CN107482333B - Connectors, Connector Assemblies, Power Assemblies and Terminal Equipment - Google Patents
Connectors, Connector Assemblies, Power Assemblies and Terminal Equipment Download PDFInfo
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- CN107482333B CN107482333B CN201710572544.9A CN201710572544A CN107482333B CN 107482333 B CN107482333 B CN 107482333B CN 201710572544 A CN201710572544 A CN 201710572544A CN 107482333 B CN107482333 B CN 107482333B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
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- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
技术领域technical field
本发明涉及电子产品领域,尤其涉及一种连接器、连接器组件、电源组件和终端设备。The invention relates to the field of electronic products, in particular to a connector, a connector assembly, a power supply assembly and a terminal device.
背景技术Background technique
连接器在终端设备中有广泛的应用。连接器在工作过程中会产生热量,过多的热量使连接器的电阻率增加,导致电性能劣化,影响终端设备的正常运行。Connectors are widely used in terminal equipment. The connector will generate heat during the working process. Excessive heat will increase the resistivity of the connector, resulting in electrical performance deterioration and affecting the normal operation of the terminal equipment.
发明内容SUMMARY OF THE INVENTION
有鉴于此,本发明提供了一种连接器、连接器组件、电源组件和终端设备,能够解决连接器过热的问题。In view of this, the present invention provides a connector, a connector assembly, a power supply assembly and a terminal device, which can solve the problem of overheating of the connector.
一种连接器,所述连接器包括导热部、本体和设置于所述本体上的端子;所述本体的外表面上设有散热孔;所述导热部位于所述本体外部,并与所述本体连接。A connector comprising a heat conducting part, a body and terminals arranged on the body; a heat dissipation hole is arranged on the outer surface of the body; the heat conducting part is located outside the body and is connected with the body Body connection.
其中,所述导热部包括间隔排列的多个第一散热板,相邻的两个所述第一散热板之间夹设有第二散热板,单个所述第一散热板的面积大于单个所述第二散热板的面积;位于最外侧的一个所述第一散热板与所述本体相连。Wherein, the heat conduction part includes a plurality of first heat dissipation plates arranged at intervals, a second heat dissipation plate is sandwiched between two adjacent first heat dissipation plates, and the area of a single first heat dissipation plate is larger than that of a single first heat dissipation plate. The area of the second heat dissipation plate; the first heat dissipation plate located on the outermost side is connected to the body.
其中,所述导热部包括间隔排列的多个第一散热板,相邻的两个所述第一散热板之间夹设有第二散热板,单个所述第一散热板的面积大于单个所述第二散热板的面积;至少一个所述第一散热板与所述本体相连。Wherein, the heat conduction part includes a plurality of first heat dissipation plates arranged at intervals, a second heat dissipation plate is sandwiched between two adjacent first heat dissipation plates, and the area of a single first heat dissipation plate is larger than that of a single first heat dissipation plate. the area of the second heat dissipation plate; at least one of the first heat dissipation plate is connected to the body.
其中,多个所述第一散热板中未与所述本体连接的所述第一散热板上设有插脚。Wherein, among the plurality of first heat dissipation plates, the first heat dissipation plate that is not connected to the body is provided with pins.
其中,所述第一散热板与所述第二散热板通过压接、铆接、螺接或粘接的方式固定。Wherein, the first heat dissipation plate and the second heat dissipation plate are fixed by means of crimping, riveting, screwing or bonding.
其中,所述导热部包括两个第一柱体,以及连接于两个所述第一柱体之间的第二柱体,所述第一柱体的径向尺寸大于所述第二柱体的径向尺寸,两个所述第一柱体中的一个所述第一柱体与所述本体相连。Wherein, the heat conducting part includes two first cylinders and a second cylinder connected between the two first cylinders, and the radial dimension of the first cylinder is larger than that of the second cylinder the radial dimension, one of the two first cylinders is connected with the body.
其中,所述导热部包括设于所述本体上的胶框,所述胶框内填充有导热胶,所述导热胶与所述本体接触。Wherein, the heat-conducting portion includes a plastic frame disposed on the main body, the plastic frame is filled with thermally conductive adhesive, and the thermally conductive adhesive is in contact with the main body.
其中,所述连接器还包括收容在所述本体之内的基座,多个所述端子间隔排布在所述基座上。Wherein, the connector further includes a base accommodated in the body, and a plurality of the terminals are arranged on the base at intervals.
其中,所述连接器为板对板连接器。Wherein, the connector is a board-to-board connector.
一种连接器组件,包括电路板,以及上述的连接器;其中,所述导热部与所述电路板相连,所述端子与所述电路板电连接。A connector assembly includes a circuit board and the above-mentioned connector; wherein, the heat conducting part is connected to the circuit board, and the terminal is electrically connected to the circuit board.
一种电源组件,包括电池,还包括上述的连接器;其中,所述电池上引出有柔性电路板,所述电池通过所述柔性电路板与所述连接器连接。A power supply assembly includes a battery and the above connector; wherein a flexible circuit board is drawn out from the battery, and the battery is connected to the connector through the flexible circuit board.
一种终端设备,包括壳体、主板以上述的连接器,所述主板及所述连接器均设于所述壳体内;其中,所述导热部与所述壳体或所述主板相连,所述端子与所述主板电连接。A terminal device, comprising a housing, a main board and the above-mentioned connector, wherein the main board and the connector are both arranged in the housing; wherein, the heat conducting part is connected to the housing or the main board, and the The terminals are electrically connected to the main board.
其中,还包括设于所述壳体内的电池,所述电池上引出有柔性电路板,所述电池通过所述柔性电路板与所述连接器连接。Wherein, it also includes a battery provided in the casing, a flexible circuit board is drawn out from the battery, and the battery is connected to the connector through the flexible circuit board.
本发明的方案,通过所述本体上的所述散热孔将所述端子上的热量散发出去。所述端子上的热量也会传递到所述本体。通过所述导热部,所述本体又能将热量传递至面积较大的电路板上,借由电路板将热量散发。由此通过对流散热和接触导热、散热,能够避免所述连接器中的热量过度累积,防止所述连接器的温升过高,保证了所述连接器的性能。In the solution of the present invention, the heat on the terminal is dissipated through the heat dissipation hole on the body. Heat on the terminals is also transferred to the body. Through the heat-conducting portion, the body can transfer heat to a circuit board with a larger area, and dissipate the heat through the circuit board. Therefore, through convection heat dissipation and contact heat conduction and heat dissipation, excessive heat accumulation in the connector can be avoided, the temperature rise of the connector is prevented from being too high, and the performance of the connector is guaranteed.
附图说明Description of drawings
为更清楚地阐述本发明的构造特征和功效,下面结合附图与具体实施例来对其进行详细说明。In order to illustrate the structural features and effects of the present invention more clearly, the following detailed description will be given in conjunction with the accompanying drawings and specific embodiments.
图1是本发明第一实施例的连接器的轴测示意图;1 is a schematic axonometric view of a connector according to a first embodiment of the present invention;
图2是图1中的连接器与电路板的组装轴测示意图;Fig. 2 is the assembly axonometric schematic diagram of the connector and the circuit board in Fig. 1;
图3是图2中部件的正视示意图;Figure 3 is a schematic front view of the components in Figure 2;
图4是本发明第二实施例的连接器与电路板的组装结构的正视示意图;4 is a schematic front view of the assembly structure of the connector and the circuit board according to the second embodiment of the present invention;
图5是本发明第三实施例的连接器与电路板的组装结构的正视示意图;5 is a schematic front view of an assembly structure of a connector and a circuit board according to a third embodiment of the present invention;
图6是本发明第四实施例的连接器与电路板的组装结构的正视示意图;6 is a schematic front view of the assembly structure of the connector and the circuit board according to the fourth embodiment of the present invention;
图7是本发明实施例的终端设备的正视示意图;7 is a schematic front view of a terminal device according to an embodiment of the present invention;
图8是图7中I处的放大轴测示意图。FIG. 8 is an enlarged axonometric schematic view at I in FIG. 7 .
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例是本发明的一部分实施例,而不是全部实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例,都应属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
本发明以下实施例提供了一种连接器,可应用于终端设备中。所述连接器包括本体和设置于所述本体上的端子;所述本体的外表面上设有散热孔,所述本体连接有导热部。The following embodiments of the present invention provide a connector, which can be applied to a terminal device. The connector includes a main body and terminals arranged on the main body; the outer surface of the main body is provided with heat dissipation holes, and the main body is connected with a heat conduction part.
其中,所述本体对其内的端子具有机械防护作用。所述本体可以使用绝缘材料制造,以起到电学防护作用。所述端子在有电流流过时会发热,热量通过所述本体上的所述散热孔散发出去。所述端子上的热量也会传递到所述本体。通过所述导热部,所述本体又能将热量传递至其他部件,例如所述终端设备中面积较大的电路板或壳体上,借由所述电路板或所述壳体将热量散发。即本发明实施例的方案通过对流散热和接触导热、散热,能够避免所述连接器中的热量过度累积,防止所述连接器的温升过高,保证了所述连接器的性能。Wherein, the body has a mechanical protective effect on the terminals in it. The body can be made of insulating material for electrical protection. The terminal generates heat when current flows, and the heat is dissipated through the heat dissipation holes on the body. Heat on the terminals is also transferred to the body. Through the heat-conducting portion, the body can transfer heat to other components, such as a circuit board or a casing with a larger area in the terminal device, and the heat is dissipated through the circuit board or the casing. That is, the solution of the embodiment of the present invention can avoid excessive heat accumulation in the connector, prevent the temperature rise of the connector from being too high, and ensure the performance of the connector through convection heat dissipation and contact heat conduction and heat dissipation.
以下实施例将以所述导热部将热量传递到所述电路板上为例进行描述。The following embodiments will be described by taking the heat transfer part transferring heat to the circuit board as an example.
具体的,在本发明第一实施例中,如图1所示,连接器10包括本体11和收容在本体11内的端子13。本体11的各个表面均设有散热孔111,且本体11的一侧连接有导热部12。Specifically, in the first embodiment of the present invention, as shown in FIG. 1 , the
如图2所示,导热部12可与电路板100相连。端子13则可与电路板100电连接。其中,导热部12包括间隔排列的多个第一散热板121,相邻的两个第一散热板121之间夹设有第二散热板122,单个第一散热板121的面积大于单个第二散热板122的面积。最外侧的一个第一散热板121与本体11相连,且每个第一散热板11均与电路板100相连。As shown in FIG. 2 , the
本第一实施例中,优选的散热孔111为圆孔,并在本体11的各个表面均有分布。在其他实施例中,散热孔111可以是其他形状的孔,例如方孔、腰型孔等;散热孔111也可以仅分布在本体11的部分表面,例如仅部分在其中一个表面。并且,散热孔111在表面上的位置,可以根据实际需要予以设置,不限于呈矩阵式样。In the first embodiment, the preferred
本第一实施例中,每个第一散热板121都与电路板100相连,且最外侧(图1、图2中为最右侧)的一个第一散热板121与本体11相连,以将本体11上的热量传递到电路板100,藉由电路板100散发出去。同时,由于导热部12形成多层板结构,由于导热部12中叠加起来的散热板大小不一,使得第一散热板121与第二散热板122之间形成额外的表面,不仅增加了导热效率,还起到了直接散热的作用。即本第一实施例的方案中,导热部12不仅能够有效导热,还能通过自身结构有效散热,从而能够避免连接器10中的热量过度累积,防止连接器10的温升过高,保证了连接器10的性能。In the first embodiment, each of the first
本第一实施例中,第一散热板121与第二散热板122均可以为方形板,且多个第一散热板121与多个第二散热板122的位置可以是中心对齐。此种结构的导热部12容易加工、结构美观。在其他实施例中,第一散热板121与第二散热板122的形状可以是其他形状,例如可以是一端为圆弧形、另一端为方形;多个第一散热板121与多个第二散热板122的位置不限于为中心对齐,例如第一散热板121与第二散热板122可以是一边平齐,以使第一散热板121与第二散热板122均与电路板100相连,由此进一步增大了与电路板100的接触面积,进一步提升了导热效率。In the first embodiment, both the first
本第一实施例中,各个第一散热板121与各个第二散热板122可以通过压接、铆接、螺接或粘接的方式连接。这些工艺成熟可靠,能够保证所制造的导热部12的工艺质量。当然,还可以采用其他适宜的工艺。In the first embodiment, each of the first
本第一实施例中,与电路板100相连的每个第一散热板121上可以设有插脚,所述插脚插接在电路板100上。由此,整个导热部12能够稳固组装在电路板100上,从而能够加强导热部12与电路板100的接触,保证导热的稳定性。当然,第一散热板121还可以采用其他方式与电路板100相连,例如可以通过粘接、焊接等。In the first embodiment, each of the first
进一步的,如图3所示,连接器10还可以包括收容在本体11之内的基座14,多个端子13间隔排布在基座14上。具体的,端子13可以具有延伸入本体11之内的部分,此部分连在基座14上。基座14能够使端子13按所需要的位置和间距排列,并保证端子13之间以及端子13与本体11之间的绝缘性能。在其他实施例中,也可以不设基座14,端子132通过其他固持结构设于本体11内。Further, as shown in FIG. 3 , the
如图4所示,在本发明第二实施例中,与上述第一实施例相同的是,连接器20的导热部22包括间隔排列的多个第一散热板221,相邻的两个第一散热板之间夹设有第二散热板222,单个第一散热板221的面积大于单个第二散热板222的面积。但与上述第一实施例不同的是,至少一个第一散热板221与本体11相连,且最外侧的一个第一散热板221可与电路板100相连。As shown in FIG. 4 , in the second embodiment of the present invention, similar to the above-mentioned first embodiment, the
本第二实施例中,相较于第一实施例中导热部12“立放”的方式,导热部22是“平放”的方式。由此能够提供一种替代的结构设计及加工制造方式,以满足不同产品设计需要。导热部22中的五个第一散热板221与本体11相连,且最外侧(图4中为最下方)的一个第一散热板221与电路板100相连。当然,与本体11相连的第一散热板221的数量不限于为五个,可以根据需要设置。在其他实施例中,若干第二散热板222也可与本体11相连,以进一步增大与本体11的导热面积。In the second embodiment, compared with the way of "standing" of the heat-conducting
进一步的,本第二实施例中,如图4所示,位于最外侧(图4中为最下方)的一个第一散热板221上可以设有插脚,便于与电路板100相连。Further, in the second embodiment, as shown in FIG. 4 , a first
如图5所示,在本发明第三实施例中,与上述第一实施例不同的是,连接器30的导热部32包括两个第一柱体321,以及连接于两个第一柱体321之间的第二柱体322。其中,第一柱体321的径向尺寸大于第二柱体322的径向尺寸,一个第一柱体321与本体11相连,另一个第一柱体321可与电路板100相连。As shown in FIG. 5 , in the third embodiment of the present invention, different from the above-mentioned first embodiment, the heat-conducting portion 32 of the
本第三实施例中,由于径向尺寸的差异,第一柱体321与第二柱体322之间形成了额外的表面,由此增强了导热效率。此种导热部32结构简单,便于制造。导热部32的数量可以是至少一个;若干导热部32均可以与端子13并排设置。此时,导热部32类似支柱支撑在本体11与电路板100之间。In this third embodiment, due to the difference in radial dimensions, an extra surface is formed between the first cylinder 321 and the second cylinder 322, thereby enhancing the thermal conductivity. The heat-conducting portion 32 has a simple structure and is easy to manufacture. The number of the heat-conducting parts 32 may be at least one; several heat-conducting parts 32 may be arranged side by side with the
如图6所示,在本发明第四实施例中,与上述第一实施例不同的是,连接器40的导热部42包括设于本体11上的胶框421,胶框421内填充有导热胶422,导热胶422的一端与本体11接触,另一端可与电路板100接触。其中,胶框421为中空的框体,胶框421的一侧连在本体11上。填充在胶框421内的导热胶142能够与本体11和电路板100接触,从而将本体11上的热量传递到电路板100。本第四实施例中,使用胶框421内填充导热胶422的方式导热,不仅设计简单,而且导热效率高。此方式中,导热部42主要起到导热作用,其散热作用微弱。而上述三种实施例的方案,导热部既能有效导热,又能有效散热。导热部42的数量可以是至少一个;若干导热部42均可以与端子13并排设置,以支撑在本体11与电路板100之间。As shown in FIG. 6 , in the fourth embodiment of the present invention, different from the first embodiment described above, the heat-conducting
本发明以上实施例中,所述连接器可以为板对板(BTB)连接器。BTB连接器采用了窄片式接触,使用表面贴片焊接(SMT)工艺,端子排列间距更小,具有小型化、薄型化和高性能等优势。当然,所述连接器还可以是其他类型的连接器,例如为零插入力(ZeroInsertion Force,简称为ZIF)连接器。In the above embodiments of the present invention, the connector may be a board-to-board (BTB) connector. The BTB connector adopts a narrow blade contact, uses a surface-mount soldering (SMT) process, and has a smaller terminal arrangement pitch, which has the advantages of miniaturization, thinness and high performance. Of course, the connector may also be other types of connectors, such as a zero insertion force (ZeroInsertion Force, ZIF for short) connector.
本发明实施例还提供了一种连接器组件,所述连接器组件包括电路板,以及上述实施例所述的连接器。其中,所述连接器的所述导热部与所述电路板相连,所述端子与所述电路板电连接。所述连接器组件通过所述导热部,能将所述本体上的热量传递至面积较大的所述电路板上,借由所述电路板将热量散发。由此能够避免所述连接器的热量过度累积,防止所述连接器的温升过高,保证了所述连接器的性能。所述连接器组件,例如可以包括上述第一实施例中的连接器10及电路板100。Embodiments of the present invention further provide a connector assembly, which includes a circuit board and the connector described in the above embodiments. Wherein, the heat conducting portion of the connector is connected with the circuit board, and the terminal is electrically connected with the circuit board. The connector assembly can transfer the heat on the body to the circuit board with a larger area through the heat conducting part, and dissipate the heat through the circuit board. In this way, excessive heat accumulation of the connector can be avoided, the temperature rise of the connector can be prevented from being too high, and the performance of the connector can be ensured. The connector assembly may include, for example, the
本发明实施例还提供了一种终端设备,包括但不限于手机、平板电脑等电子设备。如图7所示,终端设备200包括壳体210、主板及上述实施例中的所述连接器。所述主板及所述连接器均设于壳体210内。其中,所述连接器的所述导热部可与壳体210或所述主板相连,所述端子则与所述主板电连接。例如,所述连接器可以是上述第一实施例中的连接器10;所述主板可以是上述的电路板100,所述导热部可与电路板100相连。终端设备200能够通过电路板100或壳体210将连接器10的热量散发,从而避免了连接器中的热量过度累积,防止连接器的温升过高,保证了连接器以至终端设备200的性能。Embodiments of the present invention also provide a terminal device, including but not limited to electronic devices such as a mobile phone and a tablet computer. As shown in FIG. 7 , the
终端设备200中,通过连接器10,能够实现其他模组或部件与电路板100的电连接。In the
例如,如图7和8所示,所述的其他模组或部件可以是电池222,电池222上可以引出有柔性电路板221,电池222通过柔性电路板221与所述连接器(例如连接器10)相连。本实施例的所述连接器(例如连接器10)、电池222及柔性电路板221可以是电源组件220的组成部件。当然,电源组件220还可以包括其他模块或部件,例如包括功率匹配器件。电源组件220中,由于电池222无需经常拆卸,因此可以做终端设备200的内置电源,以满足当前主流产品设计的需要。For example, as shown in FIGS. 7 and 8 , the other modules or components may be
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易的想到各种等效的修改或替换,这些修改或替换都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以权利要求的保护范围为准。The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. Any person skilled in the art can easily think of various equivalents within the technical scope disclosed by the present invention. Modifications or replacements, these modifications or replacements should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
Claims (8)
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| CN106027724A (en) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | Mobile terminal and mobile phone |
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| CN205846328U (en) * | 2016-07-11 | 2016-12-28 | 嘉基电子科技(苏州)有限公司 | Cable Connector Assembly |
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| CN103384037B (en) * | 2012-05-01 | 2016-07-06 | 莫列斯有限公司 | Adapter |
| US9287656B2 (en) * | 2013-11-11 | 2016-03-15 | Amphenol Corporation | Heat dissipating electrical connector |
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|---|---|---|---|---|
| CN204029952U (en) * | 2014-07-04 | 2014-12-17 | 惠州Tcl移动通信有限公司 | A kind of battery and radiator structure thereof |
| CN106101692A (en) * | 2015-04-29 | 2016-11-09 | 塔工程有限公司 | Bread board for camera model |
| CN205846328U (en) * | 2016-07-11 | 2016-12-28 | 嘉基电子科技(苏州)有限公司 | Cable Connector Assembly |
| CN106027724A (en) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | Mobile terminal and mobile phone |
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