CN107144546A - Terahertz imaging method based on reflection time domain waveform adding window - Google Patents
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- 238000003384 imaging method Methods 0.000 title claims abstract description 70
- 230000007547 defect Effects 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000001328 terahertz time-domain spectroscopy Methods 0.000 claims abstract description 9
- 238000004458 analytical method Methods 0.000 claims abstract description 8
- 230000002950 deficient Effects 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 210000001367 artery Anatomy 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 210000003462 vein Anatomy 0.000 claims 1
- 239000011229 interlayer Substances 0.000 abstract description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 36
- 239000004810 polytetrafluoroethylene Substances 0.000 description 36
- -1 polytetrafluoroethylene Polymers 0.000 description 18
- 239000010410 layer Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 241000638935 Senecio crassissimus Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000747 cardiac effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011094 fiberboard Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3581—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation
- G01N21/3586—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation by Terahertz time domain spectroscopy [THz-TDS]
Abstract
The invention discloses a kind of terahertz imaging method based on reflection time domain waveform adding window, including herein below：Using the terahertz time-domain spectroscopy imaging system under reflective-mode, sample is scanned, obtain the reflection time domain waveform of each spatial point in scan sample plane, complete reflection time domain waveform is removed after the reflected impulse operation of sample upper surface, carry out Terahertz C-scan horizontal imaging, extract the reflection time domain waveform in defect area and non-defective region, and the imaging of Terahertz B-scan section is carried out to defect area, with reference to both information, analysis sample includes the number and depth location of defect, reflection time domain waveform is carried out using Terahertz C-scan horizontal imaging after windowing process, hierarchy slicing imaging is carried out to sample, more intuitively analyze the defect shape and area of the different interlayers of sample interior.The method is effectively improved THz wave to sample interior interlayer structure and the detectability concealed defects.
Description
Technical field
The present invention relates to Terahertz data processing field, more particularly to a kind of Terahertz based on reflection time domain waveform adding window
Imaging method.
Background technology
Terahertz (Terahertz, abbreviation THz) ripple refers to electromagnetic wave of the frequency in 0.1-10THz.Because THz wave can
To penetrate most of apolar substances, therefore opaque apolar substance can be imaged, detect its internal interlayer structure
And defect.Terahertz time-domain spectroscopy catoptric imaging technology is a kind of typical THz imaging technology.At present, traditional Terahertz
Time-domain spectroscopy catoptric imaging technology is the movement by two-dimensional scan platform, obtains reflected too from each spatial point of sample first
Hertz time domain waveform, then carries out Fourier transform to complete terahertz time-domain waveform, obtains the frequency domain ripple of each spatial point
Shape, finally by the different physical quantities chosen in time domain or frequency-domain waveform, obtains different Terahertz images.During traditional Terahertz
Domain spectral reflectance imaging algorithm has the following disadvantages：(1) Terahertz reflection time domain waveform is that THz wave exists under different delay
The reflected impulse composition at different interfaces in sample, it is generally the case that the reflected impulse of sample upper surface does not include any defect
Information, but its amplitude is far longer than the reflected impulse amplitude at other interfaces, and Fu is being carried out to complete reflection time domain waveform
During vertical leaf transformation, the reflected impulse of sample upper surface will play leading role, can flood sample interior interlayer structure and defect letter
Breath.(2) Terahertz reflection time domain waveform each frequency component after Fourier transform corresponds to a frequency in frequency domain, but often
One frequency component then covers whole time shaft in time domain, thus Fourier transform can not reflect some frequency component occur when
Which time-domain segment of countershaft, i.e. Fourier transform are without any time domain positioning performance.Therefore the frequency-region signal of sample loses the time
Information, it is impossible to distinguish the different reflected at interfaces pulses of sample interior, i.e., can not be layered the knot for embodying the different interfaces of sample interior
Structure and depth information.
The content of the invention
It is an object of the invention to overcome traditional terahertz time-domain spectroscopy catoptric imaging algorithm to sample interior interlayer structure
Deficiency with defects detection can improve in sample there is provided a kind of terahertz imaging method based on reflection time domain waveform adding window
The Detection results of portion's interlayer structure and defect.
The purpose of the present invention is achieved through the following technical solutions：
Based on the terahertz imaging method of reflection time domain waveform adding window, comprise the following steps：
(1) work of terahertz time-domain spectroscopy imaging system is set in a reflective mode enabling, Terahertz camera lens is adjusted, makes in sample
Between depth location be in optimal focal plane.Terahertz catoptric imaging scanning is carried out to sample, obtains every in scan sample plane
The Terahertz reflection time domain waveform of one spatial point；
(2) the Terahertz reflection time domain waveform to sample is analyzed, and obtains sample upper surface reflected impulse complete anti-
The position penetrated in time domain waveform；
(3) Terahertz for removing all spatial points of sample reflects the upper surface reflected impulse of time domain waveform, and uses upper surface
The amplitude of reflected impulse surrounding neighbors replaces removing the amplitude of part, obtains new Terahertz reflection time domain waveform；
(4) Terahertz C-scan horizontal imaging is carried out using the Terahertz reflection time domain waveform newly obtained；
(5) Terahertz C-scan horizontal imaging result is analyzed, during the Terahertz reflection in acquisition defect area and non-defective region
Domain waveform；
(6) it is imaged to carrying out Terahertz B-scan section at defect area, analysis Terahertz B-scan section imaging results can
Primarily determine that the depth location and number of existing defects in sample；
(7) Terahertz B-scan section imaging results are combined, time domain waveform is reflected in analyzing defect region and non-defective region
Constituent, determines position and number of the reflected impulse of fault location in reflection time domain waveform；
(8) analysis result of time domain waveform is reflected according to Terahertz, windowing process is carried out to reflection time domain waveform, obtained not
With time domain segment signal；
(9) Terahertz C-scan horizontal imaging, i.e. Terahertz slice imaging are carried out respectively to each section of time-domain signal；
(10) Terahertz slice imaging result is analyzed, the area and number of sample interior defect is obtained.
Preferably, it is characterised in that：
In step (4), Terahertz C-scan horizontal imaging refers to that the different parameters chosen in time domain or frequency domain enter to sample
Row plane Terahertz two-dimensional imaging.
In step (5), the imaging of Terahertz B-scan section refers to be imaged a certain tangent plane of sample, abscissa generation
Table sample originally horizontally or vertically position, ordinate representative sample depth location.
In step (6), the depth location for calculating defect uses delay inequality method under reflective-mode, and its mathematic(al) representation is：Wherein d is distance of the defect away from sample upper surface, and c is the light velocity in vacuum, and n is sample to be tested refractive index, and Δ t is scarce
The delay inequality fallen between the reflected impulse and sample upper surface reflected impulse at interface.
In step (8), according to the position of reflected impulse, window function is moved along time-domain signal, different time domain section is obtained
Signal.
The method of calculating defect area is in step (10):The total number of pixels of defect area is multiplied by single pixel face
Product, single pixel area is b × b, and wherein b is scan table stepping.
The beneficial effects of the present invention are：First, sample upper surface reflected impulse is eliminated to the different interfaces of sample interior
The influence of reflected impulse, that is, eliminate sample surface information, the structural information for sample interior of having given prominence to the key points；Secondly, to terahertz
Hereby reflection time domain waveform carries out " adding window analysis " and " local spectral analysis ", chooses each section of time domain or the different ginsengs of frequency-region signal
Number carries out Terahertz C-scan horizontal imaging, i.e., carry out hierarchy slicing imaging to sample interior structural information, highlight sample interior
The information of different interfaces.The method can not only carry out slice imaging analysis to sample interior information, moreover it is possible to preferably suppress to make an uproar
Sound, is effectively improved THz wave to sample interior interlayer structure and the detectability of defect.
Brief description of the drawings
Fig. 1 is the terahertz imaging method flow chart based on reflection time domain waveform adding window.
Fig. 2 is the structural representation that Terahertz reflects time-domain spectroscopy imaging system.
Fig. 3 is the imaging samples hum pattern obtained using traditional terahertz imaging algorithm.
Fig. 4 is to remove the imaging samples information obtained after the reflected impulse of sample upper surface using traditional terahertz imaging algorithm
Figure.
Fig. 5 (a) is that reference signal reflects time domain waveform.
Fig. 5 (b) is defect area and non-defective region Terahertz reflection time domain beamformer.
Row section image when Fig. 6 (a) is sample X=25.
Row section image when Fig. 6 (b) is sample X=68.
Fig. 7 (a) is the slice imaging figure of reflection time domain waveform 30-37ps time-domain segments.
Fig. 7 (b) is the slice imaging figure of reflection time domain waveform 48-53ps time-domain segments.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the accompanying drawings with specific embodiment to this
Invention is described in further detail.
Before the terahertz imaging method of the present invention is described in detail, the U.S. Zomega that the present invention is used is introduced first
The terahertz time-domain spectroscopy reflection imaging system of company's production.As shown in Figure 1 and Figure 2, in system femto-second laser 1 middle cardiac wave
A length of 1560nm, pulse width is 80-90fs, and waveform sampling rate is 500Hz, and power is 20-30mW, and maximum delay is 110ps,
Temporal resolution is 0.05ps, and frequency resolution is 11GHz.The operation principle of whole system：First, a branch of Terahertz femtosecond swashs
The pulse signal that light device 1 is launched is two beams by 2 points of beam splitter, stronger a branch of to be used as pump light, elapsed time delay control
Unit 3 incides generation Terahertz short pulse in terahertz transmitter 4；Then focusing and the collimation of off axis paraboloidal mirror 5 are passed through,
It is transferred to detection to focus on, i.e., at the position of sample 9；The weaker light of another beam as detection light, by multiple Terahertz lens 7,
8, at the position for being transferred to sample 9, come the amplitude of the instantaneous electric field that detects terahertz pulse, adjustment scanning terahertz pulse and spy
Time delay between light-metering obtains the waveform that Terahertz electric-field intensity is changed over time, and is transferred to computer 11.With reference to X-Y
Two-dimensional scan platform 10, it is possible to achieve scanned to the catoptric imaging of sample.Too in experimentation, in order to avoid water vapor in air
Influence, terahertz transmitter 4, receiver 6 and sample to be tested 9 are positioned in the seal closure filled with dry air.
Embodiment 1：
Experiment sample used is the epoxy glass fiber plate of Harbin FRP Institute's manufacture, and its main component is
Glass fibre and epoxy resin, wherein fiber content are pressed 0/90 ° of side by multilayer one-way glass fiber cloth in 60-70% or so
To laying is intersected, laminated moulding process is made.Wherein, the thickness of every layer of glass fabric is 0.2mm, and whole sample size is
100mm (length) * 100mm (width) * 3mm (height).In the uniform depth apart from glass mat upper surface 0.9mm (3mm*30%)
It is embedded with square polytetrafluoroethylene (PTFE), 20mm (diameter) * 0.1mm (height) that size is 20mm (length) * 20mm (width) * 0.1mm (height)
Circular polytetrafluoroethylene (PTFE), 20mm (length of side) * 0.1mm (height) equilateral triangle polytetrafluoroethylene (PTFE), 20mm is (between two jiaos
Distance) * 0.1mm (height) pentalpha polytetrafluoroethylene (PTFE).It is equal in the depth apart from fiberboard upper surface 1.8mm (3mm*60%)
Square polytetrafluoroethylene (PTFE), 10mm (diameter) * 0.1mm that size is 10mm (length) * 10mm (width) * 0.1mm (height) are embedded with evenly
The circular polytetrafluoroethylene (PTFE) of (height), 10mm (length of side) * 0.1mm (height) equilateral triangle polytetrafluoroethylene (PTFE), 10mm are (with respect to two jiaos
Between distance) * 0.1mm (height) pentalpha polytetrafluoroethylene (PTFE).Same shape is in the level of the size defect of different depth
Center alignment, the upper and lower surface of sample is smooth, does not see internal structure and defect completely from sample surface.
(1) laser and computer etc. are opened, it is reflection mould to set the mode of operation of terahertz time-domain spectroscopy imaging system
Formula, sample to be tested is placed in test position as shown in Figure 2, and it is 1mm to set scanning stepping, and scan area is 100*
100mm2, start two-dimensional scan platform, obtain the Terahertz reflection time domain waveform of all spatial points in scan sample plane.
(2) Fourier transform is carried out to complete Terahertz reflection time domain waveform, using 0-5THz Frequency point amplitude imagings,
The picture preferable 0.26THz amplitude imagings of information effect are chosen to, as shown in Figure 3.
(3) Terahertz for removing all spatial points of sample reflects the upper surface reflected impulse of time domain waveform, and uses upper surface
The amplitude of reflected impulse surrounding neighbors replaces removing the amplitude of part, obtains new Terahertz reflection time domain waveform.
(4) imaging algorithm same with step (2) is used to new Terahertz reflection time domain waveform, as a result as shown in Figure 4.
The internal flaw imaging effect of Fig. 4 samples is substantially better than Fig. 3, lacks we can observe that being hidden in the big polytetrafluoroethylene (PTFE) of first layer
The small polytetrafluoroethylene (PTFE) defect sagged, is capable of the horizontal level of preliminary judgement defect.
(5) obtain and be free of pixel position (13,13) in defect area, contain pixel position in a layer defects region
(19,34) and the complete reflection time domain waveform containing pixel position (24,25) in two layers of defect area, as shown in Figure 5.Fig. 5 (a)
Reference signal be focus place metallic plate survey reflection time domain waveform.
(6) to the X=25 in Fig. 4, X=68 enters the imaging of ranks section, as a result as shown in Figure 6.From Fig. 6 can from sample
There are two obvious reflecting interfaces inside this, the delay inequality of sample upper surface to the big polytetrafluoroethylene (PTFE) defect of first layer is Δ t1=
13ps, the delay inequality of sample upper surface to the small polytetrafluoroethylene (PTFE) defect of the second layer is Δ t2=28ps, by formulaCalculate
The depth for obtaining the big polytetrafluoroethylene (PTFE) defect of first layer is 0.91mm, and the depth of the small polytetrafluoroethylene (PTFE) defect of the second layer is
1.96mm, the depth location with pre-buried defect is basically identical.
(7) Fig. 5 reflection time domain waveform and Fig. 6 section imaging analysis are combined, for non-defective region, Terahertz reflection
The composition of time domain waveform is as follows：
Ar=Ar1+Ar4
Wherein, Ar1Correspondence air and the interface reflected impulse of sample upper surface, are in 18-25ps position in time domain waveform
Put, Ar4The interface reflected impulse of correspondence sample lower surface and air, is in 59-67ps position in time domain waveform.
Region for comprising only individual layer defect, the composition of Terahertz reflection time domain waveform is as follows：
Ar'=Ar1+Ar2+Ar4
Wherein, Ar2It is that glass mat and the reflected impulse and big polytetrafluoroethylene (PTFE) of big polytetrafluoroethylene (PTFE) defect upper surface lack
Sag being superimposed of surface and the reflected impulse of glass mat, because the thickness of defect is less than terahertz time-domain spectroscopy imaging system
Depth resolution, therefore superimposed pulse A is shown as in time domain waveformr2, 30-37ps position is in time domain waveform.
For the region containing two layer defects, the composition of Terahertz reflection time domain waveform is as follows：
Ar "=Ar1+Ar2+Ar3+Ar4
Wherein, Ar3It is that glass mat and the reflected impulse and small polytetrafluoroethylene (PTFE) of small polytetrafluoroethylene (PTFE) defect upper surface lack
Sag being superimposed of surface and the reflected impulse of glass mat, 48-53ps position is in time domain waveform.It is all in sample
In the time domain waveform of spatial point, upper surface reflected impulse delay 68ps or so occurs in that a small-pulse effect peak, and contrast is with reference to letter
Number, it is believed that pulse herein is system information, unrelated with sample information.
(8) Gauss is selected according to the constituent of reflected impulse in this embodiment to complete reflection time domain waveform adding window
Window function, it is different with width acquisition with the center of width adjustment window function according to the different reflected impulse positions at interface of sample interior
Time domain segment signal.
(9) Terahertz C-scan horizontal imaging is carried out to the different time domain segment signal of interception.In this embodiment, we cut
30-37ps and 48-53ps time-domain signal have been taken, slice imaging has been carried out using the peak-peak of each time-domain segment, as a result such as Fig. 7
It is shown.
(10) according to Fig. 7 analyzing defect sizes, big square defect area is about 20*20mm2Left and right, small square defect
Area is about 10*10mm2Left and right；The length of side of big triangle is about 20mm, and the length of side of small triangle is about 10mm；Big circular flaw
Diameter be about 20mm, the diameter of small circular defect is about 10mm；Big pentalpha is about 20mm with respect to the distance between two jiaos, small
Pentalpha is about 10mm with respect to the distance between two jiaos；Terahertz imaging detects defect size and pre-buried defect size basic one
Cause.
Claims (6)
1. a kind of terahertz imaging method based on reflection time domain waveform adding window, comprises the following steps：
(1) work of terahertz time-domain spectroscopy imaging system is set in a reflective mode enabling, Terahertz camera lens is adjusted, made deep in the middle of sample
Spend position and be in optimal focal plane.Terahertz reflection scanning imagery is carried out to sample, each sky in scan sample plane is obtained
Between put Terahertz reflection time domain waveform；
(2) the Terahertz reflection time domain waveform to sample is analyzed, and obtains sample upper surface reflected impulse in complete reflection
Position in domain waveform；
(3) Terahertz for removing all spatial points of sample reflects the upper surface reflected impulse of time domain waveform, and is reflected with upper surface
The amplitude of pulse surrounding neighbors replaces removing the amplitude of part, obtains new Terahertz reflection time domain waveform；
(4) Terahertz C-scan horizontal imaging is carried out using the Terahertz reflection time domain waveform newly obtained；
(5) Terahertz C-scan horizontal imaging result is analyzed, defect area and the Terahertz reflection time domain ripple in non-defective region is obtained
Shape；
(6) it is imaged to carrying out Terahertz B-scan section at defect area, analysis Terahertz B-scan section imaging results can be preliminary
Determine the depth location and number of existing defects in sample；
(7) Terahertz B-scan section imaging results are combined, the composition of time domain waveform is reflected in analyzing defect region and non-defective region
Composition, determines position and number of the reflected impulse of fault location in reflection time domain waveform；
(8) analysis result of time domain waveform is reflected according to Terahertz, windowing process is carried out to reflection time domain waveform, when obtaining different
Domain segment signal；
(9) Terahertz C-scan horizontal imaging, i.e. Terahertz slice imaging are carried out respectively to each section of time-domain signal；
(10) Terahertz slice imaging result is analyzed, the area and number of sample interior defect is obtained.
2. a kind of terahertz imaging method based on reflection time domain waveform adding window according to right 1, it is characterised in that：Step
(4) different parameters that Terahertz C-scan horizontal imaging refers to choose in time domain or frequency domain in carry out plane Terahertz two to sample
Dimension imaging.
3. a kind of terahertz imaging method based on reflection time domain waveform adding window according to right 1, it is characterised in that：Step
(5) imaging of Terahertz B-scan section refers to be imaged a certain tangent plane of sample in, and abscissa representative sample is horizontally or vertically
Position, ordinate representative sample depth location.
4. a kind of terahertz imaging method based on reflection time domain waveform adding window according to right 1, it is characterised in that：Step
(6) depth location that defect is calculated in uses delay inequality method under reflective-mode, and its mathematic(al) representation is：Wherein d is
Distance of the defect away from sample upper surface, c is the light velocity in vacuum, and n is sample to be tested refractive index, and Δ t is the reflection arteries and veins of defect interface
Delay inequality between punching and sample upper surface reflected impulse.
5. a kind of terahertz imaging method based on reflection time domain waveform adding window according to right 1, it is characterised in that：Step
(8) in, according to the position of reflected impulse, window function is moved along time-domain signal, different time domain segment signal is obtained.
6. a kind of terahertz imaging method based on reflection time domain waveform adding window according to right 1, it is characterised in that：Step
(10) method of calculating defect area is in:The total number of pixels of defect area is multiplied by single pixel area, single pixel area
For b × b, wherein b is scan table stepping.
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