CN107107251B - 动力学上有限纳米级扩散结合结构和方法 - Google Patents

动力学上有限纳米级扩散结合结构和方法 Download PDF

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Publication number
CN107107251B
CN107107251B CN201580071155.7A CN201580071155A CN107107251B CN 107107251 B CN107107251 B CN 107107251B CN 201580071155 A CN201580071155 A CN 201580071155A CN 107107251 B CN107107251 B CN 107107251B
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China
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bonding
bond
diffusion
titanium
transparent non
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Chinese (zh)
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CN107107251A (zh
Inventor
M·S·桑德林
D·A·鲁本
R·M·卡兰
G·卢索斯
T·M·温
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Medtronic Inc
Invenios LLC
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Medtronic Inc
Invenios LLC
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/14—Titanium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0875—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation
    • B32B2310/0887—Treatment by energy or chemical effects by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/18—Titanium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Ceramic Products (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Lasers (AREA)
  • Plasma & Fusion (AREA)
  • Ceramic Engineering (AREA)
CN201580071155.7A 2014-12-24 2015-12-22 动力学上有限纳米级扩散结合结构和方法 Active CN107107251B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462096706P 2014-12-24 2014-12-24
US62/096,706 2014-12-24
US14/976,475 2015-12-21
US14/976,475 US10124559B2 (en) 2014-12-24 2015-12-21 Kinetically limited nano-scale diffusion bond structures and methods
PCT/US2015/067390 WO2016106323A1 (en) 2014-12-24 2015-12-22 Kinetically limited nano-scale diffusion bond structures and methods

Publications (2)

Publication Number Publication Date
CN107107251A CN107107251A (zh) 2017-08-29
CN107107251B true CN107107251B (zh) 2020-10-16

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US (3) US10124559B2 (enExample)
EP (1) EP3237141B1 (enExample)
JP (1) JP6761419B2 (enExample)
KR (1) KR102474915B1 (enExample)
CN (1) CN107107251B (enExample)
WO (1) WO2016106323A1 (enExample)

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US10124559B2 (en) 2014-12-24 2018-11-13 Medtronic, Inc. Kinetically limited nano-scale diffusion bond structures and methods
US9865533B2 (en) 2014-12-24 2018-01-09 Medtronic, Inc. Feedthrough assemblies
US20170100597A1 (en) 2015-10-12 2017-04-13 Medtronic, Inc. Sealed implantable medical device and method of forming same
US10772228B2 (en) 2015-11-03 2020-09-08 Medtronic, Inc. Sealed package including electronic device and power source
US10098589B2 (en) 2015-12-21 2018-10-16 Medtronic, Inc. Sealed package and method of forming same
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US10580544B2 (en) 2016-12-07 2020-03-03 Medtronic, Inc. Power source and method of forming same
US10542921B2 (en) 2017-04-03 2020-01-28 Medtronic, Inc. Hermetically-sealed package and method of forming same
US10463285B2 (en) 2017-04-03 2019-11-05 Medtronic, Inc. Hermetically-sealed package and method of forming same
US10918874B2 (en) 2018-06-28 2021-02-16 Medtronic, Inc. Sealed package and method of forming same
DE102018120011B4 (de) * 2018-08-16 2022-06-15 Trumpf Laser Und Systemtechnik Gmbh Schweißverfahren zum Verbinden eines transparenten, aluminiumoxidhaltigen ersten Substrats mit einem opaken zweiten Substrat
US10888009B2 (en) * 2018-10-26 2021-01-05 Medtronic, Inc. Method of forming a sealed package
US11865639B2 (en) 2019-12-13 2024-01-09 Medtronic, Inc. Hermetic assembly and device including same
US11633611B2 (en) 2019-12-19 2023-04-25 Medtronic, Inc. Feedthrough assembly and device including same
US20210186422A1 (en) * 2019-12-20 2021-06-24 Medtronic, Inc. Implantable medical device with metal and polymer housing
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US11725995B2 (en) 2021-02-01 2023-08-15 Medtronic, Inc. Pressure sensor assembly for use in implantable medical device including a substrate having via that extends through substrate along via axis between first major surface and second major surface of substrate
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Also Published As

Publication number Publication date
US20210197521A1 (en) 2021-07-01
US12454117B2 (en) 2025-10-28
EP3237141B1 (en) 2023-02-08
KR102474915B1 (ko) 2022-12-06
US10124559B2 (en) 2018-11-13
WO2016106323A1 (en) 2016-06-30
EP3237141A1 (en) 2017-11-01
JP6761419B2 (ja) 2020-09-23
US20190039347A1 (en) 2019-02-07
US20160185081A1 (en) 2016-06-30
US10981355B2 (en) 2021-04-20
JP2018502040A (ja) 2018-01-25
CN107107251A (zh) 2017-08-29
KR20170100598A (ko) 2017-09-04

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