CN107058965B - 一种内置旋转阴极结构 - Google Patents
一种内置旋转阴极结构 Download PDFInfo
- Publication number
- CN107058965B CN107058965B CN201710512100.6A CN201710512100A CN107058965B CN 107058965 B CN107058965 B CN 107058965B CN 201710512100 A CN201710512100 A CN 201710512100A CN 107058965 B CN107058965 B CN 107058965B
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- Prior art keywords
- cathode
- target
- door
- magnetic pole
- pipe
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710512100.6A CN107058965B (zh) | 2017-06-28 | 2017-06-28 | 一种内置旋转阴极结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710512100.6A CN107058965B (zh) | 2017-06-28 | 2017-06-28 | 一种内置旋转阴极结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107058965A CN107058965A (zh) | 2017-08-18 |
CN107058965B true CN107058965B (zh) | 2018-12-14 |
Family
ID=59613985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201710512100.6A Active CN107058965B (zh) | 2017-06-28 | 2017-06-28 | 一种内置旋转阴极结构 |
Country Status (1)
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CN (1) | CN107058965B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110453188A (zh) * | 2019-08-30 | 2019-11-15 | 深圳市金耀玻璃机械有限公司 | 一种内置于真空腔体的磁钢摆动式端头组件 |
CN111243924B (zh) * | 2020-01-14 | 2022-10-25 | 中国电子科技集团公司第三十八研究所 | 一种用于射线源的转动靶机构 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8182662B2 (en) * | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
CN102296273B (zh) * | 2010-06-24 | 2013-06-05 | 上海子创镀膜技术有限公司 | 一种真空磁控溅射镀膜用旋转阴极驱动系统 |
US20130032476A1 (en) * | 2011-08-04 | 2013-02-07 | Sputtering Components, Inc. | Rotary cathodes for magnetron sputtering system |
CN102953039B (zh) * | 2012-10-26 | 2014-12-24 | 湘潭宏大真空技术股份有限公司 | 一种真空磁控溅射镀膜用的旋转阴极 |
JP2017002350A (ja) * | 2015-06-09 | 2017-01-05 | 株式会社アルバック | マグネトロンスパッタリング装置用の回転式カソードユニット |
CN105506568B (zh) * | 2016-01-21 | 2017-10-31 | 武汉科瑞达真空科技有限公司 | 一种新型孪生外置旋转阴极 |
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2017
- 2017-06-28 CN CN201710512100.6A patent/CN107058965B/zh active Active
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Publication number | Publication date |
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CN107058965A (zh) | 2017-08-18 |
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Effective date of registration: 20230323 Address after: Room 1004, Building B1, Phase I, Optical Valley Chongwen Center, 792 Gaoxin Avenue, Donghu New Technology Development Zone, Wuhan, Hubei Province, 430000 (Wuhan Area of Free Trade Zone) Patentee after: Wuhan Jiuyi Intelligent Technology Co.,Ltd. Address before: 430075 building B1, R & D building, zone B, C and D, Wuhan National biological industry base project, 666 Gaoxin Avenue, Donghu hi tech Development Zone, Wuhan City, Hubei Province Patentee before: WUHAN KERUIDA VACUUM TECHNOLOGY Co.,Ltd. |
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