CN107039889A - A kind of manufacture method of ion wind colelctor electrode - Google Patents
A kind of manufacture method of ion wind colelctor electrode Download PDFInfo
- Publication number
- CN107039889A CN107039889A CN201710265208.XA CN201710265208A CN107039889A CN 107039889 A CN107039889 A CN 107039889A CN 201710265208 A CN201710265208 A CN 201710265208A CN 107039889 A CN107039889 A CN 107039889A
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- China
- Prior art keywords
- copper
- colelctor electrode
- base plate
- copper foil
- manufacture method
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T23/00—Apparatus for generating ions to be introduced into non-enclosed gases, e.g. into the atmosphere
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- Measurement Of Radiation (AREA)
Abstract
The invention discloses a kind of manufacture method of ion wind colelctor electrode, it utilizes copper-clad base plate, and using photoetching technique or Thermal-printing Technology with method that chemolysis substrate is combined come quick Fabrication ion wind colelctor electrode, it is with low cost, process operability is strong, and production efficiency is high, and the different colelctor electrode copper mesh of exhaust vent shapes and sizes can be quickly done according to personal experiment demand, required colelctor electrode is can obtain in short time, it is high therefore, it is possible to solve colelctor electrode cost of manufacture, latent period length and the problems such as different types of colelctor electrode is to meet requirement of experiment can not be produced rapidly according to required air holes shape.
Description
Technical field
The present invention relates to the manufacturing technology field of ion wind colelctor electrode, more particularly to a kind of manufacture of ion wind colelctor electrode
Method.
Background technology
Ion wind radiating refers in non-uniform electric field, when occurring when discharging, and is produced near the larger electrode of relative curvature
The high-speed ion jet as caused by electron avalanche effect is moved, and ionic fluid is produced strongly to surrounding in electroneutral gas molecule
Disturbance, is formed by curvature larger electrode (being referred to as emission electrode) to curvature smaller electrode (being referred to as receiving electrode or colelctor electrode) direction
Air motion.
Ion wind generator is generally made up of the electrode (emission electrode) of a needle-like and a mesh electrode (colelctor electrode),
Two electrodes are mutually in close proximity but do not contact, then the two-stage of high voltage power supply be connected with two electrodes respectively, such needle electrode with
Air-flow, i.e. ion wind will be formed between mesh electrode.
General at present to form copper mesh i.e. colelctor electrode using laser cutting or mechanical stamping stretching, still, its cost is high,
Latent period is long, and can not produce different types of colelctor electrode rapidly to meet requirement of experiment according to required air holes shape.
Therefore high colelctor electrode cost of manufacture, latent period length how to be solved and can not rapidly be manufactured according to required air holes shape
Go out the problems such as different types of colelctor electrode is to meet requirement of experiment, be that those skilled in the art need the technology solved to ask at present
Topic.
The content of the invention
It is an object of the invention to provide a kind of manufacture method of ion wind colelctor electrode, colelctor electrode can be solved and be fabricated to
This height, latent period length and it can not produce different types of colelctor electrode rapidly to meet requirement of experiment according to required air holes shape
The problems such as.
In order to solve the above technical problems, the present invention provides a kind of manufacture method of ion wind colelctor electrode, including,
S1:The structure line map of colelctor electrode needed for drawing；
S2:The structure line map is printed on the copper foil of copper-clad base plate；
S3:The copper foil of exposure on the copper-clad base plate is removed, the copper foil is obtained and is shaped as the line assumption diagram
Wiring board；
S4:The substrate of the wiring board is removed, colelctor electrode is obtained.
Preferably, the substrate for removing the wiring board is specifically, remove the substrate of the wiring board using corrosive liquid.
Preferably, the corrosive liquid is specially acetone soln or sodium hydroxide solution or liquor ferri trichloridi.
Preferably, described structure line map is printed on the copper foil of copper-clad base plate specifically includes,
S201:Photosensitive dry film is covered in the copper foil surface of copper-clad base plate, the structure line map is printed as line with litho machine
Road film；
S202:The copper-clad base plate for being covered with the photosensitive dry film is exposed by the circuit film, made described photosensitive
Dry film partially hardened corresponding with the circuit film；
S203:Uncured part on the photosensitive dry film is removed, the figure on the circuit film is printed on the copper
On paper tinsel.
Preferably, the photosensitive dry film is photo-polymerization type photosensitive dry film.
Preferably, the substrate of the copper-clad base plate is phenolic resin plate.
Preferably, described structure line map is printed on the copper foil of copper-clad base plate specifically includes,
S211:The line assumption diagram is printed using transfer paper, transfer plate is obtained；
S212:The transfer plate is covered on the copper foil of copper-clad base plate, using heat transfer machine by the transfer wiring board
It is transferred on the copper foil.
The manufacture method for the ion wind colelctor electrode that the present invention is provided, it utilizes copper-clad base plate, and uses photoetching technique or heat
Transfer technique carrys out quick Fabrication ion wind colelctor electrode with the method that chemolysis substrate is combined, and with low cost, technique is operable
Property it is strong, and production efficiency is high, and the different colelctor electrode copper of exhaust vent shapes and sizes can be quickly done according to personal experiment demand
Net, can obtain required colelctor electrode in the short time, therefore, it is possible to solve high colelctor electrode cost of manufacture, latent period length and can not root
The problems such as different types of colelctor electrode is to meet requirement of experiment is produced rapidly according to required air holes shape.
Brief description of the drawings
Fig. 1 is a kind of flow chart of embodiment of the manufacture method of ion wind colelctor electrode provided by the present invention；
Fig. 2 is a kind of flow chart of embodiment of the manufacture method of ion wind colelctor electrode provided by the present invention；
Fig. 3 is the structural representation of wiring board provided by the present invention；
Fig. 4 is a kind of structural representation of embodiment of colelctor electrode provided by the present invention.
Embodiment
The core of the present invention is to provide a kind of manufacture method of ion wind colelctor electrode, can solve colelctor electrode and be fabricated to
This height, latent period length and it can not produce different types of colelctor electrode rapidly to meet requirement of experiment according to required air holes shape
The problems such as.
In order that those skilled in the art more fully understand the present invention program, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.
Fig. 1 to Fig. 3 is refer to, Fig. 1 is a kind of specific reality of the manufacture method of ion wind colelctor electrode provided by the present invention
Apply the flow chart of mode；Fig. 2 is a kind of embodiment of the manufacture method of ion wind colelctor electrode provided by the present invention
Flow chart；Fig. 3 is the structural representation of wiring board provided by the present invention；Fig. 4 is one kind of colelctor electrode provided by the present invention
The structural representation of embodiment.
The manufacture method for the ion wind colelctor electrode that the specific embodiment of the invention is provided, including,
S1:The structure line map of colelctor electrode needed for drawing.
The structure line map of required colelctor electrode can specifically be drawn by computer software, according to the requirement of required colelctor electrode
The structure line map that air holes size and shape is drawn is a circuit network, and each grid is an air holes.
S2:Structure line map is printed on the copper foil of copper-clad base plate.
Copper-clad base plate is made up of substrate 11 and the copper foil 12 covered on the substrate 11, as makes the original of common individual layer pcb board
Beginning plate；Specifically can be from phenolic resin plate as the substrate 11 of copper-clad base plate, relatively cheap, cost is relatively low, certainly, also may be used
So that from other materials plates such as epoxy resin boards, as substrate 11, the application is not specifically limited to this.
In manufacture method provided by the present invention, have a variety of methods can realize structure line map is printed on cover it is copper-based
On the copper foil 12 of plate, in wherein a kind of embodiment, it is possible to use structure line map is printed on by photoetching technique covers copper
On the copper foil 12 of substrate, photoetching technique refers in the case where illumination is acted on, by photosensitive dry film by the pattern transfer on mask plate to covering
Technology on copper base, is specifically included,
S201:Photosensitive dry film is covered on the surface of copper foil 12 of copper-clad base plate, structure line map is printed as circuit with litho machine
Film.
S202:The copper-clad base plate for being covered with photosensitive dry film is exposed by circuit film, makes photosensitive dry film and circuit film pair
The partially hardened answered.
S203:Uncured part on photosensitive dry film is removed, the figure on circuit film is printed on copper foil 12.
Photosensitive dry film generally has two kinds, photo-polymerization type photosensitive dry film and light breakdown type photosensitive dry film, and photo-polymerization type is photosensitive dry
Film can be hardened under the light irradiation of special spectrum, and water-insoluble is become from water-soluble substances, and light breakdown type photosensitive dry film is then just
It is good opposite；The circuit film made of light imprinter is the mask plate with line assumption diagram.
By taking photo-polymerization type photosensitive dry film as an example, it is irradiated in ultraviolet by circuit film copper-based with covering for photosensitive dry film
During plate surface, every place (i.e. line assumption diagram part) corresponding area with transparent thang-kng on circuit film on photosensitive dry film
Domain, color, which is then deepened, starts hardening, tightly wraps the copper foil 12 on copper-clad base plate surface, the copper that the photosensitive dry film of hardening is covered
The shape of paper tinsel 12 is the shape of required colelctor electrode；It is then possible to copper-clad base plate is inserted into sodium carbonate liquor, it is molten by developing technique
Solution removes uncured part on photosensitive dry film, leaves the cured section on photosensitive dry film, and the figure on circuit film is by realization
The shape of required colelctor electrode is printed on copper foil 12, and makes to expose without the copper foil 12 that photosensitive dry film is protected.
In another embodiment, structure line map can also be printed on by copper-clad base plate using thermal transfer
On copper foil 12, specifically include,
S211:Line assumption diagram is printed using transfer paper, transfer plate is obtained；
S212:Transfer plate is covered on the copper foil 12 of copper-clad base plate, transfer plate is transferred in copper foil using heat transfer machine
On 12.
Laser printer and heat transfer machine are needed using thermal transfer, cost is higher, and feasibility is low, and it is advantageous to use light
Structure line map is printed on the copper foil 12 of copper-clad base plate by lithography, and cost is low, and quality is good.
S3:The copper foil 12 of exposure on copper-clad base plate is removed, the wiring board that copper foil 12 is shaped as line assumption diagram is obtained.
The copper foil 12 for removing exposure on copper-clad base plate can be finally etched, structure line map is printed according to photoetching technique
Then it is the copper foil 12 without the protection of hardened photosensitive dry film on removal copper-clad base plate on the copper foil 12 of copper-clad base plate；Turn according to heat
Print method, then to remove the copper foil 12 that no transfer plate is covered, hereafter, it is possible to obtain the circuit that copper foil 12 is shaped as line assumption diagram
Plate, i.e. wiring board specifically include substrate 11 and are shaped as the copper foil 12 of line assumption diagram.
S4:The substrate 11 of the wiring board is removed, colelctor electrode is obtained.
Remove the substrate 11 of wiring board, it is possible to obtain being shaped as the copper foil 12 of structure line map, i.e. required colelctor electrode.
Wiring board can be specifically put into the corrosive liquid that can corrode substrate 11, erode substrate 11；Corrosive liquid is specific
Can be acetone soln or sodium hydroxide solution or liquor ferri trichloridi, during etching lines plate, the temperature of corrosive liquid can not be too low,
Temperature is too low to influence corrosion rate, furthermore it is also possible to the concentration by improving corrosive liquid, to accelerate the corrosion speed of substrate 11
Degree；Under normal circumstances, 10min can finish the corrosion of substrate 11, obtain required colelctor electrode.
In summary, the invention provides a kind of manufacture method of ion wind colelctor electrode, it utilizes copper-clad base plate, and uses
Photoetching technique or Thermal-printing Technology carry out quick Fabrication ion wind colelctor electrode with the method that chemolysis substrate 11 is combined, and cost is low
Honest and clean, process operability is strong, and production efficiency is high, and can quickly do exhaust vent shapes and sizes not according to personal experiment demand
Required colelctor electrode is can obtain in same colelctor electrode copper mesh, short time, colelctor electrode cost of manufacture is high, wait all therefore, it is possible to solve
Phase length and the problems such as different types of colelctor electrode is to meet requirement of experiment can not be produced rapidly according to required air holes shape.
The manufacture method to ion wind colelctor electrode provided by the present invention is described in detail above.It is used herein
Specific case is set forth to the principle and embodiment of the present invention, and the explanation of above example is only intended to help and understands this
The method and its core concept of invention.It should be pointed out that for those skilled in the art, not departing from this hair
On the premise of bright principle, some improvement and modification can also be carried out to the present invention, these are improved and modification also falls into power of the present invention
In the protection domain that profit is required.
Claims (7)
1. a kind of manufacture method of ion wind colelctor electrode, it is characterised in that including,
S1:The structure line map of colelctor electrode needed for drawing；
S2:The structure line map is printed on the copper foil of copper-clad base plate；
S3:The copper foil of exposure on the copper-clad base plate is removed, the line that the copper foil is shaped as the line assumption diagram is obtained
Road plate；
S4:The substrate of the wiring board is removed, colelctor electrode is obtained.
2. manufacture method according to claim 1, it is characterised in that the substrate of the removal wiring board specifically,
The substrate of the wiring board is removed using corrosive liquid.
3. manufacture method according to claim 2, it is characterised in that the corrosive liquid is specially acetone soln or hydroxide
Sodium solution or liquor ferri trichloridi.
4. the manufacture method according to claims 1 to 3 any one, it is characterised in that described to print structure line map
Specifically included on the copper foil of copper-clad base plate,
S201:Photosensitive dry film is covered in the copper foil surface of copper-clad base plate, the structure line map is printed as circuit glue with litho machine
Piece；
S202:The copper-clad base plate for being covered with the photosensitive dry film is exposed by the circuit film, makes the photosensitive dry film
Partially hardened corresponding with the circuit film；
S203:Uncured part on the photosensitive dry film is removed, the figure on the circuit film is printed on the copper foil.
5. manufacture method according to claim 4, it is characterised in that the photosensitive dry film is photo-polymerization type photosensitive dry film.
6. manufacture method according to claim 5, it is characterised in that the substrate of the copper-clad base plate is phenolic resin plate.
7. manufacture method according to claim 1, it is characterised in that described that structure line map is printed on copper-clad base plate
Specifically included on copper foil,
S211:The line assumption diagram is printed using transfer paper, transfer plate is obtained；
S212:The transfer plate is covered on the copper foil of copper-clad base plate, the transfer wiring board is transferred using heat transfer machine
On the copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710265208.XA CN107039889A (en) | 2017-04-21 | 2017-04-21 | A kind of manufacture method of ion wind colelctor electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710265208.XA CN107039889A (en) | 2017-04-21 | 2017-04-21 | A kind of manufacture method of ion wind colelctor electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107039889A true CN107039889A (en) | 2017-08-11 |
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ID=59535153
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710265208.XA Pending CN107039889A (en) | 2017-04-21 | 2017-04-21 | A kind of manufacture method of ion wind colelctor electrode |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1599965A (en) * | 2001-10-11 | 2005-03-23 | 迪诺佛研究有限公司 | Digital battery |
| CN102569619A (en) * | 2011-12-30 | 2012-07-11 | 广州市鸿利光电股份有限公司 | Method for making chip-on-board (COB) light source |
| CN103984458A (en) * | 2011-01-18 | 2014-08-13 | 富士胶片株式会社 | Transparent electrode sheet, method for manufacturing transparent electrode sheet, and capacitive touch panel using such transparent electrode sheet |
| CN105611745A (en) * | 2016-03-04 | 2016-05-25 | 广德英菲特电子有限公司 | Local thick copper plating method for PCB production process |
-
2017
- 2017-04-21 CN CN201710265208.XA patent/CN107039889A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1599965A (en) * | 2001-10-11 | 2005-03-23 | 迪诺佛研究有限公司 | Digital battery |
| CN103984458A (en) * | 2011-01-18 | 2014-08-13 | 富士胶片株式会社 | Transparent electrode sheet, method for manufacturing transparent electrode sheet, and capacitive touch panel using such transparent electrode sheet |
| CN102569619A (en) * | 2011-12-30 | 2012-07-11 | 广州市鸿利光电股份有限公司 | Method for making chip-on-board (COB) light source |
| CN105611745A (en) * | 2016-03-04 | 2016-05-25 | 广德英菲特电子有限公司 | Local thick copper plating method for PCB production process |
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Application publication date: 20170811 |
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| RJ01 | Rejection of invention patent application after publication |