CN107053502B - A kind of sapphire processing accurate positioning cutter device - Google Patents
A kind of sapphire processing accurate positioning cutter device Download PDFInfo
- Publication number
- CN107053502B CN107053502B CN201610790169.0A CN201610790169A CN107053502B CN 107053502 B CN107053502 B CN 107053502B CN 201610790169 A CN201610790169 A CN 201610790169A CN 107053502 B CN107053502 B CN 107053502B
- Authority
- CN
- China
- Prior art keywords
- sapphire
- cutting
- cutter device
- accurate positioning
- objective table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to gem processing technical fields, especially a kind of sapphire processing accurate positioning cutter device, including device pedestal, the upper surface of device pedestal is symmetrically arranged with two single u-shaped support rods, U-shaped support rod is provided with the mounting bracket for installing electronic spool far from one end of device pedestal, the cutting line for cutting sapphire is wrapped on two electronic spools, the upper surface of device pedestal is symmetrically installed with electric telescopic rod, electric telescopic rod is fixedly connected far from one end of device pedestal with objective table, fixed plate is provided with support frame far from one end of objective table, through equipped with sparge pipe on support frame, sparge pipe is used to spray cutting liquid to the sapphire between the first grip block and the second grip block, sapphire processing has and can carry out accurately to sapphire with the existing cutter device of cutter device comparison is accurately positioned Firm positioning, while the advantage that cut quality is good, cutting speed is stable.
Description
Technical field
The present invention relates to gem processing technical field more particularly to a kind of sapphire processing accurate positioning cutter devices.
Background technique
Sapphire wire cutting mechanism is exactly that machine guide wheel drives steel wire in running at high speed, steel wire in running at high speed with
The sapphire being pressed on steel wire recurs the process that cutting is completed in friction.In entire cutting process, to sapphire quality
And what yield rate played a major role is that the viscosity of cutting liquid, the speed of steel wire, the tension of steel wire, cutting enter knife mode and work
The feed speed etc. of part.There is loosening, illusive defect when existing sapphire cutter device clamps jewel again, lead to nothing
Method carries out accurate positional dissection to sapphire, while being not easy to adjust the tensile force of steel wire, and cut quality is bad, is easy to appear and collapses
The defects of side, the quality after influencing sapphire cutting.
Summary of the invention
The purpose of the present invention is to solve disadvantages existing in the prior art, and a kind of sapphire processing essence proposed
True positioning-cutting device.
To achieve the goals above, present invention employs following technical solutions:
Design a kind of sapphire processing accurate positioning cutter device, including device pedestal, the upper end of described device pedestal
Face is symmetrically arranged with two single u-shaped support rods, and the U-shaped support rod is provided with far from one end of device pedestal for installing electric rolling
The mounting bracket of spool is wrapped with the cutting line for cutting sapphire on two electronic spools;
The upper surface of described device pedestal is symmetrically installed with electric telescopic rod, and the electric telescopic rod is far from device pedestal
One end is fixedly connected with objective table, and the upper surface side of the objective table is fixedly connected with fixed plate, the outer wall of the fixed plate
It is fixedly connected with U-shaped board, two first connecting rods are rotatably connected in the U-shaped board, the first connecting rod is connect with second
One end of bar is rotatablely connected, and is connected with spring between two second connecting rods, the other end of second connecting rod and the
The rotation connection of two grip blocks;
The other side of the upper surface of the objective table is fixedly connected with adjustable plate, runs through on the adjustable plate and is equipped with screw thread
Bar, the one end of threaded rod far from adjustable plate are fixedly connected with the first grip block, and there are two adjust for threaded connection on the threaded rod
Nut, and two adjusting nuts are fastened on the two sides of adjustable plate respectively, the fixed plate is provided with branch far from one end of objective table
Support, through sparge pipe is equipped on support frame as described above, sparge pipe is used between the first grip block and the second grip block
Sapphire sprays cutting liquid.
Preferably, the U-shaped support rod is provided with first sliding groove far from one end of device pedestal, runs through in first sliding groove and is equipped with
Shaft, the both ends of the shaft are threaded with the nut for fastening shaft, and rotation is equipped with tensioning wheel in the shaft,
Bearing up pulley is located in the U-shaped cavity of U-shaped support rod, and tensioning wheel plays the role of tensioning to cutting line.
Preferably, one end of the U-shaped support rod approaching device pedestal is provided with second sliding slot, is slidably connected in second sliding slot
There is slide bar, and slide bar is fixedly connected with the side wall of objective table, plays the role of guiding stage movement.
Preferably, the quantity of the second grip block is no less than four, and is in rectangular arrangement in the outer wall of fixed plate.
Preferably, the upper surface of described device pedestal is provided with catch basin, and catch basin is used to saving to be sprayed from sparge pipe
Cutting liquid.
Preferably, the cutting line is the preferable steel wire of flexibility, and the surface of cutting line is bonded with gold by bonding agent
Hard rock cuts particle.
Preferably, spray head is provided on the sparge pipe, the cutting liquid in sparge pipe is uniformly sprayed to be added by spray head
The sapphire of work.
A kind of sapphire processing proposed by the present invention is with cutter device, beneficial effect is accurately positioned: passing through setting the
One grip block and the second grip block, sapphire to be processed is between the first grip block and the second grip block, the second grip block
By spring and fixed plate elastic connection, i.e. adjustable fixation position of the sapphire on objective table of adjusting nut is rotated, is convenient for
Positional dissection accurately is carried out to sapphire, multiple second grip blocks are provided in fixed plate, the device is enabled to clamp
The sapphire of irregular shape, clamping effect is good, is not easy to loosen, and objective table is gone up and down by electronic telescopic rod, blue in cutting
It is able to maintain stable cutting speed when jewel, improves the cut quality of the device, while being provided with tensioning wheel, tensioning wheel can
It is moved on U-shaped support rod, is convenient for tension adjusting degree, the tensioning dynamics of cutting line is adjusted according to different sapphires,
The cut quality of the device is further improved, sapphire processing compares existing cutting dress with cutter device is accurately positioned
It sets to have and can carry out accurately firm positioning, while the advantage that cut quality is good, cutting speed is stable to sapphire.
Detailed description of the invention
Fig. 1 is a kind of sapphire processing structural schematic diagram for being accurately positioned cutter device proposed by the present invention;
Fig. 2 is a kind of sapphire processing the accurate positioning U-shaped board of cutter device and showing for connecting rod proposed by the present invention
It is intended to;
Fig. 3 is a kind of structure of sapphire processing fixed plate and clamping plate for being accurately positioned cutter device proposed by the present invention
Schematic diagram;
Fig. 4 is a kind of structure of sapphire processing shaft and tensioning wheel for being accurately positioned cutter device proposed by the present invention
Schematic diagram.
In figure: 1 device pedestal, 2U type support rod, 3 electronic spools, 4 nuts, 5 mounting brackets, 6 cutting lines, 7 first
Sliding slot, 8 fixed plates, 9 objective tables, 10 first grip blocks, 11 threaded rods, 12 adjusting nuts, 13 adjustable plates, 14 second sliding slots, 15
Slide bar, 16 support frames, 17 sparge pipes, 18U template, 19 first connecting rods, 21 springs, 22 second connecting rods, 23 second clampings
Plate, 24 shafts, 25 tensioning wheels, 26 electric telescopic rods.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1-4, a kind of sapphire processing accurate positioning cutter device, including device pedestal 1, device pedestal 1
Upper surface is symmetrically arranged with two single u-shaped support rods 2, and U-shaped support rod 2 is provided with far from one end of device pedestal 1 for installing electricity
The mounting bracket 5 of spool 3 is moved, the cutting line 6 for cutting sapphire is wrapped on two electronic spools 3, cutting line 6 is
The preferable steel wire of flexibility, and the surface of cutting line 6 is bonded with diamond cut particle by bonding agent, sapphire hardness compared with
Height, using diamond particles steel wire come cutting sapphire, good cutting effect.
The upper surface of device pedestal 1 is symmetrically installed with electric telescopic rod 26, electric telescopic rod 26 far from device pedestal 1 one
End is fixedly connected with objective table 9, and the upper surface side of objective table 9 is fixedly connected with fixed plate 8, and the outer wall of fixed plate 8 is fixed to be connected
It is connected to U-shaped board 18, two first connecting rods 19, first connecting rod 19 and the second connecting rod 22 are rotatably connected in U-shaped board 18
One end rotation connection, spring 21 is connected between two second connecting rods 22, the other end of the second connecting rod 22 is pressed from both sides with second
The rotation connection of plate 23 is held, the quantity of the second grip block 23 is no less than four, and is in rectangular arrangement in the outer wall of fixed plate 8,
The device is enabled to clamp the sapphire of irregular shape, clamping effect is good, is not easy to loosen, accurate convenient for carrying out to sapphire
Positional dissection.
The other side of the upper surface of objective table 9 is fixedly connected with adjustable plate 13, runs through on adjustable plate 13 and is equipped with threaded rod 11,
The one end of threaded rod 11 far from adjustable plate 13 is fixedly connected with the first grip block 10, and there are two adjust for threaded connection on threaded rod 11
Nut 12 is saved, and two adjusting nuts 12 are fastened on the two sides of adjustable plate 13 respectively, fixed plate 8 is set far from one end of objective table 9
It is equipped with support frame 16, runs through on support frame 16 and is equipped with sparge pipe 17, sparge pipe 17 is used for positioned at the first grip block 10 and second
Sapphire between grip block 23 sprays cutting liquid, is provided with spray head on sparge pipe (17), and spray head is by cutting in sparge pipe (17)
It cuts liquid and is uniformly sprayed to sapphire to be processed, the upper surface of device pedestal 1 is provided with catch basin, and catch basin is for saving from spray
The cutting liquid sprayed in water pipe 17, is collected cutting liquid, avoid cutting liquid pollution week environment, design more rationally,
Hommization.
U-shaped support rod 2 is provided with first sliding groove 7 far from one end of device pedestal 1, runs through in first sliding groove 7 and is equipped with shaft 24,
The both ends of shaft 24 are threaded with the nut 4 for fastening shaft 24, and rotation is equipped with tensioning wheel 25, tensioning wheel in shaft 24
25 are located in the U-shaped cavity of U-shaped support rod 2, and tensioning wheel 25 plays the role of tensioning to cutting line 6, and tensioning wheel 25 can be
It is moved on U-shaped support rod 2, is convenient for tension adjusting degree, the tensioning dynamics of cutting line 6 is adjusted according to different sapphires,
Improve the cut quality of the device.
One end of U-shaped 2 approaching device pedestal 1 of support rod is provided with second sliding slot 14, slidably connects cunning in second sliding slot 14
Bar 15, and slide bar 15 is fixedly connected with the side wall of objective table 9, plays the role of that objective table 9 is guided to move, objective table 9 passes through electronic
Telescopic rod 26 is gone up and down, and stable cutting speed is able to maintain in cutting sapphire, is avoided the non-uniform situation of cutting, is mentioned
The cut quality of the device is risen.
Working principle: sapphire to be cut is clamped between the first grip block 10 and the second grip block 23, blue in cutting
Rotatable nut 4 adjusts fixation position of the tensioning wheel 25 on U-shaped support rod 2 before jewel, adjusts cutting line 6 to reach
The function of tensioning dynamics, objective table 9 are moved by electric telescopic rod 26, and the electronic work of spool 3 drives 6 pairs of indigo plants of cutting line
Jewel is cut.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of sapphire processing accurate positioning cutter device, including device pedestal (1), which is characterized in that described device bottom
The upper surface of seat (1) is symmetrically arranged with two single u-shaped support rods (2), the one end of the U-shaped support rod (2) far from device pedestal (1)
It is provided with the mounting bracket (5) for installing electronic spool (3), is wrapped on two electronic spools (3) for cutting
Cut sapphire cutting line (6);
The upper surface of described device pedestal (1) is symmetrically installed with electric telescopic rod (26), and the electric telescopic rod (26) is far from dress
One end of bottom set seat (1) is fixedly connected with objective table (9), and the upper surface side of the objective table (9) is fixedly connected with fixed plate
(8), the outer wall of the fixed plate (8) is fixedly connected with U-shaped board (18), is rotatably connected to two first on the U-shaped board (18)
Connecting rod (19), one end rotation connection of the first connecting rod (19) and the second connecting rod (22), two second connections
It is connected between bar (22) spring (21), the other end and the second grip block (23) rotation connection of second connecting rod (22);
The other side of the upper surface of the objective table (9) is fixedly connected with adjustable plate (13), is run through on the adjustable plate (13) and is set
Have threaded rod (11), threaded rod (11) is fixedly connected far from the one end of adjustable plate (13) with the first grip block (10), the screw thread
There are two being threadedly coupled on bar (11) adjusting nut (12), and two adjusting nuts (12) are fastened on the two of adjustable plate (13) respectively
Side, the fixed plate (8) are provided with support frame (16) far from the one end of objective table (9), run through on support frame as described above (16) and are equipped with
Sparge pipe (17), sparge pipe (17) are used for the sapphire spray between the first grip block (10) and the second grip block (23)
Cutting liquid.
2. a kind of sapphire processing accurate positioning cutter device according to claim 1, which is characterized in that described U-shaped
Support rod (2) is provided with first sliding groove (7) far from the one end of device pedestal (1), is run through in first sliding groove (7) and is equipped with shaft (24),
The both ends of the shaft (24) are threaded with the nut (4) for fastening shaft (24), rotate and set on the shaft (24)
Have tensioning wheel (25), tensioning wheel (25) is located in the U-shaped cavity of U-shaped support rod (2), and tensioning wheel (25) plays cutting line (6)
To the effect of tensioning.
3. a kind of sapphire processing accurate positioning cutter device according to claim 1, which is characterized in that described U-shaped
One end of support rod (2) approaching device pedestal (1) is provided with second sliding slot (14), and second sliding slot slidably connects slide bar in (14)
(15), and slide bar (15) is fixedly connected with the side walls of objective table (9), plays the role of guiding objective table (9) movement.
4. a kind of sapphire processing accurate positioning cutter device according to claim 1, which is characterized in that described second
The quantity of grip block (23) is no less than four, and is in rectangular arrangement in the outer wall of fixed plate (8).
5. a kind of sapphire processing accurate positioning cutter device according to claim 1, which is characterized in that described device
The upper surface of pedestal (1) is provided with catch basin, and catch basin is used to save the cutting liquid sprayed from sparge pipe (17).
6. a kind of sapphire processing accurate positioning cutter device according to claim 1, which is characterized in that the cutting
Line (6) is the preferable steel wire of flexibility, and the surface of cutting line (6) is bonded with diamond cut particle by bonding agent.
7. a kind of sapphire processing accurate positioning cutter device according to claim 1, which is characterized in that the water spray
It is provided with spray head on pipe (17), the cutting liquid in sparge pipe (17) is uniformly sprayed to sapphire to be processed by spray head.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610790169.0A CN107053502B (en) | 2016-08-31 | 2016-08-31 | A kind of sapphire processing accurate positioning cutter device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610790169.0A CN107053502B (en) | 2016-08-31 | 2016-08-31 | A kind of sapphire processing accurate positioning cutter device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107053502A CN107053502A (en) | 2017-08-18 |
CN107053502B true CN107053502B (en) | 2019-02-15 |
Family
ID=59617236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610790169.0A Active CN107053502B (en) | 2016-08-31 | 2016-08-31 | A kind of sapphire processing accurate positioning cutter device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107053502B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108724500B (en) * | 2018-08-13 | 2020-10-27 | 浙江贝盛新材料科技有限公司 | Single crystal silicon rod cutting machine wide in application range |
CN108995062B (en) * | 2018-08-13 | 2020-06-02 | 浙江贝盛新材料科技有限公司 | Adjust more convenient single crystal silicon rod cutting device |
CN109016199A (en) * | 2018-08-27 | 2018-12-18 | 温州曜世新材料科技有限公司 | A kind of graphene resin diamond wire cutting equipment |
CN111086116A (en) * | 2019-12-23 | 2020-05-01 | 中国有色桂林矿产地质研究院有限公司 | Annular diamond wire saw cutting device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5234010B2 (en) * | 2008-02-19 | 2013-07-10 | 信越半導体株式会社 | Wire saw and workpiece cutting method |
CN202207756U (en) * | 2011-07-19 | 2012-05-02 | 江阴华新电器有限公司 | Automatic positioning device for stamping mould bar stocks |
JP2013089693A (en) * | 2011-10-14 | 2013-05-13 | Sumco Corp | Slice stand and manufacturing method of semiconductor wafer |
CN104210041B (en) * | 2014-08-21 | 2016-06-01 | 浙江辉弘光电能源有限公司 | A kind of saw machine silicon rod clamper |
CN105599160B (en) * | 2016-03-28 | 2017-08-01 | 青岛理工大学 | A kind of clamping and fixing device of adjustable V-structure |
CN206170372U (en) * | 2016-08-31 | 2017-05-17 | 天通银厦新材料有限公司 | Accurate positioning cutting device is used in sapphire processing |
-
2016
- 2016-08-31 CN CN201610790169.0A patent/CN107053502B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN107053502A (en) | 2017-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107053502B (en) | A kind of sapphire processing accurate positioning cutter device | |
CN202016131U (en) | Three-roller multi-wire cutting machine | |
CN108555757B (en) | Automatic mechanical arm type polishing machine for stainless steel tableware | |
CN206170372U (en) | Accurate positioning cutting device is used in sapphire processing | |
CN208195296U (en) | A kind of steel tube bending machine | |
CN102211362A (en) | Three-roller multi-wire cutting machine | |
CN208321665U (en) | A kind of actinobacillus device being bonded wire drawing machine | |
CN108436690A (en) | A kind of Flat plate polishing device of variable area | |
CN103624187A (en) | Rebar bending machine | |
CN101386156B (en) | Silicon slice cleaning and positioning apparatus | |
CN104723469A (en) | Numerical control sapphire multi-station single wire squarer | |
CN103921131B (en) | A kind of automatic welding burnishing device and method | |
CN204622357U (en) | Numerical control sapphire multistation single line excavation machine | |
CN206925669U (en) | A kind of adjustable hardware product lapping device | |
CN109454736A (en) | Plate surface arc scratch machine | |
CN207982990U (en) | A kind of optical mirror slip fine grinding system | |
CN214818942U (en) | Width positioning device for proofing machine | |
CN209491868U (en) | Plate surface arc scratch machine | |
CN213003062U (en) | Hardware cutting equipment with turn to structure | |
CN204771117U (en) | Cutter high -frequency induction welding frock | |
CN107538356A (en) | A kind of numerical control multi-head vertical bar cutting machine that can carry out arc cutting | |
CN206382223U (en) | A kind of taut net device of accurate pair of guide rail | |
CN208213494U (en) | A kind of blotting paper compounding machine glue spraying adjustment device | |
CN209478638U (en) | A kind of diamond fretsaw cutting equipment | |
CN208323139U (en) | It is a kind of to lie down dual-purpose quick lock protection vice |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |