CN107122012B - Power transmission device and manufacturing method thereof - Google Patents
Power transmission device and manufacturing method thereof Download PDFInfo
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- CN107122012B CN107122012B CN201610100765.1A CN201610100765A CN107122012B CN 107122012 B CN107122012 B CN 107122012B CN 201610100765 A CN201610100765 A CN 201610100765A CN 107122012 B CN107122012 B CN 107122012B
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- circuit board
- conductive
- power transmission
- transmission device
- connecting element
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
- H01R4/32—Conductive members located in slot or hole in screw
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/06—Connectors or connections adapted for particular applications for computer periphery
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a power transmission device and a manufacturing method thereof. The power transmission device comprises a first circuit board, a conductive seat, a connecting element, a second circuit board and a fixing element. The conductive seat is fixed on the first circuit board. The connecting element is arranged on the conductive seat. The second circuit board is fixed on the connecting element. The fixing element is arranged on the second circuit board and penetrates through the second circuit board and the connecting element to be connected with the conductive seat. The first circuit board is electrically connected with the second circuit board through the conductive seat and the connecting element.
Description
Technical Field
The present invention relates to power transmission devices, and more particularly to a power transmission device for a computer device.
Background
In some computer devices such as network servers that consume a large amount of power, a power transmission device is provided to transmit and supply power supplied from a power supply device to a motherboard.
Since the power transmission device has many electronic components for stabilizing and managing power, the internal space of the computer device can be utilized properly. As shown in fig. 1, the electronic components P30 of the power transmission device P1 are generally disposed on two circuit boards P10, P20 stacked on each other, respectively. In addition, since the amount of current passing through the power transmission device P1 is large, the electronic component P30 can be provided with different circuit boards P10 and P20, respectively, which is convenient for maintenance.
In the conventional art, the power transmission device P1 supports the upper circuit board P20 by using the copper pillar P40 and spaces the two circuit boards P10 and P20 from each other. The power transmission device P1 is provided with two electrical connectors P50 provided on the circuit boards P10 and P20, respectively, and is connected to the two electrical connectors P50 by the wires P60.
However, although the current power transmission device meets the purpose of use, it has not met many other requirements, and therefore, there is a need to provide an improved power transmission device, which can reduce the manufacturing cost of the power transmission device.
Disclosure of Invention
An object of the present invention is to improve a power transmission device and to reduce the manufacturing cost of the power transmission device;
another object of the present invention is to provide a method for manufacturing a power transmission device with low manufacturing cost.
The invention provides a power transmission device, which comprises a first circuit board, a conductive seat, a connecting element, a second circuit board and a fixing element. The conductive seat is fixed on the first circuit board. The connecting element is arranged on the conductive seat. The second circuit board is fixed on the connecting element. The fixing element is arranged on the second circuit board and penetrates through the second circuit board and the connecting element to be connected with the conductive seat. The first circuit board is electrically connected with the second circuit board through the conductive seat and the connecting element.
The invention provides a power transmission device, which comprises a first circuit board, a first conductive seat, a second circuit board, a second conductive seat, a connecting element, a first fixing element and a second fixing element. The first conductive seat is fixed on the first circuit board. The second circuit board is located above the first circuit board. The second conductive seat is fixed on the second circuit board.
The connecting element is connected with the first conductive seat and the second conductive seat. The first fixing element passes through the connecting element and is connected with the first conductive seat. The second fixing element passes through the connecting element and is connected with the second conductive seat. The first circuit board is electrically connected with the second circuit board through the first conductive seat, the connecting element and the second conductive seat.
In some embodiments, the power transmission device further includes a conductive material, and the second circuit board further includes a conductive layer, wherein the conductive material is disposed on the conductive layer, and the connection element is connected to the conductive layer through the conductive material.
In some embodiments, the fixing element is conductive, and is directly contacted and electrically connected to the conductive base, the connecting element and the second circuit board.
In some embodiments, the power transmission device further includes a first connector and a second connector. The first connector is arranged on the first circuit board and is used for connecting with a power supply device. The second connector is arranged on the second circuit board and is used for connecting with a motherboard.
The invention provides a manufacturing method of a power transmission device, which comprises the steps of fixing a conductive seat on a first circuit board; coating a conductive material on a conductive layer of a second circuit board and adjacent to a conductive hole of the second circuit board; arranging a connecting element on the conductive material, wherein the connecting element is fixed on the second circuit board through the conductive material; placing a connecting element on the conductive seat; a fixing element penetrates through the second circuit board and the connecting element and is connected to the conductive seat so as to fix the second circuit board on the first circuit board. The first circuit board is electrically connected with the second circuit board through the conductive seat and the connecting element.
In some embodiments, the method further includes fixing a first connector and a first electronic component to the first circuit board; and fixing a second connector and a second electronic element on the second circuit board.
In summary, the power transmission device of the present invention uses the conductive base, the connecting element and the fixing element to electrically connect the two circuit boards and is used for supporting the circuit boards above, so that the conventional electrical connector for electrically connecting the two circuit boards can be replaced or reduced, and the manufacturing cost of the power transmission device can be reduced.
Drawings
Fig. 1 is a schematic diagram of a conventional power transmission device.
Fig. 2 is a perspective view of the computer device of the present invention.
Fig. 3 is a perspective view of a first embodiment of the power transmission device of the present invention.
Fig. 4 is an exploded view of a first embodiment of the power transmission device of the present invention.
Fig. 5 is a cross-sectional view of a first embodiment of the power transmission device of the present invention.
Fig. 6 is a flowchart of a method for manufacturing the power transmission device of the present invention.
Fig. 7 is a schematic diagram of a manufacturing method of the power transmission device at an intermediate stage of the manufacturing process.
Fig. 8 is a perspective view of a second embodiment of the power transmission device of the present invention.
Fig. 9 is an exploded view of a second embodiment of the power transmission device of the present invention.
Fig. 10 is a cross-sectional view of a second embodiment of the power transmission device of the present invention.
Wherein reference numerals are as follows:
first circuit board 10
Upper surface 11
Jack 12
Second circuit board 20
Upper surface 21
Lower surface 22
Conductive hole 23
Conductive layer 24
Perforations 25
Conductive seats 30, 30a, 30b
Conductive body 31
Conductive top surface 331
Fixing hole 332
Pin 32
Connecting element 40
Connection body 41
Connection top 411
Connecting bottom surface 412
Protrusion 42
Connection hole 43
First connecting portion 44
Second connecting portion 45
Central connection 46
Fixing elements 50, 50a, 50b
Screw head 51
Screw 52
Computer equipment A1
Casing A10
Motherboard A20
Main electronic component A30
Power supply device A40
Power transmission device A50
First connector B10
First electronic component B20
Second connector B30
Second electronic component B40
Alignment direction D1
Conductive material M1
Power transmission device P1
Circuit boards P10, P20
Electronic component P30
Copper pillar P40
Electric connector P50
Wire P60
Detailed Description
The following description provides many different embodiments, or examples, for implementing different features of the invention. The elements and arrangements described in the following specific examples are presented for purposes of brevity and are provided only as examples and are not intended to limit the invention. For example, the description of a structure with a first feature on or over a second feature includes direct contact between the first and second features, or with another feature disposed between the first and second features, such that the first and second features are not in direct contact.
In addition, the present description may employ the same reference numerals and/or letters in the various examples. The foregoing description is for simplicity and clarity and has not necessarily been drawn to scale between different embodiments and configurations.
The terms first, second, etc. in this specification are used for clarity of explanation only and are not intended to correspond to or limit the scope of the patent. The terms first and second are not limited to the same or different terms.
The shapes, dimensions, thicknesses, and angles of inclination in the drawings may not be drawn to scale or simplified for clarity of illustration, and are provided for illustrative purposes only.
Fig. 2 is a perspective view of a computer device A1 according to the present invention. The computer device A1 may be a server, such as a web server. The computer apparatus A1 includes a housing a10, a motherboard a20, a plurality of main electronic components a30, a power supply device a40, and a power transmission device a50. The motherboard a20 is disposed in the casing a 10. The main electronic component a30 is disposed on the motherboard a20. The main electronic component A30 may include a CPU, a display chip, a memory, etc.
The power supply device a40 is used for supplying power to the power transmission device a50. The power supply device a40 may be configured to convert ac power into dc power and supply the dc power to the power transmission device a50. The power transmission device a50 is connected to the motherboard a20 and the power supply device a40.
The power transmission device a50 is configured to transmit the power transmitted by the power supply device a40 to the motherboard a20. In some embodiments of Power over Ethernet (PoE) network power switching devices, the power transmission device a50 can stabilize, step down and reduce the amount of current provided by the power source device a40 before transmitting the power to the motherboard a20.
In some embodiments, power supply device a40 supplies 12V and 60A. The power transmission device a50 drops the voltage of 12V to 5V and outputs a plurality of sets of currents to the motherboard a20, respectively, so as to supply the appropriate power to the main electronic component a 30.
Fig. 3 is a perspective view of a first embodiment of the power transmission device a50 of the present invention. Fig. 4 is an exploded view of a first embodiment of the power transmission device a50 of the present invention. Fig. 5 is a cross-sectional view of a first embodiment of the power transmission device a50 of the present invention. The power transmission device a50 includes a first circuit board 10, a second circuit board 20, two conductive seats 30, two connecting elements 40, and two fixing elements 50.
The first circuit board 10 and the second circuit board 20 are spaced apart from each other. In the present embodiment, the first circuit board 10 and the second circuit board 20 are substantially parallel to each other. The first circuit board 10, the conductive base 30, the connecting element 40 and the fixing element 50 are arranged in an arrangement direction D1.
In the present embodiment, the power transmission device a50 further includes a first connector B10, a plurality of first electronic components B20, a second connector B30, and a plurality of second electronic components B40. The first connector B10 and the first electronic component B20 are disposed on an upper surface 11 of the first circuit board 10. In the present embodiment, the first connector B10 and the first electronic component B20 are directly fixed and electrically connected to the first circuit board 10. The first connector B10 is electrically connected to the first electronic component B20 via the first circuit board 10.
The first connector B10 is used for connecting to the power supply device a40 in fig. 2. In other words, the power generated by the power supply device a40 is transmitted to the first circuit board 10 via the first connector B10. For example, the first electronic device B20 may be a voltage stabilizing device, an over-current protection device, a resistor, a capacitor, and the like.
In the present embodiment, the conductive base 30, the connecting element 40 and/or the fixing element 50 respectively form two electrode structures, wherein one of the two electrode structures is a positive electrode structure, and the other is a negative electrode structure.
The second circuit board 20 is electrically connected to the first circuit board 10 via the electrode structures (the conductive base 30, the connecting element 40 and/or the fixing element 50). In other words, the power supplied by the power supply device a40 is transmitted to the second circuit board 20 via the electrode structure after being processed by the first electronic component B20.
In the present embodiment, the electrode structure replaces the electrical connector with higher cost in the conventional technology, and electrically connects the first circuit board 10 and the second circuit board 20, so as to reduce the manufacturing cost of the power transmission device.
The second connector B30 and the second electronic component B40 are disposed on an upper surface 21 of the second circuit board 20. In the present embodiment, the second connector B30 and the second electronic component B40 are directly fixed and electrically connected to the second circuit board 20. The second electronic component B40 is electrically connected to the electrode structure via the second circuit board 20.
The conductive base 30 is fixed on the first circuit board 10. The conductive base 30 is conductive, made of conductive material, and electrically connected to the first circuit board 10. In the present embodiment, the conductive base 30 is a power terminal, and the two conductive bases 30 are a positive conductive terminal and a negative conductive terminal, respectively.
The conductive base 30 includes a conductive body 31 and a plurality of pins 32. The conductive body 31 has a conductive top surface 331 and a fixing hole 332. In the present embodiment, the conductive top surface 331 is a plane and may be substantially parallel to the first printed circuit board. The conductive top surface 331 is spaced from the upper surface 11. A fixing hole 332 is formed in the center of the conductive top surface 331.
The pins 32 are connected to the conductive body 31 and are integrally formed with the conductive body 31. The pins 32 are inserted into the insertion holes 12 of the first circuit board 10 and electrically connected to the first circuit board 10. The insertion hole 12 is formed in the upper surface 11 of the first circuit board 10. In the present embodiment, the pins 32 are soldered to the first printed circuit board, so that the conductive base 30 is fixed to the upper surface 11 of the first circuit board 10.
The connecting element 40 is fixed on the second circuit board 20 and disposed on the conductive base 30. The connecting element 40 is electrically conductive and is made of an electrically conductive material. The connecting element 40 is electrically connected to the second circuit board 20. The connecting element 40 in this embodiment may be a surface mount element (surface mounted devices nuts, SMD nuts).
The connecting element 40 comprises a connecting body 41 and a projection 42. The connection body 41 may have a plate-like structure and has a connection top 411 and a connection bottom 412. The connecting top surface 411 is opposite to the connecting bottom surface 412. The protruding portion 42 is provided at the center of the connection top surface 411. The connecting body 41 further includes a connecting hole 43 penetrating the center of the connecting body 41 and the protruding portion 42.
In the present embodiment, the connection top surface 411 is substantially parallel to the connection bottom surface 412, and the connection top surface 411 and the connection bottom surface 412 are both planar. The connection bottom surface 412 contacts the conductive top surface 331. Since the bottom surface 412 and the top surface 331 are both planar, the connection element 40 and the conductive base 30 have good electrical connection therebetween.
The connection top 411 of the connection element 40 contacts a lower surface 22 of the second circuit board 20, and the protrusion 42 is located in a conductive hole 23 of the second circuit board 20. In the present embodiment, the lower surface 22 faces the upper surface 11 of the first circuit board 10.
In this embodiment, the second circuit board 20 further includes a conductive layer 24 disposed on the lower surface 22 of the second circuit board 20. In some embodiments, the conductive layer 24 is also located on the sidewall and/or the upper surface 21 of the conductive via 23.
In the present embodiment, a conductive material M1 is disposed between the connection element 40 and the second circuit board 20, in other words, the conductive material M1 is disposed between the connection element 40 and the second circuit board 20. The connection element 40 is connected with the conductive layer 24 via the conductive material M1.
The fixing element 50 is disposed on the second circuit board 20, and passes through the second circuit board 20 and the connecting element 40 to be connected with the conductive base 30. In some embodiments, the fixing element 50 is electrically conductive, and directly contacts and electrically connects to the conductive base 30, the connecting element 40 and the second circuit board 20. In some embodiments, the fixation element 50 is insulating.
In this embodiment, the fixing element 50 is a screw, and is locked to the conductive base 30. The fixing element 50 has a screw head 51 and a screw 52. The screw head 51 is connected to the screw 52, and is integrally formed with the screw 52. The screw head 51 is connected to the upper surface 21 of the second circuit board 20. The screw 52 passes through the conductive hole 23 and the connection hole 43 to reach the fixing hole 332. As shown in fig. 5, one end of the screw 52 is locked to the fixing hole 332 of the conductive base 30.
In the present embodiment, since the conductive base 30 is fixed to the first circuit board 10 and the connecting element 40 is fixed to the second circuit board 20, when the power transmission device a50 is assembled, the connecting element 40 can be placed on the conductive base 30 first, and then the fixing element 50 passes through the second circuit board 20 and the connecting element 40 and is locked or fixed to the conductive base 30, so that the assembly can be completed simply.
When the power transmission device a50 is disassembled, the first circuit board 10 and the second circuit board 20 can be easily separated after the fixing element 50 is removed. Since the conductive layer 24 and the conductive material M1 on the lower surface 22 of the second circuit board 20 are not worn out when the power transmission device a50 is assembled or disassembled, the service life of the power transmission device a50 can be increased.
In this embodiment, the electrode structure (the conductive base 30, the connecting element 40 and the fixing element 50) is made of rigid materials such as metal, and the electrode structure can firmly support the second circuit board 20 and space the first circuit board 10 and the second circuit board 20 from each other. Therefore, the electrode structure can replace or reduce copper columns in the traditional technology, and further the manufacturing cost of the power transmission device can be reduced.
Fig. 6 is a flowchart of a method for manufacturing the power transmission device a50 according to the present invention. Fig. 7 is a schematic diagram of a method for manufacturing the power transmission device a50 in an intermediate stage of the manufacturing process. It is to be understood that additional steps may be added before, after, and between the steps in the methods of the embodiments described below, and that some of the steps described above may be replaced, deleted, or moved.
In step S101, the first connector B10, the first electronic component B20, and the conductive base 30 are fixed to the first circuit board 10. In step S103, as shown in fig. 7, a conductive material M1 is coated on the conductive layer 24 of the second circuit board 20 and adjacent to the conductive via 23. At this time, the conductive material M1 is in a paste, molten or liquid state.
In the present embodiment, the conductive layer 24 may be a copper foil layer, and the conductive material M1 may be solder paste or conductive paste. By covering the conductive layer 24 with the conductive material M1, precious metals such as gold or silver are not required to be plated on the conductive layer 24, so that oxidation of the conductive layer 24 is avoided, and the manufacturing cost of the power transmission device a50 is reduced.
In step S105, the connecting element 40 is disposed on the conductive material M1 (as shown in fig. 5) before the conductive material M1 in the paste, molten or liquid state is solidified. Since the conductive material M1 is in a paste, molten or liquid state, the conductive material M1 can be well connected to the connection element 40 and the conductive layer 24 of the second circuit board 20.
After the conductive material M1 is cured, the connection element 40 is fixed to the second circuit board 20 via the cured conductive material M1. In the present embodiment, the second circuit board 20 may be left standing for a period of time, for example, one minute, to cure the conductive material M1.
Then, the second connector and the second electronic component B40 may be fixed to the second circuit board 20. The step of fixing the second connector and the second electronic component B40 to the second circuit board 20 may also be performed before step S103.
In step S107, the connecting element 40 is placed on the conductive base 30. In step S109, the fixing element 50 penetrates the second circuit board 20 and the connecting element 40 and is connected to the conductive base 30, so as to fix the second circuit board 20 to the first circuit board 10.
Fig. 8 is a perspective view of a second embodiment of the power transmission device a50 of the present invention. Fig. 9 is an exploded view of a second embodiment of the power transmission device a50 of the present invention. Fig. 10 is a cross-sectional view of a second embodiment of the power transmission device a50 of the present invention.
The conductive sockets 30 include a plurality of conductive sockets 30a and a plurality of conductive sockets 30b. The conductive base 30a is fixed to the first circuit board 10. The conductive base 30b is fixed on the second circuit board 20. The second circuit board 20 is located above the first circuit board 10. The second circuit board 20 has a perforation 25 adjacent to the conductive mount 30b.
The connection element 40 connects the conductive socket 30a and the conductive socket 30b. The first circuit board 10 is electrically connected to the second circuit board 20 via the conductive base 30a, the connection element 40, and the conductive base 30b. In this embodiment, the connecting element 40 has a Z-shaped structure. The connection element 40 passes through the through hole 25 of the second circuit board 20, and the conductive seat 30a is located below the through hole 25.
In the present embodiment, the connecting element 40 has a first connecting portion 44, a second connecting portion 45 and a central connecting portion 46. The first connection portion 44 is connected to the conductive top surface 331 of the conductive base 30a, the second connection portion 45 is connected to the conductive top surface 331 of the conductive base 30b, and the central connection portion 46 is connected to the first connection portion 44 and the second connection portion 45. The central connection 46 passes through the perforation 25.
The fixing element 50 includes a fixing element 50a and a fixing element 50b. The fixing element 50a passes through the first connection portion 44 of the connection element 40 and is connected to the conductive socket 30a. The fixing element 50b passes through the second connection portion 45 of the connection element 40 and is connected to the conductive socket 30b.
In this embodiment, the fixing element 50a is a screw, which is locked to the conductive base 30a, and the fixing element 50b is a screw, which is locked to the conductive base 30b.
In the present embodiment, the fixing element 50a and the fixing element 50b are conductive. The fixing element 50a is directly contacted and electrically connected to the conductive base 30a and the connecting element 40, and the fixing element 50b is directly contacted and electrically connected to the conductive base 30b and the connecting element 40.
In the present embodiment, the lengths of the first connecting portion 44, the second connecting portion 45 and/or the central connecting portion 46 can be changed to match the first circuit board 10 and the second circuit board 20 with different designs. In other words, the relative positions of the conductive base 30a and the conductive base 30b can be adjusted according to the designs of the first circuit board 10 and the second circuit board 20. For example, in some embodiments, the conductive mount 30a may not be located below the perforation 25.
In summary, the power transmission device of the present invention uses the conductive base, the connecting element and the fixing element to electrically connect the two circuit boards and is used for supporting the circuit boards above, so that the conventional electrical connector for electrically connecting the two circuit boards can be replaced or reduced, and the manufacturing cost of the power transmission device can be reduced.
The described features may be combined with, modified from, substituted for, or interchanged with one or more of the described embodiments in any suitable manner and are not limited to the specific embodiments.
While the invention has been described with reference to various embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. The above embodiments are therefore not intended to limit the scope of the invention, which is defined in the appended claims.
Claims (16)
1. A power transmission device, comprising:
a first circuit board having an upper surface and a lower surface;
a conductive seat fixed on the upper surface of the first circuit board;
a second circuit board having an upper surface and a lower surface, the upper surface being opposite to the lower surface, the lower surface of the second circuit board facing the upper surface of the first circuit board;
a connecting element arranged between the lower surface of the second circuit board and the conductive seat and fixed on the lower surface of the second circuit board; and
a fixing element arranged on the upper surface of the second circuit board and penetrating through the second circuit board and the connecting element to be connected with the conductive seat,
the first circuit board is electrically connected with the second circuit board through the conductive seat and the connecting element.
2. The power transmission device of claim 1, further comprising a conductive material, and the second circuit board further comprises a conductive layer, wherein the conductive material is disposed on the conductive layer, and the connection element is connected to the conductive layer through the conductive material.
3. The power transmission device of claim 2, wherein the conductive layer comprises a copper foil layer.
4. The power transmission device of claim 1, wherein the fixing element is a screw, and the screw is locked to the conductive base.
5. The power transmission device of claim 1, wherein the fixing element is electrically conductive and is directly contacted and electrically connected to the conductive base, the connecting element and the second circuit board.
6. A method of manufacturing a power transmission device, comprising:
fixing a conductive seat on a first circuit board;
coating a conductive material on a conductive layer of a second circuit board and adjacent to a conductive hole of the second circuit board;
disposing a connecting element on the conductive material, wherein the connecting element is fixed on the second circuit board via the conductive material;
placing the connecting element on the conductive seat; and
a fixing element penetrates through the second circuit board and the connecting element and is connected with the conductive seat so as to fix the second circuit board on the first circuit board,
the first circuit board is electrically connected with the second circuit board through the conductive seat and the connecting element.
7. The method of claim 6, wherein the conductive layer is a copper foil layer.
8. The method of claim 6, wherein the fixing element is a screw, and is fastened to the conductive base.
9. The method of claim 6, wherein the fixing element is made of conductive material and is directly contacted with and electrically connected to the conductive base, the connecting element and the second circuit board.
10. The method of manufacturing a power transmission device according to claim 6, further comprising:
fixing a first connector and a first electronic element on the first circuit board; and
a second connector and a second electronic element are fixed on the second circuit board.
11. A power transmission device, comprising:
a first circuit board having an upper surface and a lower surface;
the first conductive seat is fixed on the upper surface of the first circuit board;
a second circuit board located above the first circuit board, the second circuit board having an upper surface and a lower surface, the lower surface of the second circuit board facing the upper surface of the first circuit board;
a second conductive seat fixed on the upper surface of the second circuit board;
a connecting element connected to the first conductive base and the second conductive base, wherein a portion of the connecting element connected to the first conductive base is disposed between the lower surface of the second circuit board and the first conductive base;
the first fixing element passes through the connecting element and is connected with the first conductive seat; and
a second fixing element passing through the connecting element and connected to the second conductive seat,
the first circuit board is electrically connected with the second circuit board through the first conductive seat, the connecting element and the second conductive seat.
12. The power transmission device of claim 11, wherein the first fixing element is a screw, and is locked to the first conductive base, and the second fixing element is a screw, and is locked to the second conductive base.
13. The power transmission device of claim 11, wherein the first and second fixing elements are electrically conductive, the first fixing element is directly in contact with and electrically connected to the first conductive base and the connecting element, and the second fixing element is directly in contact with and electrically connected to the second conductive base and the connecting element.
14. The power transmission device of claim 11, wherein the second circuit board has a through hole adjacent to the second conductive base, the connection element passing through the through hole.
15. The power transmission device of claim 11, wherein the connecting element has a first connecting portion connected to the first conductive base, a second connecting portion connected to the second conductive base, and a central connecting portion connected to the first connecting portion and the second connecting portion, wherein the second circuit board has a through hole, and the central connecting portion passes through the through hole.
16. The power transmission device of claim 11, wherein the connecting element is a Z-shaped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610100765.1A CN107122012B (en) | 2016-02-24 | 2016-02-24 | Power transmission device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610100765.1A CN107122012B (en) | 2016-02-24 | 2016-02-24 | Power transmission device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107122012A CN107122012A (en) | 2017-09-01 |
| CN107122012B true CN107122012B (en) | 2023-09-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610100765.1A Active CN107122012B (en) | 2016-02-24 | 2016-02-24 | Power transmission device and manufacturing method thereof |
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| CN (1) | CN107122012B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113451791B (en) * | 2021-05-22 | 2024-01-05 | 深圳市越疆科技股份有限公司 | Connection structure, electronic skin, shell and mechanical arm of detection circuit board and electrode |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6024589A (en) * | 1997-05-14 | 2000-02-15 | Hewlett-Packard Company | Power bus bar for providing a low impedance connection between a first and second printed circuit board |
| US6175509B1 (en) * | 1997-05-14 | 2001-01-16 | Hewlett-Packard Company | Space efficient local regulator for a microprocessor |
| TW201301688A (en) * | 2011-06-29 | 2013-01-01 | Inventec Corp | Transfer module |
| CN103379813A (en) * | 2012-04-24 | 2013-10-30 | 纬创资通股份有限公司 | Electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6627822B2 (en) * | 2001-06-27 | 2003-09-30 | Intel Corporation | Electronic assembly with separate power and signal connections |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6024589A (en) * | 1997-05-14 | 2000-02-15 | Hewlett-Packard Company | Power bus bar for providing a low impedance connection between a first and second printed circuit board |
| US6175509B1 (en) * | 1997-05-14 | 2001-01-16 | Hewlett-Packard Company | Space efficient local regulator for a microprocessor |
| TW201301688A (en) * | 2011-06-29 | 2013-01-01 | Inventec Corp | Transfer module |
| CN103379813A (en) * | 2012-04-24 | 2013-10-30 | 纬创资通股份有限公司 | Electronic device |
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| CN107122012A (en) | 2017-09-01 |
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