CN107112221A - Dicing tape - Google Patents
Dicing tape Download PDFInfo
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- CN107112221A CN107112221A CN201680004665.7A CN201680004665A CN107112221A CN 107112221 A CN107112221 A CN 107112221A CN 201680004665 A CN201680004665 A CN 201680004665A CN 107112221 A CN107112221 A CN 107112221A
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- Prior art keywords
- dicing tape
- methyl
- mass
- mass parts
- chip
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Abstract
Even the chip that the present invention provides a kind of small-sized, slim electronic unit and can also suppressed in cutting action disperses and burst apart, it can make pickup easily and be not likely to produce the dicing tape of cull.According to the present invention, a kind of dicing tape is provided, it is to be laminated on base material film formed by the adhesive phase being made up of adhesive composition, it is characterized in that, above-mentioned adhesive composition contains the mass parts of (methyl) acrylate copolymer 100, the mass parts of photopolymerizable compound 5~250, the mass parts of curing agent 0.1~20 and the mass parts of Photoepolymerizationinitiater initiater 0.1~20, above-mentioned (methyl) acrylate copolymer contains the mass % of (methyl) methyl acrylate units 35~85, the mass % of (methyl) 2-EHA unit 10~60, the mass % of monomeric unit 0.5~10 with the carboxyl and mass % of the monomeric unit The with hydroxyl 0.05~5, above-mentioned photopolymerizable compound is that weight average molecular weight is 4000~8000, and unsaturated double-bond functional group number is 10~15 urethane acrylate oligomer, the thickness of above-mentioned adhesive phase is 3~7 μm.
Description
【Technical field】
The present invention relates to the dicing tape used in the manufacturing process of electronic unit.
【Background technology】
Semiconductor wafer or substrate will undergo segmentation (cutting) after the laminating dicing tape into element die, dicing tape
Extend (extension), element die from dicing tape is peeled off into each operations such as (pick up, i.e. pick up).For making in these processes
Dicing tape, expects there is sufficient bonding force to the element die (chip) formed in cutting action, while in pickup
Bonding force is decreased to the degree for not producing cull during process.
As dicing tape, there is following dicing tape：There is transmission to ultraviolet and/or electron beam isoreactivity light
The adhesive phase for causing polymerization curing reaction by ultraviolet etc. is coated with the base material film of property.The dicing tape is taken such as lower section
Method：Make adhesive phase polymerizing curable to adhesive phase irradiation ultraviolet radiation etc. after cutting action and make after bonding force reduction, pickup
The chip being divided into.
As this dicing tape, patent document 1 and Patent Document 2 discloses a kind of dicing tape, it is in base material film
Be coated with face containing be for example capable of because of active ray three-dimensional nettedization, intramolecular there is optical polymerism unsaturated double-bond
Adhesive formed by compound (multi-functional oligomer).
【Prior art literature】
【Patent document】
【Patent document 1】Japanese Unexamined Patent Publication 2006-049509 publications
【Patent document 2】Japanese Unexamined Patent Publication 2007-246633 publications
【The content of the invention】
【The invention problem to be solved】
In recent years, with electronic unit miniaturization, slimming, sometimes in the cutting action of semiconductor wafer or substrate
Easily occur chip to disperse, burst apart (chip defect), the main cause reduced as yield rate.
Therefore, the main object of the present invention is to provide a kind of dicing tape, the dicing tape, even small-sized, slim
Electronic unit, the chip that can also suppress in cutting action disperses and burst apart, and easily picks up, is not likely to produce cull.
【To solve the technological means of problem】
According to the present invention there is provided a kind of dicing tape, it is laminated on base material film by gluing that adhesive composition is constituted
Formed by mixture layer, it is characterised in that above-mentioned adhesive composition contain the mass parts of (methyl) acrylate copolymer 100,
The mass parts of photopolymerizable compound 5~250, the mass parts of curing agent 0.1~20 and the mass parts of Photoepolymerizationinitiater initiater 0.1~20,
Above-mentioned (methyl) acrylate copolymer contains the mass % of (methyl) methyl acrylate units 35~85, (methyl) acrylic acid 2-
The mass % of ethylhexyl unit 10~60, the mass % of monomeric unit 0.5~10 with carboxyl and the monomer list with hydroxyl
0.05~5 mass % of member, above-mentioned photopolymerizable compound is that weight average molecular weight is 4000~8000 and unsaturated double-bond functional group
Number is 10~15 urethane acrylate oligomer, and the thickness of above-mentioned adhesive phase is 3~7 μm.
If in general, reducing the thickness of adhesive phase, it is not susceptible to burst apart, but bonding force diminishes and easily occurs core
Piece disperses.If in addition, adjusting the composition of adhesive to suppress generation that chip disperses, easily producing following problem：Hold
Easily burst apart, either pick is deteriorated or easily occurs cull.Therefore, it was difficult effective suppression is burst apart, chip flies in the past
Make pick good while dissipating with cull.
The present inventor has made intensive studies to obtain these aspect excellent dicing tapes, as a result finds,
In the case of the adhesive phase that 3~7 μm of thickness is formed using the adhesive of specific composition, can be burst apart in effective suppression, core
Piece makes pick good while dispersing with cull, so as to complete the present invention.
It is preferably characterized in that, above-mentioned curing agent is multifunctional carbimide curing agent or multi-functional epoxy's curing agent.
It is preferably characterized in that, the bonding force for the minute surface to silicon wafer that the foundation JISZ0237 of above-mentioned dicing tape is measured is
5.0N/20mm more than.
According to another viewpoint of the present invention there is provided a kind of manufacture method of electronic unit, this method possesses following process：(a) paste
Attached process, attached dicing tape is sticked in semiconductor wafer or substrate and ring frame；(b) cutting action, cuts above-mentioned semiconductor die
Piece or substrate and form semiconductor chip or semiconductor device；(c) light irradiation process irradiates active ray to above-mentioned dicing tape；
(d) process is extended, in order to expand the interval between above-mentioned semiconductor chip or semiconductor device, above-mentioned dicing tape is drawn
Stretch；And (e) pickup process, semiconductor chip or semiconductor device are picked up from above-mentioned dicing tape, on above-mentioned dicing tape is
State the dicing tape of record.
【Invention effect】
According to the present invention, it is possible to provide a kind of dicing tape：Even small-sized, slim electronic unit, it can also suppress to cut
Cut the chip in process to disperse and burst apart, easily pick up (pick up), be not likely to produce cull.
【Embodiment】
Hereinafter, the preferred embodiment for implementing the present invention is illustrated.It should illustrate, embodiments described below table
Show an example of the representative embodiment of the present invention, therefore the scope of the present invention will not narrowly be explained by crossing.
<Adhesive composition>
It is common that adhesive composition used in the formation of the adhesive phase of the dicing tape of the present invention contains (methyl) acrylate
The mass parts of polymers 100, the mass parts of photopolymerizable compound 5~250, the mass parts of curing agent 0.1~20 and Photoepolymerizationinitiater initiater
0.1~20 mass parts.
((methyl) acrylate copolymer)
(methyl) acrylate copolymer contains：The mass % of (methyl) methyl acrylate units 35~85 (is preferably 45~75 matter
Measure %, more preferably 50~70 mass %, more preferably 55~65 mass %), (methyl) acrylic acid 2- ethyl hexyls
The mass % of ester units 10~60 (is preferably 20~50 mass %, more preferably 25~45 mass %, more preferably 30
~40 mass %), the mass % of monomeric unit 0.5~10 with carboxyl (be preferably 2~7 mass %, more preferably 3~6
Quality %, more preferably 4~5 mass %), the mass % of monomeric unit 0.05~5 with hydroxyl (be preferably 0.1~3 matter
Measure %, more preferably more preferably 0.2~2 mass %, more preferably 0.3~1 mass %, 0.4~0.7 matter
Measure %).By making (methyl) acrylate copolymer be made up of such monomeric unit, it is even if the thickness of adhesive phase is smaller
3~7 μm, it can also obtain the sufficiently high dicing tape of bonding force.Should illustrate, for the bonding force of dicing tape, preferably according to
The bonding force of minute surface being measured according to JIS Z 0237, to silicon wafer is more than 5.0N/20mm.
As the monomer with carboxyl, for example, it can enumerate (methyl) acrylic acid, crotonic acid, maleic acid, itaconic acid, rich horse
Acid, acrylamide N- Glycolic acids and cinnamic acid etc., preferably (methyl) acrylic acid.
As the monomer with hydroxy functional groups, for example, there are (methyl) acrylic acid 2- hydroxy methacrylates, (methyl) acrylic acid
2- hydroxy propyl esters and (methyl) acrylic acid 2- hydroxybutyls, preferably (methyl) acrylic acid 2- hydroxy methacrylates.
(photopolymerizable compound)
The combined amount of photopolymerizable compound is 5~250 mass parts relative to the mass parts of (methyl) acrylate copolymer 100,
Preferably 40~200 mass parts.If reducing cutting after the combined amount of photopolymerizable compound, irradiation ultraviolet radiation isoreactivity light
The fissility reduction of rubber tapping band, the pickup for easily producing semiconductor chip is bad.On the other hand, if increase photopolymerizable compound
Combined amount, then bonding force can excessively be reduced because of light irradiation process, in pickup process produce chip loosen, as productivity ratio
The main cause of reduction.
Available photopolymerizable compound is that weight average molecular weight is 4000~8000 and unsaturated double-bond official in the present invention
The urethane acrylate oligomer that number is 10~15 can be rolled into a ball.If weight average molecular weight is small, the softness on adhesive side, therefore easily
Burst apart, if weight average molecular weight is big, reduced with the adaptation of adherend, easily occur chip and disperse.If unsaturated double-bond
Functional group number is few, then the curability reduction of the adhesive after irradiation ultraviolet radiation etc., easily occurs to pick up bad, if unsaturated double-bond
Functional group number is more, then the over cure of the adhesive after irradiation ultraviolet radiation etc., produces chip and loosens.In addition, using polyurethane
In the case of acrylate oligomer, due to excellent with the adaptation and flexibility of base material film, production is difficult in pickup so having
The advantage of raw cull.
Urethane acrylate oligomer can be by making (methyl) acrylate with hydroxyl and polyester-type or polyether-type
Deng the sour fat polyurethane prepolymer reaction of terminal isocyanate and obtain, terminal isocyanate acid fat polyurethane prepolymer is to make polynary alcoholization
Obtained from compound reacts with polynary isocyanate compound.
As polyol compound, such as using ethylene glycol, propane diols, butanediol, hexylene glycol, neopentyl glycol, diethyl two
Alcohol, triethylene glycol, pentanediol, glycerine, trimethylolpropane, trimethylolethane, pentaerythrite etc..It is used as polynary carbimide
Compound, for example using 2,4- toluene diisocyanates, 2,6- toluene diisocyanates, 1,3- dimethylbenzene diisocyanate resin,
1,4- dimethylbenzene diisocyanate resin, diphenyl methane 4,4- diisocyanate resins, tri-methyl hexamethylene diisocyanate resin, six Asias
Methyl diisocyanate resin, isophorone diisocyanate resin etc..In addition, as (methyl) acrylate with hydroxyl, such as may be used
Enumerate (methyl) acrylic acid 2- hydroxy methacrylates, (methyl) acrylic acid 2- hydroxy propyl esters, polyethylene glycol (methyl) acrylate, season
Penta tetrol triacrylate, glycidol two (methyl) acrylate, dipentaerythritol monohydroxypentaacryande etc..
(curing agent)
The combined amount of curing agent is the mass parts of 0.1 mass parts~20 relative to the mass parts of (methyl) acrylate copolymer 100, excellent
Elect the mass parts of 1 mass parts~10 as.If reducing the combined amount of curing agent, cull is easily produced.On the other hand, if increase solidification
The combined amount of agent, the then deficiency or chip for occurring bonding force loosens, the main cause reduced as productivity ratio.
As curing agent, there are multifunctional carbimide curing agent, multi-functional epoxy's curing agent, aziridine cpd, trimerization
Cyanamide compound etc., preferably multifunctional carbimide curing agent, multi-functional epoxy's curing agent.Solidified by using multi-functional epoxy
Agent or multifunctional carbimide curing agent can optionally make with carboxyl as at least a portion in above-mentioned curing agent
Functional group contains monomer reaction and reduces it, it is thus possible to have the amount of monomer containing carboxyl functional group after regulation solidification.
As multifunctional carbimide curing agent, for example, there are aromatic series ployisocyanate curing agent, aliphatic poly isocyanic acid
Fat curing agent, alicyclic ployisocyanate curing agent.
Aromatic series ployisocyanate is not particularly limited, for example, can enumerate 1,3- benzene diisocyanate resin, 4,4'- diphenyl
Diisocyanate resin, 1,4- benzene diisocyanate resin, 4,4'- diphenylmethane diisocyanates fat, 2,4- toluene diisocyanates,
2,6- toluene diisocyanates, 4,4'- toluidines diisocyanate resin, the carbimide toluene of 2,4,6- tri-, 1,3,5- tri- are different
Cyanate ester benzene, dianisidine diisocyanate resin, 4,4'- diphenyl ethers diisocyanate resin, 4,4', 4 "-triphenyl methane three are different
Cyanate ester, ω, ω '-diisocyanate resin -1,3- dimethyl benzenes, ω, ω '-diisocyanate resin -1,4- dimethyl benzenes,
ω, ω '-diisocyanate resin -1,4- diethylbenzenes, 1,4- tetramethyl xylylens diisocyanate resin and 1,3- tetra-
Xylylen diisocyanate resin etc..
Aliphatic poly carbimide is not particularly limited, for example, can enumerate trimethylene diisocyanate resin, tetramethylene two
Carbimide, hexa-methylene diisocyanate resin, pentamethylene diisocyanate resin, 1,2- propylidene diisocyanate resin, 2,3- are sub-
Butyl diisocyanate resin, 1,3- butylidenes diisocyanate resin, ten dimethylene diisocyanate resins and 2,4,4- trimethyls six
Methylene diisocyanate resin etc..
Alicyclic ployisocyanate is not particularly limited, for example, can enumerate 3- carbimide methyl -3,5,5- trimethyls
Cyclohexyl carbimide, 1,3- pentamethylene diisocyanate resin, 1,3- hexamethylenes diisocyanate resin, the isocyanide of 1,4- hexamethylenes two
Sour fat, methyl -2,4- hexamethylenes diisocyanate resin, methyl -2,6- hexamethylenes diisocyanate resin, 4,4' methylene bis
Double (carbimide methyl) hexamethylenes of (cyclohexyl carbimide), 1,4- and double (carbimide methyl) hexamethylenes of 1,4-.
In ployisocyanate, 1,3- benzene diisocyanate resin, 4,4'- diphenyl diisocyanate resin, Isosorbide-5-Nitrae-benzene are preferably used
Diisocyanate resin, 4,4'- diphenylmethane diisocyanates fat, 2,4- toluene diisocyanates, 2,6- toluene diisocynates
Fat, 4,4'- toluidines diisocyanate resin, hexa-methylene diisocyanate resin.
Multi-functional epoxy's curing agent is primarily referred to as with more than 2 epoxy radicals, the compound of more than 1 tertiary N atom, can
Enumerate NN- glycidyls aniline, NN- glycidyls toluidines, the contracting of m-NN- glycidyl-aminos phenyl
Water glycerin ether, p-NN- glycidyl-aminos phenyl glycidyl ether, triglycidyl group isocyanuric acid ester, NN
The sub- dimethylbenzene of N'N'- four glycidyl groups diaminodiphenyl-methane, NNN'N'- four glycidyl groups-m-
Base diamines, the glycidyl diethylenetriamines of NNN'N'N "-five etc..
(Photoepolymerizationinitiater initiater)
The combined amount of Photoepolymerizationinitiater initiater is the matter of 0.1 mass parts~20 relative to the mass parts of (methyl) acrylate polymer 100
Measure part, the mass parts of preferably 1 mass parts~10.If combined amount is very few, the fissility from dicing tape after light irradiation is reduced,
The pickup for easily occurring semiconductor chip is bad.On the other hand, if combined amount is excessive, Photoepolymerizationinitiater initiater can be to adhesive table
Face is oozed out, as pollution the reason for.
As Photoepolymerizationinitiater initiater, using benzoin, benzoin alkyl ethers, acetophenones, Anthraquinones, thioxanthene ketone class,
Ketal class, benzophenone or xanthene ketone etc..
As benzoin, such as having benzoin, benzoin methylether, benzoin ethyl ether, benzoin propyl ether.
As acetophenones, for example, there are benzoin alkyl ethers, acetophenone, 2,2- dimethoxy-2- acetophenones, 2,2-two
Ethyoxyl -2- acetophenones, 1,1- dichloroacetophenones etc..
As Anthraquinones, there are 2-methylanthraquinone, 2- EAQs, 2- tert-butyl groups anthraquinone, 1- chloroanthraquinones etc..
As thioxanthene ketone class, for example, there are 2,4- dimethyl thioxanthones, 2,4- diisopropylthioxanthones, CTX, 2,
4- diisopropylthioxanthones etc..
As ketal class, for example, there are acetophenone dimethyl ketal, the ketal of benzyl two, benzyldiphenyl thioether, tetra methylthiuram
Single sulfide, azodiisobutyronitrile, bibenzyl, biacetyl, β-chloroanthraquinone etc..
One kind or two or more known photopolymerization promoter can be combined in Photoepolymerizationinitiater initiater as needed
It is used in combination.As photopolymerization promoter, benzoic acid system, tertiary amine etc. can be used.As tertiary amine, triethylamine, tetraethyl five can be enumerated
Amine, dimethylamino ether etc..
(bonding assigns resin)
Bonding can be coordinated to assign resin in adhesive composition.Resin is assigned as bonding, is that terpene phenol resin is complete
Or the terpene phenol resin of part hydrogenation.
Terpene phenol resin can for example be manufactured by making 1 mole of terpene compound be reacted with phenols 0.1~50.
As terpene compound, laurene, alloocimene, ocimenum, australene, nopinene, dipentene, lemon can be enumerated
Lemon alkene, α-phellandrene, α-terpinene, γ-terpinene, terpinolene, 1,8- Cineoles, 1,4- Cineoles, α-pine tar
Alcohol, β-terpinol, γ-terpinol, amphene, tricyclene, sabinene, to menthadiene class, carene class etc..In these compounds,
Use australene specifically preferred according to the invention, nopinene, limonene, laurene, alloocimene, α-terpinene.
As phenols, phenol, cresols, xylenol, catechol, resorcinol, hydroquinones, bisphenol-A etc. can be enumerated, but simultaneously
It is not limited to this.
The ratio of the phenols of terpene phenol resin is 25~50 moles of % or so, but is not limited to this.
The hydroxyl value of the terpene phenol resin hydrogenated completely or partially is preferably 50~250.When hydroxyl value is less than 50, with carbimide
Be curing agent reaction it is insufficient and oozed out to adhesive surface, the reason for as pollution, if more than 250, viscosity rise, production
The raw mixing with (methyl) acrylate copolymer etc. is uneven, and pickup characteristic is unstable.
As method for hydrogenation, it is not particularly limited, for example, can enumerates following method：Using noble metals such as palladium, ruthenium, rhodiums or
They are supported to the method carried out in the material on the carriers such as activated carbon, activated alumina, diatomite as catalyst,
Hydrogenation ratio can be determined by bromine number, determination of iodine value etc. is determined.
The hydrogenation ratio of the terpene phenol resin hydrogenated completely or partially is preferably 30 moles of more than %, more preferably 70 moles %
More than.During less than 30 moles of %, cause to glue because the reaction of the photopolymerizable compound caused by the irradiation of active ray hinders
Can not fully it reduce with joint efforts, thus pick reduction.
The match ratio of the terpene phenol resin hydrogenated completely or partially is preferably with respect to the matter of (methyl) acrylate copolymer 100
Amount part is the mass parts of 0.5 mass parts~100, more elects the mass parts of 1.0 mass parts~50 as.If the terpenes hydrogenated completely or partially
Phenol resin is that more than 0.5 mass parts then bonding force will not be too low, and the retentivity of semiconductor chip is maintained during cutting, if
Below 100 mass parts, then it can suppress to pick up bad generation.
(additive etc.)
Can for example be added in adhesive composition softening agent, age resister, filler, conductive agent, ultra-violet absorber and
The various additives such as light stabilizer.
The thickness of adhesive phase is 3~7 μm, preferably 4~6 μm.If adhesive phase is blocked up, easily burst apart.Separately
Outside, if adhesive phase is excessively thin, bonding force becomes too low, and chip retentivity when cutting sometimes reduces and causes chip to disperse,
Or between ring frame and piece being peeling property.
(base material film)
As the material of base material film, such as can enumerate the ionomer resin for being crosslinked following material with metal ion：It is poly-
Vinyl chloride, polyethylene terephthalate, acetic acid-vinyl acetate copolymer, ethylene-acrylic acid-acrylate films,
Ethylene-ethyl acrylate copolymer, polyethylene, polypropylene, propylene series copolymer, ethylene-acrylic acid copolymer, Yi Jiyi
Alkene-(methyl) acrylic copolymer or ethene-(methyl) acrylic acid-(methyl) acrylate copolymer etc..Base material film can be with
It is the mixture or copolymer of these resins or the film or the layered product of piece that are made up of these resins.
The material of base material film preferably uses ionomer resin.As ionomer resin, if using will have ethylene unit, first
The copolymer Na of base acrylic acid units and (methyl) acrylate unit+、K+、Zn2+Etc. metal ion crosslinked
Ionomer resin, then cutting swarf inhibition is notable, thus preferably uses.
Base material film can be the single or multiple lift being made up of above-mentioned material film or piece or will be by different materials structure
Into the material that is laminated such as film.The thickness of base material film is 50~200 μm, preferably 70~150 μm.
Preferred pair base material film implements antistatic treatment.As antistatic treatment, have and coordinate antistatic additive in base material film
Processing, processing, the processing based on corona discharge in base material film surface coating antistatic additive.
As antistatic additive, such as can be used quaternary ammonium salt monomer.As quaternary ammonium salt monomer, for example, it can enumerate (methyl) third
Olefin(e) acid dimethylamino ethyl ester chloride quaternary, (methyl) acrylic acid diethylamino ethyl ester chloride quaternary, (methyl) acrylic acid first
Base ethylamino ethyl ester chloride quaternary, to dimethylaminostyrene chloride quaternary and to diethylamino styrene chlorination
Quaternary salt.Wherein, preferred dimethylaminoethyl methacrylate chloride quaternary.
The application method of antiseize paste and antistatic additive is not particularly limited, for example, can be bonded in the coated on one side of base material film
Antiseize paste and/or antistatic additive, in its backsize antiseize paste and/or antistatic additive, can also be mixed into the tree of base material film by agent
Piece is carried out in fat.
Can base material film a face laminating adhesive, another side turn into average surface roughness (Ra) be 0.3~1.5 μm
Boss surface.By that base material film can be made easy in setting boss surface, extension process after dicing in the board side of expanding unit
Expansion.
(antiseize paste)
In order to improve the autgmentability after cutting, antiseize paste can be imposed to the adhesive noncontact face of base material film, or in base material
Antiseize paste is mixed into film.
As long as the material that antiseize paste makes the coefficient of friction of dicing tape and expanding unit and reduced just is not particularly limited, example
Organic siliconresin or (modification) silicone oil organo-silicon compound, fluororesin, hexagonal boron, carbon black and two sulphur can such as be enumerated
Change molybdenum etc..These friction-reducing agents can also mix Multiple components.In order to carry out the manufacture of electronic unit in toilet, preferably
Use organo-silicon compound or fluororesin.In organo-silicon compound, the especially copolymerization with silicone macromolecule monomeric unit
The intermiscibility of thing and antistatic layer is good, and the balance of antistatic behaviour and autgmentability can be achieved, thus preferably uses.
The specific process to the manufacture method of electronic unit involved in the present invention is illustrated in order.
(1) process is attached
First, in process is attached, dicing tape is attached at semiconductor wafer or substrate and ring frame.Semiconductor wafer can be with
It is the in the past general chip such as silicon wafer and gallium nitride wafer, silicon carbide wafer, sapphire wafer.Substrate can be close with resin
The common substrates such as package substrate, LED package substrate, the ceramic substrate of sealing chip.
(2) cutting action
In cutting action, cutting semiconductor chip or substrate formation semiconductor chip or semiconductor device.
(3) light irradiation process
In light irradiation process, to above-mentioned dicing tape irradiation ultraviolet radiation or electron beam isoreactivity light.Active ray is preferably from base
Material film side is irradiated.As the light source of ultraviolet, low pressure mercury lamp, high-pressure sodium lamp, ultrahigh pressure mercury lamp, metal halide lamp can be used.
Alternatively, it is also possible to replace ultraviolet using electron beam, as electronics light source beam, alpha ray, β rays, gamma-rays can be used.
Solidified by light irradiation, adhesive phase three-dimensional nettedization, the bonding force reduction of adhesive phase.Now, as above institute
State, dicing tape involved in the present invention even if it is heated also will not be closely sealed with semiconductor wafer or undue substrate, therefore pass through
The irradiation of ultraviolet etc., can obtain sufficiently low bonding force.
(4) pickup process is extended
Extend in pickup process, to expand the interval between semiconductor chip or semiconductor device, dicing tape is drawn
Stretch, and pushed up chip or part with needle pin etc..Thereafter, vacuum chuck or pneumatic clamping frame etc. attract chip or part, make it
Peel off and be picked up from the adhesive phase of dicing tape.Now, because dicing tape involved in the present invention passes through ultraviolet etc.
Irradiation bonding force can be made fully to reduce, therefore the stripping between chip or part and adhesive phase becomes easy, obtains good
Pick, will not also produce the bad phenomenons such as cull.
<The manufacture of dicing tape>
As the method for forming adhesive phase on base material film and obtaining dicing tape, for example there are as below methods：Applied using intaglio plate
The coating machine of cloth machine, comma coater, bar coater, knife type coater or roll coater etc is by adhesive Zhi Jie Tu cloth in base material film
On method；Or the method that adhesive is coated on stripping film and makes it be fitted after drying with base material film.Also protrusive board can be used
Adhesive is printed on base material film by printing, intaglio, offset printing, flexographic printing, hectographic printing or silk-screen printing etc..
The dicing tape of the present invention is preferably used in the manufacturing process of electronic unit is cutting action, back grinding procedure
In the stickup purposes of the electronic unit aggregate of referred to as workpiece.
【Embodiment】
The adhesive composition and dicing tape involved by embodiment comparative example are manufactured according to the following formulation.To mainly it coordinate
The result of composition and each experimental example is shown in 1~table of table 3.
The numerical value of composition in 1~table of table 3 represents mass parts.Photopolymerizable compound, curing agent, Photoepolymerizationinitiater initiater
Mass parts when numerical value represents (methyl) acrylate copolymer being set to 100 parts.Base material film, photopolymerizable compound, solidification
Agent, Photoepolymerizationinitiater initiater details it is as described below.
It should illustrate, weight average molecular weight is equal as the weight converted through polystyrene using gel permeation chromatography (GPC)
The value that molecule measuring is obtained.It is specifically as described below.
Device:GPC-8020SEC systems (eastern Cao's company system)
Firmly:TSK Guard HZ-L+HZM-N 6.0 × 150mm × 3
Flow:0.5ml/min
Detector:RI-8020
Concentration:0.2wt/Vol%
Injection rate:20μL
Firmly temperature:40℃
System temperature:40℃
Solvent:THF
Standard curve:Made using polystyrene standard (PL company systems), weight average molecular weight (Mw) polystyrene scaled value table
Show.
<Base material film>
Resin film A:The ionomer resin film that 80 μm of thickness, with ethylene-methyl methacrylate-acrylic acid 2- methyl propyl ester
The Zn salt of copolymer is main body.MFR 2.8g/10min (JIS K7210 methods, 210 DEG C), Mitsui DuPont
Polychemicals Co. Ltd. systems (commercially available product).
<Photopolymerizable compound>
Photopolymerizable compound A:Make the carbimide of hexa-methylene diisocyanate resin and with Dipentaerythritol Pentaacrylate
The compound obtained by the acrylate reactions of the hydroxyl of principal component, weight average molecular weight is 7500, and unsaturated double-bond function
The urethane acrylate oligomer (composite) that group's number is 10.
Photopolymerizable compound B:Use the weight average molecular weight that is synthesized with photopolymerizable compound A identical preparation methods for 4200,
Unsaturated double-bond functional group number is 10 urethane acrylate oligomer (composite)
Photopolymerizable compound C:Use the weight average molecular weight that is synthesized with photopolymerizable compound A identical preparation methods for 2100,
Unsaturated double-bond functional group number is 10 urethane acrylate oligomer (composite)
Photopolymerizable compound D:Use the weight average molecular weight that is synthesized with photopolymerizable compound A identical preparation methods for 10300,
Unsaturated double-bond functional group number is 10 urethane acrylate oligomer (composite)
Photopolymerizable compound E:Make the carbimide and dipentaerythritol 5 third of the tripolymer of isophorone diisocyanate resin
Olefin(e) acid ester compound obtained from the acrylate reactions of the hydroxyl of principal component, weight average molecular weight is 4900, and unsaturated
Double bond functional group's number is 15 urethane acrylate oligomer (composite).
It should illustrate, photopolymerizable compound is using the known method system described in Japanese Unexamined Patent Application 61-42529 publications etc.
It is standby.
<Curing agent>
Curing agent A:The trimethylolpropane addition product (commercially available product) of 2,4- toluene diisocyanates
Curing agent B:The trimethylolpropane addition product (commercially available product) of hexa-methylene diisocyanate resin
Curing agent C:N, N, N', N'- four glycidyl group m-xylylene amine (commercially available product)
<Photoepolymerizationinitiater initiater>
Photoepolymerizationinitiater initiater A:1- hydroxycyclohexyl phenyl ketones (commercially available product)
Photoepolymerizationinitiater initiater B:Benzyl dimethyl ketal (commercially available product)
【Table 1】
【Table 2】
【Table 3】
(1) bonding force
According to JIS Z 0237；2009, using cupping machine (A＆D company systems, RTG-1210), surveyed using 180 ° of stripping methods
Surely the minute surface of silicon wafer and bonding force of the dicing tape under 23 DEG C, relative humidity 50% after 20 minutes are attached at.Draw
Speed is stretched for 300mm/min, and the size of dicing tape is 250mm × 20mm.It should illustrate, the minute surface of silicon wafer uses basis
Minute surface made from JIS H 0614.
(2) chip retentivity, pick and the evaluation burst apart
Gained dicing tape is fitted in the silicon wafer and ring for 8 inches × thickness of the diameter 0.15mm for being formed with virtual circuit pattern
Shape frame.Laminating uses high voltage mercury lamp radiation 150mJ/cm after 20 minutes2Ultraviolet, followed by cut, pick up each operation.
The condition of cutting action is as follows.
Cutter device:DISCO company systems DAD341
Cutting blade:DISCO company systems NBC-ZH205O-27HEEE
The shape of cutting blade:External diameter 55.56mm, 35 μm of tread, internal diameter 19.05mm
Cutting blade rotating speed:40000rpm
Cutting blade feed speed:100mm/ seconds
Cut lengths:1.0mm square
Approach in dicing tape:30μm
Cut coolant-temperature gage:25℃
Cut water:1.0 liter/min
The condition of pickup process is as follows.
Pick device:Canon Machinery company systems CAP-300II
Propagation:8mm
Needle pin shape:70μmR
Needle pin number:1
Degree of raising on needle pin:0.3mm
In cutting action and pickup process, following evaluate is carried out.
(2-1) chip retentivity
Chip retentivity is held in the residual rate of the semiconductor chip of dicing tape according to semiconductor chip after cutting action, by with
Lower benchmark is evaluated.
◎ (excellent):Chip disperses less than 5%
Zero (good):Chip disperses for 5% less than 10%
× (can not):Chip disperses for more than 10%
(2-2) pick
Pick is according to that can pick up the ratio of semiconductor chip in pickup process, by following benchmark evaluation.
◎ (excellent):The pickup success rate of chip is more than 95%
Zero (good):The pickup success rate of chip is 80% less than 95%
× (can not):The pickup success rate of chip is less than 80%
(2-3) bursts apart (Chipping)
For bursting apart, the chip that random selection 50 is picked up observes 4 sides of chip back with 500 times of micro- sem observations,
By size from following benchmark evaluation to the maximum defect of center position.
◎ (excellent):Defect size is less than 25 μm
Zero (good):Defect size is 25 μm less than 50 μm
× (can not):Defect size is more than 50 μm
(3) contaminative
Dicing tape is attached to the minute surface of silicon wafer, high voltage mercury lamp radiation 150mJ/cm is used after 20 minutes2Ultraviolet after, will
Dicing tape is peeled off.More than 0.28 μm of the population remained on the minute surface (attaching face) of silicon wafer is determined with particle collector.
◎ (excellent):Particle is less than 500
Zero (good):Particle is 501 less than 2000.
× (can not):Particle is more than 2000.
(4) chip loosens
Chip loosens the semiconductor chip abutted according to the semiconductor chip to be picked up in pickup process because of the impact of pin jack-up
And the ratio loosened, by following benchmark evaluation.
◎ (excellent):Chip, which loosens, is less than 1%
Zero (good):Chip is loosened for 1% less than 3%
× (can not):It is more than 3% that chip, which loosens,
(investigation)
As shown in the embodiment comparative example of 1~table of table 3, the bonding that the adhesive formation thickness of specific composition is 3~7 μm is used
In all embodiments of oxidant layer, comprehensive descision is zero or ◎.On the other hand, the thickness of the composition of adhesive or adhesive phase is rule
In fixed outer all comparative examples, comprehensive descision for ×.Confirmed by these results：If, can using the dicing tape of the present invention
Effectively suppression is burst apart, chip disperses and cull, while pick can be made good.
Labor is further carried out, as described below.
In comparative example 1, because (methyl) methyl acrylate units are very few, so contaminative is poor.
In comparative example 2, because (methyl) methyl acrylate units are excessive, so chip retentivity is poor, and chip easily loosens.
In comparative example 3, because the monomeric unit with carboxyl is very few, so chip retentivity is poor.
In comparative example 4, because the monomeric unit with carboxyl is excessive, so pick and contaminative are poor.
In comparative example 5, because the monomeric unit with hydroxyl is very few, so contaminative is poor.
In comparative example 6, because the monomeric unit with hydroxyl is excessive, so chip easily loosens.
In comparative example 7, because photopolymerizable compound is very few, so chip retentivity and pick are poor.
In comparative example 8, because photopolymerizable compound is excessive, so contaminative is poor, and chip easily loosens.
In comparative example 9, because the weight average molecular weight of photopolymerizable compound is too small, so easily bursting apart.
In comparative example 10, because the weight average molecular weight of photopolymerizable compound is excessive, so chip retentivity is poor.
In comparative example 11, because curing agent is very few, so contaminative is poor.
In comparative example 12, because curing agent is excessive, so chip retentivity and contaminative are poor, and chip easily loosens.
In comparative example 13, because Photoepolymerizationinitiater initiater is very few, so pick is poor.
In comparative example 14, because Photoepolymerizationinitiater initiater is excessive, so contaminative is poor, and chip easily loosens.
In comparative example 15, because adhesive phase is excessively thin, so chip retentivity is poor, and chip easily loosens.
In comparative example 16, because adhesive phase is blocked up, so easily burst apart, and pick is poor.
Claims (4)
1. a kind of dicing tape, is laminated on base material film formed by the adhesive phase being made up of adhesive composition, it is special
Levy and be,
Described adhesive composition contains the mass parts of (methyl) acrylate copolymer 100, the matter of photopolymerizable compound 5~250
Part, the mass parts of curing agent 0.1~20 and the mass parts of Photoepolymerizationinitiater initiater 0.1~20 are measured,
(methyl) acrylate copolymer contains the mass % of (methyl) methyl acrylate units 35~85, (methyl) acrylic acid
The mass % of 2- ethylhexyls unit 10~60, the mass % of monomeric unit 0.5~10 with carboxyl and the list with hydroxyl
The mass % of body unit 0.05~5,
The photopolymerizable compound is that weight average molecular weight is 4000~8000 and unsaturated double-bond functional group number is 10~15
Urethane acrylate oligomer,
The thickness of described adhesive layer is 3~7 μm.
2. dicing tape according to claim 1, it is characterised in that the curing agent is multifunctional carbimide curing agent
Or multi-functional epoxy's curing agent.
3. dicing tape according to claim 1 or 2, it is characterised in that the dicing tape, foundation JIS Z 0237
The bonding force of minute surface measuring, to silicon wafer is more than 5.0N/20mm.
4. a kind of manufacture method of electronic unit, it is characterised in that with following process：
(a) process is attached, dicing tape is attached on semiconductor wafer or substrate and ring frame；
(b) cutting action, cuts the semiconductor wafer or substrate, forms semiconductor chip or semiconductor device；
(c) light irradiation process, active ray is irradiated to the dicing tape；
(d) process is extended, to expand the interval between the semiconductor chip or semiconductor device, the dicing tape is carried out
Stretching；And
(e) pickup process, semiconductor chip or semiconductor device are picked up from the dicing tape；
The dicing tape is dicing tape according to any one of claims 1 to 3.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015002882 | 2015-01-09 | ||
| JP2015-002882 | 2015-02-13 | ||
| PCT/JP2016/050102 WO2016111283A1 (en) | 2015-01-09 | 2016-01-05 | Dicing tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107112221A true CN107112221A (en) | 2017-08-29 |
| CN107112221B CN107112221B (en) | 2020-12-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680004665.7A Active CN107112221B (en) | 2015-01-09 | 2016-01-05 | Cutting adhesive tape |
Country Status (5)
| Country | Link |
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| JP (1) | JP6604972B2 (en) |
| KR (1) | KR102474023B1 (en) |
| CN (1) | CN107112221B (en) |
| TW (1) | TWI678409B (en) |
| WO (1) | WO2016111283A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110229636A (en) * | 2019-06-21 | 2019-09-13 | 广东硕成科技有限公司 | A kind of wafer processing dicing tape and preparation method thereof |
| CN110562795A (en) * | 2018-06-05 | 2019-12-13 | 白金光学科技（苏州）有限公司 | Dicing tape for glass substrate and method of use |
| CN110791245A (en) * | 2019-10-23 | 2020-02-14 | 萍乡高恒材料科技有限公司 | Radiation curing adhesive composition, pressure-sensitive adhesive and protective film adhesive tape |
| CN113412318A (en) * | 2019-09-26 | 2021-09-17 | 株式会社Lg化学 | Adhesive composition for dicing tape and dicing tape comprising the same |
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| JP6917166B2 (en) * | 2017-03-15 | 2021-08-11 | マクセルホールディングス株式会社 | Adhesive tape for dicing, method for manufacturing adhesive tape for dicing, and method for manufacturing semiconductor chips |
| JP7082278B2 (en) * | 2018-03-26 | 2022-06-08 | 藤倉化成株式会社 | Adhesive composition and adhesive sheet |
| CN110437578B (en) * | 2019-07-19 | 2023-01-17 | 上海悦亮机电科技有限公司 | Film, easy-to-tear adhesive tape containing film and preparation method of easy-to-tear adhesive tape |
| JP7434754B2 (en) * | 2019-08-26 | 2024-02-21 | 三菱ケミカル株式会社 | Active energy ray-curable peelable adhesive composition and peelable adhesive sheet |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005247929A (en) * | 2004-03-02 | 2005-09-15 | Mitsui Chemicals Inc | Water-dispersed pressure-sensitive acrylic adhesive composition |
| JP2010116531A (en) * | 2008-10-15 | 2010-05-27 | Hitachi Chem Co Ltd | Adhesive composition, adhesive layer, and multilayer package |
| CN102421865A (en) * | 2009-05-12 | 2012-04-18 | 电气化学工业株式会社 | Adhesive agent, adhesive sheet, and process for production of electronic component |
| CN103443229A (en) * | 2011-03-30 | 2013-12-11 | 住友电木株式会社 | Adhesive tape for processing semiconductor wafer and the like |
| CN104066806A (en) * | 2012-01-12 | 2014-09-24 | 电气化学工业株式会社 | Adhesive sheet and method for manufacturing electronic component |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4776189B2 (en) | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | Wafer processing tape |
| JP5089895B2 (en) | 2006-03-15 | 2012-12-05 | 電気化学工業株式会社 | The multilayer adhesive sheet, the adhesive sheet for multilayer adhesive sheets, and the manufacturing method of the electronic component using a multilayer adhesive sheet. |
| JP5262641B2 (en) | 2008-12-03 | 2013-08-14 | Ｊｆｅエンジニアリング株式会社 | Tandem swing welding method |
| JP5761596B2 (en) * | 2011-03-30 | 2015-08-12 | 住友ベークライト株式会社 | Adhesive tape for semiconductor wafer processing |
| JP6645959B2 (en) * | 2014-03-17 | 2020-02-14 | リンテック株式会社 | Dicing sheet and method for manufacturing chip using the dicing sheet |
| JP6506756B2 (en) * | 2014-07-14 | 2019-04-24 | デンカ株式会社 | Adhesive sheet, manufacturing method of electronic parts |
-
2015
- 2015-12-28 TW TW104143966A patent/TWI678409B/en active
-
2016
- 2016-01-05 JP JP2016568721A patent/JP6604972B2/en active Active
- 2016-01-05 CN CN201680004665.7A patent/CN107112221B/en active Active
- 2016-01-05 WO PCT/JP2016/050102 patent/WO2016111283A1/en active Application Filing
- 2016-01-05 KR KR1020177021277A patent/KR102474023B1/en active IP Right Grant
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005247929A (en) * | 2004-03-02 | 2005-09-15 | Mitsui Chemicals Inc | Water-dispersed pressure-sensitive acrylic adhesive composition |
| JP2010116531A (en) * | 2008-10-15 | 2010-05-27 | Hitachi Chem Co Ltd | Adhesive composition, adhesive layer, and multilayer package |
| CN102421865A (en) * | 2009-05-12 | 2012-04-18 | 电气化学工业株式会社 | Adhesive agent, adhesive sheet, and process for production of electronic component |
| CN103443229A (en) * | 2011-03-30 | 2013-12-11 | 住友电木株式会社 | Adhesive tape for processing semiconductor wafer and the like |
| CN104066806A (en) * | 2012-01-12 | 2014-09-24 | 电气化学工业株式会社 | Adhesive sheet and method for manufacturing electronic component |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110562795A (en) * | 2018-06-05 | 2019-12-13 | 白金光学科技（苏州）有限公司 | Dicing tape for glass substrate and method of use |
| CN110229636A (en) * | 2019-06-21 | 2019-09-13 | 广东硕成科技有限公司 | A kind of wafer processing dicing tape and preparation method thereof |
| CN113412318A (en) * | 2019-09-26 | 2021-09-17 | 株式会社Lg化学 | Adhesive composition for dicing tape and dicing tape comprising the same |
| CN110791245A (en) * | 2019-10-23 | 2020-02-14 | 萍乡高恒材料科技有限公司 | Radiation curing adhesive composition, pressure-sensitive adhesive and protective film adhesive tape |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201636408A (en) | 2016-10-16 |
| KR20170106982A (en) | 2017-09-22 |
| WO2016111283A1 (en) | 2016-07-14 |
| JPWO2016111283A1 (en) | 2017-10-19 |
| TWI678409B (en) | 2019-12-01 |
| JP6604972B2 (en) | 2019-11-13 |
| CN107112221B (en) | 2020-12-22 |
| KR102474023B1 (en) | 2022-12-02 |
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