CN107072137A - A kind of ring-type electronic component clamping device applied to SMT chip mounters - Google Patents
A kind of ring-type electronic component clamping device applied to SMT chip mounters Download PDFInfo
- Publication number
- CN107072137A CN107072137A CN201710146757.5A CN201710146757A CN107072137A CN 107072137 A CN107072137 A CN 107072137A CN 201710146757 A CN201710146757 A CN 201710146757A CN 107072137 A CN107072137 A CN 107072137A
- Authority
- CN
- China
- Prior art keywords
- ring
- electronic component
- clamping device
- type electronic
- braid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003860 storage Methods 0.000 claims abstract description 17
- 230000000694 effects Effects 0.000 claims abstract description 5
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 3
- -1 polypropylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
Abstract
The invention provides a kind of ring-type electronic component clamping device applied to SMT chip mounters, belong to surface mounting technology field.It solve the electronic component of ring-type in existing SMT mount technologies mainly by artificial mode with manual welding on pcb board, therefore the problem of had a strong impact on production efficiency.This clamping device, including braid with inhaling pawl, some storage tanks are uniformly offered in braid, the bottom of storage tank is recessed to form the locating slot of cylinder downwards, the center of locating slot raise up Formation cross-section be circular ring type locating dowel, storage tank, locating slot and locating dowel are integral type structure, inhaling pawl includes dividing plate and the mounting head being arranged above dividing plate, main part is provided with below dividing plate, the lower section both sides of main part have by the symmetrical activity riveting of pin is additionally provided with the microsprings structure that can open two clamping jaws in two clamping jaws, main part.The present invention has the advantages that production efficiency and reduction human weld's error rate can be effectively improved.
Description
Technical field
The invention belongs to surface mounting technology field, it is related to a kind of SMT suction nozzles and braid, more particularly to one kind is applied to
The ring-type electronic component clamping device of SMT chip mounters.
Background technology
SMT is referred to as surface mounting technology, is most popular a kind of technology and technique in current electronic assembly industry.It is one
Planting will be arranged on the surface of the surface of printed circuit board or other substrates without pin or short leg surface-assembled component, pass through
The method such as Reflow Soldering or immersed solder is subject to the circuit load technology of welding assembly.
All it is lightweight small volume in conventional SMT mount technologies, the characteristics of its electronic component and mainly upper surface is
Smooth planar structure, then picked up and be positioned on pcb board by way of suction nozzle is with vacuum pressure.But it is due to ring-type electricity
Its center of subcomponent is cavity structure, and traditional suction nozzle can not be by its adhesive, and the electronic component of current ring-type is mainly by artificial
Mode with manual welding on pcb board, therefore had a strong impact on production efficiency.
The content of the invention
The purpose of the present invention is applied to SMT chip mounters for the above-mentioned problems in the prior art there is provided one kind
Ring-type electronic component clamping device.
The purpose of the present invention can be realized by following technical proposal：A kind of ring-type electronics member applied to SMT chip mounters
Part clamping device, including braid is with inhaling pawl, it is characterised in that some storage tanks are uniformly offered in described braid, it is described
The bottom of storage tank is recessed to form the locating slot of cylinder downwards, and the center of the locating slot raises up Formation cross-section for annulus
The locating dowel of type, described storage tank, locating slot and locating dowel is integral type structure, and described suction pawl includes dividing plate and is arranged at
Main part is provided with below mounting head above dividing plate, the dividing plate, the lower section both sides of the main part are symmetrically lived by pin
Dynamic riveting has the microsprings structure for being additionally provided with two clamping jaws, described main part and can opening two clamping jaws.
The ring-type electronic component clamping device of SMT chip mounters its technique effect, which should be used for, is：By braid to need into
The ring-type electronic component of row attachment（Call element in the following text）Disc type encapsulation is carried out, element is placed in storage tank, the structure of storage tank is upper
Narrow under width, upper width is to pick up element in order to which clamping jaw can extend into, under it is narrow be in order to which retaining element prevents it from being fed in braid
It is subjected to displacement in journey, locating slot and locating dowel is additionally provided with storage tank, the setting of the structure can further makes element in patch
Positioning in piece machine is more accurate, inhales the structure that pawl is a kind of applied aerodynamics and microsprings, and upper end is conventional peace
Dress head is attached with existing chip mounter, and there are two clamping jaws, operationally, chip mounter head in lower end by main part activity riveting
Pull of vacuum is produced, clamps clamping jaw, so that clamping element, is moved again to behind the fixed position on pcb board, head is returned to just
Normal atmospheric pressure, clamping jaw is unclamped by the microsprings structure in main part, and element completes paster and installed.
In a kind of above-mentioned ring-type electronic component clamping device applied to SMT chip mounters, section of the clamping jaw bottom
Face is arc structure.
In a kind of above-mentioned ring-type electronic component clamping device applied to SMT chip mounters, the inwall of the clamping jaw is
Coarse structure.
In a kind of above-mentioned ring-type electronic component clamping device applied to SMT chip mounters, the side of the braid is equal
Even offers the ratchet hole being engaged with chip mounter top feeder.
In a kind of above-mentioned ring-type electronic component clamping device applied to SMT chip mounters, the material of the braid is
Polypropylene.
Compared with prior art, the ring-type electronic component clamping devices of SMT chip mounters should be used for by by traditional suction
Mouth is improved into suction pawl structure, can make Placement circulating electron element, efficient using can be achieved after the clamping device
Change, the processing of high accuracy, its production efficiency improves nearly 6 times compared with traditional human weld, greatly reduces cost and goes out
Error rate.
Brief description of the drawings
Fig. 1 is the structural representation of braid in this clamping device.
Fig. 2 is the structural representation of suction pawl in this clamping device and the proj ected bottom view of clamping jaw.
In figure, 101, storage tank；102nd, locating slot；103rd, locating dowel；104th, ratchet hole；201st, dividing plate；202nd, mounting head；
203rd, main part；204th, sell；205th, clamping jaw.
Embodiment
The following is specific embodiment of the invention and with reference to accompanying drawing, technical scheme is further described,
But the present invention is not limited to these embodiments.
As shown in Figure 1 and Figure 2, the ring-type electronic component clamping device of SMT chip mounters, including braid should be used for inhaling pawl,
Some storage tanks 101 are uniformly offered in braid, the bottom of storage tank 101 is recessed to form the locating slot 102 of cylinder downwards,
The center of locating slot 102 raise up Formation cross-section be circular ring type locating dowel 103, storage tank 101, locating slot 102 with positioning
Post 103 is integral type structure, inhales the mounting head 202 that pawl includes dividing plate 201 and is arranged at the top of dividing plate 201, the lower section of dividing plate 201
Main part 203 is provided with, there are two clamping jaws 205, main part in the lower section both sides of main part 203 by the symmetrical activity riveting of pin 204
The microsprings structure that can open two clamping jaws 205 is additionally provided with 203.
Further describe in detail, in order that clamping jaw 205 is easier to pick up element, the section of the bottom of clamping jaw 205 is arc structure, and
The arc structure is engaged according to the size of ring-type electronic component, in order to prevent element from being come off during gripping, clamping jaw 205
Inwall is coarse structure, and the side of braid uniformly offers the ratchet hole 104 being engaged with chip mounter top feeder, the structure
For the conventional structure on SMT material strips, mainly for charging is acted on, the material of braid is polypropylene.
Specific embodiment described herein is only to spirit explanation for example of the invention.Technology neck belonging to of the invention
The technical staff in domain can be made various modifications or supplement to described specific embodiment or be replaced using similar mode
Generation, but without departing from the spiritual of the present invention or surmount scope defined in appended claims.
Although more used herein storage tank 101, locating slot 102, locating dowel 103, ratchet hole 104, dividing plate 201,
The terms such as mounting head 202, main part 203, pin 204, clamping jaw 205, but it is not precluded from the possibility using other terms.Use this
A little terms are used for the purpose of more easily describing and explaining the essence of the present invention；It is construed as any additional limitation
All disagreed with spirit of the present invention.
Claims (5)
1. a kind of ring-type electronic component clamping device applied to SMT chip mounters, including braid is with inhaling pawl, it is characterised in that institute
Some storage tanks are uniformly offered in the braid stated（101）, the storage tank（101）Bottom be recessed to form cylinder downwards
Locating slot（102）, the locating slot（102）Center raise up Formation cross-section be circular ring type locating dowel（103）, it is described
Storage tank（101）, locating slot（102）With locating dowel（103）For integral type structure, described suction pawl includes dividing plate（201）With
It is arranged at dividing plate（201）The mounting head of top（202）, the dividing plate（201）Lower section be provided with main part（203）, the master
Body portion（203）Lower section both sides pass through pin（204）Symmetrical activity riveting has two clamping jaws（205）, described main part（203）It is interior
Two clamping jaws can be made by being additionally provided with（205）The microsprings structure opened.
2. a kind of ring-type electronic component clamping device applied to SMT chip mounters according to claim 1, its feature exists
In the clamping jaw（205）The section of bottom is arc structure.
3. a kind of ring-type electronic component clamping device applied to SMT chip mounters according to claim 1 or 2, its feature
It is, the clamping jaw（205）Inwall be coarse structure.
4. a kind of ring-type electronic component clamping device applied to SMT chip mounters according to claim 1, its feature exists
In the side of the braid uniformly offers the ratchet hole being engaged with chip mounter top feeder（104）.
5. a kind of ring-type electronic component clamping device applied to SMT chip mounters according to claim 1 or 4, its feature
It is, the material of the braid is polypropylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710146757.5A CN107072137B (en) | 2017-03-13 | 2017-03-13 | Annular electronic element clamping device applied to SMT chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710146757.5A CN107072137B (en) | 2017-03-13 | 2017-03-13 | Annular electronic element clamping device applied to SMT chip mounter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107072137A true CN107072137A (en) | 2017-08-18 |
| CN107072137B CN107072137B (en) | 2023-10-31 |
Family
ID=59622132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710146757.5A Active CN107072137B (en) | 2017-03-13 | 2017-03-13 | Annular electronic element clamping device applied to SMT chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107072137B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195437A (en) * | 2018-11-12 | 2019-01-11 | 昆山东野电子有限公司 | The positioning carrier of three-dimensional shape electronic component |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5199564A (en) * | 1992-03-13 | 1993-04-06 | Minnesota Mining And Manufacturing Company | Carrier tape for electronic through-hole components |
| US5590029A (en) * | 1995-01-12 | 1996-12-31 | Dell Usa, L.P. | Circuit board SMT device mounting apparatus |
| CN2506566Y (en) * | 2001-10-25 | 2002-08-21 | 玮锋科技股份有限公司 | Package web for electronic component |
| JP2002362679A (en) * | 2001-06-11 | 2002-12-18 | Rohm Co Ltd | Semiconductor electronic component carrier |
| JP2005108959A (en) * | 2003-09-29 | 2005-04-21 | Hitachi High-Tech Instruments Co Ltd | Electronic component loading apparatus |
| JP2006114764A (en) * | 2004-10-15 | 2006-04-27 | Murata Mfg Co Ltd | Packaged electronic component and electronic component mounter |
| CN202728889U (en) * | 2012-07-24 | 2013-02-13 | 天水华天集成电路包装材料有限公司 | Carrier tape for integrated circuit element |
| CN204180396U (en) * | 2014-10-29 | 2015-02-25 | 滨中元川金属制品（昆山）有限公司 | For the accessory of element pasted on surface clot band |
| CN205363904U (en) * | 2015-12-30 | 2016-07-06 | 海信（广东）空调有限公司 | Electronic clamping jaw |
| CN205667026U (en) * | 2016-04-21 | 2016-10-26 | 深圳市蒙瑞电子有限公司 | SMT heavily is good at nozzle |
| CN106304829A (en) * | 2016-10-26 | 2017-01-04 | 中国科学院长春光学精密机械与物理研究所 | A kind of scattered or short braid components and parts mount pallet automatically |
| CN206506832U (en) * | 2017-03-13 | 2017-09-19 | 浙江益中智能电气有限公司 | A kind of ring-type electronic component clamping device applied to SMT chip mounters |
-
2017
- 2017-03-13 CN CN201710146757.5A patent/CN107072137B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5199564A (en) * | 1992-03-13 | 1993-04-06 | Minnesota Mining And Manufacturing Company | Carrier tape for electronic through-hole components |
| US5590029A (en) * | 1995-01-12 | 1996-12-31 | Dell Usa, L.P. | Circuit board SMT device mounting apparatus |
| JP2002362679A (en) * | 2001-06-11 | 2002-12-18 | Rohm Co Ltd | Semiconductor electronic component carrier |
| CN2506566Y (en) * | 2001-10-25 | 2002-08-21 | 玮锋科技股份有限公司 | Package web for electronic component |
| JP2005108959A (en) * | 2003-09-29 | 2005-04-21 | Hitachi High-Tech Instruments Co Ltd | Electronic component loading apparatus |
| JP2006114764A (en) * | 2004-10-15 | 2006-04-27 | Murata Mfg Co Ltd | Packaged electronic component and electronic component mounter |
| CN202728889U (en) * | 2012-07-24 | 2013-02-13 | 天水华天集成电路包装材料有限公司 | Carrier tape for integrated circuit element |
| CN204180396U (en) * | 2014-10-29 | 2015-02-25 | 滨中元川金属制品（昆山）有限公司 | For the accessory of element pasted on surface clot band |
| CN205363904U (en) * | 2015-12-30 | 2016-07-06 | 海信（广东）空调有限公司 | Electronic clamping jaw |
| CN205667026U (en) * | 2016-04-21 | 2016-10-26 | 深圳市蒙瑞电子有限公司 | SMT heavily is good at nozzle |
| CN106304829A (en) * | 2016-10-26 | 2017-01-04 | 中国科学院长春光学精密机械与物理研究所 | A kind of scattered or short braid components and parts mount pallet automatically |
| CN206506832U (en) * | 2017-03-13 | 2017-09-19 | 浙江益中智能电气有限公司 | A kind of ring-type electronic component clamping device applied to SMT chip mounters |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195437A (en) * | 2018-11-12 | 2019-01-11 | 昆山东野电子有限公司 | The positioning carrier of three-dimensional shape electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107072137B (en) | 2023-10-31 |
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