CN107146837B - LED light source unit capable of emitting light from two sides and manufacturing method thereof - Google Patents
LED light source unit capable of emitting light from two sides and manufacturing method thereof Download PDFInfo
- Publication number
- CN107146837B CN107146837B CN201710109139.3A CN201710109139A CN107146837B CN 107146837 B CN107146837 B CN 107146837B CN 201710109139 A CN201710109139 A CN 201710109139A CN 107146837 B CN107146837 B CN 107146837B
- Authority
- CN
- China
- Prior art keywords
- transparent substrate
- pins
- light source
- led
- source unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention discloses a double-sided side-emitting LED light source unit and a manufacturing method thereof, wherein the LED light source unit comprises pins, a transparent substrate, an LED wafer and an insulating protective layer; the pins are formed by cutting a metal bracket manufactured by integrally molding equipment, the LED wafer is fixed on the transparent substrate, and the transparent substrate is fixed on the pins; the circuit is arranged on the transparent substrate and is connected between the LED wafer and the pins so as to realize electric communication between the LED wafer and the pins; the pin, the transparent substrate and the LED wafer are wrapped by the insulating protective layer, and the pin is incompletely wrapped and partially exposed outside the insulating protective layer. The LED light source with the double-sided side light emission manufactured by the manufacturing method has the characteristics of simple process, flexible application and the like.
Description
Technical Field
The invention relates to a double-sided side-emitting LED light source unit and a manufacturing method thereof.
Background
The LED is a solid-state light-emitting device which emits light by utilizing PN junction under the action of an electric field, has the characteristics of high efficiency, environmental protection and energy saving, and is a new green and environmental-friendly light source. With the rapid advance of LED technology in recent years, various light sources made of LEDs are becoming dominant products in the new generation lighting market.
In the process of manufacturing the LED surface light source, a specific substrate is usually manufactured, and the LED light source unit is welded on the substrate. The light emitted by the LED has special directivity, usually single-sided light emission, and when a plurality of LED light source units are arranged in a large area, dark corners or uneven light are likely to occur. Therefore, to form an LED surface light source with soft and uniform light source, and less breakage and damage, it is important to manufacture an LED light source unit with convenient installation, high brightness and good thermal conductivity.
Disclosure of Invention
The invention provides a double-sided side-emitting LED light source unit and a manufacturing method thereof, which overcome the problems in the background technology.
One of the adopted technical schemes for solving the technical problems is to provide a manufacturing method of a double-sided side-emitting LED light source unit, which comprises the following steps:
1) Manufacturing a metal bracket: the method comprises the steps that a metal bracket is manufactured by utilizing equipment through integral molding, the metal bracket comprises a base with a hollowed middle part, a pin is arranged at the hollowed part of the base, one end of the pin is fixedly connected with the metal bracket to form a fixed end, and the other end of the pin forms a free end;
2) Manufacturing a circuit assembly: fixing two ends of a transparent substrate to free ends of the pins, wherein the transparent substrate is provided with an LED wafer, the free ends are electrically communicated with the anode and the cathode of the LED wafer through a circuit arranged on the transparent substrate, and the circuit assembly comprises the transparent substrate and the circuit arranged on the transparent substrate;
3) Bending the free end of the pin out of the plane where the metal bracket is located, wherein the fixed end of the pin and the free end form an included angle;
4) Manufacturing an insulating protective layer: coating silica gel on the peripheries of the LED wafer, the luminous component and the pins, and exposing at least one part of the fixed ends of the pins;
5) And the pins of the metal support are partially exposed outside the insulating protection layer, and the base is cut off to form the LED light source unit.
In a preferred embodiment: in the step 2), the LED chip is fixed on the transparent substrate, conductive layers are coated at two ends of the transparent substrate, and the positions, coated with the conductive layers, on the transparent substrate are fixed at the pins of the metal bracket.
In a preferred embodiment: in the step 2), the method further comprises the steps of fixing the LED wafer on the transparent substrate, respectively welding one ends of the gold wires to the conducting layer of the transparent substrate, and electrically connecting the other ends of the gold wires with the corresponding positive and negative electrodes of the LED wafer.
In a preferred embodiment: in the step 3), the free ends of the pins are bent at 90 degrees out of the plane where the metal bracket is located.
The invention solves the technical problems by adopting the following technical scheme: the LED light source unit with double-sided side luminescence manufactured by the method comprises pins, a transparent substrate, an LED wafer and an insulating protective layer;
the pins are bent to form free ends and fixed ends, and the free ends are electrically connected with the anode and the cathode of the LED wafer;
the LED chip is fixed on the transparent substrate, the transparent substrate is fixed on the pins, a circuit is arranged on the transparent substrate, and the circuit arranged on the transparent substrate is connected between the LED chip and the pins to realize electrical communication between the LED chip and the pins;
the pin, the luminous component and the LED wafer are wrapped by the insulating protective layer, and the pin is incompletely wrapped and partially exposed outside the insulating protective layer.
In a preferred embodiment: the pins are L-shaped.
In a preferred embodiment: the circuit arranged on the transparent substrate comprises a conductive layer coated on the transparent substrate, and the conductive layer is positioned at the joint of the transparent substrate and the pins.
In a preferred embodiment: the circuit arranged on the transparent substrate further comprises gold wires, one ends of the gold wires are welded to the conducting layer of the transparent substrate respectively, and the other ends of the gold wires are electrically communicated with the anode and the cathode corresponding to the LED wafer.
In a preferred embodiment: the transparent substrate is transparent ceramic.
In a preferred embodiment: the conductive coating is a silver layer.
Compared with the background technology, the technical proposal has the following advantages:
1. the problem of single-sided light emission of the existing LED light source unit is solved, the light emission angle and the brightness are increased, and the LED light source unit is easy to form;
2. the structure of the vertical LED wafer and the arrangement of the insulating protective layer enable the surface light source formed by the large-area arrangement of the LED light source units not to be easily broken and damaged.
3. The metal bracket is manufactured by integrally molding equipment, so that batch production can be realized, the efficiency is high, and the cost is low;
and 4, the finished product of the LED light source unit is installed on the single substrate through a surface mounting technology as the conventional SMD patch light source, so that the working procedure is simple, and the manpower and material resources can be effectively saved.
Drawings
The invention is further described below with reference to the drawings and examples.
Fig. 1 is a schematic diagram showing a metal bracket, a circuit assembly and an LED chip of a LED light source unit with double-sided side emission in embodiment 1;
fig. 2 is a schematic diagram showing a metal bracket, a circuit assembly and an LED chip after bending of a double-sided side-emitting LED light source unit according to embodiment 1;
fig. 3 is a front view of a metal bracket, a circuit assembly and an LED chip after bending of a double-sided side-emitting LED light source unit according to embodiment 1;
fig. 4 is a schematic diagram showing a structure of a manufacturing step 3) of a double-sided side-emitting LED light source unit according to embodiment 1;
FIG. 5 is a perspective view showing a double-sided side-emission LED light source of embodiment 1;
FIG. 6 is a left side view of a double-sided side-emitting LED light source of embodiment 1;
fig. 7 is a plan view showing a flexible surface light source according to embodiment 2;
fig. 8 is a front view showing a flexible surface light source according to embodiment 2;
fig. 9 is a front view showing a flexible surface light source according to embodiment 2;
Detailed Description
The invention is further described below with reference to the drawings and detailed description.
Example 1
Referring to fig. 1 to 6, a method for manufacturing a double-sided side-emission LED light source unit 1 includes the steps of:
1) Manufacturing a metal bracket 2: the metal bracket 2 is manufactured by utilizing equipment integrated molding, the metal bracket 2 comprises a base 21 with a hollowed middle part, a pin 23 is arranged at the hollowed part of the base 21, one end of the pin 23 is fixedly connected with the metal bracket 2 to form a fixed end 232, and the other end of the pin is formed to form a free end 234;
2) Manufacturing a circuit assembly 4: fixing both ends of a transparent substrate 41 to free ends 234 of the pins 23, the transparent substrate 41 being arranged with LED chips 43, the free ends 234 electrically communicating the positive and negative poles of the LED chips 43 through circuits arranged on the transparent substrate 41, the circuit assembly 4 being a transparent substrate 41 and circuits arranged on the transparent substrate 41;
3) Bending the free end 234 of the pin 23 out of the plane of the metal bracket 2, wherein the fixed end 232 of the pin 23 forms an included angle with the free end 234;
4) Manufacturing an insulating protective layer 6: coating silica gel on the peripheries of the LED wafer 43, the circuit assembly 4 and the pins 23, and exposing at least a part of the fixed ends 232 of the pins 23;
5) The remaining part is exposed outside the insulating protection layer 6, the pins 23 of the metal bracket 2 are cut off the base 21 to form the LED light source unit 1.
In this embodiment, the step 2) further includes fixing the LED chip 43 to the transparent substrate 41, coating conductive layers on both ends of the transparent substrate 41, and fixing the positions of the transparent substrate 41 coated with the conductive layers at the pins 23 of the metal bracket 2. The LED chip 43 is fixed on the transparent substrate 41, one ends of the gold wires 45 are respectively welded to the conductive layers of the transparent substrate 41, and the other ends are electrically connected with the corresponding positive and negative electrodes of the LED chip 43. The free ends 234 of the pins 23 are bent 90 degrees out of the plane of the metal bracket 2, and are L-shaped.
The LED light source unit 1 with double-sided side light emission manufactured by the method comprises pins 23, a transparent substrate 41, an LED wafer 43 and an insulating protection layer 6; the pins 23 are bent to form free ends 234 and fixed ends 232, and the free ends 234 are electrically connected with the anode and the cathode of the LED chip 43; the LED chip 43 is fixed on the transparent substrate 41, the transparent substrate 41 is fixed on the pins 23, and a circuit is arranged on the transparent substrate 41, and the circuit arranged on the transparent substrate 41 is connected between the LED chip 43 and the pins 23 to realize electrical communication between the two; the insulating protective layer 6 wraps the pins 23, the transparent substrate 41 and the LED chip 43, and the pins 23 are incompletely wrapped and partially exposed outside the insulating protective layer 6. The LED light source unit 1 with the exposed pins 23 has the same installation process as the conventional SMD surface mount light source, and can be installed on an aluminum substrate processed by an SMT surface mount machine quickly and conveniently.
In this embodiment, in order to enable more stable electrical connection between the LED chip and the pins, the circuit disposed on the transparent substrate 41 includes a conductive layer coated on the transparent substrate 41, where the conductive layer is a silver layer, and the conductive layer is located at a connection position between the transparent substrate 41 and the pins 23; the circuit arranged on the transparent substrate 41 further includes gold wires 45, one ends of the gold wires 45 are respectively welded to the conductive layer of the transparent substrate 41, and the other ends are electrically connected with the positive and negative electrodes corresponding to the LED chip 43.
The transparent substrate 41 is made of transparent ceramic, when the pins 23 are bent and the side surface of the LED chip 43 emits light, the transparent substrate can transmit light to the greatest extent, so that light loss is reduced, and the transparent ceramic has a good fixing and supporting effect due to high mechanical strength and hardness, so that the LED chip 43 is effectively prevented from being broken, and the product yield is improved.
Example 2
Referring to fig. 7 to 9, a flexible surface light source is manufactured using the LED light source unit 1 of embodiment 1.
The LED light source unit 1 with double-sided side light emission in the embodiment comprises pins 23, a transparent substrate 41 and an LED wafer 43; the pins 23 are bent to form free ends 234 and fixed ends 232, and the free ends 234 are electrically connected with the anode and the cathode of the LED chip 43; the LED chip 43 is fixed on the transparent substrate 41, the transparent substrate 41 is fixed on the pins 23, and a circuit is arranged on the transparent substrate 41, and the circuit arranged on the transparent substrate 41 is connected between the LED chip 43 and the pins 23 to realize electrical communication between the two; the insulating protective layer 6 wraps the pins 23, the light emitting component and the LED chip 43, and the pins 23 are incompletely wrapped and partially exposed outside the insulating protective layer 6.
In this embodiment: the LED light source unit 1 adopts an LED wafer 43 which emits blue light, the bottom of the LED light source unit 1 is welded to the FPC flexible substrate 3 through solder paste, and finally, the surface of the FPC flexible substrate 3 on which the LED light source unit 1 is arranged is coated with an insulating protection layer 6, the insulating protection layer 6 is a silica gel layer, and fluorescent powder dots 5 are contained inside the insulating protection layer.
In this embodiment: by utilizing the characteristics that human eyes are insensitive to blue light and the refractive index of the blue light is large, the blue light excites the fluorescent powder dots 5 to emit white light, so that the effect of uniform light emission of the whole surface is achieved.
In this embodiment: the silica gel layer can be made thin so as to reduce the volume and achieve the effect of convenient installation. The specific operation is that fluorescent powder net points 5 are arranged on the inner surface of the silica gel, and then a layer of silica gel is covered on the silica gel.
In a preferred embodiment: the fluorescent powder net points 5 are arranged in the middle of the silica gel layer.
In a preferred embodiment: the fluorescent powder dots 5 are arranged on the FPC flexible substrate 3.
The foregoing description is only illustrative of the preferred embodiments of the present invention, and therefore should not be taken as limiting the scope of the invention, for all changes and modifications that come within the meaning and range of equivalency of the claims and specification are therefore intended to be embraced therein.
Claims (7)
1. A method for manufacturing a double-sided side-emitting LED light source unit, characterized by:
1) Manufacturing a metal bracket: the method comprises the steps that a metal bracket is manufactured by utilizing equipment through integral molding, the metal bracket comprises a base with a hollowed middle part, a pin is arranged at the hollowed part of the base, one end of the pin is fixedly connected with the metal bracket to form a fixed end, and the other end of the pin forms a free end;
2) Manufacturing a circuit assembly: fixing two ends of a transparent substrate to free ends of the pins, wherein the transparent substrate is provided with an LED wafer, the free ends are electrically communicated with the anode and the cathode of the LED wafer through a circuit arranged on the transparent substrate, and the circuit assembly comprises the transparent substrate and the circuit arranged on the transparent substrate;
3) Bending the free end of the pin out of the plane where the metal bracket is located, wherein the fixed end of the pin and the free end form an included angle;
4) Manufacturing an insulating protective layer: coating silica gel on the peripheries of the LED wafer, the circuit component and the pins, and exposing at least a part of the fixed ends of the pins;
5) The pins of the metal support are reserved, part of the pins is exposed outside the insulation protection layer, and the base is cut off to form an LED light source unit;
in the step 2), the LED chip is fixed on the transparent substrate, conductive layers are coated at two ends of the transparent substrate, and the positions, coated with the conductive layers, on the transparent substrate are fixed at the pins of the metal bracket;
in the step 2), the method further comprises the steps of fixing the LED wafer on the transparent substrate, respectively welding one ends of the gold wires to the conducting layer of the transparent substrate, and electrically connecting the other ends of the gold wires with the corresponding anode and the corresponding cathode of the LED wafer;
in the step 3), the free ends of the pins are bent at 90 degrees out of the plane where the metal bracket is located.
2. A double-sided side-emitting LED light source unit fabricated by the method of claim 1, wherein: the LED chip comprises pins, a transparent substrate, an LED chip and an insulating protective layer;
the pins are bent to form free ends and fixed ends, and the free ends are electrically connected with the anode and the cathode of the LED wafer;
the LED chip is fixed on the transparent substrate, the transparent substrate is fixed on the pins, a circuit is arranged on the transparent substrate, and the circuit arranged on the transparent substrate is connected between the LED chip and the pins to realize electrical communication between the LED chip and the pins;
the pin, the transparent substrate and the LED wafer are wrapped by the insulating protective layer, and the pin is incompletely wrapped and partially exposed outside the insulating protective layer.
3. The LED light source unit of claim 2, wherein: the pins are L-shaped.
4. The LED light source unit of claim 2, wherein: the circuit arranged on the transparent substrate comprises a conductive layer coated on the transparent substrate, and the conductive layer is positioned at the joint of the transparent substrate and the pins.
5. The LED light source unit of claim 4, wherein: the circuit arranged on the transparent substrate further comprises gold wires, one ends of the gold wires are welded to the conducting layer of the transparent substrate respectively, and the other ends of the gold wires are electrically communicated with the anode and the cathode corresponding to the LED wafer.
6. A double-sided light emitting LED light source unit according to claim 2 or 3, characterized in that: the transparent substrate is transparent ceramic.
7. A double-sided light emitting LED light source unit according to claim 2 or 3, characterized in that: the conductive layer is a silver layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710109139.3A CN107146837B (en) | 2017-02-27 | 2017-02-27 | LED light source unit capable of emitting light from two sides and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710109139.3A CN107146837B (en) | 2017-02-27 | 2017-02-27 | LED light source unit capable of emitting light from two sides and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107146837A CN107146837A (en) | 2017-09-08 |
| CN107146837B true CN107146837B (en) | 2023-04-28 |
Family
ID=59783737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710109139.3A Active CN107146837B (en) | 2017-02-27 | 2017-02-27 | LED light source unit capable of emitting light from two sides and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107146837B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101187458A (en) * | 2007-12-10 | 2008-05-28 | 昌鑫光电（东莞）有限公司 | LED lamp plate structure with patch type bracket and its production process |
| CN101424377A (en) * | 2008-12-11 | 2009-05-06 | 友达光电股份有限公司 | Light source module with positioning viewfinder and method for manufacturing same |
| JP2012028652A (en) * | 2010-07-26 | 2012-02-09 | Civilight Shenzhen Semiconductor Lighting Co Ltd | Warm white light led lamp having high luminance and high color index and led module |
| CN103500786A (en) * | 2013-09-29 | 2014-01-08 | 杭州杭科光电股份有限公司 | Full-angle luminous LED (light-emitting diode) light source and preparation method thereof |
| CN203517457U (en) * | 2013-08-29 | 2014-04-02 | 昆山龙腾光电有限公司 | Light-emitting diode light bar device and backlight module with light-emitting diode light bar device |
-
2017
- 2017-02-27 CN CN201710109139.3A patent/CN107146837B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101187458A (en) * | 2007-12-10 | 2008-05-28 | 昌鑫光电（东莞）有限公司 | LED lamp plate structure with patch type bracket and its production process |
| CN101424377A (en) * | 2008-12-11 | 2009-05-06 | 友达光电股份有限公司 | Light source module with positioning viewfinder and method for manufacturing same |
| JP2012028652A (en) * | 2010-07-26 | 2012-02-09 | Civilight Shenzhen Semiconductor Lighting Co Ltd | Warm white light led lamp having high luminance and high color index and led module |
| CN203517457U (en) * | 2013-08-29 | 2014-04-02 | 昆山龙腾光电有限公司 | Light-emitting diode light bar device and backlight module with light-emitting diode light bar device |
| CN103500786A (en) * | 2013-09-29 | 2014-01-08 | 杭州杭科光电股份有限公司 | Full-angle luminous LED (light-emitting diode) light source and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| LED平板灯发光性能的改进方法与技术研究;刘金鑫;《工程科技Ⅱ辑》;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107146837A (en) | 2017-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203615157U (en) | Light and lighting device | |
| JP2011508941A5 (en) | ||
| CN204289531U (en) | Full-color LED encapsulation structure and LED show module | |
| CN201293282Y (en) | LED support and LED luminous structure | |
| EP3719387A1 (en) | Flexible led light bar | |
| JP2012069834A (en) | Light-emitting device and lighting unit | |
| JP2013171952A (en) | Light emitting device and illuminating device | |
| KR20100105388A (en) | Method for fabricating light emitting diode divice and light emitting diode package and light emitting diode module and lamp device having the same | |
| KR101329194B1 (en) | Optical module and manufacturing method thereof | |
| CN211118842U (en) | Double-sided luminous L ED flexible lamp strip and light source | |
| CN104896324B (en) | Illumination light source and lighting device | |
| CN201820800U (en) | High-power LED device | |
| CN204240091U (en) | Illumination light source and lighting device | |
| CN107146837B (en) | LED light source unit capable of emitting light from two sides and manufacturing method thereof | |
| CN113053864B (en) | Semiconductor double-layer array flip packaging structure and packaging method thereof | |
| KR20140008911A (en) | Optical module and manufacturing method thereof | |
| CN210920978U (en) | Rigid metal plate luminous support | |
| CN204387719U (en) | Bulb-shaped lamp and lighting device | |
| KR100592333B1 (en) | A led module | |
| CN101256964A (en) | Method for manufacturing a plurality of surface adhering type LED structure thereof | |
| CN216120342U (en) | LED module and electronic equipment | |
| KR101255139B1 (en) | Heat emission structure for LED element and Method for forming the same | |
| CN216958028U (en) | Side-emitting thermoelectric separation LED assembly | |
| CN106257666B (en) | LED filament | |
| CN206584952U (en) | A kind of luminous LED light source unit of double-face side |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |