CN107072137B - Annular electronic element clamping device applied to SMT chip mounter - Google Patents
Annular electronic element clamping device applied to SMT chip mounter Download PDFInfo
- Publication number
- CN107072137B CN107072137B CN201710146757.5A CN201710146757A CN107072137B CN 107072137 B CN107072137 B CN 107072137B CN 201710146757 A CN201710146757 A CN 201710146757A CN 107072137 B CN107072137 B CN 107072137B
- Authority
- CN
- China
- Prior art keywords
- chip mounter
- clamping device
- braid
- annular electronic
- main part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 210000000078 claw Anatomy 0.000 claims abstract description 15
- 230000000694 effects Effects 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 claims abstract description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- -1 polypropylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 238000005192 partition Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides an annular electronic element clamping device applied to an SMT chip mounter, and belongs to the technical field of surface mounting. The method solves the problem that the production efficiency is seriously affected because annular electronic elements in the prior SMT (surface mount technology) are mainly welded on a PCB (printed circuit board) manually in a manual mode. This clamping device, including the braid with inhale the claw, even a plurality of holding grooves of having seted up on the braid, the bottom undercut of holding groove forms columniform constant head tank, the central upward arch of constant head tank forms the cross-section and is the reference column of ring type, holding groove, constant head tank and reference column structure as an organic whole, inhale the claw including the baffle and set up in the installation head of baffle top, the below of baffle is provided with main part, the below both sides of main part have two clamping jaws through the activity of round pin symmetry riveting, still be equipped with the miniature spring structure that can make two clamping jaws open in the main part. The invention has the advantages of effectively improving the production efficiency and reducing the error rate of manual welding.
Description
Technical Field
The invention belongs to the technical field of surface mounting, relates to an SMT suction nozzle and a braid, and in particular relates to an annular electronic component clamping device applied to an SMT chip mounter.
Background
SMT is known as surface mount technology and is currently one of the most popular techniques and technologies in the electronics assembly industry. The circuit mounting technology is to mount no-pin or short-lead surface assembly components on the surface of a printed circuit board or the surface of other base plates, and to carry out welding assembly by reflow soldering or dip soldering and other methods.
In the conventional SMT chip mounting technology, the electronic components are light in weight, small in volume and mainly have a flat planar structure on the upper surface, and are sucked up and placed on the PCB board by the suction nozzle in a vacuum air pressure mode. However, because the center of the annular electronic component is in a cavity structure, the traditional suction nozzle cannot suck the annular electronic component, and the annular electronic component is mainly welded on the PCB manually in a manual mode at present, so that the production efficiency is seriously affected.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides an annular electronic element clamping device applied to an SMT chip mounter.
The aim of the invention can be achieved by the following technical scheme: be applied to annular electronic component clamping device of SMT chip mounter, include the braid and inhale the claw, its characterized in that, the braid on even offer a plurality of holding tanks, the bottom undercut of holding tank forms columniform constant head tank, the center of constant head tank upwards protrudes the reference column that forms the cross-section and be the ring type, holding tank, constant head tank and reference column structure as an organic whole, inhale the claw include the baffle and set up the installation head in the baffle top, the below of baffle is provided with main part, the below both sides of main part have two clamping claws through round pin symmetry activity riveting, main part in still be equipped with the miniature spring structure that can make two clamping claws open.
The annular electronic element clamping device applied to the SMT chip mounter has the technical effects that: the annular electronic element (called element below) to be mounted is packaged in a disc type through the braid, the element is arranged in the accommodating groove, the accommodating groove is wide at the upper part and narrow at the lower part, the clamping jaw is used for clamping the element, the clamping jaw is used for fixing the element to prevent the element from displacement in the taping feeding process, the positioning groove and the positioning column are further arranged in the accommodating groove, the positioning of the element in the chip mounter can be further accurate through the arrangement of the structure, the suction jaw is a structure applying aerodynamics and a miniature spring, the upper end of the suction jaw is connected with the conventional chip mounter, the lower end of the suction jaw is movably riveted with two clamping jaws through the main body part, during operation, the chip mounter head generates vacuum suction force to clamp the clamping jaw, so that the clamping jaw is clamped, after the clamping jaw moves to a fixed position on the PCB, the head returns to normal air pressure, the clamping jaw is loosened through the miniature spring structure in the main body part, and the chip mounting is completed.
In the annular electronic element clamping device applied to the SMT chip mounter, the section of the bottom of the clamping jaw is of an arc structure.
In the annular electronic element clamping device applied to the SMT chip mounter, the inner wall of the clamping jaw is of a coarse structure.
In the annular electronic element clamping device applied to the SMT chip mounter, ratchet holes matched with the feeder on the chip mounter are uniformly formed in one side of the braid.
In the annular electronic element clamping device applied to the SMT chip mounter, the braid is made of polypropylene.
Compared with the prior art, the annular electronic component clamping device applied to the SMT chip mounter is improved into the suction claw structure through the traditional suction nozzle, so that the chip mounter can mount the annular electronic component, and the clamping device can be used for realizing high-efficiency and high-accuracy processing, and compared with traditional manual welding, the production efficiency is improved by nearly 6 times, and the cost and the error rate are greatly reduced.
Drawings
Fig. 1 is a schematic structural view of a braid in the present clamping device.
Fig. 2 is a schematic structural view of the suction claw and a bottom projection view of the claw in the clamping device.
In the figure, 101, a receiving groove; 102. a positioning groove; 103. positioning columns; 104. a ratchet hole; 201. a partition plate; 202. a mounting head; 203. a main body portion; 204. a pin; 205. clamping jaw.
Detailed Description
The following are specific embodiments of the present invention and the technical solutions of the present invention will be further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1 and 2, the clamping device for the annular electronic component of the SMT chip mounter comprises a braid and suction claws, wherein a plurality of accommodating grooves 101 are uniformly formed in the braid, the bottoms of the accommodating grooves 101 are downwards recessed to form cylindrical positioning grooves 102, the centers of the positioning grooves 102 are upwards protruded to form positioning columns 103 with circular sections, the accommodating grooves 101, the positioning grooves 102 and the positioning columns 103 are of an integrated structure, the suction claws comprise a partition 201 and a mounting head 202 arranged above the partition 201, the lower side of the partition 201 is provided with a main body 203, two clamping claws 205 are symmetrically and movably riveted on two sides below the main body 203 through pins 204, and a miniature spring structure capable of enabling the two clamping claws 205 to be opened is further arranged in the main body 203.
Further, in order to make the clamping jaw 205 clamp the component more easily, the section of the bottom of the clamping jaw 205 is of an arc structure, the arc structure is matched with the annular electronic component according to the size of the annular electronic component, in order to prevent the component from falling off in the clamping process, the inner wall of the clamping jaw 205 is of a rough structure, one side of the braid is uniformly provided with ratchet holes 104 matched with the feeder on the chip mounter, the structure is a conventional structure on the SMT material belt, and the braid is made of polypropylene mainly for feeding.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Although terms such as the receiving groove 101, the positioning groove 102, the positioning post 103, the ratchet hole 104, the spacer 201, the mounting head 202, the body portion 203, the pin 204, the jaw 205, etc. are used more herein, the possibility of using other terms is not excluded. These terms are used merely for convenience in describing and explaining the nature of the invention; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present invention.
Claims (5)
1. Be applied to annular electronic component clamping device of SMT chip mounter, include the braid and inhale claw, its characterized in that, the braid on even offer a plurality of holding groove (101), the bottom undercut of holding groove (101) forms columniform constant head tank (102), the center of constant head tank (102) upwards protrudes and forms cross-section and be reference column (103) for ring type, holding groove (101), constant head tank (102) and reference column (103) structure as an organic whole, inhale claw include baffle (201) and set up in installation head (202) of baffle (201) top, the below of baffle (201) is provided with main part (203), the below both sides of main part (203) have two clamping jaw (205) through round pin (204) symmetry activity riveting, main part (203) in still be equipped with the miniature spring structure that can make two clamping jaw (205) open.
2. The annular electronic component clamping device applied to the SMT chip mounter according to claim 1, wherein the section of the bottom of the clamping jaw (205) is of an arc structure.
3. The annular electronic component clamping device applied to the SMT chip mounter according to claim 1 or 2, wherein the inner wall of the clamping jaw (205) is of a rough structure.
4. The clamping device for the annular electronic component applied to the SMT chip mounter according to claim 1, wherein ratchet holes (104) matched with the feeder on the chip mounter are uniformly formed in one side of the braid.
5. The clamping device for annular electronic components applied to an SMT chip mounter according to claim 1 or 4, wherein the braid is made of polypropylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710146757.5A CN107072137B (en) | 2017-03-13 | 2017-03-13 | Annular electronic element clamping device applied to SMT chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710146757.5A CN107072137B (en) | 2017-03-13 | 2017-03-13 | Annular electronic element clamping device applied to SMT chip mounter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107072137A CN107072137A (en) | 2017-08-18 |
| CN107072137B true CN107072137B (en) | 2023-10-31 |
Family
ID=59622132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710146757.5A Active CN107072137B (en) | 2017-03-13 | 2017-03-13 | Annular electronic element clamping device applied to SMT chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107072137B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195437A (en) * | 2018-11-12 | 2019-01-11 | 昆山东野电子有限公司 | The positioning carrier of three-dimensional shape electronic component |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5199564A (en) * | 1992-03-13 | 1993-04-06 | Minnesota Mining And Manufacturing Company | Carrier tape for electronic through-hole components |
| US5590029A (en) * | 1995-01-12 | 1996-12-31 | Dell Usa, L.P. | Circuit board SMT device mounting apparatus |
| CN2506566Y (en) * | 2001-10-25 | 2002-08-21 | 玮锋科技股份有限公司 | Package web for electronic component |
| JP2002362679A (en) * | 2001-06-11 | 2002-12-18 | Rohm Co Ltd | Semiconductor electronic component carrier |
| JP2005108959A (en) * | 2003-09-29 | 2005-04-21 | Hitachi High-Tech Instruments Co Ltd | Electronic component loading apparatus |
| JP2006114764A (en) * | 2004-10-15 | 2006-04-27 | Murata Mfg Co Ltd | Packaged electronic component and electronic component mounter |
| CN202728889U (en) * | 2012-07-24 | 2013-02-13 | 天水华天集成电路包装材料有限公司 | Carrier tape for integrated circuit element |
| CN204180396U (en) * | 2014-10-29 | 2015-02-25 | 滨中元川金属制品（昆山）有限公司 | For the accessory of element pasted on surface clot band |
| CN205363904U (en) * | 2015-12-30 | 2016-07-06 | 海信（广东）空调有限公司 | Electric clamping jaw |
| CN205667026U (en) * | 2016-04-21 | 2016-10-26 | 深圳市蒙瑞电子有限公司 | SMT heavily is good at nozzle |
| CN106304829A (en) * | 2016-10-26 | 2017-01-04 | 中国科学院长春光学精密机械与物理研究所 | A kind of scattered or short braid components and parts mount pallet automatically |
| CN206506832U (en) * | 2017-03-13 | 2017-09-19 | 浙江益中智能电气有限公司 | A kind of ring-type electronic component clamping device applied to SMT chip mounters |
-
2017
- 2017-03-13 CN CN201710146757.5A patent/CN107072137B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5199564A (en) * | 1992-03-13 | 1993-04-06 | Minnesota Mining And Manufacturing Company | Carrier tape for electronic through-hole components |
| US5590029A (en) * | 1995-01-12 | 1996-12-31 | Dell Usa, L.P. | Circuit board SMT device mounting apparatus |
| JP2002362679A (en) * | 2001-06-11 | 2002-12-18 | Rohm Co Ltd | Semiconductor electronic component carrier |
| CN2506566Y (en) * | 2001-10-25 | 2002-08-21 | 玮锋科技股份有限公司 | Package web for electronic component |
| JP2005108959A (en) * | 2003-09-29 | 2005-04-21 | Hitachi High-Tech Instruments Co Ltd | Electronic component loading apparatus |
| JP2006114764A (en) * | 2004-10-15 | 2006-04-27 | Murata Mfg Co Ltd | Packaged electronic component and electronic component mounter |
| CN202728889U (en) * | 2012-07-24 | 2013-02-13 | 天水华天集成电路包装材料有限公司 | Carrier tape for integrated circuit element |
| CN204180396U (en) * | 2014-10-29 | 2015-02-25 | 滨中元川金属制品（昆山）有限公司 | For the accessory of element pasted on surface clot band |
| CN205363904U (en) * | 2015-12-30 | 2016-07-06 | 海信（广东）空调有限公司 | Electric clamping jaw |
| CN205667026U (en) * | 2016-04-21 | 2016-10-26 | 深圳市蒙瑞电子有限公司 | SMT heavily is good at nozzle |
| CN106304829A (en) * | 2016-10-26 | 2017-01-04 | 中国科学院长春光学精密机械与物理研究所 | A kind of scattered or short braid components and parts mount pallet automatically |
| CN206506832U (en) * | 2017-03-13 | 2017-09-19 | 浙江益中智能电气有限公司 | A kind of ring-type electronic component clamping device applied to SMT chip mounters |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107072137A (en) | 2017-08-18 |
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