CN107068620B - A kind of TO metal ceramic tube shell structure - Google Patents
A kind of TO metal ceramic tube shell structure Download PDFInfo
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- CN107068620B CN107068620B CN201710409192.5A CN201710409192A CN107068620B CN 107068620 B CN107068620 B CN 107068620B CN 201710409192 A CN201710409192 A CN 201710409192A CN 107068620 B CN107068620 B CN 107068620B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
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Abstract
The invention discloses a kind of TO metal ceramic tube shell structures, including shell shell, internal electrode and external electrode；The shell shell includes rectangle iron-nickel alloy frame, the tungsten copper bottom plate for being mounted on rectangle iron-nickel alloy frame bottom and the beryllium oxide insulating trip being sintered at the top of tungsten copper bottom plate；The internal electrode includes the first molybdenum copper electrode piece and the second molybdenum copper electrode piece, and the first molybdenum copper electrode piece and the second molybdenum copper electrode piece are sintered respectively on beryllium oxide insulating trip；The external electrode includes first electrode sheet, second electrode sheet and third electrode slice, TO metal ceramic tube shell structure of the present invention, dexterously the electrode of general T O metal ceramic tube shell product is drawn by chip to the bonding third electrode slice, is transformed to by chip to the bonding the second molybdenum copper electrode piece；Ceramic cartridge product size is consistent with plastic packaging product, has achieved the purpose that compatible exchange.
Description
Technical field
The present invention relates to technical field of semiconductor device, specially a kind of TO metal ceramic tube shell structure.
Background technique
Semiconductor (semiconductor) refers to that electric conductivity is between conductor (conductor) and insulator under room temperature
(insulator) material between.Semiconductor has a wide range of applications on radio, television set and thermometric.Such as diode
It is exactly the device using semiconductor fabrication.Semiconductor refers to that a kind of electric conductivity can be controlled, range can from insulator to conductor it
Between material.No matter from the perspective of science and technology or economic development, the importance of semiconductor is all very huge.Today is big
Partial electronic product, as the core cell in computer, mobile phone or digital audio tape all has pole with semiconductor
For close connection.Common semiconductor material has silicon, germanium, GaAs etc., and silicon is even more in various semiconductor materials, in quotient
Industry applies upper most influential one kind.
Currently, the semi-conductor discrete devices such as import TO shape power MOSFET are Plastic Package form, plastic packaging product quilt
It is known as non-tight device, domestic expert has been presented for the requirement of high-quality level product disabling plastic device.In order to meet me
The product of the military highly reliable application field of state and national defence key project is mating, needs to replace plastic packaging knot with cermet encapsulating structure
Structure.Current country's general T O Can structure, only one internal big welding section are used to welding chip, internal electrode
Exit is integrated with external three outer leads, and middle leads are directly welded with big welding section, and two sides lead is vacantly as chip
The bonding region that electrode is drawn not can be carried out the bonding of a plurality of crude aluminum line, can not meet high current due to bonding region limited area
It is required that.
Summary of the invention
It is mentioned above in the background art to solve the purpose of the present invention is to provide a kind of TO metal ceramic tube shell structure
Problem.
To achieve the above object, the invention provides the following technical scheme: a kind of TO metal ceramic tube shell structure, including shell
Shell, internal electrode and external electrode；The shell shell includes rectangle iron-nickel alloy frame, is mounted on rectangle iron-nickel alloy side
The tungsten copper bottom plate of frame bottom and the beryllium oxide insulating trip being sintered at the top of tungsten copper bottom plate；The internal electrode includes the first molybdenum copper
Electrode slice and the second molybdenum copper electrode piece, and the first molybdenum copper electrode piece and the second molybdenum copper electrode piece are sintered respectively in beryllium oxide insulating trip
On；The external electrode includes first electrode sheet, second electrode sheet and third electrode slice, and first electrode sheet, second electrode
It is sintered and is constituted by ceramic insulator between piece and third electrode slice and shell shell；The first electrode sheet is in shell shell
Portion is hanging；The second electrode sheet and third electrode slice pass through copper post and the first molybdenum copper electrode piece and the second molybdenum copper electrode piece respectively
Sintering；The coating of the shell surface of shell is nickel layer.
As a preferred technical solution of the present invention, the size of the first molybdenum copper electrode piece is 9.5mm × 9.2mm,
The size of the second molybdenum copper electrode piece is 2.0mm × 9.2mm；First molybdenum copper electrode piece and the second molybdenum copper electrode piece are molybdenum copper material
Material, plating nickel on surface, nickel layer thickness are 5 μm~8.9 μm.
As a preferred technical solution of the present invention, the connection type between the internal electrode and external electrode is electricity
Property connection；Copper post is 70A-100A by current capacity value range.
As a preferred technical solution of the present invention, the rectangle iron-nickel alloy frame is adopted close to end position is drawn
With local reduction's technology, increase itself and exit distance, solved while guaranteeing product pressure resistance shell dimension it is smaller with draw
The biggish contradiction of line spacing.
As a preferred technical solution of the present invention, the first molybdenum copper electrode piece be chip welding section, described second
Molybdenum copper electrode piece is the bonding region that chip heavy current electrode is drawn, and bonding a plurality of crude aluminum line allows to flow through high current.
As a preferred technical solution of the present invention, the rectangle iron-nickel alloy frame is sintered before outer lead, by square
Shape iron-nickel alloy frame bottom both sides carry out local reduction, and wall thickness is thinned to 0.7mm by 1.3mm, and it is 4mm that length, which is thinned,.
Beneficial effect
Compared with prior art, the beneficial effects of the present invention are: TO metal ceramic tube shell structure of the present invention, the shell shell
Body includes rectangle iron-nickel alloy frame, the tungsten copper bottom plate for being mounted on rectangle iron-nickel alloy frame bottom and sintering in tungsten copper bottom plate
The beryllium oxide insulating trip at top；The internal electrode includes the first molybdenum copper electrode piece and the second molybdenum copper electrode piece, and the first molybdenum copper
Electrode slice and the second molybdenum copper electrode piece are sintered respectively on beryllium oxide insulating trip；The external electrode include first electrode sheet,
Second electrode sheet and third electrode slice, and pass through between first electrode sheet, second electrode sheet and third electrode slice and shell shell
Ceramic insulator sintering is constituted；The first electrode sheet is hanging in shell enclosure interior；The second electrode sheet and third electrode
Piece passes through copper post and the first molybdenum copper electrode piece respectively and the second molybdenum copper electrode piece is sintered；Dexterously by general T O cermet shell and tube
The electrode of product is drawn by chip to the bonding third electrode slice, is transformed to by chip to the key the second molybdenum copper electrode piece
It closes；Ceramic cartridge product size is consistent with plastic packaging product, has achieved the purpose that compatible exchange；It is practical, it is easy to spread
It uses.
Detailed description of the invention
Fig. 1 is side view of the invention；
Fig. 2 is top view of the invention；
In figure: 1- internal electrode, 2- external electrode, 3- rectangle iron-nickel alloy frame, 4- tungsten copper bottom plate, the insulation of 5- beryllium oxide
Piece, 6- the first molybdenum copper electrode piece, 7- the second molybdenum copper electrode piece, 8- first electrode sheet, 9- second electrode sheet, 10- third electrode slice,
11- ceramic insulator, 12- copper post.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1-2 a kind of embodiment provided by the invention: a kind of TO metal ceramic tube shell structure, including shell shell
Body, internal electrode 1 and external electrode 2；The shell shell includes rectangle iron-nickel alloy frame 3, is mounted on rectangle iron-nickel alloy
Beryllium oxide insulating trip 5 of the tungsten copper bottom plate 4 and sintering of 3 bottom of frame at the top of tungsten copper bottom plate 4；The internal electrode 1 includes
First molybdenum copper electrode piece 6 and the second molybdenum copper electrode piece 7, and the first molybdenum copper electrode piece 6 and the second molybdenum copper electrode piece 7 are sintered respectively
On beryllium oxide insulating trip 5；The external electrode 2 includes first electrode sheet 8, second electrode sheet 9 and third electrode slice 10, and the
It is made up of between one electrode slice 8, second electrode sheet 9 and third electrode slice 10 and shell shell the sintering of ceramic insulator 11；Institute
It is hanging in shell enclosure interior to state first electrode sheet 8；The second electrode sheet 9 and third electrode slice 10 respectively by copper post 12 with
First molybdenum copper electrode piece 6 and the sintering of the second molybdenum copper electrode piece 7；The coating of the shell surface of shell is nickel layer；First molybdenum
The size of copper electrode piece 6 is 9.5mm × 9.2mm, and the size of the second molybdenum copper electrode piece 7 is 2.0mm × 9.2mm；First molybdenum
Copper electrode piece 6 and the second molybdenum copper electrode piece 7 are molybdenum copper product, and plating nickel on surface, nickel layer thickness is 5 μm~8.9 μm；The internal electricity
Connection type between pole 1 and external electrode 2 is to be electrically connected；In order to guarantee high current ability, tungsten copper bottom plate 4 is by general T O gold
A first molybdenum copper electrode piece 6 for belonging to ceramic cartridge is changed to two electrode slices, wherein the first molybdenum copper electrode piece 6 is used for welded pipe
Core, the second molybdenum copper electrode piece 7 for tube core high-current leading outlet (such as emitter of the source electrode of power MOSFET, pliotron,
The cathode of power scr) bonding region, a plurality of crude aluminum line can be bonded；First molybdenum copper electrode piece 6 and the second molybdenum copper electrode piece 7
It is connect using copper post 12 with external electrode, current capacity is up to 70A-100A；The rectangle iron-nickel alloy frame 3 is close to extraction
End position increases itself and exit distance using local reduction's technology, solves shell dimension while guaranteeing product pressure resistance
The smaller and biggish contradiction of lead spacing；The first molybdenum copper electrode piece 6 is chip welding section, the second molybdenum copper electrode piece 7
For the bonding region that chip heavy current electrode is drawn, bonding a plurality of crude aluminum line allows to flow through high current；The rectangle iron-nickel alloy
Frame 3 is sintered before outer lead, 3 bottom both sides of rectangle iron-nickel alloy frame is carried out local reduction, wall thickness is thinned by 1.3mm
To 0.7mm, it is 4mm that length, which is thinned,.
In summary
TO metal ceramic tube shell structure of the present invention, the shell shell include rectangle iron-nickel alloy frame 3, are mounted on rectangle
Beryllium oxide insulating trip 5 of the tungsten copper bottom plate 4 and sintering of 3 bottom of iron-nickel alloy frame at the top of tungsten copper bottom plate 4；The internal electricity
Pole 1 includes the first molybdenum copper electrode piece 6 and the second molybdenum copper electrode piece 7, and the first molybdenum copper electrode piece 6 and the second molybdenum copper electrode piece 7 divide
It Shao Jie not be on beryllium oxide insulating trip 5；The external electrode 2 includes first electrode sheet 8, second electrode sheet 9 and third electrode
Piece 10, and burnt between first electrode sheet 8, second electrode sheet 9 and third electrode slice 10 and shell shell by ceramic insulator 11
Knot is constituted；The first electrode sheet 8 is hanging in shell enclosure interior；The second electrode sheet 9 and third electrode slice 10 lead to respectively
Cross copper post 12 and the first molybdenum copper electrode piece 6 and the sintering of the second molybdenum copper electrode piece 7；Dexterously by general T O rectangle iron-nickel alloy frame
The electrode of 3 products is drawn by chip to the bonding third electrode slice, is transformed to by chip to the key the second molybdenum copper electrode piece 7
It closes；Ceramic cartridge product size is consistent with plastic packaging product, has achieved the purpose that compatible exchange；It is practical, it is easy to spread
It uses.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ".
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (4)
1. a kind of TO metal ceramic tube shell structure, including shell shell, internal electrode (1) and external electrode (2)；Its feature exists
In: the shell shell includes rectangle iron-nickel alloy frame (3), the tungsten copper bottom for being mounted on rectangle iron-nickel alloy frame (3) bottom
Plate (4) and the beryllium oxide insulating trip (5) being sintered at the top of tungsten copper bottom plate (4)；The internal electrode (1) includes the first molybdenum copper electricity
Pole piece (6) and the second molybdenum copper electrode piece (7), and the first molybdenum copper electrode piece (6) and the second molybdenum copper electrode piece (7) are sintered respectively in oxygen
Change on beryllium insulating trip (5)；The external electrode (2) includes first electrode sheet (8), second electrode sheet (9) and third electrode slice
(10), and between first electrode sheet (8), second electrode sheet (9) and third electrode slice (10) and shell shell pass through ceramic insulation
Sub (11) sintering is constituted；The first electrode sheet (8) is hanging in shell enclosure interior；The second electrode sheet (9) and third electricity
Pole piece (10) is sintered by copper post (12) and the first molybdenum copper electrode piece (6) and the second molybdenum copper electrode piece (7) respectively；The shell shell
The coating in body surface face is nickel layer；
The rectangle iron-nickel alloy frame (3) is close to end position is drawn, using local reduction's technology, increase itself and exit away from
From solving that shell dimension is smaller with the biggish contradiction of lead spacing, and the rectangular iron nickel closes while guaranteeing product pressure resistance
Golden-rimmed frame (3), be sintered outer lead before, by rectangle iron-nickel alloy frame (3) bottom both sides carry out local reduction, wall thickness by
1.3mm is thinned to 0.7mm, and it is 4mm that length, which is thinned,.
2. a kind of TO metal ceramic tube shell structure according to claim 1, it is characterised in that: the first molybdenum copper electrode piece
(6) size is 9.5mm × 9.2mm, and the size of the second molybdenum copper electrode piece (7) is 2.0mm × 9.2mm；First molybdenum copper electricity
Pole piece (6) and the second molybdenum copper electrode piece (7) are molybdenum copper product, and plating nickel on surface, nickel layer thickness is 5 μm~8.9 μm.
3. a kind of TO metal ceramic tube shell structure according to claim 1, it is characterised in that: the internal electrode (1) with
Connection type between external electrode (2) is to be electrically connected；Copper post (12) is 70A-100A by current capacity value range.
4. a kind of TO metal ceramic tube shell structure according to claim 1, it is characterised in that: the first molybdenum copper electrode piece
It (6) is chip welding section, the second molybdenum copper electrode piece (7) is the bonding region that chip heavy current electrode is drawn, bonding a plurality of
Crude aluminum line, allows to flow through high current.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409192.5A CN107068620B (en) | 2017-06-02 | 2017-06-02 | A kind of TO metal ceramic tube shell structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409192.5A CN107068620B (en) | 2017-06-02 | 2017-06-02 | A kind of TO metal ceramic tube shell structure |
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| Publication Number | Publication Date |
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| CN107068620A CN107068620A (en) | 2017-08-18 |
| CN107068620B true CN107068620B (en) | 2019-10-25 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116124728A (en) * | 2023-02-24 | 2023-05-16 | 上海烨映微电子科技股份有限公司 | Thermopile infrared detector, preparation method thereof and NDIR detection system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202009341U (en) * | 2011-04-15 | 2011-10-12 | 锦州辽晶电子科技有限公司 | High-voltage high-power inverter module |
| CN203774187U (en) * | 2014-03-04 | 2014-08-13 | 青岛凯瑞电子有限公司 | Solid-state relay housing where ground connection parts of internal leads are at a certain angle |
| CN204497239U (en) * | 2015-04-28 | 2015-07-22 | 锦州辽晶电子科技有限公司 | Metallic packaging big current, high voltage, fast recovery diode |
| CN206834165U (en) * | 2017-06-02 | 2018-01-02 | 朝阳无线电元件有限责任公司 | A kind of TO cermets shell structure |
-
2017
- 2017-06-02 CN CN201710409192.5A patent/CN107068620B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202009341U (en) * | 2011-04-15 | 2011-10-12 | 锦州辽晶电子科技有限公司 | High-voltage high-power inverter module |
| CN203774187U (en) * | 2014-03-04 | 2014-08-13 | 青岛凯瑞电子有限公司 | Solid-state relay housing where ground connection parts of internal leads are at a certain angle |
| CN204497239U (en) * | 2015-04-28 | 2015-07-22 | 锦州辽晶电子科技有限公司 | Metallic packaging big current, high voltage, fast recovery diode |
| CN206834165U (en) * | 2017-06-02 | 2018-01-02 | 朝阳无线电元件有限责任公司 | A kind of TO cermets shell structure |
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| Publication number | Publication date |
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| CN107068620A (en) | 2017-08-18 |
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Address after: 122000 105, section 5, Wenhua Road, Longcheng District, Chaoyang City, Liaoning Province Patentee after: Chaoyang Microelectronics Technology Co., Ltd Address before: 122000 No. two, section 75, Chaoyang City, Liaoning, Xinhua Road Patentee before: CHAOYANG RADIO COMPONENTS Co.,Ltd. |