CN107130796A - A kind of clean room wafer board flatness control methods - Google Patents
A kind of clean room wafer board flatness control methods Download PDFInfo
- Publication number
- CN107130796A CN107130796A CN201710414868.XA CN201710414868A CN107130796A CN 107130796 A CN107130796 A CN 107130796A CN 201710414868 A CN201710414868 A CN 201710414868A CN 107130796 A CN107130796 A CN 107130796A
- Authority
- CN
- China
- Prior art keywords
- flatness
- wafer
- wafer cone
- formwork
- clean room
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
- E04G15/00—Forms or shutterings for making openings, cavities, slits, or channels
- E04G15/06—Forms or shutterings for making openings, cavities, slits, or channels for cavities or channels in walls of floors, e.g. for making chimneys
- E04G15/063—Re-usable forms
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Mechanical Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A kind of clean room wafer board flatness control methods, including five flatness set-up procedures, be respectively：First time flatness adjustment, second of flatness adjustment after completion keel and building template laying to the building template absolute altitude are being carried out after the completion of supporting frame is built to jacking, the third time flatness that the wafer cone formwork upper surface is carried out is being adjusted after completing the laying of wafer cone formwork, the 4th flatness that the wafer cone formwork absolute altitude is carried out adjusted again after reinforcing bar colligation is completed, and the 5th flatness adjustment carried out to the wafer cone formwork absolute altitude carried out after casting concrete before concrete initial set.Its advantage is：By new material, the use of new technology, the wafer board structure construction time is shortened in terms of the duration；Each operation formation specification；Rational construction reduces follow-up repairing, reduces construction cost.
Description
Technical field
The present invention relates to a kind of building technology of clean room, the waffle plate flatness control of more particularly to a kind of clean room
Method processed.
Background technology
Clean room also turn into dust-free workshop, refer to by the particulate in the air in the range of certain space, pernicious gas,
The contaminant exclusions such as bacterium, and by the distribution of indoor temperature, cleanliness factor, pressure, air velocity and air, noise vibration and illumination,
Factory building of the Electrostatic Control in a certain range of needs, mainly as the job shop to precision electronic device element.
At present, main construction method is two kinds of civil engineering formula and assembled, and mainly uses assembled, assembling therein
Formula clean room has three-level air filtering system, and its ceiling has return air construction, and existing construction process mainly has utilization
Wafer cone carries out pouring construction as mould of boxing out, and has a variety of advantages by the use of wafer cone as mould of boxing out, such as shaping effect
Rate is high, and the engineering time is short, but root is according to the survey, this at present to carry out asking in the presence of many in work progress using wafer cone
Topic：
1st, wafer cone requires high for the smooth degree of reference plane, and wafer cone is after mounting because sedimentation or concrete are squeezed
Pressure-volume is easily shifted over, and causes top surface out-of-flatness, and difficulty is caused to the ground construction of superstructure；
2nd, in existing construction technology due to there is error when supporting frame is built, cause after the completion of later stage process by
Very large deviation is caused in the accumulation of error, or even needs reconstruction of doing over again；
3rd, we have found that because the use of wafer cone is higher to flatness requirement in existing construction method, it is therefore desirable to
Absolute altitude is repeatedly measured, but the regulation of existing measurement process is very unreasonable, is frequently present of measurement procedure arrangement in construction work
Before sequence, cause the result of measurement to be failed with after construction, then measure herein, cause wasting manpower and material resources.
The content of the invention
The present invention can avoid the clean room China of drawbacks described above to make up the deficiencies in the prior art there is provided a kind of
Husband's plate flatness control method.
The present invention is achieved through the following technical solutions：
A kind of clean room wafer board flatness control methods, including four flatness set-up procedures, be respectively：Complete
To the first time flatness adjustment on the building template surface, after the laying of wafer cone formwork is completed after being laid into building template
To the wafer cone formwork upper surface carry out second of flatness adjustment, complete reinforcing bar colligation after again to the wafer cone
Formwork upper surface carry out third time flatness adjustment, and carried out in casting concrete to the wafer cone formwork upper table
The 4th flatness adjustment that face is carried out.
As a preferred technical solution of the present invention, the supporting frame before the first time flatness set-up procedure is taken
Need to carry out supporting frame absolute altitude during building, and carry out after the completion of building the flatness adjustment to supporting frame.
As a preferred technical solution of the present invention, in the first time flatness set-up procedure, specific method is
Construction area is divided into area no more than 500m2Several regions, in each region choose no less than 20 measurement click through
Rower is high and records, and is then adjusted according to record, continuous repeated measurement and adjustment, until reaching that standard passes through acceptance(check)
After could carry out lay wafer cone formwork process.
As a preferred technical solution of the present invention, in second of flatness set-up procedure, specific method is
The cylinder cap of the wafer cone formwork is measured and recorded to the difference in height between adjacent wafer cone cylinder cap after tight, Ran Hougen
It is adjusted according to overall record result to meeting standard.
As a preferred technical solution of the present invention, in the third time flatness set-up procedure, specific method is
Height is measured to the cylinder cap of the wafer cone formwork using spirit level, pair with the level difference of adjacent wafer cone more than 5mm
Wafer cone be adjusted.
As a preferred technical solution of the present invention, in the 4th flatness set-up procedure, specific method is
The height of concrete is higher than the wafer cone formwork height 3-5mm during casting concrete, and concrete is avoided in casting process
Wafer cone formwork is directly impacted, and the larger wafer cone formwork of elevation difference is adjusted using the buoyancy and pressure of concrete, directly
An absolute altitude is carried out again after to concreting terminating to waffle cylinder mould shell to check.
It is used as a preferred technical solution of the present invention, when the flatness to supporting frame is adjusted, the work used
Tool is total powerstation and laser collimator.
It is big using length in the 4th flatness set-up procedure as a preferred technical solution of the present invention
Struck off in 2 meters of darbys according to the position higher than the wafer cone formwork height 3-5mm.
As a preferred technical solution of the present invention, after the completion of the 4th flatness set-up procedure, in addition it is also necessary to
Carry out carrying out concrete polishing receipts light, it includes mechanical grinding and receives light with artificial, until concrete surface and the wafer cone
Untill upper surface flush.
Compared with prior art, the present invention is had an advantageous effect in that：
1st, in the present invention, by having the adjustment of four flatness and flatness adjustment to supporting frame altogether and last to mixed
Light is received in the polishing for coagulating soil, can accurately ensure that the flatness of construction area plane meets regulation requirement, and advised in the present invention
The selection of fixed flatness adjustment process also very rationally, can also save process, so as to improve while construction quality is improved
Efficiency of construction.
2nd, the specific method for the flatness adjustment being further limited in the present invention in the laying of building template, Neng Goufang
Error only is produced in initial building template process, and causes to form the accumulation of error in subsequent handling, construction quality is influenceed.
3rd, in the present invention, due to after the laying of wafer cone formwork, carrying out level measurement to avoid due to waffle cylinder mould
Shell itself has that scale error or building template are not smooth enough and wafer cone formwork difference that produce is high larger, to previous procedure
Check problem is served, and guarantee is formed to the development of latter procedure.
4th, due to that during assembling reinforcement wafer cone formwork can be made to be squeezed or collide and be subjected to displacement, it is therefore desirable to
Measurement absolute altitude again is carried out to waffle cylinder mould shell before casting concrete, adjustment does not meet the wafer cone formwork of specification.
5th, because concreting in the present invention is primary concreting, pour more uniformly, and pouring time control
System pours height and is more than wafer cone height 3-5mm, can receive light to the heavy reality of concrete and bleeding and follow-up polishing and cause thickness
The compensation of loss is spent, eliminates and subsequently also needs to pour process once again, the engineering time can be greatlyd save.
6th, in the construction technology of the present invention, by the way that receipts light is polished for a plurality of times to concrete upper surface, substantially increase flat
Whole degree, and the absolute altitude of wafer cone and concrete upper surface measure and record again, it can not only examine and pour operation
Construction quality, moreover it is possible to which the construction to follow-up epoxy resin ground provides reference.
In summary, by levelling adjustment of the concrete regulation to correlation surface, Neng Gouxian in the process that wafer board is constructed
The raising construction quality of work simultaneously shortens the duration.
Embodiment
With reference to embodiment, the invention will be further described：
At present, carrying out pouring wafer board and generally comprising the steps using wafer cone formwork：
(1) supporting frame is built；
(2) building template is laid；
(3) wafer cone formwork is laid；
(4) wafer cone formwork is reinforced；
(5) assembling reinforcement；
(6) casting concrete；
(7) light is received to concrete polishing；
(8) supporting frame and building template are removed.
The present invention is in above-mentioned steps, specifically to increase following flatness set-up procedure, be respectively：Complete building template
To the first time flatness adjustment on the building template surface, after the laying of wafer cone formwork is completed to the waffle after laying
Cylinder mould shell upper surface carry out second of flatness adjustment, complete reinforcing bar colligation after again to the wafer cone formwork upper surface
The third time flatness adjustment of progress, and carried out to the wafer cone formwork upper surface the carried out in casting concrete
Four flatness adjustment.
Wherein, need to enter supporting frame in the supporting frame build process before the first time flatness set-up procedure
Rower is high, contour especially for that will carry out sign with infrared laser machine to each tie point of support frame as described above body and vertical rod
Line simultaneously carries out adjusting the flatness of supporting frame after the completion of building.
Further, in the first time flatness set-up procedure, specific method is that construction area is divided into area not
More than 500m2Several regions, in each region choose no less than 20 measurement points and utilize total powerstation and laser alignment
Instrument carries out absolute altitude and recorded, and is then adjusted according to record, continuous repeated measurement and adjustment, until reaching standard by examination
It could carry out laying wafer cone formwork process after qualified.So as to ensure that the flatness of the laying process in building template meets
Specification, and then eliminate the accumulation of error.
Further, in second above-mentioned of flatness set-up procedure, first manually can tentatively it be checked using ruler adjacent
Cylinder cap between high margin, then by the cylinder cap of the wafer cone formwork after tight to adjacent wafer cone cylinder cap between difference in height
Measure and record, be then adjusted according to overall record result to meeting standard.
Extrude or collide because assembling reinforcement can be produced to waffle cylinder mould shell, in order to prevent wafer cone formwork from deforming and position
Move, and reduce error, it is necessary to which first wafer cone formwork is fixed, fixed form can be used by bolt to adjacent waffle
Cylinder mould shell, which is attached and silicone adhesive is smeared in gap, is filled bonding, in the third time flatness set-up procedure,
Specific method is that height is measured to the cylinder cap of the wafer cone formwork using spirit level, the elevation difference pair with adjacent wafer cone
It is adjusted away from the wafer cone more than 5mm.
In ensuing 4th flatness set-up procedure is implemented, cause to miss to offset concrete water bleeding and sedimentation
Difference, in casting concrete, the height of concrete is higher than the wafer cone formwork height 3-5mm, avoids mixing in casting process
Solidifying soil directly impacts wafer cone formwork, and is adjusted the larger waffle cylinder mould of elevation difference using the buoyancy and pressure of concrete
Shell, the darby for being more than 2 meters using length is struck off according to the position higher than the wafer cone formwork height 3-5mm, until mixed
Solidifying soil carries out an absolute altitude to waffle cylinder mould shell and checked again after pouring end.
In order to do not influence during construction in later period using the plane as epoxy resin flow automatically ground flatness, at described 4th time
After the completion of flatness set-up procedure, in addition it is also necessary to carry out carrying out concrete polishing receipts light, it includes mechanical grinding and receives light with artificial,
Untill concrete surface and the wafer cone upper surface flush.
Claims (9)
1. a kind of clean room wafer board flatness control methods, it is characterized in that, including four flatness set-up procedures, respectively
It is：First time flatness to the building template surface after building template laying is completed adjusts, completes wafer cone formwork
Laying after to the wafer cone formwork upper surface carry out second of flatness adjustment, complete reinforcing bar colligation after again to institute
State wafer cone formwork upper surface progress third time flatness adjustment, and carried out in casting concrete to the wafer cone
The 4th flatness adjustment that formwork upper surface is carried out.
2. a kind of clean room wafer board flatness control methods according to claim 1, it is characterized in that, described
Need to carry out absolute altitude to supporting frame in supporting frame build process before flatness set-up procedure, and after the completion of building
The flatness of supporting frame is adjusted.
3. a kind of clean room wafer board flatness control methods according to claim 1, it is characterized in that, described
In flatness set-up procedure, specific method is that construction area is divided into area no more than 500m2Several regions, every
No less than 20 measurement points are chosen in individual region to carry out absolute altitude and record, and are then adjusted according to record, continuous repeated measurement
And adjustment, until reaching that standard could carry out laying wafer cone formwork process after acceptance(check).
4. a kind of clean room wafer board flatness control methods according to claim 1, it is characterized in that, described
In secondary flatness set-up procedure, specific method be by the cylinder cap of the wafer cone formwork it is tight after to adjacent wafer cone cylinder cap it
Between difference in height measure and record, be then adjusted according to overall record result to meeting standard.
5. a kind of clean room wafer board flatness control methods according to claim 1, it is characterized in that, described
In three flatness set-up procedures, specific method is that height is measured to the cylinder cap of the wafer cone formwork using spirit level,
Pair wafer cone for being more than 5mm with the level difference of adjacent wafer cone is adjusted.
6. a kind of clean room wafer board flatness control methods according to claim 1, it is characterized in that, described
In four flatness set-up procedures, the height of concrete is higher than the wafer cone formwork height when specific method is casting concrete
3-5mm is spent, avoids concrete directly to impact wafer cone formwork, and the buoyancy using concrete and pressure progress in casting process
The larger wafer cone formwork of elevation difference is adjusted, is answered until concreting carries out an absolute altitude again after terminating to waffle cylinder mould shell
Core.
7. a kind of clean room wafer board flatness control methods according to claim 2, it is characterized in that, to support
During the flatness adjustment of support body, the instrument used is total powerstation and laser collimator.
8. a kind of clean room wafer board flatness control methods according to claim 1 or 6, it is characterized in that, in institute
State in the 4th flatness set-up procedure, be more than 2 meters of darby according to higher than the wafer cone formwork height 3-5mm using length
Position struck off.
9. a kind of clean room wafer board flatness control methods according to claim 1 or 6, it is characterized in that, in institute
After the completion of stating the 4th flatness set-up procedure, in addition it is also necessary to carry out carrying out polishing to concrete to receive light, it include mechanical grinding with
It is artificial to receive light, untill concrete surface and the wafer cone upper surface flush.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710414868.XA CN107130796A (en) | 2017-06-05 | 2017-06-05 | A kind of clean room wafer board flatness control methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710414868.XA CN107130796A (en) | 2017-06-05 | 2017-06-05 | A kind of clean room wafer board flatness control methods |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107130796A true CN107130796A (en) | 2017-09-05 |
Family
ID=59733759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710414868.XA Pending CN107130796A (en) | 2017-06-05 | 2017-06-05 | A kind of clean room wafer board flatness control methods |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107130796A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110835998A (en) * | 2019-11-22 | 2020-02-25 | 上海宝冶集团有限公司 | Method for improving epoxy construction efficiency of cast-in-situ floor waffle holes |
| CN113700273A (en) * | 2021-09-02 | 2021-11-26 | 中国建筑第八工程局有限公司 | Cheese board of large electronic clean workshop and construction method |
| CN115898004A (en) * | 2022-11-17 | 2023-04-04 | 中建八局第四建设有限公司 | One-time precise and flat construction method for waffle-tube ultra-deep ultra-thick ribbed multi-hole beam plate surface |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100041948A (en) * | 2008-10-15 | 2010-04-23 | 신세계건설(주) | One way waffle slab system continued by post-tensioning and post-tensioning method of the same |
| CN102359272A (en) * | 2011-08-15 | 2012-02-22 | 中国建筑第八工程局有限公司 | Construction method for waffle slab by using veitch cylinder as hole reservation die |
| CN102433996A (en) * | 2011-09-29 | 2012-05-02 | 中国建筑第八工程局有限公司 | Method for constructing wafer board with SMC (Sheet Molding Compound) hole forming mould |
-
2017
- 2017-06-05 CN CN201710414868.XA patent/CN107130796A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100041948A (en) * | 2008-10-15 | 2010-04-23 | 신세계건설(주) | One way waffle slab system continued by post-tensioning and post-tensioning method of the same |
| CN102359272A (en) * | 2011-08-15 | 2012-02-22 | 中国建筑第八工程局有限公司 | Construction method for waffle slab by using veitch cylinder as hole reservation die |
| CN102433996A (en) * | 2011-09-29 | 2012-05-02 | 中国建筑第八工程局有限公司 | Method for constructing wafer board with SMC (Sheet Molding Compound) hole forming mould |
Non-Patent Citations (4)
| Title |
|---|
| 刘凡: "奇氏桶华夫板施工", 《福建建筑》 * |
| 孙琼、万焜: "FRP华夫板在厂房工程的应用", 《施工技术》 * |
| 崔卓立等: "浅谈华夫板SMC模具施工技术", 《广东科技》 * |
| 苏川等: "某电子洁净厂房华夫板施工技术", 《施工技术》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110835998A (en) * | 2019-11-22 | 2020-02-25 | 上海宝冶集团有限公司 | Method for improving epoxy construction efficiency of cast-in-situ floor waffle holes |
| CN113700273A (en) * | 2021-09-02 | 2021-11-26 | 中国建筑第八工程局有限公司 | Cheese board of large electronic clean workshop and construction method |
| CN115898004A (en) * | 2022-11-17 | 2023-04-04 | 中建八局第四建设有限公司 | One-time precise and flat construction method for waffle-tube ultra-deep ultra-thick ribbed multi-hole beam plate surface |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103938796B (en) | Cast-in-situ reinforced concrete column construction | |
| CN107130796A (en) | A kind of clean room wafer board flatness control methods | |
| CN107023104A (en) | A kind of wafer board construction technology for clean room | |
| CN108532969B (en) | Profile steel supporting device for loading hole embedded part and construction method of profile steel supporting device | |
| CN106584654A (en) | Production process for prefabricated reinforced concrete duct pieces | |
| CN106401207B (en) | The overlapping connection structure and its construction method on pillar basis are added for existing building | |
| CN108643217B (en) | Construction method for high-speed railway roadbed contact net stand column foundation | |
| CN110409799B (en) | Wind tunnel fair-faced concrete construction process | |
| CN106320715B (en) | A kind of construction method of installation of the I-shaped inclined-plane built-in fitting of large size | |
| CN102433996A (en) | Method for constructing wafer board with SMC (Sheet Molding Compound) hole forming mould | |
| CN106121236B (en) | Floor bar protective layer and structural elevation integrated control method | |
| CN218508722U (en) | Shock insulation buttress positioning pouring structure | |
| CN110666958A (en) | Floor prefabricated part production process | |
| CN108661313A (en) | A kind of cast-in-place linkage section mould plate supporting device of tool-type concrete folding plate | |
| CN206513014U (en) | A kind of sleiding form device | |
| CN108103936B (en) | The method that prefabricated bent cap is installed on column | |
| CN1427123A (en) | Manufacturing technology of straddle type single rail prestressed reinforced concrete rail beam | |
| CN108677722A (en) | Hollow High Pier with Thin Wall stub top section construction technology | |
| CN110409800B (en) | High-precision formwork construction method for cast-in-situ bare concrete wind tunnel | |
| CN108214824A (en) | Tower method for manufacturing component, tower component and the method for building tower | |
| CN112458905A (en) | Splicing adjustment method for prefabricated capping beam and prefabricated stand column | |
| CN109025256B (en) | High-rise building 3D printing device connected with steel platform and construction method | |
| CN215630024U (en) | Pipeline engineering backfill layer thickness control tool | |
| WO2021103895A1 (en) | Pre-embedded assembly type expansion joint ultra-long installation suspension leveling positioning system and construction method | |
| CN208718360U (en) | A kind of cast-in-place linkage section mould plate supporting device of tool-type concrete folding plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170905 |