CN107023104A - A kind of wafer board construction technology for clean room - Google Patents
A kind of wafer board construction technology for clean room Download PDFInfo
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- CN107023104A CN107023104A CN201710415045.9A CN201710415045A CN107023104A CN 107023104 A CN107023104 A CN 107023104A CN 201710415045 A CN201710415045 A CN 201710415045A CN 107023104 A CN107023104 A CN 107023104A
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B5/00—Floors; Floor construction with regard to insulation; Connections specially adapted therefor
- E04B5/48—Special adaptations of floors for incorporating ducts, e.g. for heating or ventilating
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
- E04G15/00—Forms or shutterings for making openings, cavities, slits, or channels
- E04G15/06—Forms or shutterings for making openings, cavities, slits, or channels for cavities or channels in walls of floors, e.g. for making chimneys
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
- E04G15/00—Forms or shutterings for making openings, cavities, slits, or channels
- E04G15/06—Forms or shutterings for making openings, cavities, slits, or channels for cavities or channels in walls of floors, e.g. for making chimneys
- E04G15/061—Non-reusable forms
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The present invention relates to a kind of building technology of clean room, more particularly to a kind of wafer board construction technology for clean room.Its main technical characteristic is using the wafer cone group at least with four wafer cones, primary and secondary keel are set up on scaffold after the completion of scaffold is built, the primary and secondary keel are 50 × 50 × 3mm square through-pipe, and wafer cone group is also fixed after laying waffle tube template, and in colligation waffle beam reinforcing bar thereon.Before and after colligation waffle beam reinforced process level measurement and adjustment will be carried out to wafer cone upper surface.The present invention is had an advantageous effect in that：Wafer cone group is not easily susceptible to impact or floats and be subjected to displacement, substantially increase efficiency of construction, flatness control is easier, primary concreting, and uniform quality simultaneously improves efficiency, substantially increases construction quality.
Description
Technical field
The present invention relates to a kind of building technology of clean room, a kind of more particularly to wafer board for clean room is applied
Work technique.
Background technology
Clean room is also referred to as dust-free workshop, refers to the particulate in the air in the range of certain space, You Haiqi
The contaminant exclusions such as body, bacterium, and by the distribution of indoor temperature, cleanliness factor, pressure, air velocity and air, noise vibration and photograph
Factory building of the bright, Electrostatic Control in a certain range of needs, mainly as the job shop to precision electronic device element.
At present, main construction method is two kinds of civil engineering formula and assembled, and mainly uses assembled, dress therein
There is three-level air filtering system with formula clean room, its ceiling has return air construction, existing construction process is mainly favourable
Pouring construction is carried out as mould of boxing out with wafer cone, but root is according to the survey, current this form of construction work is asked in the presence of many
Topic：
1st, wafer cone requires high for the smooth degree of reference plane, freestanding wafer cone after mounting due to sedimentation or
Person's concrete extrusion is easily shifted over, and causes top surface out-of-flatness, and difficulty is caused to the ground construction of superstructure；
2nd, flitch largely is used as support member in existing construction technology, although flitch cost is relatively low, but it makes
Deformation is very easy in even to degenerate；
3rd, in existing construction technology, wafer cone is that assembling is set, so wanting to keep its flatness very tired
Hardly possible is, it is necessary to repeatedly levelling adjustment；
4th, the structural strength of wafer cone is big, but toughness is poor, is highly susceptible to collide and damage in construction；
5th, wafer cone bottom surface easily produces gap after current construction method is built, and causes dust in clean room exceeded；
6th, in the range of requirement of the receipts face technique of concrete to waffle plate flatness is very high, it is necessary to reach 3m × 3m
Flatness is less than 3mm standard, and existing construction is often extremely difficult to；
7th, currently without the standardized construction scheme for forming system, the building materials in work progress are caused to waste serious, construction
Quality is difficult to ensure that.
In summary, existing waffle board construction method larger, the problem of effect is poor that there is error.
The content of the invention
The present invention in order to make up the deficiencies in the prior art there is provided a kind of construction cost it is low, it is effective reduction the construction period simultaneously
And significantly improve the wafer board construction technology for clean room of clean effect.
The present invention is achieved through the following technical solutions：
A kind of wafer board construction technology for clean room, comprises the following steps：
(1) scaffold is set up；
(2) building template is laid on scaffold；
(3) wafer cone template is laid in template；
(4) disturbing concrete；
(5) concrete finishing polishing；
(6) scaffold and template are removed；
In the step (3), the waffle tube template is the wafer cone group at least with four wafer cones, and
Also include step after the step (3)：
(3.1) fixed wafer cone group
Specific method is that two groups of adjacent wafer cones are spirally connected by screw or bolt, then by wafer cone group it
Between gap be filled by binding agent and cover tightly the cylinder cap of the wafer cone；
(3.2) level measurement and adjustment are carried out to wafer cone upper surface
Certain point is fixed on laser leveler and sets original absolute altitude, is positioned over often by the graduated scale with receiver
Record and be accordingly finely adjusted after individual measurement point surface, receiver feedback data；
(3.3) colligation waffle beam reinforcing bar
First maked somebody a mere figurehead around the wafer cone group along the direction of beam and primary and secondary beam steel and colligation are set, then set respectively
North-south and transmeridional girt strip and colligation are put, makes the waffle beam reinforcing bar that groined type shape is formed around the wafer cone；
(3.4) absolute altitude is carried out to wafer cone upper surface to measure and adjust
, it is necessary to which absolute altitude is adjusted again to wafer cone upper surface after the completion of rib beam steel bar colligation.
As a preferred technical solution of the present invention, the scaffold be total sub-semigroup or disk buckle type scaffold,
And jacking is provided with the scaffold and by upper plane leveling.
As a preferred technical solution of the present invention, step is also included after the step (1)：(1.1) in the pin
Primary and secondary keel are set up in hand cradle, the primary and secondary keel are 50 × 50 × 3mm square through-pipe.
As a preferred technical solution of the present invention, in the step (4) concrete pour as primary concreting and
The absolute altitude 3-5mm that height is more than the wafer cone upper surface is poured, and using spirit level or Geoplane to concrete surface
Flatness controlled at any time.
As a preferred technical solution of the present invention, step (5) the concrete finishing polishing includes following step
Suddenly：
(5.1) when concrete reaches critical initial setting time using disc sander and according to pour order carry out machinery beat
Mill receives light；
(5.2) mechanical grinding is received after light using artificial further to being carried out at the edge of wafer cone and concrete out-of-flatness
Fine grinding.
As a preferred technical solution of the present invention, in the step (3), the laying order of the wafer cone group is
Laid from construction area center to surrounding.
As a preferred technical solution of the present invention, the step (6), which removes scaffold and template, includes following step
Suddenly：
(6.1) dismounting of scaffold cross bar：When the intensity of concrete reaches the 100% of design strength standard value, carry out
Whole cross bars of scaffold are removed, and dismounting order is carried out by four circumferential centers of construction area；
(6.2) dismounting of scaffold upright rod, keel and template：After whole cross bars of scaffold are removed, along secondary joist
Direction carry out dismounting vertical rod, and remove primary and secondary keel and template therewith；
(6.3) after form removable wafer cone processing：After form removal, the spillage of wafer cone group is stitched with sander
At gap and the polishing such as residue is clean, and fluid sealant blind is used, finally strike off fluid sealant.
As a preferred technical solution of the present invention, implement after the step (5.2), in addition it is also necessary to carry out next step：
(5.3) to pouring after the completion of concrete absolute altitude checked and recorded.
As a preferred technical solution of the present invention, step is also included after the step (2)：(2.1) built to described
The absolute altitude and flatness of building mould, which are measured, to be checked, and is entered specifically by using whole station type electronic distance meter, laser collimator
Row measurement, and it is less than 500m in each area2Region in measurement point be no less than 20.
As a preferred technical solution of the present invention, the building template is the overlay film wood plywood that thickness is 15mm.
Compared with prior art, the present invention is had an advantageous effect in that：
1st, the present invention using wafer cone group be used as box out mould carry out pour wafer board, due to wafer cone group compared to
The monotubular wafer cone globality of prior art is stronger, and intensity is higher, and stability preferably, not only substantially reduces the engineering time, also
The flatness after laying wafer cone group can be improved.Further, since the structural advantage of the wafer cone group, is first carried out in construction
Laying, then carries out assembling reinforcement, because reinforcing bar is set in wafer cone group, to wafer cone before casting concrete
Group forms pressure so that in follow-up casting concrete, wafer cone group is not easily susceptible to impact or floats and be subjected to displacement.
2nd, the scaffold is further limited in the present invention as total sub-semigroup or disk buckle type scaffold, Neng Gouda
To fast construction and the effect removed, efficiency of construction is substantially increased, and due to being provided with jacking on the scaffold, can
Leveling is carried out to upper plane by the jacking, the construction requirement of next step is met.
3rd, in the present invention, because the square through-pipe using metal material is as primary and secondary keel, instead of of the prior art
Flitch leads to, because its structural strength is big, therefore the flatness of laying building template is easier control, it is to avoid because flitch is logical
It is easily bent even rotten defect.
4th, because concreting in the present invention is primary concreting, pour more uniformly, and pouring time control
System pours height and is more than wafer cone height 3-5mm, can receive light to the heavy reality of concrete and bleeding and follow-up polishing and cause thickness
The compensation of loss is spent, eliminates and subsequently also needs to pour process once again, the engineering time can be greatlyd save.
5th, in the construction technology of the present invention, by the way that receipts light is polished for a plurality of times to concrete upper surface, substantially increase flat
Whole degree, so that the basis for the epoxy resin ground construction built to the follow-up surface as last layer.
6th, the laying by wafer cone group in the construction disclosed in the present invention and the dismounting order of scaffold and template,
Efficiency of construction can be effectively improved, prevents the confusions such as building materials in construction area, vehicle, instrument from parking so that construction is smooth, and
The security of construction can be greatly improved.
7th, by the absolute altitude of wafer cone and concrete upper surface measure and record again after concreting,
The construction quality for pouring operation can not only be examined, moreover it is possible to which the construction to follow-up epoxy resin ground provides reference.
8th, in the present invention, it can be prevented by detailed careful absolute altitude and testing flatness in laying building template
Error accumulation, so as to optimize architectural effect and quality, and in order that the program and result standard of construction operation unitize, enters
The preferred measurement point of more than 20 of one step.
Embodiment
With reference to embodiment, the invention will be further described, but the invention is not limited in this, the system in embodiment
Preparation Method is customary preparation methods, is no longer described in detail.
A kind of wafer board construction technology for clean room, comprises the following steps：
(1) scaffold is set up
The scaffold is that jacking is provided with total sub-semigroup or disk buckle type scaffold, and the scaffold and is incited somebody to action
Upper plane leveling；
(1.1) primary and secondary keel are set up
Set up on the scaffold and primary and secondary keel are made by 50 × 50 × 3mm square through-pipe；
(2) building template is laid on scaffold
The building template is the overlay film wood plywood that thickness is 15mm；
(2.1) absolute altitude and flatness of the building template are measured and checked
Measure, and be less than in each area specifically by using whole station type electronic distance meter, laser collimator
500m2Region in measurement point be no less than 20；
(3) wafer cone template is laid in template
Laying wafer cone group, and the waffle are carried out from construction area center to surrounding on the scaffold of construction area
Tube template is the wafer cone group with four wafer cones；
(3.1) fixed wafer cone group
Specific method is that two groups of adjacent wafer cones are spirally connected by screw or bolt, then by wafer cone group it
Between gap be filled by binding agent and cover tightly the cylinder cap of the wafer cone；
(3.2) level measurement and adjustment are carried out to wafer cone upper surface；
(3.3) colligation waffle beam reinforcing bar
First maked somebody a mere figurehead around the wafer cone group along the direction of beam and primary and secondary beam steel and colligation are set, then set respectively
North-south and transmeridional girt strip and colligation are put, makes the waffle beam reinforcing bar that groined type shape is formed around the wafer cone；
(3.4) absolute altitude is carried out to wafer cone upper surface to measure and adjust again
, it is necessary to which absolute altitude is adjusted again to wafer cone upper surface after the completion of rib beam steel bar colligation；
(4) disturbing concrete
Concrete pour for primary concreting and pour height be more than the wafer cone upper surface absolute altitude 3-5mm, and
The flatness of concrete surface is controlled at any time using spirit level or Geoplane；
(5) concrete finishing polishing；
(5.1) when concrete reaches critical initial setting time using disc sander and according to pour order carry out machinery beat
Mill receives light；
(5.2) mechanical grinding is received after light using artificial further to being carried out at the edge of wafer cone and concrete out-of-flatness
Fine grinding；
(5.3) to pouring after the completion of concrete absolute altitude checked and recorded；
(6) scaffold and template are removed；
(6.1) dismounting of scaffold cross bar
When the intensity of concrete reaches the 100% of design strength standard value, remove whole cross bars of scaffold,
And dismounting order is carried out by four circumferential centers of construction area；
(6.2) dismounting of scaffold upright rod, keel and template
After whole cross bars of scaffold are removed, dismounting vertical rod is carried out along the direction of secondary joist, and remove therewith it is main,
Secondary joist and template；
(6.3) after form removable wafer cone processing
After form removal, with sander by the spillage gap of wafer cone group and the polishing such as residue is clean, it is used in combination
Fluid sealant blind, finally strikes off fluid sealant.
Embodiment
In order that technical scheme can be disclosed more complete, clear, below we pass through positioned at Huizhou Qiao Chang
The cycle of sixty years road, the ㎡ of main building floor space 36960, construction area is about that the construction of the electronic workshop toilet of 15.7 ten thousand square meters is real
Example is described in detail：
In the present embodiment, its building requirements is：Importance rate is three-level, and Antiseismic building sets up defences classification for Class C, main
Factory building is 4 layers, and depth of building is 33.95m.Secondly floor plate is wafer board, floor height 5.75m, the Wan ㎡ of area about 3.4 are long
The Support in 242.4m, wide 133.2m, two layers of north side and southern side is normal concrete structure.In the present embodiment, by this two layers
Floor is divided into 1st area to 21st area totally 21 construction areas, wherein having four rows, area of 1st area of first row -4 and the 4th row 17 by north orientation south
Area of area -21 is Hou Jiao areas, and middle second row and area of 5th area of the 3rd row -16 are template region.
Followed by the working procedure for setting up scaffold, it is preferentially using on disk buckle type scaffold, and the scaffold
Jacking is provided with, and by the jacking by upper plane leveling, so that high precision control is carried out, to ensure flatness and reducing frame
Body material usage, main joist is double 50 × 50 × 3mm square steel tubes, and secondary joist is 50 × 50 × 3mm square steel tubes, is separated by between 300mm
Away from arrangement, formwork edge joint position keeps flat fixed form using 50 × 100mm flitches.Then support frame clear height (without collet, jacking,
Fang Tong, template etc.) it is 4.9m, vertical rod and 1.8m+1.5m+1.5m vertical rod modes using 3m+1.8m (overlap joint can increase 0.1m)
Stagger and set up, adjustable jack selects KTC-60, adjustable extent 25cm.
Then carry out laying building template process on scaffold, building template, and institute are laid on the keel of scaffold
The overlay film wood plywood that building template preferentially uses thickness for 15mm is stated, is also needed to after laying repeated multiple times to the building
The absolute altitude and flatness of template, which are measured, to be checked and then adjusts, specifically by use whole station type electronic distance meter, laser quasi
Straight instrument is measured, and is less than 500m in each area2Region in measurement point be no less than 20.
After laying building template, the datum line that error is less than 2mm is drawn on building template, with every axis
As control line, prevent cumulative errors excessive, wherein datum line and Loft Line will can be different from other lines in template.So
Laying waffle tube template is carried out according to datum line and control line afterwards, needed first to building template before laying waffle tube template
Cleaned, on the contrary pollution waffle tube template, and the waffle tube template is the wafer cone group with four wafer cones, from construction
Regional center carries out laying wafer cone group to surrounding.Then also wafer cone group is fixed, specific method is by screw
Or two groups of adjacent wafer cones are spirally connected by bolt, are then filled in the gap between wafer cone group by silicone adhesive
Tightly, concrete slurry seepage is prevented, the cylinder cap of the wafer cone is also covered tightly afterwards, repeatedly inspection is needed in practical operation
The stringency of cylinder cap, then to carrying out level measurement and adjustment record to wafer cone upper surface.
After colligation waffle beam reinforcing bar, i.e., first maked somebody a mere figurehead around the wafer cone group along the direction of beam and primary-secondary beam is set
Reinforcing bar and colligation, then north-south and transmeridional girt strip and colligation are set respectively, make to form groined type shape around the wafer cone
Waffle beam reinforcing bar；Because wafer board cross beam is intensive in Specific construction, reinforcing bar must point direction, segmentation is built on stilts ties up
Prick：First colligation border girder reinforcing bar, after the completion of colligation time beam steel, beam muscle will make somebody a mere figurehead colligation, and built on stilts take erects between cover plate
Flitch or steel pipe, be sequentially：Stirrup → putting frame square through-pipe → is put to wear upper reinforcement, colligation to fix → wear lower rebar, colligation solid
Determine → put off into mould, the girt strip reinforcing bar of colligation other direction after the girt strip reinforcing bar in a direction is fully completed, sequentially to put hoop
Muscle → wearing upper reinforcement, colligation to fix → is worn must welded reinforcement reinforcement at lower rebar, and construction joint closing in net.In rib
, it is necessary to which absolute altitude is adjusted again to wafer cone upper surface after beam steel bar colligation is completed, first by preliminary review, and will knot
Fruit record is on wafer cone cylinder cap.
After casting concrete and receipts light of polishing, described concrete needs to add retarder, and specific match ratio is to pass through
Determined after field experiment, experiment is to do slump experiment before concreting at the scene, it is suitable to be determined according to actual conditions
Slump range.Concrete therein pouring as primary concreting and made and to concrete to offset concrete shrinkage
Height reserved, pour the absolute altitude 3-5mm that height is more than the wafer cone upper surface, and swept using spirit level or laser
Level is controlled the flatness of concrete surface at any time；Disc sander is utilized when concrete reaches critical initial setting time
And carry out mechanical grinding receipts light according to order is poured；Mechanical grinding, which is received, utilizes artificial edge and concrete to wafer cone after light
Further refined at out-of-flatness；Concrete absolute altitude after the completion of to pouring is checked and recorded.
When the intensity of concrete reaches the 100% of design strength standard value, because haulage vehicle needs to be parked in two nearby
Ce Houjiao areas, dismounting order is to be carried out by four circumferential centers of construction area due to wafer cone group and building template and adhesion,
Therefore the whole cross bars for carrying out removing scaffold are needed, after whole cross bars of scaffold are removed, are entered along the direction of secondary joist
Row removes vertical rod, and removes primary and secondary keel and template therewith；After form removal, the spillage of wafer cone group is stitched with sander
At gap and the polishing such as residue is clean, and with toilet's silica gel special blind, and final blading.
It is finally that some conventional maintenance works are carried out to this building, because it belongs to the routine of those skilled in the art
Technological means, therefore repeat no more.By taking this engineering as an example, the large-scale bottom plate laser smoothing technology of electronic workshop and wafer board construction
Planarization technology, by absolute altitude control within 5mm, flatness is controlled within 3mm.Waffle bucket is substantially without breakage, and the proportion of goods damageds exist
Less than 1%, cost-effective about 200,000 yuan；The cylinder cap of wafer cone can be recycled to manufacturer；Remove after support body, concrete ground
Face repair rate is less than 0.5%；Finished product protection works well.Organoleptic quality is good, and surface color is consistent, obtains owner, item
PMC, designing unit, the consistent accreditation of supervisor.
Claims (10)
1. a kind of wafer board construction technology for clean room, comprises the following steps：
(1) scaffold is set up；
(2) building template is laid on scaffold；
(3) wafer cone template is laid in template；
(4) disturbing concrete；
(5) concrete finishing polishing；
(6) scaffold and template are removed；
It is characterized in that, the waffle tube template in the step (3) is the wafer cone group at least with four wafer cones, and in institute
Stating also includes step after step (3)：
(3.1) fixed wafer cone group, specific method is that two groups of adjacent wafer cones are spirally connected by screw or bolt, then
Gap between wafer cone group is filled by binding agent and the cylinder cap of the wafer cone is covered tightly；
(3.2) level measurement and adjustment are carried out to wafer cone upper surface；
(3.3) colligation waffle beam reinforcing bar
First maked somebody a mere figurehead around the wafer cone group along the direction of beam and primary and secondary beam steel and colligation are set, then north and south is set respectively
To with transmeridional girt strip and colligation, make the waffle beam reinforcing bar that groined type shape is formed around the wafer cone；
(3.4) absolute altitude is carried out to wafer cone upper surface to measure and adjust again
, it is necessary to which absolute altitude is adjusted again to wafer cone upper surface after the completion of rib beam steel bar colligation.
2. a kind of wafer board construction technology for clean room according to claim 1, it is characterized in that, the scaffold
To be provided with jacking on total sub-semigroup or disk buckle type scaffold, and the scaffold and by upper plane leveling.
3. a kind of wafer board construction technology for clean room according to claim 1, it is characterized in that, in the step
(1) step is also included after：(1.1) primary and secondary keel are set up on the scaffold, the primary and secondary keel are 50 × 50 × 3mm
Square through-pipe.
4. a kind of wafer board construction technology for clean room according to claim 1, it is characterized in that, the step
(4) concrete pours as primary concreting and pours the absolute altitude 3-5mm that height is more than the wafer cone upper surface in, and utilizes
Spirit level or Geoplane are controlled the flatness of concrete surface at any time.
5. a kind of wafer board construction technology for clean room according to claim 1, it is characterized in that, the step
(5) comprise the following steps in concrete finishing polishing：
(5.1) when concrete reaches critical initial setting time using disc sander and according to pour order carry out mechanical grinding receipts
Light；
(5.2) mechanical grinding is received after light using artificial to carrying out further essence at the edge of wafer cone and concrete out-of-flatness
Mill.
6. a kind of wafer board construction technology for clean room according to claim 1, it is characterized in that, the step
(3) in, the laying order of the wafer cone group is to be laid from construction area center to surrounding.
7. a kind of wafer board construction technology for clean room according to claim 1, it is characterized in that, the step
(6) remove and comprise the following steps in scaffold and template：
(6.1) dismounting of scaffold cross bar：When the intensity of concrete reaches the 100% of design strength standard value, removed
Whole cross bars of scaffold, and dismounting order is carried out by four circumferential centers of construction area；
(6.2) dismounting of scaffold upright rod, keel and template：After whole cross bars of scaffold are removed, along the side of secondary joist
To progress dismounting vertical rod, and primary and secondary keel and template are removed therewith；
(6.3) after form removable wafer cone processing：After form removal, with sander by the spillage gap of wafer cone group,
And the polishing such as residue is clean, and fluid sealant blind is used, finally strike off fluid sealant.
8. a kind of wafer board construction technology for clean room according to claim 5, it is characterized in that, implement the step
Suddenly after (5.2), in addition it is also necessary to carry out next step：(5.3) to pouring after the completion of concrete absolute altitude checked and recorded.
9. a kind of wafer board construction technology for clean room according to claim 1, it is characterized in that, in the step
(2) step is also included after：(2.1) absolute altitude and flatness of the building template are measured and checked, specifically by using
Whole station type electronic distance meter, laser collimator are measured, and are less than 500m in each area2Region in measurement point it is many
In 20.
10. a kind of wafer board construction technology for clean room according to claim 1, it is characterized in that, the building
Template is the overlay film wood plywood that thickness is 15mm.
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| CN107642231A (en) * | 2017-09-15 | 2018-01-30 | 中铁二十五局集团第五工程有限公司 | A kind of trapezoidal waffle templates of SMC strengthen arrangement of reinforcement |
| CN108277921A (en) * | 2017-12-29 | 2018-07-13 | 上海建工二建集团有限公司 | Combined hoisting system suitable for waffle slab steel bar construction |
| CN108331228A (en) * | 2018-02-05 | 2018-07-27 | 吴士传 | Construction technology for electronic workshop ventilation waffle bucket |
| CN108643432A (en) * | 2018-05-02 | 2018-10-12 | 成都建筑工程集团总公司 | Electronic chip workshop wafer board structure construction engineering method |
| CN108756039A (en) * | 2018-07-11 | 2018-11-06 | 上海宝冶集团有限公司 | floor construction method |
| CN110835998A (en) * | 2019-11-22 | 2020-02-25 | 上海宝冶集团有限公司 | Method for improving epoxy construction efficiency of cast-in-situ floor waffle holes |
| CN112627507A (en) * | 2020-12-11 | 2021-04-09 | 上海宝冶集团有限公司 | Method for building ultrahigh special-shaped waffle slab |
| CN113718812A (en) * | 2021-09-07 | 2021-11-30 | 中建八局第一建设有限公司 | Super-large-area clean room terrace construction method |
| CN114934665A (en) * | 2022-06-30 | 2022-08-23 | 中国建筑第四工程局有限公司 | Waffle slab flatness construction method and mechanism |
| CN115898004A (en) * | 2022-11-17 | 2023-04-04 | 中建八局第四建设有限公司 | One-time precise and flat construction method for waffle-tube ultra-deep ultra-thick ribbed multi-hole beam plate surface |
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| CN107642231A (en) * | 2017-09-15 | 2018-01-30 | 中铁二十五局集团第五工程有限公司 | A kind of trapezoidal waffle templates of SMC strengthen arrangement of reinforcement |
| CN108277921A (en) * | 2017-12-29 | 2018-07-13 | 上海建工二建集团有限公司 | Combined hoisting system suitable for waffle slab steel bar construction |
| CN108331228A (en) * | 2018-02-05 | 2018-07-27 | 吴士传 | Construction technology for electronic workshop ventilation waffle bucket |
| CN108643432A (en) * | 2018-05-02 | 2018-10-12 | 成都建筑工程集团总公司 | Electronic chip workshop wafer board structure construction engineering method |
| CN108756039A (en) * | 2018-07-11 | 2018-11-06 | 上海宝冶集团有限公司 | floor construction method |
| CN110835998A (en) * | 2019-11-22 | 2020-02-25 | 上海宝冶集团有限公司 | Method for improving epoxy construction efficiency of cast-in-situ floor waffle holes |
| CN112627507A (en) * | 2020-12-11 | 2021-04-09 | 上海宝冶集团有限公司 | Method for building ultrahigh special-shaped waffle slab |
| CN113718812A (en) * | 2021-09-07 | 2021-11-30 | 中建八局第一建设有限公司 | Super-large-area clean room terrace construction method |
| CN114934665A (en) * | 2022-06-30 | 2022-08-23 | 中国建筑第四工程局有限公司 | Waffle slab flatness construction method and mechanism |
| CN114934665B (en) * | 2022-06-30 | 2024-03-29 | 中国建筑第四工程局有限公司 | Huafu plate flatness construction method and mechanism |
| CN115898004A (en) * | 2022-11-17 | 2023-04-04 | 中建八局第四建设有限公司 | One-time precise and flat construction method for waffle-tube ultra-deep ultra-thick ribbed multi-hole beam plate surface |
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Application publication date: 20170808 |