposed in the housing at a location remote from the processor.
4. The electronic device of claim 1, wherein the parameter type of the normal temperature parameter set is different from the parameter type of the high temperature parameter set.
5. The electronic device of claim 4, wherein the set of normal temperature parameters includes a first power limit parameter, and the set of high temperature parameters includes a frequency parameter.
6. The electronic device of claim 1, further comprising
The processor allocates the current processing work to the drawing processor when the processing resources are insufficient.
7. The electronic device of claim 1, wherein the processor further comprises a thermal control circuit module that forces a heat dissipation mechanism when it is determined that the processor reaches a heat dissipation initiation temperature.
8. The electronic device of claim 7, wherein the normal temperature parameter set includes a normal temperature thermal control circuit parameter, the high temperature parameter set includes a high temperature thermal control circuit parameter, the processor sets the heat dissipation initiation temperature according to the normal temperature thermal control circuit parameter when determining that the sensed temperature is not greater than the high temperature threshold, and sets the heat dissipation initiation temperature according to the high temperature thermal control circuit parameter when determining that the sensed temperature is greater than the high temperature threshold.
9. The electronic device of claim 1, wherein the memory further stores a low temperature start parameter set and a low temperature threshold, the normal temperature parameter set, the high temperature parameter set and the low temperature start parameter set respectively correspond to different processor limits, the low temperature threshold is smaller than the high temperature threshold, the processor retrieves and replaces the current parameter set with the low temperature start parameter set to operate in different processor limits when determining that the sensed temperature is smaller than the low temperature threshold, wherein a low temperature start power of the processor during operation using the low temperature start parameter set is smaller than the normal temperature operating power.
10. The electronic device of claim 9, wherein the memory further stores a low temperature operation parameter set, and the normal temperature parameter set, the high temperature parameter set, the low temperature start parameter set, and the low temperature operation parameter set respectively correspond to different processor limitations, and the processor retrieves and replaces the low temperature start parameter set with the low temperature operation parameter set to operate in different processor limitations when operating with the low temperature start parameter set and determining that warm-up is complete, wherein a low temperature operation power of the processor when operating with the low temperature operation parameter set is greater than the low temperature start power.
11. A power management method is applied to an electronic device, and is characterized in that the electronic device comprises a temperature sensor, a memory and a processor, and the power management method comprises the following steps:
a) sensing a sensed temperature via the temperature sensor;
b) capturing a normal temperature parameter set and a high temperature parameter set from the memory, wherein the normal temperature parameter set and the high temperature parameter set respectively correspond to different processor limiting modes, and a high temperature operating power of the processor of the electronic device when the processor operates by using the high temperature parameter set is greater than a normal temperature operating power when the processor operates by using the normal temperature parameter set;
c) when the sensed temperature is judged to be not more than a high-temperature critical value, replacing the current parameter group with the normal-temperature parameter group to operate the processor in different processor limiting modes; and
d) and when the sensed temperature is judged to be larger than the high-temperature critical value, replacing the current parameter group with the high-temperature parameter group to operate the processor in different processor limiting modes so as to promote the operating power of the processor to be the high-temperature operating power.
12. The method according to claim 11, wherein the step a senses an ambient temperature and a surface temperature of the processor, and calculates the sensed temperature according to the ambient temperature and the surface temperature.
13. The power management method according to claim 11, wherein the step a senses a temperature inside the electronic device at a location remote from the processor as the sensed temperature.
14. The power management method of claim 11, wherein the parameter type of the normal temperature parameter set is different from the parameter type of the high temperature parameter set.
15. The method of claim 14, wherein the normal temperature parameter set comprises a first power limit parameter, and the high temperature parameter set comprises a frequency parameter.
16. The power management method according to claim 11, further comprising, after the step d, a step d 1: when the processing resource is detected to be insufficient, the current processing work of the processor is distributed to a graphic processor of the electronic device.
17. The power management method according to claim 11, further comprising a step e of: and forcibly executing a heat dissipation mechanism when the processor reaches a heat dissipation starting temperature.
18. The power management method of claim 17 wherein the set of ambient temperature parameters includes an ambient temperature thermal control circuit parameter, the set of high temperature parameters includes a high temperature thermal control circuit parameter, the step c includes a step c 1: setting the heat dissipation starting temperature according to the normal temperature heat dissipation starting temperature parameter, wherein the step d includes a step d 1: and setting the heat dissipation starting temperature according to the high-temperature thermal control circuit parameters.
19. The method according to claim 11, wherein in the step b, a low temperature start parameter set and a low temperature threshold are further extracted, wherein the low temperature threshold is smaller than the high temperature threshold, a low temperature start power of the processor when operating using the low temperature start parameter set is smaller than the normal temperature operating power, and the normal temperature parameter set, the high temperature parameter set and the low temperature start parameter set respectively correspond to different processor limiting modes; the power management method further comprises a step f: and when the sensed temperature is judged to be smaller than the low-temperature critical value, replacing the current parameter group with the low-temperature starting parameter group to operate the processor in different processor limiting modes.
20. The power management method of claim 19, further capturing a low temperature operation parameter set in step b, wherein a low temperature operation power of the electronic device is greater than the low temperature start power when the electronic device operates using the low temperature operation parameter set, and the normal temperature parameter set, the high temperature parameter set, the low temperature start parameter set, and the low temperature operation parameter set respectively correspond to different processor limitations; the power management method further comprises a step g after the step f: and when the processor is judged to be completely warmed up, replacing the low-temperature starting parameter group with the low-temperature operating parameter group to operate the processor in different processor limiting modes.
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| CN108845906A (en) * | 2018-07-19 | 2018-11-20 | 郑州云海信息技术有限公司 | A kind of method and device promoting SPEC cpu test result |
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