CN107121897A - A kind of photoresist circuit design - Google Patents
A kind of photoresist circuit design Download PDFInfo
- Publication number
- CN107121897A CN107121897A CN201710425257.5A CN201710425257A CN107121897A CN 107121897 A CN107121897 A CN 107121897A CN 201710425257 A CN201710425257 A CN 201710425257A CN 107121897 A CN107121897 A CN 107121897A
- Authority
- CN
- China
- Prior art keywords
- photoresist
- container
- circuit design
- pipe
- design according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The present invention relates to technical field of semiconductors, more particularly to a kind of photoresist circuit design, including：Photoresist container, is positioned in a temperature control room；Photoresist container includes an air inlet and a gum outlet, and air inlet extrudes the photoresist in photoresist container from gum outlet for being passed through gas；First pipeline, is sequentially connected the gum outlet of photoresist container, one prestores container, a filter, a proximal pod, a pump and a shower nozzle；First pipeline is wrapped with second pipe, and second pipe is heated for being passed through heating medium to the first pipeline；The beneficial effect of above-mentioned technical proposal is：The use term of validity of photoresist can be improved while the spraying of photoresist is not influenceed.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of photoresist circuit design.
Background technology
The technical sophistication of photoresist, kind is more.According to its chemical reaction mechanism and development principle, negative photoresist and just can be divided
The property class of glue two.Form insoluble material after illumination is negative photoresist；Conversely, being insoluble to some solvents, become after illumination
What it is into soluble substance is positive photoresist., just can be in the electricity needed for silicon chip surface is etched by photoresist making coatings using this performance
Road figure.
Photoresist is expensive and the term of validity is short, and the term of validity typically only has 6 months, and some special photoetching glue, such as
Some on-chip system packing materials, the at normal temperatures term of validity of only 10 days.Photoresist is stored in refrigeration or freezing environment
And transport, but be to be stored at normal temperatures in board in operation process.Some boards glue race goods is few or is only intended to reality
When testing, this bottle of glue will be used for a long time at normal temperatures.At normal temperatures, photoresist occurs that particulate increases, felt for exposure for a long time
Situations such as luminosity decline, polymer increase, energy variation, defect is caused to increase during operation on wafer.
The content of the invention
In view of the above-mentioned problems, the present invention proposes a kind of photoresist circuit design, it is characterised in that applied applied to photoresist
In cloth machine；Including：
Photoresist container, is positioned in a temperature control room；
The photoresist container includes an air inlet and a gum outlet, and the air inlet is used to be passed through gas by the photoetching
Photoresist in glue container is extruded from the gum outlet；
First pipeline, be sequentially connected the gum outlet of the photoresist container, one prestore container, a filter, a near-end hold
Device, a pump and a shower nozzle；
First pipeline is wrapped with second pipe, and the second pipe is used to be passed through heating medium to the described first pipe
Heated in road.
Above-mentioned photoresist circuit design, wherein, the second pipe has one first to surround structural sections, first bag
Prestore container described in closed structure section encirclement.
Above-mentioned photoresist circuit design, wherein, in addition to：
Heater, neighbouring prestore container and/or the first encirclement structural sections setting, for the appearance that prestores
Device and/or the first encirclement structural sections are heated.
Above-mentioned photoresist circuit design, wherein, side, bottom surface and the top of the container that prestored described in the heater covering
Face.
Above-mentioned photoresist circuit design, wherein, the heated perimeter of the heater is 20~40 DEG C.
Above-mentioned photoresist circuit design, wherein, the second pipe has one second to surround structural sections, second bag
Closed structure section surrounds the proximal pod.
Above-mentioned photoresist circuit design, wherein, the second pipe has one first bypass structure, first bypass
Structure is used to get around the filter.
Above-mentioned photoresist circuit design, wherein, the second pipe has one second bypass structure, second bypass
Structure is used to get around the pump.
Above-mentioned photoresist circuit design, wherein, it is neighbouring that the input port of the second pipe is arranged at the second pipe
One end of the shower nozzle；
The delivery outlet of the second pipe is arranged at the second pipe adjacent to one end of the photoresist container.
Above-mentioned photoresist circuit design, wherein, the heating medium is the water that temperature is 22 DEG C or 23 DEG C.
Above-mentioned photoresist circuit design, wherein, in addition to：
3rd pipeline, prestore container, the filter and the proximal pod described in connection respectively, described for discharging
The photoresist prestored in container and/or the filter and/or the proximal pod.
Above-mentioned photoresist circuit design, wherein, in addition to：
Temperature sensor, is arranged between the pump and the shower nozzle, for gathering between the pump and the shower nozzle
The temperature of the photoresist is simultaneously exported as feedback.
Above-mentioned photoresist circuit design, wherein, the temperature controlling range in the temperature control room is -20~25 DEG C.
Beneficial effect：Photoresist circuit design in the present invention can improve light while the spraying of photoresist is not influenceed
The use term of validity of photoresist.
Brief description of the drawings
Fig. 1 is the structural representation of photoresist circuit design in one embodiment of the invention；
Fig. 2 is the diagrammatic cross-section of second pipe the first pipeline of parcel in one embodiment of the invention；
Fig. 3 wraps up the diagrammatic cross-section for the container that prestores for second pipe in one embodiment of the invention.
Embodiment
The present invention is further described with reference to the accompanying drawings and examples.
In a preferred embodiment, as shown in Figure 1, it is proposed that a kind of photoresist circuit design, wherein, applied to light
In photoresist coating machine；Including：
Photoresist container 10, is positioned in a temperature-controlled chamber RM；
Photoresist container 10 includes an air inlet 11 and a gum outlet 12, and air inlet 11 holds photoresist for being passed through gas
Photoresist in device 10 is extruded from gum outlet 12；
First pipeline L1, the gum outlet 12, one for being sequentially connected photoresist container 10 prestores container 20, a filter 30, one
Proximal pod 40, a pump 50 and a shower nozzle 60；
First pipeline L1 is wrapped with second pipe L2, and second pipe L2 enters for being passed through heating medium to the first pipeline L1
Row heating.
In above-mentioned technical proposal, the first pipeline L1 can have multiple or one group of pipeline, for being connected to the container that prestores
Between 20 and filter 30, and between filter 30 and proximal pod 40, and between proximal pod 40 and pump 50, and pump
Between 50 and shower nozzle 60, play a part of to transmit photoresist；First pipeline L1 is wrapped with second pipe L2, and second pipe L2 should
For sealed pipeline, the first pipeline L1 exposed all should be coated on as far as possible interior so that the first pipeline L1 heating surface area
Maximum, accordingly even when photoresist is stored in photoresist container 10, the heating of heating medium that can also be in second pipe L2
Under return back to suitable for spraying temperature；First pipeline L1 is in the position of the container 20 that prestores, filter 30, proximal pod 40 and pump 50
The place of putting can be disjunction, and second pipe L2 can be single pipe or one group of pipeline；The container 20 that prestores can be used for light
Photoresist is pre-stored.
In a preferred embodiment, as shown in figure 1, second pipe L2 has one first to surround structural sections SD1, first
Surround structural sections SD1 and surround the container 20 that prestores.
In above-mentioned technical proposal, second pipe L2 should be axial parcel, i.e. second pipe to the first pipeline L1 parcel
L2 is consistent with the first pipeline L1 trend；But it is not tubulose that the container 20 that prestores is general, in order that obtaining in second pipe L2
The heating efficiency of heating medium be fully utilized, first can will be set to surround structural sections on second pipe L2, for surrounding
Prestore container 20 to heat the container 20 that prestores, the purpose for being arranged to encirclement structure is the shape phase with the container 20 that prestores
Match somebody with somebody；First surrounds structural sections SD1 can be in container shapes, and its profile can be as shown in Figure 3；Second pipe L2 parcels first are managed
Road L1 profile can be as shown in Figure 2.
As preferred embodiment, it can also include：
Heater HT, the neighbouring container 20 and/or first that prestores surrounds SD1 sections of settings of structure, for the container 20 that prestores
And/or first encirclement structural sections SD1 heated.
As preferred embodiment, heater HT covers side, bottom surface and the top surface for the container 20 that prestores, but this is
A kind of preferred mode, heater HT can also be other set-up modes, can be as far as possible farthest to the container that prestores
20 carry out heat radiation, and heater HT can be contacted with the container 20 that prestores or do not contacted.
As preferred embodiment, heater HT heated perimeter is 20~40 DEG C.
In a preferred embodiment, second pipe L2 has one second to surround structural sections SD2, and second surrounds structural sections
Surround proximal pod 40.
In above-mentioned technical proposal, the second encirclement structural sections SD2 can be in container shapes.
In a preferred embodiment, second pipe L2 has one first bypass structure TW1, the first bypass structure TW1
For around opened filter 30.
In a preferred embodiment, second pipe L2 has one second bypass structure TW2, the second bypass structure TW2
For around turn on pump 50.
In a preferred embodiment, second pipe L2 input port is arranged at second pipe L2 adjacent to the one of shower nozzle 60
End；
Second pipe L2 delivery outlet is arranged at second pipe L2 adjacent to one end of photoresist container 10.
The heat that above-mentioned technical proposal can avoid the heating medium in second pipe L2 from being produced during transmission is damaged
Photoresist fails to reach the situation of assigned temperature at shower nozzle 60 caused by losing.
In a preferred embodiment, heating medium is the water that temperature is 22 DEG C or 23 DEG C, but this is preferred feelings
Condition, is not construed as limitation of the present invention.
In a preferred embodiment, it can also include：
3rd pipeline DR, connects prestore container 20, filter 30 and proximal pod 40 respectively, for discharging the container that prestores
20 and/or filter 30 and/or proximal pod 40 in photoresist.
In a preferred embodiment, as shown in figure 1, can also include：
Temperature sensor SS, is arranged between pump 50 and shower nozzle 60, for gathering the photoresist between pump 50 and shower nozzle 60
Temperature and export as feedback.
In above-mentioned technical proposal, temperature sensor SS can be connected with shower nozzle 60, such as with the miniature processing on shower nozzle 60
Device is connected, and can not be sprayed when being not up to certain target value with the temperature for controlling shower nozzle 60 to be gathered at temperature sensor SS；Temperature is passed
Sensor SS and shower nozzle 60 distance are generally less than 20cm.
In a preferred embodiment, as shown in figure 1, can also include：
Heater HT, surrounds the outside for the container 20 that prestores, for being heated to the outside of the container 20 that prestores, with to pre-
The photoresist deposited in container 20 is heated.
In a preferred embodiment, the temperature controlling range in temperature-controlled chamber RM is -20~25 DEG C.
By explanation and accompanying drawing, the exemplary embodiments of the specific structure of embodiment are given, based on essence of the invention
God, can also make other conversions.Although foregoing invention proposes existing preferred embodiment, however, these contents are not intended as
Limitation.
For a person skilled in the art, read after described above, various changes and modifications undoubtedly will be evident.
Therefore, appended claims should regard whole variations and modifications of the true intention and scope that cover the present invention as.In power
Any and all scope and content of equal value, are all considered as still belonging to the intent and scope of the invention in the range of sharp claim.
Claims (13)
1. a kind of photoresist circuit design, it is characterised in that applied in photoetching rubber coating；Including：
Photoresist container, is positioned in a temperature control room；
The photoresist container includes an air inlet and a gum outlet, and the air inlet holds the photoresist for being passed through gas
Photoresist in device is extruded from the gum outlet；
First pipeline, is sequentially connected the gum outlet of the photoresist container, one prestores container, a filter, a proximal pod, one
Pump and a shower nozzle；
First pipeline is wrapped with second pipe, and the second pipe enters for being passed through heating medium to first pipeline
Row heating.
2. photoresist circuit design according to claim 1, it is characterised in that the second pipe has one first to surround
Structural sections, described first surrounds the container that prestored described in structural sections encirclement.
3. photoresist circuit design according to claim 2, it is characterised in that also include：
Heater, neighbouring prestore container and/or the first encirclement structural sections setting, for the container that prestores
And/or the first encirclement structural sections are heated.
4. photoresist circuit design according to claim 3, it is characterised in that prestore appearance described in the heater covering
Side, bottom surface and the top surface of device.
5. photoresist circuit design according to claim 3, it is characterised in that the heated perimeter of the heater is 20
~40 DEG C.
6. photoresist circuit design according to claim 1, it is characterised in that the second pipe has one second to surround
Structural sections, described second, which surrounds structural sections, surrounds the proximal pod.
7. photoresist circuit design according to claim 1, it is characterised in that the second pipe has one first bypass
Structure, first bypass structure is used to get around the filter.
8. photoresist circuit design according to claim 1, it is characterised in that the second pipe has one second bypass
Structure, second bypass structure is used to get around the pump.
9. photoresist circuit design according to claim 1, it is characterised in that the input port of the second pipe is arranged at
The second pipe is adjacent to one end of the shower nozzle；
The delivery outlet of the second pipe is arranged at the second pipe adjacent to one end of the photoresist container.
10. photoresist circuit design according to claim 1, it is characterised in that the heating medium is that temperature is 22 DEG C
Or 23 DEG C of water.
11. photoresist circuit design according to claim 1, it is characterised in that also include：
3rd pipeline, prestore container, the filter and the proximal pod described in connection respectively, for discharging described prestore
The photoresist in container and/or the filter and/or the proximal pod.
12. photoresist circuit design according to claim 1, it is characterised in that also include：
Temperature sensor, is arranged between the pump and the shower nozzle, described in gathering between the pump and the shower nozzle
The temperature of photoresist is simultaneously exported as feedback.
13. photoresist circuit design according to claim 1, it is characterised in that the temperature control in the temperature control room
Scope processed is -20~25 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710425257.5A CN107121897A (en) | 2017-05-25 | 2017-05-25 | A kind of photoresist circuit design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710425257.5A CN107121897A (en) | 2017-05-25 | 2017-05-25 | A kind of photoresist circuit design |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107121897A true CN107121897A (en) | 2017-09-01 |
Family
ID=59730199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710425257.5A Pending CN107121897A (en) | 2017-05-25 | 2017-05-25 | A kind of photoresist circuit design |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107121897A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108187979A (en) * | 2018-01-31 | 2018-06-22 | 京东方科技集团股份有限公司 | A kind of photoresist glue feed system and coating machine |
| CN116967216A (en) * | 2023-09-25 | 2023-10-31 | 福建省德尚电子材料有限公司 | Photoresist pipeline system |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794407A (en) * | 1994-09-01 | 1995-04-07 | Fujitsu Ltd | Method and device for treating substrate |
| KR20020074835A (en) * | 2001-03-22 | 2002-10-04 | 삼성전자 주식회사 | apparatus of supplying photoresist for manufacturing semiconductor |
| CN1570766A (en) * | 2003-07-11 | 2005-01-26 | 友达光电股份有限公司 | Photoresist coating device |
| KR20050098410A (en) * | 2004-04-07 | 2005-10-12 | 삼성전자주식회사 | Apparatus and method for dispensing photosensitive solution in semiconductor device fabrication equipment |
| KR20050108483A (en) * | 2004-05-11 | 2005-11-16 | 삼성전자주식회사 | Photoresist spinner |
| KR20060033953A (en) * | 2004-10-18 | 2006-04-21 | 삼성전자주식회사 | Apparatus for supplying a photoresist composition |
| CN1766734A (en) * | 2004-10-13 | 2006-05-03 | 三星电子株式会社 | Be used for method and apparatus at distribution photoresists such as manufacturing semiconductor devices |
| KR20060065191A (en) * | 2004-12-10 | 2006-06-14 | 삼성전자주식회사 | Apparatus for removing bubbles and preventing bubbles' growing in photo resist |
| KR100702793B1 (en) * | 2005-12-06 | 2007-04-03 | 동부일렉트로닉스 주식회사 | Apparatus for supplying photo resist and method for testing the apparatus |
| CN101013266A (en) * | 2007-02-28 | 2007-08-08 | 友达光电股份有限公司 | Supply system |
| CN101246311A (en) * | 2007-02-12 | 2008-08-20 | 中芯国际集成电路制造(上海)有限公司 | Photo resist air bubble eliminating system and method thereof |
| CN101398626A (en) * | 2007-09-26 | 2009-04-01 | 中芯国际集成电路制造(上海)有限公司 | Photo resist supply device |
| CN103807571A (en) * | 2012-11-06 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Heat-preservation device of photoresist pipeline casing pipe |
| CN204129434U (en) * | 2014-08-27 | 2015-01-28 | 上海华力微电子有限公司 | Photoresist feeding mechanism and system |
-
2017
- 2017-05-25 CN CN201710425257.5A patent/CN107121897A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794407A (en) * | 1994-09-01 | 1995-04-07 | Fujitsu Ltd | Method and device for treating substrate |
| KR20020074835A (en) * | 2001-03-22 | 2002-10-04 | 삼성전자 주식회사 | apparatus of supplying photoresist for manufacturing semiconductor |
| CN1570766A (en) * | 2003-07-11 | 2005-01-26 | 友达光电股份有限公司 | Photoresist coating device |
| KR20050098410A (en) * | 2004-04-07 | 2005-10-12 | 삼성전자주식회사 | Apparatus and method for dispensing photosensitive solution in semiconductor device fabrication equipment |
| KR20050108483A (en) * | 2004-05-11 | 2005-11-16 | 삼성전자주식회사 | Photoresist spinner |
| CN1766734A (en) * | 2004-10-13 | 2006-05-03 | 三星电子株式会社 | Be used for method and apparatus at distribution photoresists such as manufacturing semiconductor devices |
| KR20060033953A (en) * | 2004-10-18 | 2006-04-21 | 삼성전자주식회사 | Apparatus for supplying a photoresist composition |
| KR20060065191A (en) * | 2004-12-10 | 2006-06-14 | 삼성전자주식회사 | Apparatus for removing bubbles and preventing bubbles' growing in photo resist |
| KR100702793B1 (en) * | 2005-12-06 | 2007-04-03 | 동부일렉트로닉스 주식회사 | Apparatus for supplying photo resist and method for testing the apparatus |
| CN101246311A (en) * | 2007-02-12 | 2008-08-20 | 中芯国际集成电路制造(上海)有限公司 | Photo resist air bubble eliminating system and method thereof |
| CN101013266A (en) * | 2007-02-28 | 2007-08-08 | 友达光电股份有限公司 | Supply system |
| CN101398626A (en) * | 2007-09-26 | 2009-04-01 | 中芯国际集成电路制造(上海)有限公司 | Photo resist supply device |
| CN103807571A (en) * | 2012-11-06 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Heat-preservation device of photoresist pipeline casing pipe |
| CN204129434U (en) * | 2014-08-27 | 2015-01-28 | 上海华力微电子有限公司 | Photoresist feeding mechanism and system |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108187979A (en) * | 2018-01-31 | 2018-06-22 | 京东方科技集团股份有限公司 | A kind of photoresist glue feed system and coating machine |
| CN116967216A (en) * | 2023-09-25 | 2023-10-31 | 福建省德尚电子材料有限公司 | Photoresist pipeline system |
| CN116967216B (en) * | 2023-09-25 | 2023-12-19 | 福建省德尚电子材料有限公司 | Photoresist pipeline system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103996640B (en) | Chemicals feeder, the device and method for carrying out wet process | |
| CN102405128B (en) | Drying device under reduced pressure for plastic forming material | |
| CN107121897A (en) | A kind of photoresist circuit design | |
| CN206042744U (en) | A kind of seed-dressing device | |
| CN102625899B (en) | Method and device for drying bulk capillary-porous materials | |
| CN207351174U (en) | A kind of industrial high efficiency drying device | |
| TW200934588A (en) | Reduced pressure drying apparatus | |
| CN103707451A (en) | Substrate vacuum drying device and method | |
| CN103263064A (en) | Microwave, hot-air and vacuum combined drying equipment | |
| CN109489348A (en) | The nitrogen protection microwave vacuum drying device and drying means of optical plastic raw material | |
| US5570516A (en) | Drying system having continuously connected close spiral conveyers | |
| CN101822335B (en) | Steam boiling and drying integrated equipment for producing preboiled rice | |
| CN107871682A (en) | Transmission chamber and semiconductor processing equipment | |
| CN108302907A (en) | A kind of onboard integrated Grain drier and its drying means | |
| JP6127723B2 (en) | Drying control system, dryer, drying control method, drying method | |
| CN204787649U (en) | Corn is dried and is used vacuum drying machine | |
| CN209194053U (en) | Source bottle | |
| CN203697341U (en) | Substrate vacuum drying device | |
| CN202547286U (en) | Static drying oven for thermal sensitive materials | |
| CN211552394U (en) | Drying device of bacillus | |
| CN207446651U (en) | A kind of adjustable drying mechanism | |
| CN214645214U (en) | Hot air drying device is used in production of PM thermal synthesis membrane | |
| CN107462003A (en) | A kind of high power capacity grain column | |
| CN207021236U (en) | HMDS coating apparatus | |
| CN209386689U (en) | A kind of nitrogen protection microwave vacuum drying device of optical plastic raw material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |