CN107122012A - Power transmission device and preparation method thereof - Google Patents
Power transmission device and preparation method thereof Download PDFInfo
- Publication number
- CN107122012A CN107122012A CN201610100765.1A CN201610100765A CN107122012A CN 107122012 A CN107122012 A CN 107122012A CN 201610100765 A CN201610100765 A CN 201610100765A CN 107122012 A CN107122012 A CN 107122012A
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- China
- Prior art keywords
- circuit board
- conductive
- power transmission
- transmission device
- conductive seat
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
- H01R4/32—Conductive members located in slot or hole in screw
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/06—Connectors or connections adapted for particular applications for computer periphery
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention provides a kind of power transmission device and preparation method thereof.Power transmission device includes a first circuit board, a conductive seat, a connecting element, a second circuit board and a retaining element.Conductive seat is fixed on first circuit board.Connecting element is arranged on conductive seat.Second circuit board is fixed in connecting element.Retaining element is arranged on second circuit board, and is connected through second circuit board and connecting element with conductive seat.First circuit board is electrically connected with via conductive seat and connecting element with second circuit board.
Description
Technical field
The invention mainly relates to a kind of power transmission device, espespecially it is related to a kind of electric power for computer equipment
Transmitting device.
Background technology
In the computer equipment for needing to consume substantial amounts of electric power in network server etc., possesses power transmission mostly
Device is transmitted with the electric power for being supplied supply unit is supplied in motherboard.
Because the electronic component for voltage stabilizing, management electric power on power transmission device is numerous, in order to be able to appropriate
The kind inner space using computer equipment.As shown in figure 1, the general electronics by power transmission device P1
Element P30 is respectively arranged on superposed two pieces of circuit boards P10, P20.Separately due to passing through electric power
The transmitting device P1 magnitude of current is larger, therefore, and electronic component P30 is set to different circuit boards respectively
P10, P20 also can be repaired conveniently.
In traditional technology, power transmission device P1 utilizes the circuit board P20 above copper post P40 supports
And make two circuit board P10, P20 spaced.In addition, power transmission device P1 utilizes two electric connectors
P50 sets and is respectively arranged at circuit board P10, P20, and is attached above-mentioned two using wire P60 and is electrically connected
Meet device P50.
But, although current power transmission device has met the purpose that it is used, but not yet meets many
It is otherwise to require, accordingly, it is desirable to provide the improvement project of power transmission device, can reduce electric power biography
The cost of manufacture of defeated device.
The content of the invention
One object of the present invention can reduce the making of power transmission device to improve power transmission device
Cost；
Another object of the present invention is a kind of making side of the power transmission device of low manufacture cost of offer
Method.
The invention provides a kind of power transmission device, including a first circuit board, a conductive seat, a company
Connect element, a second circuit board and a retaining element.Conductive seat is fixed on first circuit board.Connection
Element is arranged on conductive seat.Second circuit board is fixed in connecting element.Retaining element is arranged at second
On circuit board, and it is connected through second circuit board and connecting element with conductive seat.First circuit board via
Conductive seat and connecting element are electrically connected with second circuit board.
The invention provides a kind of power transmission device, including a first circuit board, one first conductive seat,
One second circuit board, one second conductive seat, a connecting element, one first retaining element and one second are solid
Determine element.First conductive seat is fixed on first circuit board.Second circuit board is located above first circuit board.
Second conductive seat is fixed on second circuit board.
Connecting element connects the first conductive seat and the second conductive seat.First retaining element passes through connecting element,
And it is connected to the first conductive seat.Second retaining element passes through connecting element, and is connected to the second conductive seat.
First circuit board is electrically connected with via the first conductive seat, connecting element, the second conductive seat and second circuit board.
In some embodiments, power transmission device also includes a conductive material, and second circuit board is also wrapped
A conductive layer is included, wherein conductive material is arranged at conductive layer, and connecting element is via conductive material and conduction
Layer connection.
In some embodiments, retaining element to be conductive, directly contact be electrically connected at conductive seat,
Connecting element and second circuit board.
In some embodiments, power transmission device also includes one first connector and one second connector.
First connector is arranged at first circuit board, to connect a supply unit.Second connector is arranged at
Two circuit boards, to connect a motherboard.
One is fixed on the invention provides a kind of preparation method of power transmission device, including by a conductive seat
First circuit board；A conductive material is coated with a conductive layer of a second circuit board and one second electricity is adjacent to
One conductive hole of road plate；Set a connecting element in conductive material, connecting element is fixed via conductive material
In second circuit board；Connecting element is placed in conductive seat；One retaining element is run through into second circuit board, connected
Element is connect, and is connected to conductive seat, second circuit board is fixed on first circuit board.First circuit board
It is electrically connected with via conductive seat and connecting element with second circuit board.
In some embodiments, the preparation method of power transmission device also include one first connector and
One first electronic component is fixed on first circuit board；And one second connector and one second electronics is first
Part is fixed on second circuit board.
In summary, power transmission device of the invention utilizes conductive seat, connecting element and retaining element
It is electrically connected with two circuit boards, and to support the circuit board of top, therefore may replace in conventional art and be used for
The electric connector of two circuit boards is electrically connected with, the copper post in conventional art, Jin Erneng is also may replace or reduce
Reduce the cost of manufacture of power transmission device.
Brief description of the drawings
Fig. 1 is the schematic diagram of traditional power transmission device.
Fig. 2 is the stereogram of the computer equipment of the present invention.
Fig. 3 is the stereogram of the first implementation of the power transmission device of the present invention.
Fig. 4 is the exploded view of the first implementation of the power transmission device of the present invention.
Fig. 5 is the sectional view of the first implementation of the power transmission device of the present invention.
Fig. 6 is the flow chart of the preparation method of the power transmission device of the present invention.
Fig. 7 is the preparation method of the power transmission device of the present invention in the schematic diagram in processing procedure interstage.
Fig. 8 is the stereogram of the second implementation of the power transmission device of the present invention.
Fig. 9 is the exploded view of the second implementation of the power transmission device of the present invention.
Figure 10 is the cut-away view of the second implementation of the power transmission device of the present invention.
Wherein, description of reference numerals is as follows：
First circuit board 10
Upper surface 11
Jack 12
Second circuit board 20
Upper surface 21
Lower surface 22
Conductive hole 23
Conductive layer 24
Perforation 25
Conductive seat 30,30a, 30b
Conductive body 31
Conductive top surface 331
Fixing hole 332
Pin 32
Connecting element 40
Connect body 41
Connect top surface 411
Connect bottom surface 412
Protuberance 42
Connecting hole 43
First connecting portion 44
Second connecting portion 45
Central connection 46
Retaining element 50,50a, 50b
Screw terminal 51
Screw rod 52
Computer equipment A1
Casing A10
Motherboard A20
Main electronic component A30
Supply unit A40
Power transmission device A50
First connector B10
First electronic component B20
Second connector B30
Second electronic component B40
Orientation D1
Conductive material M1
Power transmission device P1
Circuit board P10, P20
Electronic component P30
Copper post P40
Electric connector P50
Wire P60
Embodiment
The following description provides many different embodiments or example, for implementing the present invention not
Same feature.Element and arrangement mode described by following specific examples, only for the expression present invention simplified,
Its only as an example, and and be not used to limitation the present invention.For example, fisrt feature in a second feature or
The description of the structure of top is directly contacted between including the first and second features, or is set with another feature
It is placed between the first and second features, so that the first and second features are not direct contact.
In addition, this specification has continued to use identical element numbers and/or word in different examples.It is foregoing
Continue to use only for simplify and clearly, be not offered as to have between different embodiments and setting
Association.
The first of this specification and second grade vocabulary, only as the purpose of clear interpretation, and is not used to pair
Should in and limitation the scope of the claims.In addition, the vocabulary such as fisrt feature and second feature, and non-limiting it is
Identical or different feature.
Shape, size, thickness and inclined angle in accompanying drawing perhaps to clarity of illustration and
Draw or be simplified not according to ratio, the use of explanation is only provided.
Fig. 2 is the computer equipment A1 of present invention stereogram.Computer equipment A1 can be a servomechanism, example
Such as network server.Computer equipment A1 includes a casing A10, a motherboard A20, multiple main electronics
Element A30, a supply unit A40 and a power transmission device A50.Motherboard A20 is arranged at machine
In shell A10.Main electronic component A30 is arranged on motherboard A20.Main electronic component A30 may include
Central processing unit, display chip, memory body etc..
Supply unit A40 is to supply electric power in power transmission device A50.Supply unit A40 can be used to
Alternating current is converted into direct current, and direct current is supplied in power transmission device A50.Power transmission is filled
Put A50 connection motherboard A20 and supply unit A40.
Power transmission device A50 is transmitted the supply unit A40 electric power transmitted to be transmitted
In motherboard A20.In the implementation of some Power over Ethernet (PoE) networking power supplying switch equipment
In example, the electric power that power transmission device A50 can be provided supply unit A40 carries out voltage stabilizing, decompression
And after the reduction magnitude of current, then power transmission is to motherboard A20.
In some embodiments, supply unit A40 supplies 12V and 60A.Power transmission device A50
12V voltage is reduced to 5V, and exports multigroup electric current respectively to motherboard A20, so as to supplying respectively
Electric power that should be suitable main electronic component A30.
Fig. 3 is the stereogram of the power transmission device A50 of the present invention the first implementation.Fig. 4 is this
The exploded view of the power transmission device A50 of invention the first implementation.Fig. 5 passes for the electric power of the present invention
The sectional view of defeated device A50 the first implementation.Power transmission device A50 includes a first circuit board
10th, a second circuit board 20, two conductive seats 30, two connecting elements 40 and two retaining elements
50。
First circuit board 10 and second circuit board 20 are spaced.In the present embodiment, first circuit board
10 are substantially parallel to each other with second circuit board 20.First circuit board 10, conductive seat 30, connecting element 40
And retaining element 50 is in arrangement on an orientation D1.
In the present embodiment, power transmission device A50 also includes one first connector B10, multiple first
Electronic component B20, the second connector B30 and multiple second electronic component B40.First connector B10
And first electronic component B20 be arranged on a upper surface 11 of first circuit board 10.In the present embodiment
In, the first connector B10 and the first electronic component B20 are directly fixed and are electrically connected at the first circuit
Plate 10.First connector B10 is electrically connected at the first electronic component B20 via first circuit board 10.
First connector B10 is used to the supply unit A40 in connection figure 2.In other words, supply unit
Electric power produced by A40 is sent to first circuit board 10 via the first connector B10.For example,
One electronic component B20 can be voltage stabilizing element, over-current protecting element, resistance and electric capacity etc..
In the present embodiment, conductive seat 30, connecting element 40 and/or retaining element 50 form two respectively
Electrode structure, wherein one of above-mentioned two electrode structure are anode electrode structure, and another one is negative pole
Electrode structure.
Second circuit board 20 is via above-mentioned electrode structure (conductive seat 30, connecting element 40 and/or fixed member
Part 50) it is electrically connected with first circuit board 10.In other words, the electric power warp that supply unit A40 is supplied
Transmitted after the first electronic component B20 is handled, then via above-mentioned electrode structure to second circuit board 20.
In the present embodiment, the higher electric connector of cost in conventional art is replaced with above-mentioned electrode structure,
First circuit board 10 and second circuit board 20 are electrically connected with, and then the making of power transmission device can be reduced
Cost.
Second connector B30 and the second electronic component B40 are arranged at a upper table of second circuit board 20
On face 21.In the present embodiment, the second connector B30 and the second electronic component B40 are directly fixed
And it is electrically connected at second circuit board 20.Second electronic component B40 electrically connects via second circuit board 20
It is connected to above-mentioned electrode structure.
Conductive seat 30 is fixed on first circuit board 10.Conductive seat 30 is conductive, and by conduction material
Made by matter, and it is electrically connected with first circuit board 10.In the present embodiment, conductive seat 30 is an electricity
Source terminal, and two conductive seats 30 are respectively a positive conductive terminal and a cathode conductive terminal.
Conductive seat 30 includes a conductive body 31 and multiple pins 32.Conductive body 31 has one to lead
The electric fixing hole 332 of top surface 331 and one.In the present embodiment, conductive top surface 331 is a plane, and
It can be substantially parallel to the first printed circuit board (PCB).Conductive top surface 331 and upper surface 11 are spaced.Fixing hole
332 are formed at the center of conductive top surface 331.
Pin 32 is connected to conductive body 31, and integrally formed with conductive body 31.Pin 32 is planted
It is electrically connected with the jack 12 of first circuit board 10, and with first circuit board 10.Jack 12 is formed at
The upper surface 11 of first circuit board 10.In the present embodiment, pin 32 is welded in the first printed circuit board (PCB),
So as to causing conductive seat 30 to be fixed on the upper surface 11 of first circuit board 10.
Connecting element 40 is fixed on second circuit board 20, and is arranged on conductive seat 30.Connecting element 40
To be conductive, and as made by conductive material.Connecting element 40 is electrically connected with second circuit board 20.
In the present embodiment connecting element 40 can for a surface adhering element (surface mounted devices nuts,
SMD nuts)。
Connecting element 40 includes a connection protuberance 42 of body 41 and one.It can be one to connect body 41
Platy structure, and bottom surface 412 is connected with one with a connection top surface 411.The above-mentioned phase of connection top surface 411
For connection bottom surface 412.Protuberance 42 is arranged at the center of connection top surface 411.Connect body 41 also
Including a connecting hole 43, through the center of connection body 41 and protuberance 42.
In the present embodiment, connection top surface 411 is roughly parallel to connection bottom surface 412, and connection top surface 411
And connection bottom surface 412 is plane.Connection bottom surface 412 contacts conductive top surface 331.Due to connection bottom surface
412 be to have well between plane, therefore connecting element 40 and conductive seat 30 with conductive top surface 331
Electric connection.
The connection top surface 411 of connecting element 40 contacts a lower surface 22 of second circuit board 20, and prominent
Portion 42 is located in a conductive hole 23 of second circuit board 20.In the present embodiment, the direction of lower surface 22
The upper surface 11 of first circuit board 10.
In the present embodiment, second circuit board 20 also includes a conductive layer 24, positioned at second circuit board 20
With lower surface 22.In some embodiments, conductive layer 24 also positioned at conductive hole 23 side wall and/or on
Surface 21.
In the present embodiment, there is a conductive material M1 between connecting element 40 and second circuit board 20,
In other words, conductive material M1 is arranged between connecting element 40 and second circuit board 20.Connection member
Part 40 is connected via conductive material M1 with conductive layer 24.
Retaining element 50 is arranged on second circuit board 20, and first through second circuit board 20 and connection
It is connected after part 40 with conductive seat 30.In some embodiments, retaining element 50 is conductive, directly
Contact and be electrically connected at conductive seat 30, connecting element 40 and second circuit board 20.In some implementations
In example, retaining element 50 is insulation.
In the present embodiment, retaining element 50 is a screw, is locked in conductive seat 30.Retaining element 50
With a screw terminal 51 and a screw rod 52.Screw terminal 51 is connected to screw rod 52, and with screw rod 52 integrally
Formed.Screw terminal 51 is connected to the upper surface 21 of second circuit board 20.Screw rod 52 through conductive hole 23,
Connecting hole 43 reaches fixing hole 332.As shown in figure 5, one end of screw rod 52 is locked in conductive seat 30
Fixing hole 332.
In the present embodiment, because conductive seat 30 is fixed on first circuit board 10, and connecting element 40 is solid
, can be first by connection due to second circuit board 20, therefore when being assembled for power transmission device A50
Element 40 is positioned on conductive seat 30, afterwards again by retaining element 50 is through second circuit board 20 and connects
Connect and lock or be fixed on conductive seat 30 after element 40, you can simply complete assembling.
, can be easily after can retaining element 50 be removed when power transmission device A50 is dismantled
First circuit board 10 is separated with second circuit board 20.Assembled due to power transmission device A50 or
During dismounting, it can't be ground in the conductive layer 24 and conductive material M1 of the lower surface 22 of second circuit board 20
Damage, therefore power transmission device A50 service lifes can be increased.
In the present embodiment, electrode structure (conductive seat 30, connecting element 40 and retaining element 50) is metal
Deng made by rigid, electrode structure can be fixedly supported second circuit board 20, and make first circuit board
10 is spaced with second circuit board 20.Therefore, electrode structure may replace or reduce in conventional art
Copper post, and then the cost of manufacture of power transmission device can be reduced.
Fig. 6 is the flow chart of the power transmission device A50 of present invention preparation method.Fig. 7 is the present invention
Power transmission device A50 preparation method in the schematic diagram in processing procedure interstage.It will be appreciated that in
In each step in the method for following examples, can before each step, increase volume afterwards and therebetween
Outer step, and can be replaced, delete or move in some foregoing steps.
In step S101, by the first connector B10, the first electronic component B20 and conductive seat 30
It is fixed on first circuit board 10.In step S103, as shown in fig. 7, applying conductive material M1 in
The conductive layer 24 of second circuit board 20 is simultaneously adjacent to conductive hole 23.Now, conductive material M1 is a cream
Shape, molten state or liquid.
In the present embodiment, conductive layer 24 can be a copper foil layer, and conductive material M1 can be tin cream or to lead
Electric glue.Conductive layer 24 is covered in by conductive material M1, therefore need not be plated on conductive layer 24
The precious metal such as gold or silver, to avoid conductive layer 24 from aoxidizing, and then can reduce power transmission device A50
Cost of manufacture.
In step S105, in the upper conductive material M1 for being set forth in paste, molten state or liquid in solidification
Before, connecting element 40 is set in conductive material M1 (as shown in Figure 5).Due to now conductive material M1
For paste, molten state or liquid, thus conductive material M1 can well be connected to connecting element 40 and
The conductive layer 24 of second circuit board 20.
After conductive material M1 solidifies, connecting element 40 is fixed on via the conductive material M1 of solidification
Two circuit boards 20.In the present embodiment, second circuit board 20 can be stood to such as one minute a period of time,
To allow conductive material M1 to solidify.
Afterwards, the second connector and the second electronic component B40 can be fixed on second circuit board 20.Will
The step of second connector and the second electronic component B40 are fixed on second circuit board 20 also can be in step
Implement before S103.
In step S107, connecting element 40 is placed in conductive seat 30., will be solid in step S109
Element 50 is determined through second circuit board 20, connecting element 40, and is connected to conductive seat 30, by second
Circuit board 20 is fixed on first circuit board 10.
Fig. 8 is the stereogram of the power transmission device A50 of the present invention the second implementation.Fig. 9 is this
The exploded view of the power transmission device A50 of invention the second implementation.Figure 10 is electric power of the invention
The cut-away view of transmitting device A50 the second implementation.
Conductive seat 30 includes multiple conductive seat 30a and multiple conductive seat 30b.Conductive seat 30a is fixed on
One circuit board 10.Conductive seat 30b is fixed on second circuit board 20.Second circuit board 20 is located at first
The top of circuit board 10.Second circuit board 20 has the perforation 25 for being adjacent to conductive seat 30b.
Connecting element 40 connects conductive seat 30a and conductive seat 30b.First circuit board 10 is via conduction
Seat 30a, connecting element 40, conductive seat 30b and second circuit board 20 are electrically connected with.In the present embodiment,
Connecting element 40 is a Z-type structure.Connecting element 40 passes through the perforation 25 of second circuit board 20, and
Conductive seat 30a is located at the lower section of perforation 25.
In the present embodiment, connecting element 40 have a first connecting portion 44, a second connecting portion 45 with
And a central connection 46.First connecting portion 44 is connected to conductive seat 30a conductive top surface 331, second
The conductive top surface 331 and central connection 46 that connecting portion 45 is connected to conductive seat 30b are connected to first
Connecting portion 44 and second connecting portion 45.Central connection 46 passes through perforation 25.
Retaining element 50 includes retaining element 50a and retaining element 50b.Retaining element 50a passes through connection
The first connecting portion 44 of element 40, and it is connected to conductive seat 30a.Retaining element 50b passes through connecting element
40 second connecting portion 45, and it is connected to conductive seat 30b.
In the present embodiment, retaining element 50a is a screw, is locked in conductive seat 30a, and fixed member
Part 50b is a screw, is locked in conductive seat 30b.
In the present embodiment, retaining element 50a and retaining element 50b is conductive.Retaining element 50a
Directly contact is with being electrically connected at conductive seat 30a and connecting element 40, and retaining element 50b is directly contacted
With being electrically connected at conductive seat 30b and connecting element 40.
In the present embodiment, it can connect by first connecting portion 44, second connecting portion 45 and/or center is changed
The length of socket part 46, to coordinate the first circuit board 10 and second circuit board 20 of different designs.In other words
Say, the relative position between conductive seat 30a and conductive seat 30b is coordinated first circuit board 10 and second
The design of circuit board 20 and adjust.For example in some embodiments, conductive seat 30a can not be located at perforation
25 lower section.
In summary, power transmission device of the invention utilizes conductive seat, connecting element and retaining element
It is electrically connected with two circuit boards, and to support the circuit board of top, therefore may replace in conventional art and be used for
The electric connector of two circuit boards is electrically connected with, the copper post in conventional art, Jin Erneng is also may replace or reduce
Reduce the cost of manufacture of power transmission device.
The embodiment mutually group that the above-mentioned feature disclosed can have been disclosed with one or more in any appropriate manner
Close, modify, replace or convert, be not limited to specific embodiment.
Though the present invention is disclosed above with various embodiments, but it is only exemplary reference and is not used to limit this
The scope of invention, it is any to be familiar with this those skilled in the art, without departing from the spirit and scope of the present invention, when can
Do a little change and modification.Therefore above-described embodiment is not limited to the scope of the present invention, the present invention
Protection domain when being defined depending on the appended claims scope person of defining.
Claims (16)
1. a kind of power transmission device, including：
One first circuit board；
One conductive seat, is fixed on the first circuit board；
One connecting element, is arranged on the conductive seat；
One second circuit board, is fixed in the connecting element；And
One retaining element, is arranged on the second circuit board, and passes through the second circuit board and the connection
Element is connected with the conductive seat,
Wherein the first circuit board electrically connects via the conductive seat and the connecting element with the second circuit board
Connect.
2. power transmission device as claimed in claim 1, in addition to a conductive material, and second electricity
Road plate also includes a conductive layer, and the wherein conductive material is arranged at the conductive layer, and the connecting element via
The conductive material is connected with the conductive layer.
3. power transmission device as claimed in claim 2, the wherein conductive layer include being a copper foil layer.
4. power transmission device as claimed in claim 1, the wherein retaining element are a screw, the spiral shell
Silk is locked in the conductive seat.
5. power transmission device as claimed in claim 1, the wherein retaining element are conductive, directly
Contact is with being electrically connected at the conductive seat, the connecting element and the second circuit board.
6. a kind of preparation method of power transmission device, including：
One conductive seat is fixed on a first circuit board；
A conductive material is coated with a conductive layer of a second circuit board and the one of a second circuit board is adjacent to
Conductive hole；
One connecting element is set in the conductive material, and the connecting element is fixed on this via the conductive material
Second circuit board；
The connecting element is placed in the conductive seat；And
One retaining element is run through into the second circuit board, the connecting element, and is connected to the conductive seat, with
The second circuit board is fixed on the first circuit board,
Wherein the first circuit board electrically connects via the conductive seat and the connecting element with the second circuit board
Connect.
7. the preparation method of power transmission device as claimed in claim 6, the wherein conductive layer are a bronze medal
Layers of foil.
8. the preparation method of power transmission device as claimed in claim 6, the wherein retaining element are one
Screw, is locked in the conductive seat.
9. the preparation method of power transmission device as claimed in claim 6, the wherein retaining element are to lead
Electric material, directly contact is with being electrically connected at the conductive seat, the connecting element and the second circuit board.
10. the preparation method of power transmission device as claimed in claim 6, in addition to：
One first connector and one first electronic component are fixed on the first circuit board；And
One second connector and one second electronic component are fixed on the second circuit board.
11. a kind of power transmission device, including：
One first circuit board；
One first conductive seat, is fixed on the first circuit board；
One second circuit board, above the first circuit board；
One second conductive seat, is fixed on the second circuit board；
One connecting element, connects first conductive seat and second conductive seat；
One first retaining element, through the connecting element, and is connected to first conductive seat；And
One second retaining element, through the connecting element, and is connected to second conductive seat,
Wherein the first circuit board is via first conductive seat, the connecting element, second conductive seat and is somebody's turn to do
Second circuit board is electrically connected with.
12. power transmission device as claimed in claim 11, wherein first retaining element are a screw,
First conductive seat is locked in, and second retaining element is a screw, is locked in second conductive seat.
13. power transmission device as claimed in claim 11, wherein first retaining element with this second
Retaining element is conductive, and first retaining element directly contact is with being electrically connected at first conductive seat
With the connecting element, and second retaining element directly contact be electrically connected at second conductive seat with should
Connecting element.
It is adjacent to 14. power transmission device as claimed in claim 11, the wherein second circuit board have
One perforation of second conductive seat, the connecting element passes through the perforation.
15. power transmission device as claimed in claim 11, the wherein connecting element, which have, is connected to this
One first connecting portion of the first conductive seat, the second connecting portion for being connected to second conductive seat and connection
In a central connection of the first connecting portion and the second connecting portion, the wherein second circuit board has one
Perforation, and the central connection passes through the perforation.
16. power transmission device as claimed in claim 11, the wherein connecting element are a Z-type structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610100765.1A CN107122012B (en) | 2016-02-24 | 2016-02-24 | Power transmission device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610100765.1A CN107122012B (en) | 2016-02-24 | 2016-02-24 | Power transmission device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107122012A true CN107122012A (en) | 2017-09-01 |
| CN107122012B CN107122012B (en) | 2023-09-19 |
Family
ID=59717588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610100765.1A Active CN107122012B (en) | 2016-02-24 | 2016-02-24 | Power transmission device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107122012B (en) |
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| CN113451791A (en) * | 2021-05-22 | 2021-09-28 | 深圳市越疆科技有限公司 | Connection structure of detection circuit board and electrode, electronic skin, shell and mechanical arm |
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| US6175509B1 (en) * | 1997-05-14 | 2001-01-16 | Hewlett-Packard Company | Space efficient local regulator for a microprocessor |
| US20030001254A1 (en) * | 2001-06-27 | 2003-01-02 | Jackson James Daniel | Electronic assembly with separate power and signal connections |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113451791A (en) * | 2021-05-22 | 2021-09-28 | 深圳市越疆科技有限公司 | Connection structure of detection circuit board and electrode, electronic skin, shell and mechanical arm |
| CN113451791B (en) * | 2021-05-22 | 2024-01-05 | 深圳市越疆科技股份有限公司 | Connection structure, electronic skin, shell and mechanical arm of detection circuit board and electrode |
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| Publication number | Publication date |
|---|---|
| CN107122012B (en) | 2023-09-19 |
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