CN107127338A - Based on increasing material manufacturing can any dip sweeping path generating method - Google Patents
Based on increasing material manufacturing can any dip sweeping path generating method Download PDFInfo
- Publication number
- CN107127338A CN107127338A CN201610106245.1A CN201610106245A CN107127338A CN 107127338 A CN107127338 A CN 107127338A CN 201610106245 A CN201610106245 A CN 201610106245A CN 107127338 A CN107127338 A CN 107127338A
- Authority
- CN
- China
- Prior art keywords
- scanned
- panel data
- layer
- several
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
- B22F10/366—Scanning parameters, e.g. hatch distance or scanning strategy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/80—Data acquisition or data processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention discloses based on increasing material manufacturing can any dip sweeping path generating method, it comprises the following steps:The 3D physical models of part to be printed are subjected to slicing delamination;Obtain current layer and next layer of panel data;According to current layer panel data, some regions to be scanned are uniformly divided into along fixed angle or arbitrary angle to current layer panel data, several regions to be scanned of current layer are obtained;According to several regions to be scanned of current layer, several scanning patterns of current layer are generated along arbitrary angle or fixed angle;According to next layer plane data, several another regions to be scanned are uniformly divided into along another fixed angle or another arbitrary angle to it, next layer several regions to be scanned are obtained;According to next layer several regions to be scanned, next layer several scanning patterns are generated along arbitrary angle or fixed angle;Repeat the above steps, until completing the scanning of model.Formed precision of the present invention is high, meets the requirement of labyrinth printing technique.
Description
Technical field
The present invention relates to material increasing field, and in particular to based on increasing material manufacturing can any dip sweeping path generating method.
Background technology
3D printing technique, i.e. increases material manufacturing technology, based on entity mathematical model file, using moulding material, 3D solid is constructed by way of successively printing.For traditional process technology, 3D printing technique need not separately make mould, directly process finished product.And the special construction obstacle that tradition machinery processing can be overcome not realize, the simplification production of arbitrarily complicated structure member can be realized, can automatically, directly, accurately will be by design philosophy from CAD model, model or part with certain function are converted into, relatively broad application is obtained in fields such as building, Aero-Space, machinery, biomedicines at present.
For selective laser sintering, i.e. SLS, its operation principle, which is computer, controls the two-dimensional scan track of laser beam according to the hierarchical model of prototype, and selectively sintering solid dusty material is to form an aspect of part.Sintering is completed after one layer, and working piston declines a thickness, and powdering system spreads new powder again.Control laser beam scans the new layer of sintering again, so moves in circles, is layering, until 3 d part shaping.
At present, the part after laser sintered, because the inside parts stress after laser beam flying cannot disperse, stress deformation can occur for part, influence the quality of forming parts.
The content of the invention
In order to solve the above technical problems, we have proposed based on increasing material manufacturing can any dip sweeping path generating method, the purpose is to overcome the formed precision of the part caused in response to force deformation low, improve the Forming Quality of part.
To reach above-mentioned purpose, technical scheme is as follows:
Based on increasing material manufacturing can any dip sweeping path generating method, it comprises the following steps:
1)Cut into slices according to the 3D physical models of part to be printed, obtain the panel data of all individual layers;
2)To the panel data layered shaping of all individual layers, the panel data of current individual layer is selected, and obtains current layer panel data and next layer plane data;
3)According to current layer panel data, some regions to be scanned are uniformly divided into along fixed angle or arbitrary angle to current layer panel data, several regions to be scanned of current layer are obtained;
4)According to several regions to be scanned of current layer, several scanning patterns of current layer are generated along arbitrary angle or fixed angle;
5)According to next layer plane data of the panel data of current individual layer, several another regions to be scanned are uniformly divided into along another fixed angle or another arbitrary angle to next layer plane data, next layer several regions to be scanned are obtained;
6)According to next layer several regions to be scanned, next layer several scanning patterns are generated along arbitrary angle or fixed angle;
7)Repeat the above steps 3)、4)、5)、6), the scanning pattern of the panel data until completing whole all individual layers of model.
It is preferred that, the panel data is the panel data of SLC files, CLI files or extended formatting.
By above-mentioned technical proposal, the beneficial effects of the invention are as follows:Based on increasing material manufacturing can any dip sweeping path generating method, enable to inside parts stress to disperse, reduce and shrink, improve the formed precision of part.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, the required accompanying drawing used in embodiment or description of the prior art will be briefly described below, apparently, drawings in the following description are only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 be disclosed in the embodiment of the present invention 1 based on increasing material manufacturing can any dip sweeping path generating method schematic flow sheet.
Embodiment
The technical scheme in the embodiment of the present invention is clearly and completely described below in conjunction with the accompanying drawings, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made belongs to the scope of protection of the invention.
The embodiment to the present invention is described in further detail below.
Embodiment 1.
Based on increasing material manufacturing can any dip sweeping path generating method, it comprises the following steps:
S101, is cut into slices according to the 3D physical models of part to be printed, obtains the panel data of all individual layers;
S102, to the panel data layered shaping of all individual layers, selects the panel data of current individual layer, and obtain current layer panel data and next layer plane data;
S103, according to current layer panel data, is uniformly divided into some regions to be scanned along fixed angle or arbitrary angle to current layer panel data, obtains several regions to be scanned of current layer;
S104, according to several regions to be scanned of current layer, several scanning patterns of current layer are generated along arbitrary angle or fixed angle;
Next layer plane data, according to next layer plane data of the panel data of current individual layer, are uniformly divided into several another regions to be scanned along another fixed angle or another arbitrary angle, obtain next layer several regions to be scanned by S105;
S106, according to next layer several regions to be scanned, next layer several scanning patterns are generated along arbitrary angle or fixed angle;
S107, repeat the above steps S103, S104, S105, S106, the scanning pattern of the panel data until completing whole all individual layers of model.
The panel data is the panel data of SLC files, CLI files or extended formatting.
Above-described is only the preferred embodiment of the present invention, it is noted that for the person of ordinary skill of the art, without departing from the concept of the premise of the invention, various modifications and improvements can be made, and these belong to protection scope of the present invention.
Claims (2)
1. based on increasing material manufacturing can any dip sweeping path generating method, it is characterised in that it comprises the following steps:
1)Cut into slices according to the 3D physical models of part to be printed, obtain the panel data of all individual layers;
2)To the panel data layered shaping of all individual layers, the panel data of current individual layer is selected, and obtains current layer panel data and next layer plane data;
3)According to current layer panel data, some regions to be scanned are uniformly divided into along fixed angle or arbitrary angle to current layer panel data, several regions to be scanned of current layer are obtained;
4)According to several regions to be scanned of current layer, several scanning patterns of current layer are generated along arbitrary angle or fixed angle;
5)According to next layer plane data of the panel data of current individual layer, several another regions to be scanned are uniformly divided into along another fixed angle or another arbitrary angle to next layer plane data, next layer several regions to be scanned are obtained;
6)According to next layer several regions to be scanned, next layer several scanning patterns are generated along arbitrary angle or fixed angle;
7)Repeat the above steps 3)、4)、5)、6), the scanning pattern of the panel data until completing whole all individual layers of model.
2. it is according to claim 1 based on increasing material manufacturing can any dip sweeping path generating method, it is characterised in that the panel data is the panel data of SLC files, CLI files or extended formatting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610106245.1A CN107127338A (en) | 2016-02-26 | 2016-02-26 | Based on increasing material manufacturing can any dip sweeping path generating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610106245.1A CN107127338A (en) | 2016-02-26 | 2016-02-26 | Based on increasing material manufacturing can any dip sweeping path generating method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107127338A true CN107127338A (en) | 2017-09-05 |
Family
ID=59721581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610106245.1A Pending CN107127338A (en) | 2016-02-26 | 2016-02-26 | Based on increasing material manufacturing can any dip sweeping path generating method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107127338A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203992396U (en) * | 2014-06-30 | 2014-12-10 | 湖南华曙高科技有限责任公司 | Increase material manufacturing equipment compound rolling power spreading device and increase material manufacturing equipment |
WO2015141776A1 (en) * | 2014-03-19 | 2015-09-24 | シーメット株式会社 | Manufacturing tank of three-dimensional manufacturing device |
CN105235223A (en) * | 2015-11-19 | 2016-01-13 | 吴江中瑞机电科技有限公司 | Random-angle scanning path method controlling stress deformation of additive manufacturing |
CN105252774A (en) * | 2015-11-19 | 2016-01-20 | 吴江中瑞机电科技有限公司 | Generating method for multiple contour scanning paths for additive manufacturing |
-
2016
- 2016-02-26 CN CN201610106245.1A patent/CN107127338A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015141776A1 (en) * | 2014-03-19 | 2015-09-24 | シーメット株式会社 | Manufacturing tank of three-dimensional manufacturing device |
CN203992396U (en) * | 2014-06-30 | 2014-12-10 | 湖南华曙高科技有限责任公司 | Increase material manufacturing equipment compound rolling power spreading device and increase material manufacturing equipment |
CN105235223A (en) * | 2015-11-19 | 2016-01-13 | 吴江中瑞机电科技有限公司 | Random-angle scanning path method controlling stress deformation of additive manufacturing |
CN105252774A (en) * | 2015-11-19 | 2016-01-20 | 吴江中瑞机电科技有限公司 | Generating method for multiple contour scanning paths for additive manufacturing |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108995219B (en) | Slicing method with variable layer thickness, 3D printing method and 3D printed product | |
US20170313047A1 (en) | 3d jet printing apparatus having reciprocating jetting molding mechanism | |
CN106925776A (en) | A kind of subregion scanning pattern generation method of control increasing material manufacturing stress deformation | |
CN103894608B (en) | A kind of 3 D-printing large spot scanning pattern generation method | |
CN107803987B (en) | Adaptive layered processing method and system for additive manufacturing and additive manufacturing equipment | |
CN103407296A (en) | Method for achieving high-melting-point material 3D printing through nanometer ink together with laser melting | |
CN111037917B (en) | FDM printing method, system and medium based on model splitting and splicing printing | |
CN108016034B (en) | Photocuring laser scanning system and method | |
CN103143706A (en) | 3D (three dimensional) printing manufacturing method of seal | |
CN106808681A (en) | A kind of method for improving increasing material manufacturing element precision | |
CN103752823B (en) | Triangular mesh type laser scanning method for selective laser sintering | |
CN103950201B (en) | The unlimited Method of printing in threedimensional model single shaft direction and system | |
CN106825570B (en) | Slice scanning processing method and system for three-dimension object manufacture | |
CN103722171A (en) | Honeycombed laser scanning method for selective laser sintering | |
CN106426907B (en) | A kind of efficient scan method of discontinuous filling laser gain material manufacture | |
CN105538712A (en) | 3D printing method adopting laser hybrid profile scanning | |
CN102116933A (en) | Laser scanning method for selective laser firing | |
CN108127115A (en) | A kind of laser beam scan path generation method for increasing material manufacturing three-dimension object | |
CN105772721A (en) | Light-spot-size-variable scanning path generation method based on additive manufacturing | |
CN105172135A (en) | Printing method of multi-sprayer high-speed FDM model | |
KR101961198B1 (en) | 3D printing method and printed 3D structure | |
CN104875394A (en) | 3D part printing device and method | |
CN109047759B (en) | Laser scanning method for improving interlayer strength and reducing warping deformation | |
JP2004124201A (en) | Method of laser beam lithography using metal powder | |
CN106926465A (en) | A kind of fractional scanning path generating method of control increasing material manufacturing stress deformation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170905 |
|
RJ01 | Rejection of invention patent application after publication |