CN107107575B - Sealing film for electronic component - Google Patents

Sealing film for electronic component Download PDF

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Publication number
CN107107575B
CN107107575B CN201580068125.0A CN201580068125A CN107107575B CN 107107575 B CN107107575 B CN 107107575B CN 201580068125 A CN201580068125 A CN 201580068125A CN 107107575 B CN107107575 B CN 107107575B
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film
group
layer
resin
sealing film
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CN107107575A (en
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井崎公裕
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
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Priority claimed from JP2014258134A external-priority patent/JP6634675B2/en
Priority claimed from JP2015003727A external-priority patent/JP2016128245A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7246—Water vapor barrier

Abstract

A sealing film for electronic components, which comprises a polyester film and, laminated on one surface thereof, a coating layer, a barrier layer and a protective layer in this order, wherein the coating layer contains at least 1 or more kinds of binder resin selected from the group consisting of polyester resins, polyurethane resins and acrylic resins, and the water vapor permeability of the sealing film measured under the measurement conditions of 40 ℃ temperature and 90% RH according to JIS-K7129B method is 0.01g/m2And/day is less.

Description

Sealing film for electronic component
Technical Field
The present invention relates to a sealing film for electronic components such as a resin sheet, electronic paper, and organic E L, which has excellent transparency, barrier properties, and adhesion to an adhesive layer, and which requires a high level of water vapor barrier properties and has a content of a quantum dot.
Background
In optical applications, polyester films are widely used mainly for various display applications because of their excellent optical properties.
On the other hand, as a result of rapid spread of displays such as electronic paper and organic E L in recent years, in view of weight reduction and flexibility, research is being intensively conducted to replace a transparent plastic film as a glass substrate.
However, when the glass substrate is replaced with a transparent plastic film, moisture penetrates through the transparent plastic film, and thus the device may be deteriorated. Therefore, a transparent plastic film having a gas barrier layer is required, but conventional gas barrier films for food packaging use have insufficient moisture barrier properties, and it is difficult to suppress deterioration of electronic devices.
For the purpose of use in displays such as electronic paper and organic E L, it has been proposed that a cured resin layer made of a polymer and a gas barrier layer made of nitrided silicon oxide be provided on at least one surface of a plastic film, and that the water vapor permeability be 0.02g/m2A gas barrier film of day (patent document 1).
However, although the gas barrier film described in patent document 1 has an effect of improving the gas barrier property, no consideration is given to the adhesion to the adhesive layer. In addition, when silicon nitride oxide is used as a gas barrier film of a gas barrier layer, the refractive index of the gas barrier layer is high, the difference in refractive index from the protective layer is large, and the transmittance may be lowered.
Further, it is proposed to laminate a planarization layer, a gas barrier layer and a protective layer on a base film by an atmospheric pressure plasma CVD method, and the laminate has a thickness of 10-6g/m2A gas barrier film having a water vapor barrier property of the order of/day (patent document 2).
However, although the gas barrier film described in example 1 of patent document 2 has good gas barrier properties, the protective layer made of an inorganic polymer produced by atmospheric pressure CVD using TEOS as a raw material does not necessarily have sufficient adhesion to the adhesive layer.
Further, as a protective layer of a gas barrier film, a gas barrier laminated film in which a composite film of polyvinyl alcohol and an inorganic layered compound is laminated has been proposed (patent document 3), but when used for a display such as a display, the appearance tends to be whitish and the transparency tends to be poor. Further, a gas barrier laminated film having a structure in which a sol-gel layer is provided as a protective layer has been proposed (patent document 4), and although the surface hardness is good, the flexibility and the adhesion to an adhesive layer are sometimes poor.
In patent document 5, a countermeasure for improving the gas barrier layer by alternately stacking the organic layer and the inorganic layer is taken, and although the gas barrier property is improved, the interlayer adhesiveness at the interface of the organic layer and the inorganic layer is insufficient.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2009-190186
Patent document 2: japanese patent laid-open publication No. 2007-83644
Patent document 3: japanese patent laid-open publication No. 2003-231789
Patent document 4: japanese patent laid-open publication No. 2003-326634
Patent document 5: japanese patent No. 4254350
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a sealing film for electronic components such as a quantum dot-containing resin sheet, electronic paper, and organic E L, which has excellent transparency, barrier properties, and adhesion to an adhesive layer.
Means for solving the problems
The present inventors have conducted extensive studies and, as a result, have found that the above-mentioned problems can be easily solved by a sealing film having a specific structure, and have completed the present invention.
That is, the gist of the present invention is a sealant film for electronic parts, which is a sealant film comprising a coating layer, a barrier layer and a protective layer laminated in this order on one surface of a polyester film, wherein the coating layer contains at least 1 or more kinds of binder resins selected from polyester resins, acrylic resins and polyurethane resins and at least 1 or more kinds of crosslinking agents selected from oxazoline compounds, melamine resins and isocyanate compounds, and the water vapor permeability of the sealant film measured under the measurement conditions of a temperature of 40 ℃ and a humidity of 90% RH according to JIS-K71 7129B is 0.01g/m2And/day is less.
Effects of the invention
The sealing film for electronic components of the present invention is excellent in transparency, barrier properties and adhesion to an adhesive layer, and is suitable as a sealing film for electronic components such as a resin sheet, electronic paper, and organic E L, which require a high level of barrier properties and have a high industrial value.
Drawings
Fig. 1 is a schematic cross-sectional view showing a laminate according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail below.
First, a polyester film will be described.
The polyester film may have a single-layer structure or a laminated structure, and for example, may have 4 or more layers in addition to 2 or 3 layers, and is not particularly limited as long as the polyester film does not exceed the gist of the present invention.
The polyester may be a homopolyester or a copolyester. When the polyester is a homopolyester, a homopolyester obtained by polycondensing an aromatic dicarboxylic acid and an aliphatic diol is preferable. As the aromatic dicarboxylic acid, there may be mentioned: terephthalic acid, 2, 6-naphthalenedicarboxylic acid and the like, and examples of the aliphatic diol include: ethylene glycol, diethylene glycol, 1, 4-cyclohexanedimethanol, and the like. As a representative polyester, polyethylene terephthalate (PET) and the like can be exemplified. On the other hand, as the dicarboxylic acid component of the copolyester, there can be mentioned: one or more of isophthalic acid, phthalic acid, terephthalic acid, 2, 6-naphthalenedicarboxylic acid, adipic acid, sebacic acid, hydroxycarboxylic acids (e.g., p-hydroxybenzoic acid), and the like, and examples of the diol component include: one or more of ethylene glycol, diethylene glycol, propylene glycol, butanediol, 1, 4-cyclohexanedimethanol, neopentyl glycol and the like. In any case, the polyester referred to in the present invention means a polyester such as polyethylene terephthalate having usually 60 mol% or more, preferably 80 mol% or more of ethylene terephthalate units.
In the polyester film, it is preferable to blend particles mainly for the purpose of imparting slipperiness. The kind of the particles to be blended is not particularly limited as long as it is particles capable of imparting slipperiness, and specific examples thereof include: particles of silica, calcium carbonate, magnesium carbonate, barium carbonate, calcium sulfate, calcium phosphate, magnesium phosphate, kaolin, alumina, titanium oxide, and the like. Further, heat-resistant organic particles described in, for example, Japanese patent publication No. 59-5216 and Japanese patent publication No. 59-217755 can be used. Examples of the other heat-resistant organic particles include thermosetting urea resins, thermosetting phenol resins, thermosetting epoxy resins, and benzoguanamine resins. Further, precipitated particles obtained by precipitating and finely dispersing a part of a metal compound such as a catalyst in the polyester production process may be used.
On the other hand, the shape of the particles is not particularly limited, and any shape such as spherical, block, rod, and flat can be used. Further, the hardness, specific gravity, color, and the like are not particularly limited. These series of particles may be used in combination of 2 or more kinds as required.
The average particle diameter of the particles is usually in the range of 0.01 to 3 μm, preferably 0.01 to 1 μm. When the average particle size is less than 0.01 μm, the particles tend to aggregate and the dispersibility is insufficient, while when the average particle size exceeds 3 μm, the surface roughness of the film becomes too coarse, and there may be a case where a release layer is applied in a subsequent step.
The content of the particles is usually in the range of 0.001 to 5% by weight, preferably 0.005 to 3% by weight. When the content of the particles is less than 0.001% by weight, the slipperiness of the film may be insufficient, while when the content of the particles exceeds 5% by weight, the transparency of the film may be insufficient.
The method for adding the particles to the polyester film is not particularly limited, and conventionally known methods can be used. For example, the polyester may be added at any stage of producing the polyester constituting each layer, but it is preferable that the polycondensation reaction is carried out at the stage of esterification or after the end of the transesterification reaction.
A method of blending a slurry of particles dispersed in ethylene glycol, water or the like with a polyester raw material by using a kneading extruder with an exhaust port; or a method of blending the dried pellets with the polyester raw material using a kneading extruder.
In addition to the above-mentioned particles, a conventionally known fluorescent whitening agent, antioxidant, antistatic agent, heat stabilizer, lubricant, dye, pigment, and the like may be added to the polyester film as necessary.
The thickness of the polyester film is not particularly limited as long as the film can be formed. Considering the mechanical strength, flexibility, transparency, etc., of the film base, it is preferable to be 12 to 125 μm, and more preferably 25 to 100 μm.
The production examples of the polyester film are specifically described, but are not limited to the following production examples.
First, a method of using the polyester raw material described above and cooling and solidifying a molten sheet extruded from a die with a cooling roll to obtain an unstretched sheet is preferable. In this case, in order to improve the planarity of the sheet, it is necessary to improve the adhesion between the sheet and the rotary cooling drum, and it is preferable to use an electrostatic application adhesion method and/or a liquid coating adhesion method. Next, the obtained unstretched sheet is stretched in the biaxial direction. In this case, first, the above-described unstretched sheet is stretched in one direction by a stretcher of a roll or tenter system. The stretching temperature is usually 70-120 ℃, preferably 80-110 ℃, and the stretching ratio is usually 2.5-7 times, preferably 3.0-6 times. Then, the stretching temperature orthogonal to the stretching direction in the first stage is usually 70 to 170 ℃ and the stretching ratio is usually 3.0 to 7 times, preferably 3.5 to 6 times. And then, continuously performing heat treatment at a temperature of 180-270 ℃ under tension or under relaxation within 30% to obtain a biaxially oriented film. In the above-mentioned stretching, a method of performing stretching in one direction in 2 stages or more may be employed. In this case, it is preferable to perform the stretching in both directions so that the final stretching ratios fall within the above ranges.
In addition, a simultaneous biaxial stretching method may be employed for the production of the polyester film. The simultaneous biaxial stretching method is a method of simultaneously stretching and orienting the above-mentioned unstretched sheet in the machine direction and the width direction while controlling the temperature at usually 70 to 120 ℃, preferably 80 to 110 ℃, and the stretching ratio is 4 to 50 times, preferably 7 to 35 times, and more preferably 10 to 25 times in terms of the area ratio. And then, continuously carrying out heat treatment under the condition of tension or relaxation within 30% at the temperature of 170-250 ℃ to obtain the stretch oriented film. As the simultaneous biaxial stretching apparatus using the above stretching method, a conventionally known stretching method such as a screw method, a pantograph (pantograph) method, a linear drive method, or the like can be used.
Further, a so-called coating-drawing method (in-line coating) in which the surface of the film is treated in the drawing step of the polyester film described above may be performed. When a coating layer is provided on a polyester film by a coating-stretching method, the coating can be performed simultaneously with stretching, and the thickness of the coating layer can be reduced according to the stretching magnification, whereby a film suitable as a polyester film can be produced.
Next, the coating layer will be explained.
In order to improve the adhesion to the barrier layer, a coating layer containing at least 1 or more binder resins selected from polyester resins, acrylic resins, and polyurethane resins and at least 1 or more crosslinking agents selected from melamine resins, oxazoline group-containing resins, and isocyanate compounds is formed on the polyester film.
The polyester resin is defined as a linear polyester comprising a dicarboxylic acid component and a diol component, and examples of the dicarboxylic acid component include terephthalic acid, isophthalic acid, phthalic acid, 2, 6-naphthalenedicarboxylic acid, 4-diphenyldicarboxylic acid, 1, 4-cyclohexanedicarboxylic acid, adipic acid, sebacic acid, phenylindanedicarboxylic acid, dimer acid, and the like, and two or more of these components may be used.
Further, as the diol component, there may be exemplified: ethylene glycol, 1, 4-butanediol, neopentyl glycol, diethylene glycol, dipropylene glycol, 1, 6-hexanediol, 1, 4-cyclohexanedimethanol, xylylene glycol, dimethylolpropionic acid, glycerin, trimethylolpropane, poly (oxyethylene) glycol, poly (oxybutylene) glycol, an alkylene oxide adduct of bisphenol a, an alkylene oxide adduct of hydrogenated bisphenol a, and the like. More than 2 of these substances can be used.
Among such polyol components, ethylene glycol, an ethylene oxide adduct and/or a propylene oxide adduct of bisphenol a, and 1, 4-butanediol are preferable, and ethylene glycol, an ethylene oxide adduct of bisphenol a, and/or a propylene oxide adduct are more preferable.
In addition, in the coating layer constituting the sealant film of the present invention, it is preferable to contain at least 1 or more kinds of polyester resins having a sulfonic acid (salt) group for easy water dispersion or water solubility.
As the polyester resin having a sulfonic acid (salt) group, for example, preferable are: sulfonic acid alkali metal salt-based or sulfonic acid amine salt-based compounds such as isophthalic acid 5-sodium sulfonate, isophthalic acid 5-ammonium sulfonate, isophthalic acid 4-sodium sulfonate, isophthalic acid 4-ammonium methanesulfonate, isophthalic acid 2-sodium sulfonate, isophthalic acid 5-potassium sulfonate, isophthalic acid 4-potassium sulfonate, isophthalic acid 2-potassium sulfonate, sodium sulfosuccinate, and the like.
In the polyester resin, the glass transition temperature (hereinafter, may be abbreviated as Tg) may be preferably 40 ℃ or higher, and more preferably 60 ℃ or higher. When the Tg is less than 40 ℃, for the purpose of improving adhesiveness, when the coating thickness of the coating layer is increased, defects such as blocking are likely to occur.
The acrylic resin is a polymer formed from a polymerizable monomer having a carbon-carbon double bond, which is represented by an acrylic monomer and a methacrylic monomer. They may be either homopolymers or copolymers. In addition, copolymers of these polymers with other polymers (e.g., polyesters, polyurethanes, etc.) are also included. For example, block copolymers and graft copolymers. Further, the polyester composition may contain a polymer (in some cases, a mixture of polymers) obtained by polymerizing a polymerizable monomer having a carbon-carbon double bond in a polyester solution or a polyester dispersion. Similarly, the polymer (in some cases, a mixture of polymers) obtained by polymerizing a polymerizable monomer having a carbon-carbon double bond in a polyurethane solution or a polyurethane dispersion is also included. Similarly, a polymer (polymer mixture in some cases) obtained by polymerizing a polymerizable monomer having a carbon-carbon double bond in a solution or dispersion of another polymer is also included.
The polymerizable monomer having a carbon-carbon double bond is not particularly limited, and typical examples of the compound include various carboxyl group-containing monomers such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, fumaric acid, maleic acid, and citraconic acid, and salts thereof, (various hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, monobutyl hydroxy fumarate, and monobutyl hydroxy itaconate, (various (meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and lauryl (meth) acrylate), (various nitrogen-containing vinyl monomers such as methyl (meth) acrylamide, diacetone acrylamide, N-methylolacrylamide, and (meth) acrylonitrile), various nitrogen-containing vinyl monomers such as nitrogen-containing derivatives thereof, and various polymerizable monomers such as styrene, α -methyl styrene, divinyl benzene, vinyltoluene, various vinyl chloride, vinyl fluoride, various vinyl chloride, vinyl fluoride, various vinyl fluoride.
In the acrylic resin, the glass transition temperature (hereinafter, may be abbreviated as Tg) may be preferably 40 ℃ or higher, and more preferably 60 ℃ or higher. When the Tg is less than 40 ℃, defects such as blocking may be easily caused when the coating thickness of the coating layer is increased in order to improve the adhesiveness.
As the urethane resin, a urethane resin having a polycarbonate structure is preferable. The polyurethane resin having a polycarbonate structure is a polyurethane resin in which one of polyols as a main constituent of the polyurethane resin is a polycarbonate polyol.
Polycarbonate polyols are obtained by dealcoholization of polyols and carbonate compounds. Examples of the polyhydric alcohols include: ethylene glycol, 1, 2-propanediol, 1, 3-propanediol, trimethylolpropane, 1, 2-butanediol, 1, 3-butanediol, 1, 4-butanediol, 1, 5-pentanediol, 1, 6-hexanediol, 1, 4-cyclohexanediol, 1, 4-cyclohexanedimethanol, 1, 7-heptanediol, 1, 8-octanediol, 1, 9-nonanediol, 1, 10-decanediol, neopentyl glycol, 3-methyl-1, 5-pentanediol, 3-dimethylolheptane and the like. Examples of the carbonate compound include dimethyl carbonate, diethyl carbonate, diphenyl carbonate, and ethylene carbonate, and examples of the polycarbonate polyol obtained by these reactions include: poly (1, 6-hexylene) carbonate, poly (3-methyl-1, 5-pentylene) carbonate, and the like.
Examples of the polyisocyanate constituting the polyurethane resin having a polycarbonate structure include aromatic diisocyanates such as toluene diisocyanate, xylylene diisocyanate, methylene diphenyl diisocyanate, phenylene diisocyanate, naphthalene diisocyanate and tolidine diisocyanate, aliphatic diisocyanates having an aromatic ring such as α ', α' -tetramethylxylylene diisocyanate, aliphatic diisocyanates such as methylene diisocyanate, propylene diisocyanate, lysine diisocyanate, trimethylhexamethylene diisocyanate and hexamethylene diisocyanate, alicyclic diisocyanates such as cyclohexane diisocyanate, methylcyclohexane diisocyanate, isophorone diisocyanate, methylene bis (4-cyclohexyl isocyanate), dicyclohexylmethane diisocyanate and isopropylidene dicyclohexyl diisocyanate, and these may be used alone or in combination of two or more.
A chain extender may be used in synthesizing the polyurethane resin, and the chain extender is not particularly limited as long as it has 2 or more reactive groups that react with isocyanate groups, and in general, a chain extender having 2 hydroxyl groups or amino groups may be mainly used.
As the chain extender having 2 hydroxyl groups, for example, there can be mentioned: aliphatic diols such as ethylene glycol, propylene glycol, butylene glycol, and pentylene glycol; and glycols such as aromatic glycols like benzene dimethanol and bishydroxyethoxybenzene, and ester glycols like neopentyl glycol and neopentyl glycol hydroxypivalate. In addition, as the chain extender having 2 amino groups, for example: aromatic diamines such as tolylenediamine, xylylenediamine, and diphenylmethanediamine; aliphatic diamines such as ethylenediamine, propylenediamine, hexamethylenediamine, 2-dimethyl-1, 3-propylenediamine, 2-methyl-1, 5-pentylenediamine, trimethylhexamethylenediamine, 2-butyl-2-ethyl-1, 5-pentylenediamine, 1, 8-octylenediamine, 1, 9-nonylenediamine, and 1, 10-decyldiamine; alicyclic diamines such as 1-amino-3-aminomethyl-3, 5, 5-trimethylcyclohexane, dicyclohexylmethane diamine, isopropylidene cyclohexyl-4, 4' -diamine, 1, 4-diaminocyclohexane, 1, 3-bisaminomethyl cyclohexane, and isophorone diamine.
The polyurethane resin may be a solvent medium, but is preferably water medium. In order to disperse or dissolve the polyurethane resin in water, there are forced emulsification type using an emulsifier, self-emulsification type in which a hydrophilic group is introduced into a polyurethane resin, water-soluble type, and the like. In particular, a self-emulsifying type in which an ionic group is introduced into the skeleton of the polyurethane resin and the polyurethane resin is ionomerized is preferable because the storage stability of the liquid and the water resistance, transparency, and adhesion of the obtained coating layer are excellent.
Examples of the introduced ionic group include: carboxyl group, sulfonic acid, phosphoric acid, phosphonic acid, quaternary ammonium salt and the like, and carboxyl group is preferred. As a method for introducing a carboxyl group into a polyurethane resin, various methods can be employed in each stage of the polymerization reaction. Examples include: a method in which a resin having a carboxyl group is used as a copolymerization component at the time of prepolymer synthesis; a method of using a component having a carboxyl group as one component of a polyol, a polyisocyanate, a chain extender, and the like. Particularly, a method of introducing a desired amount of carboxyl groups in accordance with the feed amount of the component using a carboxyl group-containing diol is preferable. For example, dimethylolpropionic acid, dimethylolbutyric acid, bis- (2-hydroxyethyl) propionic acid, bis- (2-hydroxyethyl) butyric acid, and the like may be copolymerized with the diol used for the polymerization of the polyurethane resin. The carboxyl group is preferably in the form of a salt obtained by neutralization with ammonia, an amine, an alkali metal, an inorganic base, or the like. Particularly preferred substances are ammonia, trimethylamine, triethylamine.
The glass transition temperature (hereinafter, sometimes referred to as Tg) of the polyurethane resin having a polycarbonate structure is preferably 0 ℃ or lower, more preferably-15 ℃ or lower, and still more preferably-30 ℃ or lower. Polyurethane resins having a Tg of higher than 0 ℃ may have insufficient adhesion. Tg as used herein means: a temperature at which a dried coating film of the polyurethane resin was prepared and measured using a Differential Scanning Calorimeter (DSC).
The oxazoline compound is a compound having an oxazoline group in the molecule, and particularly preferably an oxazoline group-containing polymer, and can be produced by polymerizing an addition polymerizable oxazoline group-containing monomer alone or with another monomer, and the addition polymerizable oxazoline group-containing monomer includes 2-vinyl-2-oxazoline, 2-vinyl-4-methyl-2-oxazoline, 2-vinyl-5-methyl-2-oxazoline, 2-isopropenyl-4-methyl-2-oxazoline, 2-isopropenyl-5-ethyl-2-oxazoline, and the like, and these monomers may be used in a mixture of 1 or 2 or more, and among these, 2-isopropenyl-2-oxazoline are also industrially easily available, and preferably, as long as the other monomers are copolymerizable with the addition polymerizable oxazoline group-containing monomer, there are not limited, and, for example, alkyl (meth) acrylates (such as alkyl, ethyl, N-propyl, isopropyl, N-butyl, 2-hexyl, 2-ethyl-2-oxazoline), and the like, and the alkyl (meth) acrylates (e.g., methyl vinyl chloride, N-butyl, N-vinyl chloride, N-butyl, N-2-ethyl acrylate, N-2-vinyl acetate, N-vinyl chloride, acrylic acid, vinyl chloride, acrylic acid, acrylic.
The content of the oxazoline group contained in the oxazoline compound is usually in the range of 0.5 to 10mmol/g, preferably 1 to 9mmol/g, more preferably 3 to 8mmol/g, and further preferably 4 to 6mmol/g in terms of the amount of the oxazoline group. In order to improve the strength of the coating film, it is preferable to use the above range.
The melamine resin is not particularly limited, and melamine, methylolated melamine derivatives obtained by condensing melamine with formaldehyde, compounds partially or completely etherified by reacting a lower alcohol with methylolated melamine, and mixtures thereof can be used.
The melamine resin may be a condensate of a monomer or a dimer or higher polymer, or a mixture thereof. As the lower alcohol used for the etherification, methanol, ethanol, isopropanol, n-butanol, isobutanol, and the like can be preferably used. The functional group is a group having an imino group, a hydroxymethyl group, or an alkoxymethyl group such as a methoxymethyl group or a butoxymethyl group in 1 molecule, and an imino-type methylated melamine, a hydroxymethyl-type methylated melamine, a fully alkyl-type methylated melamine, or the like can be used. Among these, methylolated melamine is most preferable. Further, for the purpose of promoting the thermosetting of the melamine resin, an acid catalyst such as p-toluenesulfonic acid may be used in combination.
Examples of the isocyanate include aromatic isocyanates such as toluene diisocyanate, xylylene diisocyanate, methylene diphenyl diisocyanate, phenylene diisocyanate, and naphthalene diisocyanate, aliphatic isocyanates having an aromatic ring such as α ', α' -tetramethylxylylene diisocyanate, aliphatic isocyanates such as methylene diisocyanate, propylene diisocyanate, lysine diisocyanate, trimethylhexamethylene diisocyanate, and hexamethylene diisocyanate, alicyclic isocyanates such as cyclohexane diisocyanate, methylcyclohexane diisocyanate, isophorone diisocyanate, methylenebis (4-cyclohexyl isocyanate), and isopropylidenedicyclohexyl diisocyanate, and the like.
When used in the state of blocking isocyanate, examples of the blocking agent include: salts of hydrogen sulfite; phenol compounds such as phenol, cresol and ethylphenol; alcohol compounds such as propylene glycol monomethyl ether, ethylene glycol, benzyl alcohol, methanol, and ethanol; active methylene compounds such as dimethyl malonate, diethyl malonate, methyl acetoacetate, ethyl acetoacetate, and acetylacetone; thiol compounds such as butanethiol and dodecanethiol; lactam-based compounds such as caprolactam and valerolactam; amine compounds such as diphenylaniline, aniline, and ethylene imine; amide compounds of acetanilide and acetic acid amide; and oxime compounds such as formaldehyde, acetaldoxime, acetoxime, methylethylketoxime, cyclohexanone oxime and the like, which may be used alone or in combination of 2 or more.
The isocyanate compound in the present invention may be used as a monomer, or may be used as a mixture or a combination with various polymers. To improve the dispersibility or the crosslinkability of the isocyanate-based compound, a mixture and/or a combination with the polyester resin and/or the polyurethane resin may be used.
The proportions of the above components in the coating layer are as follows.
The proportion of the polyester resin is usually 10 to 80 wt%, preferably 20 to 60 wt%, the proportion of the acrylic resin is usually 10 to 60 wt%, preferably 20 to 50 wt%, the proportion of the polyurethane resin is usually 10 to 80 wt%, preferably 20 to 60 wt%, the proportion of the oxazoline compound is usually 20 to 80 wt%, preferably 40 to 80 wt%, the proportion of the melamine resin is usually 6 to 80 wt%, preferably 10 to 60 wt%, and the proportion of the isocyanate compound is usually 6 to 80 wt%, preferably 10 to 60 wt%.
The coating layer is formed by coating and drying a coating liquid, and the coating amount (after drying) is usually 0.005 to 1g/m in view of coatability2Preferably 0.005 to 0.5g/m2More preferably 0.01 to 0.2g/m2And (3) a range. The coating weight (after drying) is less than 0.005g/m2In the case of (2), the stability is insufficient from the viewpoint of coatability, and it may be difficult to obtain a uniform coating film. On the other hand, it exceeds 1g/m2When thick coating is performed, the coating film adhesion, curability, and the like of the coating layer itself may be reduced.
As a method for applying the coating liquid on the polyester film, conventionally known coating methods such as reverse gravure coating, direct gravure coating, roll coating, die coating, bar coating, and curtain coating can be used. Examples of the coating method are described in "coating method" (コーティング method) published in 1979 of the original Miyazai courage of Maki bookstore.
On the film surface on which the coating layer is not provided, a coating layer such as an antistatic layer or an oligomer precipitation preventing layer may be provided within a range not to impair the gist of the present invention.
The polyester film may be subjected to surface treatment such as corona treatment or plasma treatment in advance.
Next, the barrier layer will be explained.
The barrier layer is laminated for the purpose of imparting barrier properties to the polyester film. As the material of the barrier layer, in the present invention, the water vapor permeability obtained by the measurement according to JIS-K7129B method is 0.01g/m under the measurement conditions of 40 ℃ temperature and 90% RH humidity, as long as the barrier property can be brought to a desired level2No particular limitation is imposed on the content of the monomer unit,/day or less.
Examples of the material of the barrier layer include: silicon compounds such as polysilazane compounds, polycarbosilane compounds, polysilane compounds, polyorganosiloxane compounds, and tetraorganosilane compounds; inorganic oxides such as silicon oxide, silicon oxynitride, aluminum oxide, aluminum oxynitride, magnesium oxide, zinc oxide, indium oxide, and tin oxide; inorganic nitrides such as silicon nitride and aluminum nitride; inorganic oxide nitrides such as silicon oxide nitride; metals such as aluminum, magnesium, zinc, and tin. These substances may be used alone in 1 kind, or in combination of 2 or more kinds.
The thickness of the barrier layer is usually 1nm to 10 μm, preferably 10nm to 5 μm, more preferably 20 to 500nm, and particularly preferably 50 to 200 nm. If the thickness of the barrier layer is less than 1nm, the barrier effect may be insufficient. On the other hand, if the thickness of the barrier layer exceeds 10 μm, the barrier layer tends to be saturated in performance and it is difficult to expect a barrier effect equal to or more than this.
The barrier layer may be a single layer or a multilayer composed of 2 or more layers.
The method for forming the barrier layer may be any conventionally known method depending on the material constituting the barrier layer, and may be appropriately selected depending on the purpose. Examples thereof include: a method of forming a material of the barrier layer on a polyester film by a vapor deposition method, a sputtering method, an ion plating method, a thermal CVD method, a plasma CVD method, or the like; or a method in which a solution obtained by dissolving the material of the barrier layer in an organic solvent is applied to a polyester film, and the obtained coating film is subjected to plasma ion implantation. As ions to be implanted by plasma ion implantation, for example: ions of rare gases such as argon, helium, neon, krypton, and xenon, fluorocarbons, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, and sulfur; ions of metals such as gold, silver, copper, platinum, nickel, palladium, chromium, titanium, molybdenum, niobium, tantalum, tungsten, and aluminum.
Next, the protective layer will be explained.
By applying the protective layer on the barrier layer, the coating liquid for forming the protective layer uniformly penetrates into minute defective portions existing in the barrier layer, and the defective portions of the barrier layer can be repaired by heat curing. Further, by coating the barrier layer with the protective layer, the barrier layer can be protected from friction and scraping caused by contact with the guide roll for conveyance in the processing step, and can maintain good barrier properties without being affected by an organic solvent used in the manufacturing step.
Hereinafter, an embodiment in which the protective layer contains an organic compound containing at least 1 or more metal elements selected from aluminum, titanium, and zirconium will be described.
Specific examples of the organic compound having an aluminum element include: tris (acetylacetonate) aluminum, bis (ethylacetoacetate) monoacetylacetonate aluminum, di-n-butoxymonoethylacetoacetate aluminum, diisopropoxymethylacetoacetate aluminum, and the like.
Specific examples of the organic compound having a titanium element include: titanate esters such as tetra-n-butyl titanate, tetra-isopropyl titanate, butyl titanate dimer, tetra (2-ethylhexyl) titanate, and tetramethyl titanate; titanium chelate compounds such as titanium acetylacetonate, titanium tetraacetylacetonate, titanium polyacetylacetonate, titanium octyleneglycolate, titanium lactate, titanium triethanolate, and titanium ethylacetoacetate.
Specific examples of the organic compound having a zirconium element include: zirconium acetate, zirconium n-propionate, zirconium n-butyrate, zirconium tetraacetylacetonate, zirconium monoacetylacetonate, zirconium diacetoneacetylacetonate, and the like.
Among these, organic compounds containing a metal element selected from aluminum and zirconium are preferably organic compounds having a chelate structure, particularly from the viewpoint of improving adhesion performance. Further, it is specifically described in "a crosslinking agent handbook" (heading (s) ハンドブック) (hei 2 years edition by yochen editors (japan) ltd.).
The protective layer is preferably formed by combining an organosilicon compound represented by the following general formula (1) in order to protect the barrier layer and improve adhesion to the adhesive layer.
The organic silicon compound constituting the protective layer in the present invention preferably uses a general formula (1): si (X)d(Y)e(R1)f[ wherein X is an organic group having at least 1 selected from the group consisting of an epoxy group, a mercapto group, a (meth) acryloyl group, an alkenyl group, a haloalkyl group and an amino group, and R is1Is a monovalent hydrocarbon group having 1 to 10 carbon atoms, Y is a hydrolyzable group, d is an integer of 1 or 2, e is an integer of 2 or 3, f is an integer of 0 or 1, and d + e + f is 4.]The type of representation.
The organosilicon compound represented by the general formula (1) may be a compound having 2 hydrolyzable groups Y capable of forming siloxane bonds by hydrolysis or condensation reaction (D unit source) or a compound having 3 hydrolyzable groups Y (T unit source).
In the general formula (1), a monovalent hydrocarbon group R1The number of carbon atoms of (2) is 1 to 10, and methyl, ethyl and propyl are particularly preferable.
In the general formula (1), as the hydrolyzable group Y, conventionally known groups can be used, and the following groups can be exemplified. Methoxy, ethoxy, butoxy, isopropanoyloxy, acetoxy, butanone oxime, amino and the like. These hydrolyzable groups may be used alone or in combination of two or more. When a methoxy group or an ethoxy group is used, good storage stability can be imparted to the coating material, and the coating material is particularly preferable because it has suitable hydrolyzability.
Specific examples of the organosilicon compounds include vinyltrimethoxysilane, gamma-glycidoxypropyltrimethoxysilane, gamma-glycidoxypropylmethyldiethoxysilane, β - (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, gamma-mercaptopropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-acryloxypropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, 5-hexenyltrimethoxysilane, p-vinyltrimethoxysilane, trifluoropropyltrimethoxysilane, gamma-glycidoxypropyltriethoxysilane, gamma-glycidoxypropylmethyldiisopropyloxysilane and the like.
In the protective layer, a catalyst may be used in combination for the purpose of promoting hydrolysis and condensation reactions. Specific examples thereof include: organic acids such as acetic acid, butyric acid, maleic acid and citric acid, inorganic acids such as hydrochloric acid, nitric acid, phosphoric acid and sulfuric acid, basic compounds such as triethylamine, organic metal salts such as tetrabutyl titanate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin dioctoate, dibutyltin dioleate, diphenyltin diacetate, dibutyltin oxide, dibutyltin dimethoxytin, dibutyltin bis (triethoxysilyloxy) tin dibutylbis, dibutyltin benzylmaleate and the like, fluorine-containing compounds such as KF and NH4F, and the like. The above catalysts may be used alone, or 2 or more of them may be used in combination. Among them, in particular, in terms of the coating film having good durability, an organic metal salt is preferable, and in terms of the catalyst activity capable of being maintained for a long time, a tin catalyst is preferably used.
As another embodiment of the protective layer, a case where a urethane resin is contained in the protective layer is exemplified.
The polyurethane resin is obtained by reacting an isocyanate compound with a diol or polyol compound. Examples of the isocyanate compound include aromatic polyisocyanate, aliphatic polyisocyanate, alicyclic polyisocyanate, and aliphatic polyisocyanate, and a diisocyanate compound is generally used. Examples of the aromatic diisocyanate include: toluene diisocyanate (2, 4-or 2, 6-toluene diisocyanate or a mixture Thereof) (TDI), phenylene diisocyanate (m-, p-phenylene diisocyanate or a mixture thereof), 4 '-diphenyl diisocyanate, 1, 5-Naphthalene Diisocyanate (NDI), diphenylmethane diisocyanate (4,4' -, 2,4'-, or 2,2' -diphenylmethane diisocyanate or a mixture thereof) (MDI), 4 '-tolidine diisocyanate (TODI), 4' -diphenyl ether diisocyanate, and the like. Examples of the aromatic aliphatic diisocyanate include: xylylene diisocyanate (1, 3-or 1, 4-xylylene diisocyanate or a mixture thereof) (XDI), tetramethylxylylene diisocyanate (1, 3-or 1, 4-tetramethylxylylene diisocyanate or a mixture Thereof) (TMXDI), omega' -diisocyanato-1, 4-diethylbenzene, and the like. Examples of the alicyclic diisocyanate include: 1, 3-cyclopentene diisocyanate, cyclohexane diisocyanate (1, 4-cyclohexane diisocyanate, 1, 3-cyclohexane diisocyanate), 3-isocyanatomethyl-3, 5, 5-trimethylcyclohexyl isocyanate (isophorone isocyanate, IPDI), methylene bis (cyclohexyl isocyanate) (4,4' -, 2,4' -or 2,2' -methylene bis (cyclohexyl isocyanate)) (hydrogenated MDI), methylcyclohexane diisocyanate (methyl-2, 4-cyclohexane diisocyanate, methyl-2, 6-cyclohexane diisocyanate), bis (isocyanatomethyl) cyclohexane (1, 3-or 1, 4-bis (isocyanatomethyl) cyclohexane or mixtures thereof) (hydrogenated XDI), and the like. Examples of the aliphatic diisocyanate include: trimethylene diisocyanate, 1, 2-propylene diisocyanate, butylene diisocyanate (tetramethylene diisocyanate, 1, 2-butylene diisocyanate, 2, 3-butylene diisocyanate, 1, 3-butylene diisocyanate), hexamethylene diisocyanate, pentamethylene diisocyanate, 2,4, 4-or 2,2, 4-trimethylhexamethylene diisocyanate, 2, 6-diisocyanatomethyl caffeate, and the like.
As the diol or polyol component constituting the polyurethane resin, an alkylene glycol can be preferably used from the viewpoint of gas barrier properties. Examples of the alkylene glycol include low molecular weight glycols such as linear or branched alkylene glycols having 2 to 10 carbon atoms, e.g., ethylene glycol, propylene glycol, 1, 3-butanediol, 1, 4-butanediol, pentanediol, hexanediol, neopentylglycol, heptanediol, and octanediol, and (poly) oxyalkylene glycols having 2 to 4 carbon atoms. These diol components may be used alone or in combination of 2 or more. Further, if necessary, a low molecular weight diol component such as an aromatic diol such as bisphenol A, bishydroxyethyl terephthalate, catechol, resorcinol, hydroquinone, 1, 3-or 1, 4-benzenedimethanol, or an alicyclic diol such as hydrogenated bisphenol A, hydrogenated benzenedimethanol, cyclohexanediol, or cyclohexane may be used in combination. Further, if necessary, a polyol component having 3 or more functions, for example, a polyol component such as glycerin, trimethylolethane, or trimethylolpropane may be used in combination. The polyol component preferably contains a C2-8 polyol component.
Further, the protective layer may contain inorganic particles for the purpose of improving the fixability and lubricity within a range not impairing the gist of the present invention, and specific examples thereof include: silica, alumina, kaolin, calcium carbonate, titanium oxide, barium salts, and the like.
Further, the coating composition may contain an antifoaming agent, a coating property improving agent, a thickener, an organic lubricant, organic polymer particles, an antioxidant, an ultraviolet absorber foaming agent, a dye, and the like, as required.
The organic solvent used may be only one type or two or more types may be appropriately used for the purpose of improving dispersibility, film forming property, and the like, within the scope not departing from the gist of the present invention.
The coating amount (after drying) of the protective layer is usually 0.005 to 1g/m2Preferably 0.005 to 0.5g/m2The range of (1). The coating weight (after drying) is less than 0.005g/m2In the case of (2), the uniformity of the coating thickness may be insufficient, and the protective function as a protective layer may be insufficient. On the other hand, the coating is applied over 1g/m2In the case of (3), a problem such as a decrease in lubricity may occur.
The protective layer having the above composition has good durability and excellent adhesion to the adhesive layer. Depending on the product configuration, the quantum dot-containing resin sheet may be directly bonded without providing an adhesive layer.
When the total light transmittance of the sealing film obtained in this way is less than 86%, the transparency of the device may be low and the visibility may be poor when the sealing film is used as a sealing film such as a quantum dot-containing resin sheet, electronic paper, or organic E L.
The sealing film of the present invention has a water vapor transmission rate of 0.01g/m2The requirement is set below/day. Preferably 0.005g/m2The ratio/day is not more than that. Particularly, as the sealing film for electronic parts, 0.005g/m is preferable2If the content exceeds this range,/day or less, moisture will gradually enter the device during long-term use of the device, and the device will tend to be easily deteriorated.
Next, a resin sheet containing dots as an object to be bonded with the sealing film of the present invention will be described.
A plurality of quantum dots and a resin may be contained on the quantum dot-containing resin sheet layer (sometimes simply referred to as a quantum dot layer). Quantum dots refer to semiconductor particles of a specified size having a quantum confinement effect (quantum confinement effect). In general, the diameter of the quantum dot is preferably in the range of 1 to 10 nm.
When the quantum dot absorbs light from the excitation source and reaches an energy excited state, energy corresponding to the energy band gap of the quantum dot is emitted. Therefore, when the size of the quantum dot or the composition of the substance is adjusted, the energy band gap can be adjusted, and energy of various levels of wavelength bands can be obtained.
For example, the quantum dots have a size of
Figure BDA0001321354930000171
In the case of (2), a red color is emitted, and the size of the quantum dot is
Figure BDA0001321354930000172
In the case of (2), a green color is emitted, and the size of the quantum dot is
Figure BDA0001321354930000173
In the case of (2), a blue color is emitted, and yellow has an intermediate size between a quantum dot emitting red and a quantum dot emitting green. It can be grasped that the size of the quantum dot changes from about as the spectrum formed by the wavelength of light changes from red to blue
Figure BDA0001321354930000174
Gradually become about
Figure BDA0001321354930000175
The values may differ somewhat.
Therefore, in view of the above quantum dots, various colors including red, green, and blue due to quantum size effect (quantum size effect) can be easily obtained. Therefore, colors emitting light at respective wavelengths may be produced, and red, green, and blue may be mixed to produce white or various colors.
For example, in the case where the light emitted from the light source is blue light, the quantum dot layer may contain red quantum dots and green quantum dots. The red quantum dots convert a part of the blue light into red light having a wavelength region of 620 to 750nm, and the green quantum dots convert a part of the blue light into green light having a wavelength region of 495 to 570 nm. Then, the blue light not converted into the red light and the green light is directly transmitted through the quantum dot layer. Therefore, blue light, red light, and green light are emitted from the quantum dot layer on the upper surface, and these lights are mixed to generate white light.
The quantum dots can be synthesized by a chemical wet method. The above-described chemical wet method is a method of growing particles by adding a precursor substance to an organic solvent. Examples of the quantum dots include: II-VI compounds such as CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS.
In addition, the quantum dot may have a core-shell structure. Here, the core includes any one selected from CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe, and HgS, and the shell also includes any one selected from CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe, and HgS. Further, the compound may be a III-V compound such as InP.
The organic ligands substituted on the surface of the quantum dots include pyridine, mercapto alcohol, thiol, phosphine oxide, and the like, and serve to stabilize unstable quantum dots after synthesis, and examples of commercially available quantum dots include various quantum dots manufactured by SIGMA-A L DRICH, and the like.
In addition, as for the resin containing quantum dots, a substance that does not absorb the wavelength of light mainly emitted from the light source is preferably used. Specifically, epoxy groups, silicones, acrylic polymers, glass, carbonate polymers, or a mixture thereof can be used. Even when the resin has elasticity, the resin can contribute to improvement of durability of the liquid crystal display device against external impact.
On the other hand, a method of forming a quantum dot layer is as follows.
The resin layer containing quantum dots may be formed by adding a plurality of quantum dots to the resin and applying the resin on the upper portion of the color filter layer by a spin coating method or a printing method.
The quantum dot resin sheet can be formed by molding and curing a resin to which quantum dots are added.
Further, a quantum dot layer can be formed by injecting an organic solution to disperse a plurality of quantum dots therein and curing the organic solution. The organic solution may contain at least 1 of toluene, chloroform and ethanol. Here, the organic solution does not absorb blue wavelengths. In this case, since the reaction between the ligand of the quantum dot and the organic solution does not occur, there is an advantage in that the lifetime and efficiency of the quantum dot layer are increased.
The quantum dot-containing resin sheet is a laminate obtained by laminating a sealing film via an adhesive layer.
The adhesive layer is explained below.
The pressure-sensitive adhesive layer is a layer made of a material having pressure-sensitive adhesiveness, and conventionally known materials such as acrylic pressure-sensitive adhesives and silicone pressure-sensitive adhesives can be used. In addition, in the bonding, a conventionally known bonding method can be adopted.
Examples
The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples as long as the invention does not exceed the gist thereof. The assay used in the present invention is as follows.
(1) Determination of the intrinsic viscosity (dl/g) of the polyester:
1g of a polyester from which other polymer components and pigments incompatible with the polyester were removed was precisely weighed, and 100ml of a mixed solvent of phenol/tetrachloroethane (weight ratio) 50/50 was added and dissolved, and the measurement was performed at 30 ℃.
(2) Measurement of average particle diameter (d 50: μm):
the cumulative (weight basis) 50% value in the equivalent spherical distribution measured by a centrifugal sedimentation type particle size distribution measuring apparatus (model SA-CP3, Shimadzu corporation) was defined as the average particle size.
(3) Glass transition temperature (Tg) measurement of polyester resin:
the sample weight was increased at a rate of 10 ℃/min under a nitrogen stream using a DSC-II type measuring apparatus manufactured by Perkinelmer, and the Tg was determined as the temperature at which the sample began to deviate from the baseline.
(4) Film thickness of the barrier layer:
a sample film was cut into a size of 1mm × mm and embedded in an epoxy resin for an electron microscope, the sample film was fixed to a sample holder of a microtome, and a thin section parallel to the short side of the embedded sample was prepared, and then, at a portion of the section where no significant damage was observed in the thin film, a transmission electron microscope (JEM-2010, JEO L) was used to photograph at an accelerating voltage of 200kV, a bright field, and an observation magnification of 1 ten thousand times, thereby obtaining a photograph, and the film thickness was determined from the obtained photograph.
(5) Refractive index measurement of protective layer and polyester film:
the refractive index was measured by an Abbe refractometer using the sodium D line as a light source by the JISK7142-19965.1 (method A).
(6) Refractive index measurement of coating layer and barrier layer:
the change in the polarization state of the reflected light from the coating layer or the barrier layer formed on the silicon wafer or the quartz glass by the coater was measured at 60 degrees, 65 degrees, and 70 degrees of the incident angle using a high-speed spectrometer M-2000 (manufactured by j.a. woollam), and the refractive index at a wavelength of 550nm was calculated by analysis software WVASE 32.
(7) Evaluation of transparency of sealing film:
the total light transmittance of the film was measured with respect to the sealing film for measurement by a haze meter "HM-150" manufactured by color technical research on village, K.K. according to JIS-K-7136.
(criteria for determination)
A: total light transmittance of 89% or more (good, level with no particular problem)
B: the total light transmittance is above 86% and below 89%
(to a level of no problem, but may be difficult to apply to a display device of a high-end model)
(8) Water vapor transmission rate:
the measurement was carried out at a temperature of 40 ℃ and a humidity of 90% RH based on the B method (infrared sensor method) described in JIS K7129(2000 edition) using a water vapor transmission rate and transmittance measuring device (model name, "PERMATRAN" (registered trademark) W3/31) manufactured by Mocon corporation. 2 test pieces were cut out from 1 sample, each test piece was measured 1 time, and the average of 2 measured values was defined as the water vapor transmission rate of the sample.
(9) Adhesion to adhesive layer:
using the laminates obtained in examples and comparative examples, the feeling of peeling when one sealing film was peeled from the laminate was judged according to the following criteria.
(criteria for determination)
A: the sealing film and the resin sheet containing the sub dots are firmly adhered to each other, and the peeling is difficult. (level with no practical problems)
B: the sealing film and the resin sheet containing the sub dots can be peeled off. (level with practical problems)
(10) Evaluation of luminance unevenness of laminate (evaluation of substitute for practical characteristics):
a laminate obtained by sandwiching the sealing films obtained in item (9) and obtained by bonding the sealing films obtained in examples and comparative examples and the resin sheet containing quantum dots was laminated on a light diffusion film of a TFT liquid crystal module (model 192GC00, charpy corporation), and light was emitted from a L ED light source by applying 9.75V, and the luminance unevenness was evaluated by using the following criteria.
(criteria for determination)
A: no uneven brightness condition was observed.
B: there are some states where the brightness is not uniform but there is no problem in practical use.
C: the brightness unevenness was clear, which was a practically problematic state.
(11) And (3) comprehensive evaluation:
using the sealing films produced in each of the examples and comparative examples, the overall evaluation was performed on each evaluation item of transparency, barrier property, adhesiveness to an adhesive layer, and unevenness in brightness according to the following criteria.
Reference for judgment
A: the transparency, barrier property, adhesiveness to the adhesive layer, and luminance unevenness were all determined as a. (level with no practical problems)
B: at least one of transparency, barrier property, adhesiveness to an adhesive layer, and luminance unevenness includes B determination. (level which may be problematic in practical use)
C: at least one of the transparency, barrier property, adhesiveness to the adhesive layer, and luminance unevenness includes C determination. (level with practical problems)
The polyesters used in examples and comparative examples were prepared as follows.
Production of polyester
Production example 1 (polyester A1)
100 parts of dimethyl terephthalate, 60 parts of ethylene glycol and 0.09 part of magnesium acetate tetrahydrate are taken out into a reactor, and while heating and temperature rising are carried out, methanol is distilled off to carry out an ester exchange reaction, and the temperature rises to 230 ℃ within 4 hours from the start of the reaction, and the ester exchange reaction is substantially ended. Subsequently, 0.04 parts of ethyl acid phosphate and 0.03 parts of antimony trioxide were added to the ethylene glycol slurry, and then the temperature was increased to 280 ℃ and the pressure was increased to 15mmHg over 100 minutes, and thereafter the pressure was gradually decreased to 0.3 mmHg. After 4 hours, the system was returned to normal pressure, to obtain polyester A1 having an intrinsic viscosity of 0.61 (dl/g).
Production example 2 (polyester A2)
Polyester A2 having an intrinsic viscosity of 0.62(dl/g) was obtained in the same manner as in the production method of polyester (A) except that after ethyl acid phosphate was added, silica particles having an average particle diameter of 2.3 μm were added so that the content of the silica particles in the polyester became 0.2% by weight.
Example 1 (production of sealing film F1)
A raw material containing polyesters A1 and A2 at a ratio of 85% and 15% was used as a raw material for a surface layer and a raw material containing polyester A1 at a ratio of 100% was used as a raw material for an intermediate layer, and the raw materials were supplied to 2 extruders with vent holes, melt-extruded at 290 ℃ and then cooled and solidified on a cooling roll having a surface temperature of 40 ℃ by an electrostatic precipitation method to obtain an amorphous film having a thickness of about 1500. mu.m. The film was stretched 3.5 times in the machine direction at 85 ℃. Then, the coating thickness (after drying) was set to 0.05g/m2After coating both surfaces with a coating liquid having the following coating layer composition, the film was introduced into a tenter, stretched 3.8 times in the transverse direction at 100 ℃, and heat-treated at 210 ℃ to obtain a polyester film F1 provided with a coating layer having a thickness of 100 μm (thickness composition ratio 2.5 μm/95 μm/2.5 μm).
In addition, as the composition contained in the coating liquid, the following was used.
< (production Condition of aqueous acrylic resin) >
A mixture of 40 parts by weight of ethyl acrylate, 30 parts by weight of methyl methacrylate, 20 parts by weight of methacrylic acid and 10 parts by weight of glycidyl methacrylate was solution-polymerized in ethanol, and the mixture was added after polymerization and heated to remove ethanol. The pH was adjusted to 7.5 with ammonia water to obtain a water-based acrylic resin water-based paint.
< (production Condition of aqueous polyurethane resin) >
First, a polyester polyol was obtained which was composed of 664 parts by weight of terephthalic acid, 631 parts by weight of isophthalic acid, 472 parts by weight of 1, 4-butanediol, and 447 parts by weight of neopentyl glycol. Then, 321 parts by weight of adipic acid and 268 parts by weight of dimethylolpropionic acid were added to the obtained polyester polyol to obtain a pendant carboxyl group-containing polyester polyol A. Further, 160 parts by weight of hexamethylene diisocyanate was added to 1880 parts by weight of the polyester polyol A to obtain an aqueous polyurethane resin coating composition.
< waterborne polyester resin >
Tg＝63℃
Acid component: 50 mol% of terephthalic acid
Isophthalic acid 48 mol%
Isophthalic acid-5-sulfonic acid Na 2 mol%
A diol component: ethylene glycol 50 mol%
Neopentyl glycol 50 mol%
< isocyanate-based Compound >
An active methylene blocked polyisocyanate synthesized by the following method:
1000 parts by weight of hexamethylene diisocyanate was stirred at 60 ℃ and 0.1 part by weight of tetramethylammonium decanoate was added as a catalyst. After 4 hours, 0.2 part by weight of phosphoric acid was added to stop the reaction, to obtain an isocyanurate type polyisocyanate composition. 100 parts by weight of the obtained isocyanurate type polyisocyanate composition, 42.3 parts by weight of methoxypolyethylene glycol having a number average molecular weight of 400, and 29.5 parts by weight of propylene glycol monomethyl ether acetate were added and the mixture was held at 80 ℃ for 7 hours. Then, 35.8 parts by weight of methyl isobutyrylacetate, 32.2 parts by weight of diethyl malonate, and 0.88 part by weight of a 28% methanol solution of sodium methoxide were added to the reaction mixture while maintaining the temperature of the reaction mixture at 60 ℃ for 4 hours. 58.9 parts by weight of n-butanol was added, the reaction mixture was kept at 80 ℃ for 2 hours, and then 0.86 part by weight of 2-ethylhexyl acid phosphate was added to the reaction mixture.
(composition of coating layer)
I: oxazoline group-containing polymer
(Epocros WS-500, manufactured by Nippon catalyst Co., Ltd.) "
Oxazoline group content 4.5mmol/g)0 wt%,
II: 0 wt% of water-based acrylic resin,
III: 45% by weight of the aqueous polyurethane resin
IV: melamine resin 30% by weight
(alkylol melamine)/urea copolymerized crosslinkable resin
BECKAMINE "J101" manufactured by DIC corporation)
V: 20 wt% of water-based polyester resin,
VI: isocyanate-based Compound 0% by weight
VII: colloidal silica (average particle diameter 70nm) 5% by weight
The coating liquid was diluted with ion-exchanged water to prepare a coating liquid having a solid content of 2% by weight.
< formation of Barrier layer 1 >
An active energy ray-curable resin composed of an active energy ray-curable resin was applied to the surface of the coating layer of the obtained coating film by a #16 wire bar, dried at 80 ℃ for 1 minute to remove the solvent, and then irradiated with a metal halide lamp for an ultraviolet ray at 120w/cm and a cumulative luminous flux of 180mJ/cm2The barrier layer 1 was irradiated with ultraviolet rays and was formed to have a thickness (after drying) of 5 μm.
Composition of active energy ray-curable resin
A mixed coating solution of 72 parts by weight of dipentaerythritol acrylate, 18 parts by weight of 2-hydroxy-3-phenoxypropyl acrylate, 1 part by weight of a photopolymerization initiator (Irgacure 651, available from Ciba specialty Chemicals Co., Ltd.), and 200 parts by weight of methyl ethyl ketone.
< formation of Barrier layer 2 >
The following barrier layer 2 was laminated on the barrier layer 1, and specifically, the water pressure in the vacuum chamber before sputtering was 1 × 10-4Pa, then, the reaction was performed. As the sputtering conditions, Al-Si (composition ratio) was used for the targetAl: si-5: 5. high purity chemical system), applying 3W/cm2Of the DC power. Further, Ar gas was supplied and film formation was performed by a DC magnetron sputtering method under an atmosphere of 0.4 Pa. At this time, the magnetic field strength was 600 gauss. The center roll temperature was set to 0 ℃, and oxygen flow rate was controlled while the discharge voltage during sputtering was constant, using Speedflow manufactured by Gencoa. In this case, the discharge voltage when only Ar gas is supplied is set to 100%, and Ar gas and O are supplied2When the discharge voltage when 50sccm of gas was applied was 0%, the discharge voltage was set to a value of 50%. As described above, the barrier layer 2 having a film thickness of 40nm and a refractive index of 1.52 was deposited.
< formation of protective layer 1 >
Organic compound with aluminum element (a 1): 19.5% by weight
Tris (acetylacetonate) aluminium
Organosilicon compound (B1): 80% by weight
Gamma-glycidoxypropyltrimethoxysilane
Catalyst (C1): 0.5% by weight
Dibutyl tin dilaurate
The above coating agent was diluted with a toluene/MEK mixed solvent (mixing ratio 1: 1) to make 4% by weight.
Then, the coating weight (after drying) on the barrier layer 2 was 0.1g/m2The protective layer 1 composed of the above coating agent was applied by the reverse gravure coating method, and after heat treatment at 120 ℃ for 30 seconds, a sealing film was obtained.
Next, the obtained sealing films were bonded to both sides of the resin sheet containing the quantum dots by the following procedure, to obtain a laminate.
< preparation of coating liquid for Forming Quantum dot resin sheet >
A resin sheet preparation liquid containing quantum dots was prepared by mixing 40 wt% of "OE-6630A/B" (manufactured by Tollido Corning Co., Ltd., refractive index: 1.53) as a silicone resin, 40 wt% of "CdSe/ZnS 480" (manufactured by SIGMA-A L DRICH Co., Ltd.: Blue480nm), "CdSe/ZnS 530" (manufactured by SIGMA-A L DRICH Co., Ltd.: Green530nm) and "CdSe/ZnS 560" (manufactured by SIGMA-A L DRICH Co., Ltd.: Yellow560nm) as quantum dots in a ratio of 20 wt% each in a polyethylene container having a volume of 300ml, and then stirring and defoaming at 1000rpm for 20 minutes by using a planetary stirring and defoaming device "MAZESTAR (registered trademark)" KK-400 (manufactured by Kurabo).
< Quantum dot resin sheet formation >
The resin liquid for sheet formation was applied to a polyester film (DIAFOI L T100 model manufactured by Mitsubishi resin corporation: 100 μm) using a slit die coater, and the resultant was heated at 130 ℃ for 5 minutes and dried to obtain a quantum dot resin sheet having a film thickness (after drying) of 50 μm.
< formation of laminate >
"SD 4580" (an organic silicone adhesive manufactured by Toray Corning corporation) was applied to both sides of the quantum dot resin sheet, and the sheet was dried by heating at 100 ℃ for 5 minutes to obtain an adhesive layer having a thickness of 25 μm. Further, the sealing film was laminated as a cover film on the adhesive layer at 100 ℃ for 3 minutes so that the surface of the protective layer was bonded to the surface of the adhesive layer.
Examples 2 to 12
A sealant film was produced in the same manner as in example 1 except that the composition of the coating layer and the thickness of the polyester film in example 1 were changed as shown in tables 1 and 2 below.
Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer, thereby obtaining a laminate.
Examples 13 to 15
A sealant film was produced in the same manner as in example 1, except that the composition of the barrier layer in example 1 was changed to the barrier layer 2 described below. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer, thereby obtaining a laminate.
< formation of Barrier layer 3 >
The gas barrier layer made of alumina was formed, and at this time, it was confirmed that the water pressure in the vacuum chamber before sputtering was 1 × 10- 4Pa, then, the reaction was performed. Then is turned onIn the sputtering conditions, Al (manufactured by Technofinie Co., Ltd.) was used as a target and applied at 3W/cm2Of the DC power. Further, Ar gas was supplied and film formation was performed by a DC magnetron sputtering method under an atmosphere of 0.4 Pa. At this time, the magnetic field strength was 600 gauss. The center roll temperature was set to 0 ℃, and the oxygen flow rate was controlled so that the discharge voltage during sputtering was constant, using Speedflo manufactured by Gencoa. In this case, the discharge voltage when only Ar gas is flowed is set to 100%, and Ar gas and O are mixed2When the discharge voltage when gas was flowed at 50sccm was 0%, the discharge voltage was set to a value of 50%. As described above, the barrier layer 2 having a thickness of 32nm and a refractive index of 1.61 was formed on the coating layer.
In the obtained sealing film, the difference in refractive index between the barrier layer 2 (refractive index: 1.61) and the protective layer (refractive index: 1.43) was large, and therefore, the transparency was slightly poor.
Examples 16 to 18
A sealing film was produced in the same manner as in example 1, except that the composition of the protective layer was changed to the protective layer 2 and the adhesive layer was changed to the acrylic adhesive layer in example 1. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer to obtain a laminate.
< formation of protective layer 2 >
A main agent: WPB-341 (manufactured by Mitsui chemical Co., Ltd.)
Curing agent: WD-725 (Sanjing chemical Co., Ltd.)
Mixing ratio of main agent/curing agent (100/3.75) (weight ratio), ethyl acetate: a coating liquid for a protective layer having a solid content of 10% by weight was prepared from a toluene mixed solvent (mixing ratio: 1).
(acrylic pressure-sensitive adhesive layer composition)
Butyl acrylate (100 parts by weight) and acrylic acid (6 parts by weight) were copolymerized in ethyl acetate by a conventional method to obtain a solution (solid content: 30% by weight) of an acrylic copolymer having a weight-average molecular weight of 60 ten thousand (in terms of polystyrene). An acrylic pressure-sensitive adhesive layer composition was obtained by adding 6 parts by weight of TETRADC (manufactured by mitsubishi gas chemical corporation) as an epoxy-based crosslinking agent to 100 parts by weight (solid content) of the acrylic copolymer.
Example 19
A sealing film was produced in the same manner as in example 1, except that the thickness of the base material in example 1 was changed to 50 μm. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer to obtain a laminate.
Example 20
A sealant film was produced in the same manner as in example 1, except that the barrier layer structure in example 1 was changed to a 1-layer structure of only the barrier layer 1. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer, thereby obtaining a laminate.
Example 21
A sealant film was produced in the same manner as in example 1 except that the barrier layer structure in example 1 was changed to a 1-layer structure of only the barrier layer 2. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer, thereby obtaining a laminate.
Example 22
A sealant film was produced in the same manner as in example 1, except that the raw material composition of the polyester film was changed in example 1. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer to obtain a laminate.
Example 23
A sealant film was produced in the same manner as in example 1, except that in example 1, the coating layer was not provided on the surface opposite to the surface provided with the barrier layer. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer, thereby obtaining a laminate.
Example 24
In example 1, a laminate was obtained by laminating a sealing film and a resin sheet containing quantum dots via an acrylic adhesive layer having a thickness of 25 μm in the same manner as in example 1, except that the type of the adhesive layer was changed to the acrylic adhesive layer described in example 16, and heating and drying were performed at 100 ℃ for 5 minutes.
Comparative example 1
A sealant film was produced in the same manner as in example 1, except that the composition of the coating layer in example 1 was changed to the coating layer 5. Then, the sealing film and the quantum dot-containing resin sheet are bonded to each other via the adhesive layer, thereby obtaining a laminate.
Comparative example 2
A sealant film was produced in the same manner as in example 1, except that the composition of the coating layer in example 1 was changed to the coating layer 10. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer, thereby obtaining a laminate.
Comparative example 3
A sealant film was produced in the same manner as in example 1, except that the composition of the coating layer in example 1 was changed to the coating layer 15. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer, thereby obtaining a laminate.
Comparative example 4
A sealing film was produced in the same manner as in example 1, except that the coating layer was not provided in example 1. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer, thereby obtaining a laminate.
Comparative example 5
A sealant film was produced in the same manner as in example 1, except that no barrier layer was provided in example 1. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer, thereby obtaining a laminate.
Comparative example 6
A sealing film was produced in the same manner as in example 1, except that no protective layer was provided in example 1. Then, the sealing film and the resin sheet containing the quantum dots are bonded to each other via the adhesive layer, thereby obtaining a laminate.
The properties of each sealing film obtained in the above examples and comparative examples are shown in tables 1 to 5.
[ Table 1]
Figure BDA0001321354930000291
[ Table 2]
Figure BDA0001321354930000301
[ Table 3]
Figure BDA0001321354930000311
[ Table 4]
Figure BDA0001321354930000321
[ Table 5-1]
Figure BDA0001321354930000331
[ tables 5-2]
Figure BDA0001321354930000341
Industrial applicability of the invention
The sealing film for electronic components of the present invention is particularly excellent in transparency, water vapor barrier property and adhesiveness to an adhesive layer, and is suitable as a sealing film for electronic components such as a resin sheet, electronic paper, and organic E L, which require a high water vapor barrier property and a content of a quantum dot, and has a high industrial value.
Description of the symbols
10: laminate
11: resin sheet containing quantum dots
12: first polyester film
13: first coating layer
14: a first barrier layer
15: first protective layer
22: second polyester film
23: second coating layer
24: a second barrier layer
25: second protective layer
31: first sealing film
32: second sealing film
41: first adhesive layer
42: second adhesive layer

Claims (7)

1. A sealing film for electronic parts, characterized in that:
the sealant film comprises a coating layer, a barrier layer and a protective layer sequentially laminated on one surface of a polyester film,
the coating layer contains at least 1 or more binder resins selected from polyester resins, acrylic resins and polyurethane resins and at least 1 or more crosslinking agents selected from melamine resins and isocyanate compounds,
the isocyanate compound is active methylene blocked polyisocyanate, the proportion of the active methylene blocked polyisocyanate is 10-60 wt%,
the protective layer contains a compound represented by the general formula (1): si (X)d(Y)e(R1)fAn organosilicon compound represented by the formula, wherein X is an organic group having at least 1 selected from the group consisting of an epoxy group, a mercapto group, a (meth) acryloyl group, an alkenyl group, a haloalkyl group and an amino group, and R is1A monovalent hydrocarbon group having 1 to 10 carbon atoms, Y is a hydrolyzable group, d is an integer of 1 or 2, e is an integer of 2 or 3, f is an integer of 0 or 1, d + e + f is 4,
the water vapor permeability of the seal film measured under the measurement conditions of 40 ℃ temperature and 90% RH humidity according to JIS-K7129B method was 0.01g/m2And/day is less.
2. The sealing film for electronic components according to claim 1, wherein:
in the coating layer, the proportion of the polyester resin is 10 to 80 wt%, the proportion of the acrylic resin is 10 to 60 wt%, the proportion of the polyurethane resin is 10 to 80 wt%, and the proportion of the melamine resin is 6 to 80 wt%.
3. The sealing film for electronic components according to claim 1 or 2, wherein:
the barrier layer is composed of at least 2 layers.
4. The sealing film for electronic components according to claim 1 or 2, wherein:
the protective layer contains a polyurethane resin.
5. The sealing film for electronic components according to claim 1 or 2, wherein:
the electronic component is a resin sheet containing sub-dots.
6. A film laminate characterized by:
the sealing film for electronic components according to any one of claims 1 to 5 is bonded to both surfaces of the resin sheet containing quantum dots via an adhesive layer.
7. The film laminate according to claim 6, characterized in that:
the adhesive layer is acrylic or silicone.
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