CN107053502A - A kind of processing of sapphire is with being accurately positioned cutter device - Google Patents
A kind of processing of sapphire is with being accurately positioned cutter device Download PDFInfo
- Publication number
- CN107053502A CN107053502A CN201610790169.0A CN201610790169A CN107053502A CN 107053502 A CN107053502 A CN 107053502A CN 201610790169 A CN201610790169 A CN 201610790169A CN 107053502 A CN107053502 A CN 107053502A
- Authority
- CN
- China
- Prior art keywords
- sapphire
- accurately positioned
- cutter device
- objective table
- grip block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
Abstract
The present invention relates to gem processing technical field, a kind of especially sapphire processing is with being accurately positioned cutter device, including device pedestal, the upper surface of device pedestal is symmetrically arranged with two single u-shaped support bars, the one end of U-shaped support bar away from device pedestal is provided with the mounting bracket for installing electronic spool, the line of cut for cutting sapphire is wrapped with two electronic spools, the upper surface of device pedestal is symmetrically installed with electric expansion bar, the one end of electric expansion bar away from device pedestal is fixedly connected with objective table, the one end of fixed plate away from objective table is provided with support frame, run through on support frame and be provided with sparge pipe, sparge pipe is used to spray cutting liquid to the sapphire between the first grip block and the second grip block, sapphire processing contrasts existing cutter device with the positioning that can carry out accurately consolidating to sapphire with cutter device is accurately positioned, cut quality is good simultaneously, the stable advantage of cutting speed.
Description
Technical field
The present invention relates to gem processing technical field, more particularly to a kind of processing of sapphire is with being accurately positioned cutter device.
Background technology
Sapphire wire cutting mechanism is exactly that machine guide wheel drives steel wire in running at high speed, steel wire in running at high speed with
The sapphire being pressed on steel wire recurs the process that friction completes cutting.In whole cutting process, to sapphire quality
And it is that the viscosity of cutting liquid, the speed of steel wire, the tension force of steel wire, cutting enter knife mode and work that yield rate, which plays a major role,
Feed speed of part etc..Existing sapphire cutter device has loosening, illusive defect when clamping jewel again, cause nothing
Method carries out accurate positional dissection to sapphire, while being difficult to adjust the tensile force of steel wire, cut quality is bad, easily collapses
The defects such as side, the quality after influence sapphire cutting.
The content of the invention
The invention aims to solve shortcoming present in prior art, and a kind of sapphire processing proposed is smart
True positioning-cutting device.
To achieve these goals, present invention employs following technical scheme：
A kind of processing of sapphire is designed with being accurately positioned cutter device, including device pedestal, the upper end of described device base
Face is symmetrically arranged with two single u-shaped support bars, and the described one end of U-shaped support bar away from device pedestal is provided with for installing electric rolling
The line of cut for cutting sapphire is wrapped with the mounting bracket of spool, two electronic spools；
The upper surface of described device base is symmetrically installed with electric expansion bar, and the electric expansion bar is away from device pedestal
One end is fixedly connected with objective table, and the upper surface side of the objective table is fixedly connected with fixed plate, the outer wall of the fixed plate
It is fixedly connected with U-shaped plate, the U-shaped plate and is rotatably connected to two head rods, the head rod is connected with second
One end of bar rotates and spring is connected between connection, two second connecting rods, the other end of second connecting rod and the
Two grip blocks rotate connection；
The opposite side of the upper surface of the objective table, which is fixedly connected with to run through on adjustable plate, the adjustable plate, is provided with screw thread
Bar, the one end of threaded rod away from adjustable plate is fixedly connected with the first grip block, and two regulations are threaded with the threaded rod
Nut, and two adjusting nuts are fastened on the both sides of adjustable plate respectively, the one end of the fixed plate away from objective table is provided with branch
Run through on support, support frame as described above and be provided with sparge pipe, sparge pipe is used between the first grip block and the second grip block
Sapphire sprays cutting liquid.
It is preferred that, the described one end of U-shaped support bar away from device pedestal is provided with to run through in the first chute, the first chute and is provided with
Rotating shaft, the two ends of the rotating shaft, which are threaded with to rotate in the nut for fastening rotating shaft, the rotating shaft, is provided with tensioning wheel,
Bearing up pulley is located in the U-shaped cavity of U-shaped support bar, and tensioning wheel plays a part of tensioning to line of cut.
It is preferred that, one end of the U-shaped support bar approaching device base, which is provided with the second chute, the second chute, to be slidably connected
There is slide bar, and slide bar is fixedly connected with the side wall of objective table, plays a part of guiding stage movement.
It is preferred that, it no less than four, and in the outer wall of fixed plate is in rectangular arrangement that the quantity of the second grip block, which is,.
It is preferred that, the upper surface of described device base is provided with catch basin, and catch basin is used to save what is sprayed from sparge pipe
Cutting liquid.
It is preferred that, the line of cut is the preferable steel wire of pliability, and the surface of line of cut is bonded with gold by bonding agent
Hard rock cuts particle.
It is preferred that, shower nozzle is provided with the sparge pipe, the cutting liquid in sparge pipe is uniformly sprayed to be added by shower nozzle
The sapphire of work.
A kind of sapphire processing proposed by the present invention is with cutter device is accurately positioned, and beneficial effect is：By setting the
One grip block and the second grip block, sapphire to be processed are located between the first grip block and the second grip block, the second grip block
By spring and fixed plate elastic connection, it is adjustable fixed position of the sapphire on objective table to rotate adjusting nut, is easy to
It is accurate that positional dissection is carried out to sapphire, multiple second grip blocks are provided with fixed plate, enable to the device to clamp
The sapphire of irregular shape, clamping effect is good, be difficult to loosen, and objective table is lifted by electronic telescopic rod, blue in cutting
It can keep stablizing cutting speed during jewel, improve the cut quality of the device, while being provided with tensioning wheel, tensioning wheel can
Moved on U-shaped support bar, be easy to tension adjusting degree, the tensioning dynamics of line of cut is adjusted according to different sapphires,
The cut quality of the device is further improved, sapphire processing is filled with the existing cutting of cutter device contrast is accurately positioned
Put with accurately firm positioning can be carried out to sapphire, while the advantage that cut quality is good, cutting speed is stable.
Brief description of the drawings
Fig. 1 is a kind of sapphire processing structural representation for being accurately positioned cutter device proposed by the present invention；
Fig. 2 is a kind of sapphire processing proposed by the present invention with being accurately positioned the U-shaped plate of cutter device and showing for connecting rod
It is intended to；
Fig. 3 is used for a kind of sapphire processing proposed by the present invention and is accurately positioned the fixed plate of cutter device and the structure of clamping plate
Schematic diagram；
Fig. 4 is a kind of sapphire the processing rotating shaft for being accurately positioned cutter device and the structure of tensioning wheel proposed by the present invention
Schematic diagram.
In figure：1 device pedestal, 2U types support bar, 3 electronic spools, 4 nuts, 5 mounting brackets, 6 lines of cut, 7 first are slided
Groove, 8 fixed plates, 9 objective tables, 10 first grip blocks, 11 threaded rods, 12 adjusting nuts, 13 adjustable plates, 14 second chutes, 15 are slided
Bar, 16 support frames, 17 sparge pipes, 18U templates, 19 head rods, 20 second connecting rods, 21 springs, 22 second connecting rods, 23
Second grip block, 24 rotating shafts, 25 tensioning wheels, 26 electric expansion bars.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.
Reference picture 1-4, a kind of sapphire processing with being accurately positioned cutter device, including device pedestal 1, device pedestal 1
Upper surface is symmetrically arranged with two single u-shaped support bars 2, and the U-shaped one end of support bar 2 away from device pedestal 1 is provided with for installing electricity
The line of cut 6 for cutting sapphire is wrapped with the mounting bracket 5 of dynamic spool 3, two electronic spools 3, line of cut 6 is
The preferable steel wire of pliability, and the surface of line of cut 6 is bonded with diamond cut particle by bonding agent, sapphire hardness compared with
Height, using diamond particles steel wire come cutting sapphire, good cutting effect.
The upper surface of device pedestal 1 is symmetrically installed with electric expansion bar 26, electric expansion bar 26 away from device pedestal 1 one
End is fixedly connected with objective table 9, and the upper surface side of objective table 9 is fixedly connected with fixed plate 8, and the outer wall of fixed plate 8, which is fixed, to be connected
It is connected on U-shaped plate 18, U-shaped plate 18 and is rotatably connected to two head rods 19, the connecting rod 20 of head rod 19 and second
One end rotates and spring 21 is connected between connection, two second connecting rods 22, the other end of the second connecting rod 22 and the second clamping
Plate 23 rotates connection, and it no less than four, and in the outer wall of fixed plate 8 is in rectangular arrangement, energy that the quantity of the second grip block 23, which is,
Enough so that the device clamps the sapphire of irregular shape, clamping effect is good, be difficult to loosen, and is easy to carry out accurately sapphire
Positional dissection.
The opposite side of the upper surface of objective table 9, which is fixedly connected with to run through on adjustable plate 13, adjustable plate 13, is provided with threaded rod 11,
The one end of threaded rod 11 away from adjustable plate 13 is fixedly connected with the first grip block 10, and two regulations are threaded with threaded rod 11
Nut 12, and two adjusting nuts 12 are fastened on the both sides of adjustable plate 13 respectively, the one end of fixed plate 8 away from objective table 9 is set
Have to run through on support frame 16, support frame 16 and be provided with sparge pipe 17, sparge pipe 17 is used for positioned at the first grip block 10 and the second folder
The sapphire spray cutting liquid between plate 23 is held, shower nozzle is provided with sparge pipe (17), shower nozzle is by the cutting in sparge pipe (17)
Liquid is uniformly sprayed to sapphire to be processed, and the upper surface of device pedestal 1 is provided with catch basin, and catch basin is used to save from water spray
The cutting liquid sprayed in pipe 17, be collected to cutting liquid, it is to avoid the environment in cutting liquid pollution week, design more rationally, people
Property.
The U-shaped one end of support bar 2 away from device pedestal 1, which is provided with to run through in the first chute 7, the first chute 7, is provided with rotating shaft 24,
The two ends of rotating shaft 24, which are threaded with to rotate in the nut 4 for fastening rotating shaft 24, rotating shaft 24, is provided with tensioning wheel 25, tensioning wheel
25 are located in the U-shaped cavity of U-shaped support bar 2, and tensioning wheel 25 plays a part of tensioning to line of cut 6, and tensioning wheel 25 can be in U
Moved on type support bar 2, be easy to tension adjusting degree, the tensioning dynamics of line of cut 6 is adjusted according to different sapphires, carries
The cut quality of the device is risen.
One end of the U-shaped approaching device base 1 of support bar 2, which is provided with the second chute 14, the second chute 14, slidably connects cunning
Bar 15, and slide bar 15 is fixedly connected with the side wall of objective table 9, plays a part of guiding objective table 9 and moves, objective table 9 is by electronic
Telescopic rod 26 is lifted, can keep stablizing cutting speed in cutting sapphire, it is to avoid the uneven situation of cutting, is carried
The cut quality of the device is risen.
Operation principle：Sapphire to be cut is clamped between the first grip block 10 and the second grip block 23, blue in cutting
Fixed position of the rotatable regulation of nut 4 tensioning wheel 25 on U-shaped support bar 2 before jewel, so as to reach regulation line of cut 6
The function of tensioning dynamics, objective table 9 is moved by electric expansion bar 26, and the electronic work of spool 3 drives 6 pairs of indigo plants of line of cut
Jewel is cut.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (7)
1. a kind of processing of sapphire is with being accurately positioned cutter device, including device pedestal (1), it is characterised in that described device bottom
The upper surface of seat (1) is symmetrically arranged with two single u-shaped support bars (2), the one end of the U-shaped support bar (2) away from device pedestal (1)
It is provided with the mounting bracket (5) for installing electronic spool (3), two electronic spools (3) and is wrapped with for cutting
Cut sapphire line of cut (6)；
The upper surface of described device base (1) is symmetrically installed with electric expansion bar (26), and the electric expansion bar (26) is away from dress
One end of bottom set seat (1) is fixedly connected with objective table (9), and the upper surface side of the objective table (9) is fixedly connected with fixed plate
(8), the outer wall of the fixed plate (8) is fixedly connected with U-shaped plate (18), the U-shaped plate (18) and is rotatably connected to two first
Connecting rod (19), the head rod (19) rotates with one end of the second connecting rod (20) and is connected, two second connections
Spring (21) is connected between bar (22), the other end of second connecting rod (22) is rotated with the second grip block (23) to be connected；
The opposite side of the upper surface of the objective table (9) is fixedly connected with to run through on adjustable plate (13), the adjustable plate (13) and set
There is threaded rod (11), the one end of threaded rod (11) away from adjustable plate (13) is fixedly connected with the first grip block (10), the screw thread
Two adjusting nuts (12) are threaded with bar (11), and two adjusting nuts (12) are fastened on the two of adjustable plate (13) respectively
Side, the one end of the fixed plate (8) away from objective table (9) is provided with to run through on support frame (16), support frame as described above (16) and is provided with
Sparge pipe (17), sparge pipe (17) is used to spray to the sapphire between the first grip block (10) and the second grip block (23)
Cutting liquid.
2. a kind of sapphire processing according to claim 1 is with being accurately positioned cutter device, it is characterised in that described U-shaped
The one end of support bar (2) away from device pedestal (1), which is provided with to run through in the first chute (7), the first chute (7), is provided with rotating shaft (24),
The two ends of the rotating shaft (24) are threaded with to rotate on the nut (4) for fastening rotating shaft (24), the rotating shaft (24) and set
There is tensioning wheel (25), tensioning wheel (25) is located in the U-shaped cavity of U-shaped support bar (2), and tensioning wheel (25) rises to line of cut (6)
To the effect of tensioning.
3. a kind of sapphire processing according to claim 1 is with being accurately positioned cutter device, it is characterised in that described U-shaped
One end of support bar (2) approaching device base (1) is provided with the second chute (14), and the second chute slidably connects slide bar in (14)
(15) guiding objective table (9) motion, and slide bar (15) is fixedly connected with the side wall of objective table (9), is played a part of.
4. a kind of sapphire processing according to claim 1 is with being accurately positioned cutter device, it is characterised in that described second
The quantity of grip block (23) be no less than four, and fixed plate (8) outer wall be in rectangular arrangement.
5. a kind of sapphire processing according to claim 1 is with being accurately positioned cutter device, it is characterised in that described device
The upper surface of base (1) is provided with catch basin, and catch basin is used to save the cutting liquid sprayed from sparge pipe (17).
6. a kind of sapphire processing according to claim 1 is with being accurately positioned cutter device, it is characterised in that the cutting
Line (6) is the preferable steel wire of pliability, and the surface of line of cut (6) is bonded with diamond cut particle by bonding agent.
7. a kind of sapphire processing according to claim 1 is with being accurately positioned cutter device, it is characterised in that the water spray
Shower nozzle is provided with pipe (17), the cutting liquid in sparge pipe (17) is uniformly sprayed to sapphire to be processed by shower nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790169.0A CN107053502B (en) | 2016-08-31 | 2016-08-31 | A kind of sapphire processing accurate positioning cutter device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790169.0A CN107053502B (en) | 2016-08-31 | 2016-08-31 | A kind of sapphire processing accurate positioning cutter device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107053502A true CN107053502A (en) | 2017-08-18 |
| CN107053502B CN107053502B (en) | 2019-02-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610790169.0A Active CN107053502B (en) | 2016-08-31 | 2016-08-31 | A kind of sapphire processing accurate positioning cutter device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108724500A (en) * | 2018-08-13 | 2018-11-02 | 浙江贝盛新材料科技有限公司 | A kind of silicon single crystal rod cutting machine that the scope of application is wider |
| CN108995062A (en) * | 2018-08-13 | 2018-12-14 | 浙江贝盛新材料科技有限公司 | It is a kind of to adjust more conveniently silicon single crystal rod cutter device |
| CN109016199A (en) * | 2018-08-27 | 2018-12-18 | 温州曜世新材料科技有限公司 | A kind of graphene resin diamond wire cutting equipment |
| CN111086116A (en) * | 2019-12-23 | 2020-05-01 | 中国有色桂林矿产地质研究院有限公司 | Annular diamond wire saw cutting device |
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| JP2013089693A (en) * | 2011-10-14 | 2013-05-13 | Sumco Corp | Slice stand and manufacturing method of semiconductor wafer |
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| CN105599160A (en) * | 2016-03-28 | 2016-05-25 | 青岛理工大学 | Adjustable clamping fixing device with V-shaped structure |
| CN206170372U (en) * | 2016-08-31 | 2017-05-17 | 天通银厦新材料有限公司 | Accurate positioning cutting device is used in sapphire processing |
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| WO2009104222A1 (en) * | 2008-02-19 | 2009-08-27 | 信越半導体株式会社 | Wire saw, and work cutting method |
| CN202207756U (en) * | 2011-07-19 | 2012-05-02 | 江阴华新电器有限公司 | Automatic positioning device for stamping mould bar stocks |
| JP2013089693A (en) * | 2011-10-14 | 2013-05-13 | Sumco Corp | Slice stand and manufacturing method of semiconductor wafer |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108724500A (en) * | 2018-08-13 | 2018-11-02 | 浙江贝盛新材料科技有限公司 | A kind of silicon single crystal rod cutting machine that the scope of application is wider |
| CN108995062A (en) * | 2018-08-13 | 2018-12-14 | 浙江贝盛新材料科技有限公司 | It is a kind of to adjust more conveniently silicon single crystal rod cutter device |
| CN108995062B (en) * | 2018-08-13 | 2020-06-02 | 浙江贝盛新材料科技有限公司 | Adjust more convenient single crystal silicon rod cutting device |
| CN109016199A (en) * | 2018-08-27 | 2018-12-18 | 温州曜世新材料科技有限公司 | A kind of graphene resin diamond wire cutting equipment |
| CN111086116A (en) * | 2019-12-23 | 2020-05-01 | 中国有色桂林矿产地质研究院有限公司 | Annular diamond wire saw cutting device |
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| CN107053502B (en) | 2019-02-15 |
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