CN107093549A - Bond the painting method and device in intermediate layer - Google Patents
Bond the painting method and device in intermediate layer Download PDFInfo
- Publication number
- CN107093549A CN107093549A CN201710318843.XA CN201710318843A CN107093549A CN 107093549 A CN107093549 A CN 107093549A CN 201710318843 A CN201710318843 A CN 201710318843A CN 107093549 A CN107093549 A CN 107093549A
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- Prior art keywords
- binding material
- reaction chamber
- substrate
- intermediate layer
- atomization
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a kind of painting method and device in cohesive intermediate layer, belong to field of manufacturing semiconductor devices.Methods described includes：Binding material is atomized；The binding material after atomization is imported to the reaction chamber for being provided with substrate, to form cohesive intermediate layer in the substrate surface.The present invention is effectively improved the efficiency of the painting method in adhesion intermediate layer.The present invention, which is used to coat on substrate, bonds intermediate layer.
Description
Technical field
The present invention relates to field of manufacturing semiconductor devices, the more particularly to a kind of painting method and device in cohesive intermediate layer.
Background technology
Photoresist is the key function material of progress photoetching process in semiconductor devices process industry.Photoresist is through ultraviolet light
After irradiation, occurs series of chemical so that rate of dissolution of the photoresist in developer solution produces change before and after exposure, then passes through
Crossing the processes such as development, post bake, etching and striping just can be by specific high-precision pattern transfer to semiconductor devices to be processed
Substrate surface.But the photoresist overwhelming majority is hydrophobic, and substrate majority is hydrophilic, if directly coated in substrate surface
If photoresist, the adhesion between photoresist and substrate can be caused poor.In order to solve the problem, coating photoresist it
Before, one layer of cohesive intermediate layer first generally is coated in substrate surface, then photoresist is coated on intermediate layer is bonded, to increase photoetching
Adhesion between glue and substrate, generally, it is the silicon ammonium of hexamethyl two (English to bond the binding material in intermediate layer：
Hexamethyldisilazane；Abbreviation：HMDS).
In correlation technique, coating HMDS method is：The HMDS of liquid is pressurizeed by pressure apparatus, makes HMDS state
It is changed into gaseous state, then, gaseous HMDS is mixed with nitrogen so that gaseous HMDS enters vacuum chamber under the carrying of nitrogen
Room, the gaseous state HMDS into vacuum chamber can chemically react with substrate surface, then realize substrate surface HMDS painting
Cover.
But, the amount for the gaseous state HMDS that the nitrogen of unit volume can be carried is seldom in correlation technique so that the set time
The density for being inside coated in the HMDS of substrate surface is smaller, causes the contact angle of substrate surface smaller, and then cause substrate and photoetching
Adhesion between glue is smaller, therefore, and the painting method in existing adhesion intermediate layer is less efficient.
The content of the invention
In order to the painting method for solving existing adhesion intermediate layer it is less efficient the problem of, the embodiments of the invention provide one
Plant the painting method and device for bonding intermediate layer.The technical scheme is as follows：
First aspect includes there is provided a kind of painting method in cohesive intermediate layer, methods described：
Binding material is atomized；
The binding material after atomization is imported to the reaction chamber for being provided with substrate, to form viscous in the substrate surface
Tie intermediate layer.
Alternatively, it is described to be atomized binding material, including：
The binding material is pressurizeed, so that the binding material is atomized.
Alternatively, it is described before the binding material by after atomization imports and is provided with the reaction chamber of substrate
Method also includes：
Extract the gas in the reaction chamber out.
Alternatively, import and be provided with after the reaction chamber of substrate in the binding material by after atomization, it is described
Method also includes：
The reaction chamber is internally heated so that the reaction chamber internal temperature reaches target temperature.
Alternatively, the target temperature is 100 degrees Celsius to 130 degrees Celsius.
Alternatively, the binding material is the silicon ammonium of hexamethyl two.
Second aspect includes there is provided a kind of coating unit in cohesive intermediate layer, described device：
Atomizing component and importing component, the export mouth of the atomizing component are connected with the introducing port of the importing component, institute
The introducing port for stating reaction chamber of the export mouth for importing component with being provided with substrate is connected；
The atomizing component, for binding material to be atomized；
The importing component, for the binding material after atomization to be imported into the reaction chamber, with the substrate
Surface forms cohesive intermediate layer.
Alternatively, the atomizing component, specifically for：
The binding material is pressurizeed, so that the binding material is atomized.
Alternatively, described device also includes：
Vacuum elements, for extracting the gas in the reaction chamber, the bleeding point of the vacuum elements and the reaction out
The export mouth connection of chamber.
Alternatively, described device also includes：
Temperature rising module, for being internally heated to the reaction chamber so that the reaction chamber internal temperature reaches
Target temperature.
The beneficial effect that technical scheme provided in an embodiment of the present invention is brought is：
The painting method and device in cohesive intermediate layer provided in an embodiment of the present invention, by the way that binding material is atomized, and will
Binding material after atomization imports the reaction chamber for being provided with substrate, adds the bonding for being passed through reaction chamber in the set time
The amount of material, correspondingly increases the density for the binding material that substrate surface is coated in the set time, increases substrate surface
Contact angle, and then increase the adhesion between substrate and photoresist, be effectively improved the painting method in adhesion intermediate layer
Efficiency.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, makes required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is a kind of flow chart of the painting method in cohesive intermediate layer provided in an embodiment of the present invention；
Fig. 2 is the flow chart of the painting method in another cohesive intermediate layer provided in an embodiment of the present invention；
Fig. 3 is a kind of structural representation of the coating unit in cohesive intermediate layer provided in an embodiment of the present invention.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to embodiment party of the present invention
Formula is described in further detail.
The embodiments of the invention provide a kind of painting method in cohesive intermediate layer, as shown in figure 1, the painting in the bonding intermediate layer
Coating method can include：
Step 101, binding material is atomized.
Step 102, the binding material after atomization is imported it is provided with the reaction chamber of substrate, to form viscous in substrate surface
Tie intermediate layer.
In summary, the painting method in cohesive intermediate layer provided in an embodiment of the present invention, by the way that binding material is atomized, and
Binding material after atomization is imported to the reaction chamber for being provided with substrate, adds in the set time and is passed through the viscous of reaction chamber
The amount of material is tied, the density for the binding material that substrate surface is coated in the set time is correspondingly increased, increases substrate table
The contact angle in face, and then the adhesion between substrate and photoresist is increased, it is effectively improved the coating side in adhesion intermediate layer
The efficiency of method.
Fig. 2 is the painting method in another cohesive intermediate layer provided in an embodiment of the present invention, as shown in Fig. 2 in the bonding
The painting method of interbed can include：
Step 201, binding material is atomized.
Alternatively, binding material can be HMDS, or, the binding material can also be to be coated on substrate to increase
The other materials of adhesion between photoresist and substrate, the embodiment of the present invention is not specifically limited to it.
When binding material is atomized, the atomization sides such as pressure atomization, rotary disk atomisation, gas atomization or sound wave atomization can be used
Method, the embodiment of the present invention is not also limited it., can be using atomizing component to binding material when using pressure atomization method
Pressurization, so that binding material is atomized, it is atomized for example, HMDS can be pressurized into 2-20 MPas.
Gas in step 202, extraction chamber.
It is alternatively possible to use chamber vent (English：Exhaust；Abbreviation：EXH) the gas in component extraction chamber
Body, or, the gas in vavuum pump extraction chamber can also be used, or, the group that other can also be used to be evacuated
Part extracts the gas in chamber out, as long as the gas in chamber can be extracted out, the pressure inside reaction chamber is less than outside pressure
It is strong.
It should be noted that the gas of extraction chamber, makes the pressure inside reaction chamber be less than outside pressure, energy
Enough make the binding material of atomization faster and be more easily introduced into reaction chamber, to shorten the time of whole coating procedure, and then
Improve coating efficiency.Also, when using the gas in chamber vent device extraction chamber, reduced relative to prior art
Use of the vavuum pump in coating procedure, can reduce coating cost to a certain extent.
In practical application, the binding material that the action of the gas in extraction chamber can be after by atomization, which is imported, to be set
Start to perform before the reaction chamber for having substrate, can also start to perform during the binding material after importing atomization, also
It can start to perform the action before atomizing material is imported, and be started again at during the binding material after importing atomization
Perform the action.Also, the execution of the action can be constantly to perform in whole importing process, can also be in importing process
Perform to middle non-continuous, as long as ensureing that the pressure inside reaction chamber is less than outside pressure.
Step 203, the binding material after atomization is imported it is provided with the reaction chamber of substrate, to form viscous in substrate surface
Tie intermediate layer.
Alternatively, bonding intermediate layer can solidify and the material layer of layered for the binding material of atomization in substrate surface,
Or, bonding intermediate layer can also react the material layer to be formed for binding material and the substrate of substrate surface, the formation
Bonding intermediate layer has larger contact angle, and the larger contact angle is the increase for showing as substrate surface adhesion.
Illustratively, it is assumed that binding material is HMDS, substrate is glass substrate, and the main component of glass is silica, base
The HMDS of plate surface can occur chemical reaction and produce silicon oxygen bond after being contacted with silica, silicon oxygen bond determines cohesive intermediate layer
Viscoelastic behavior, the viscoelastic behavior is to show as the larger contact angle of substrate surface, and bonding is formed with when photoresist is coated in
During the substrate surface in intermediate layer, the increase of the substrate surface contact angle shows as the increasing of adhesion between substrate and photoresist
Greatly.
Step 204, reaction chamber is internally heated so that reaction chamber internal temperature reaches target temperature.
Wherein, target temperature can be 100 degrees Celsius to 130 degrees Celsius.
It is alternatively possible to be heated using temperature rising module to reflection chamber interior, by the temperature liter inside reaction chamber
Height, can accelerate the reaction speed between substrate and binding material or the setting rate of binding material, to shorten the reaction time
Or setting time, and then shorten the time of whole coating procedure, improve coating efficiency.
It should be noted that provided in an embodiment of the present invention performed after atomizing material is imported is carried out to reaction chamber inside
The action of heating is a kind of schematical example, not to limit, and in practical application, reaction chamber is internally heated
Action and atomizing material importing action priority can be adjusted according to actual conditions, that is to say, mist can be first carried out
The importing action for changing material performs the action being internally heated to reaction chamber again, can also first carry out to reaction chamber inside
The action heated performs the importing action of atomizing material again, can also start execution pair in the importing process of atomizing material
Action that reaction chamber is internally heated etc., as long as ensureing that reaction chamber internal temperature reaches target temperature, and ties up temperature
Hold certain duration.
In summary, the painting method in cohesive intermediate layer provided in an embodiment of the present invention, by the way that binding material is atomized, and
Binding material after atomization is imported to the reaction chamber for being provided with substrate, the bonding that reaction chamber is passed through in the set time is added
The amount of material, correspondingly increases the density for the binding material that substrate surface is coated in the set time, increases substrate surface
Contact angle, and then increase the adhesion between substrate and photoresist, be effectively improved the painting method in adhesion intermediate layer
Efficiency.
It should be noted that the sequencing of the painting method step in cohesive intermediate layer provided in an embodiment of the present invention can be with
Suitably adjusted, step according to circumstances can also accordingly be increased and decreased.Any one skilled in the art is at this
Invent in the technical scope disclosed, the method that can readily occur in change should be all included within the scope of the present invention, therefore
Repeat no more.
The embodiments of the invention provide a kind of coating unit in cohesive intermediate layer, as shown in figure 3, the painting in the bonding intermediate layer
Coating device can include：
Atomizing component 301 and importing component 302, the export mouth of atomizing component 301 connect with importing the introducing port of component 302
Connect, the introducing port for importing reaction chamber 303 of the export mouth of component 302 with being provided with substrate 4 is connected.
The atomizing component 301 can be used for binding material being atomized.
The importing component 302 can be used for the binding material after atomization importing reaction chamber 303, with the surface of substrate 4
Formed and bond intermediate layer.
Wherein, binding material can be the silicon ammonium of hexamethyl two.
In summary, the coating unit in cohesive intermediate layer provided in an embodiment of the present invention, material will be bonded by atomizing component
Material atomization, imports component and the binding material after atomization is imported to the reaction chamber for being provided with substrate, add in the set time and lead to
Enter the amount of the binding material of reaction chamber, correspondingly increase the close of binding material that substrate surface is coated in the set time
Degree, increases the contact angle of substrate surface, and then increases the adhesion between substrate and photoresist, is effectively improved adhesion
The efficiency of the painting method in intermediate layer.
Alternatively, atomizing component 301, specifically can be used for：Binding material is pressurizeed, so that binding material is atomized.
Alternatively, bonding the coating unit in intermediate layer can also include：
Vacuum elements 304, for the gas in extraction chamber 303, the bleeding point and reaction chamber of vacuum elements 304
303 export mouth connection.
Fig. 3 is refer to, when being evacuated using vacuum elements 304 to reaction chamber 303, the pumping of vacuum elements 304
Mouth can be located at the upper and lower ends of reaction chamber 303 respectively with importing the introducing port of component 302, and substrate 4 is arranged at reaction chamber
303 middle part, also, the plate face of substrate 303 is parallel with the placed side of the cavity of reaction chamber 303, as shown in figure 3, the reaction chamber
The placed side of the cavity of room 303 can be horizontal plane, and binding material is imported after reaction chamber, and the binding material of atomization can be in weight
On the surface that substrate 4 is sprayed onto in the presence of power.
It is possible to further which according to the export mouth of component 302 is imported to the distance of substrate, the export of component 302 will be imported
Mouth is arranged to default shape, the binding material of the atomization sprayed from export mouth is all sprayed onto the surface of substrate, to improve
The utilization rate of binding material, also, when the binding material of atomization that export mouth sprays is sprayed onto the surface of substrate more, not by
Being sprayed onto the binding material of substrate surface, to be evacuated the probability that component takes away just smaller, it becomes possible to correspondingly reduce and vacuum elements are taken out
The intractability of the material gone out, correspondingly reduction coats cost.
Also, support 5 can also be included inside reaction chamber 303, the support 5 has horizontal support face, can be at this
Substrate 4 is placed on horizontal support face.In practical application, set location, size and the shape of support 5 can be according to actual feelings
Condition is configured, as long as the setting without prejudice to of the support imports the work of component and vacuum elements, the embodiment of the present invention pair
It is not specifically limited.For example：As shown in figure 3, the support 5 can be arranged on the middle part of reaction chamber.
Alternatively, bonding the coating unit in intermediate layer can also include：
Temperature rising module 305, for being internally heated to reaction chamber 303 so that the internal temperature of reaction chamber 303 reaches
Target temperature.Alternatively, the target temperature can be 100 degrees Celsius to 130 degrees Celsius.
It should be noted that in the coating unit for bonding intermediate layer, above-mentioned importing component, vacuum elements and temperature rising module
Relative position on reaction chamber can also be configured according to actual conditions, and the embodiment of the present invention does not do specific limit to it
It is fixed.
In summary, the coating unit in cohesive intermediate layer provided in an embodiment of the present invention, material will be bonded by atomizing component
Material atomization, imports component and the binding material after atomization is imported to the reaction chamber for being provided with substrate, add in the set time
The amount of the binding material of reaction chamber is passed through, the close of binding material that substrate surface is coated in the set time is correspondingly increased
Degree, increases the contact angle of substrate surface, and then increases the adhesion between substrate and photoresist, is effectively improved adhesion
The efficiency of the painting method in intermediate layer.
It is apparent to those skilled in the art that, for convenience and simplicity of description, the device of foregoing description
With the specific work process of component, the corresponding process in preceding method embodiment is may be referred to, be will not be repeated here.
One of ordinary skill in the art will appreciate that realizing that all or part of step of above-described embodiment can be by hardware
To complete, the hardware of correlation can also be instructed to complete by program, described program can be stored in a kind of computer-readable
In storage medium, storage medium mentioned above can be read-only storage, disk or CD etc..
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (10)
1. a kind of painting method in cohesive intermediate layer, it is characterised in that methods described includes：
Binding material is atomized；
The binding material after atomization is imported to the reaction chamber for being provided with substrate, in being formed and bonded in the substrate surface
Interbed.
2. according to the method described in claim 1, it is characterised in that described to be atomized binding material, including：
The binding material is pressurizeed, so that the binding material is atomized.
3. method according to claim 2, it is characterised in that import and set in the binding material by after atomization
Have before the reaction chamber of substrate, methods described also includes：
Extract the gas in the reaction chamber out.
4. method according to claim 3, it is characterised in that import and set in the binding material by after atomization
Have after the reaction chamber of substrate, methods described also includes：
The reaction chamber is internally heated so that the reaction chamber internal temperature reaches target temperature.
5. method according to claim 4, it is characterised in that the target temperature is 100 degrees Celsius to 130 degrees Celsius.
6. according to any described method of claim 1 to 5, it is characterised in that the binding material is the silicon ammonium of hexamethyl two.
7. a kind of coating unit in cohesive intermediate layer, it is characterised in that described device includes：
Atomizing component and importing component, the export mouth of the atomizing component are connected with the introducing port of the importing component, described to lead
The export mouth for entering component is connected with the introducing port for the reaction chamber for being provided with substrate；
The atomizing component, for binding material to be atomized；
The importing component, for the binding material after atomization to be imported into the reaction chamber, with the substrate surface
Formed and bond intermediate layer.
8. device according to claim 7, it is characterised in that the atomizing component, specifically for：
The binding material is pressurizeed, so that the binding material is atomized.
9. device according to claim 8, it is characterised in that described device also includes：
Vacuum elements, for extracting the gas in the reaction chamber, the bleeding point of the vacuum elements and the reaction chamber out
Export mouth connection.
10. device according to claim 9, it is characterised in that described device also includes：
Temperature rising module, for being internally heated to the reaction chamber so that the reaction chamber internal temperature reaches target
Temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710318843.XA CN107093549A (en) | 2017-05-08 | 2017-05-08 | Bond the painting method and device in intermediate layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710318843.XA CN107093549A (en) | 2017-05-08 | 2017-05-08 | Bond the painting method and device in intermediate layer |
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| Publication Number | Publication Date |
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| CN107093549A true CN107093549A (en) | 2017-08-25 |
Family
ID=59637970
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710318843.XA Pending CN107093549A (en) | 2017-05-08 | 2017-05-08 | Bond the painting method and device in intermediate layer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109962026A (en) * | 2017-12-26 | 2019-07-02 | 无锡华润上华科技有限公司 | A kind of preprocess method and photolithography method of wafer |
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| KR100824631B1 (en) * | 2006-08-28 | 2008-04-24 | 동부일렉트로닉스 주식회사 | Apparatus for Processing HMDS and Method Therefor |
| CN102540721A (en) * | 2010-12-23 | 2012-07-04 | 比亚迪股份有限公司 | Photoresist composition and method for preparing fluorescent layer on surface of light emitting diode (LED) |
| TW201300556A (en) * | 2011-06-21 | 2013-01-01 | Creating Nano Technologies Inc | Method for evaporating film |
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2017
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05102022A (en) * | 1991-10-08 | 1993-04-23 | Tokyo Electron Ltd | Treatment apparatus |
| JP2007019340A (en) * | 2005-07-08 | 2007-01-25 | Tokyo Electron Ltd | Substrate processor |
| KR100824631B1 (en) * | 2006-08-28 | 2008-04-24 | 동부일렉트로닉스 주식회사 | Apparatus for Processing HMDS and Method Therefor |
| CN102540721A (en) * | 2010-12-23 | 2012-07-04 | 比亚迪股份有限公司 | Photoresist composition and method for preparing fluorescent layer on surface of light emitting diode (LED) |
| TW201300556A (en) * | 2011-06-21 | 2013-01-01 | Creating Nano Technologies Inc | Method for evaporating film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109962026A (en) * | 2017-12-26 | 2019-07-02 | 无锡华润上华科技有限公司 | A kind of preprocess method and photolithography method of wafer |
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Application publication date: 20170825 |