CN107037681B - A kind of micromation projective module group and its micro- galvanometer encapsulation base - Google Patents
A kind of micromation projective module group and its micro- galvanometer encapsulation base Download PDFInfo
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- CN107037681B CN107037681B CN201710411898.5A CN201710411898A CN107037681B CN 107037681 B CN107037681 B CN 107037681B CN 201710411898 A CN201710411898 A CN 201710411898A CN 107037681 B CN107037681 B CN 107037681B
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- Prior art keywords
- galvanometer
- micro
- positioning protrusion
- positioning
- module group
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
- G02B26/04—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light by periodically varying the intensity of light, e.g. using choppers
Abstract
The invention discloses a kind of micromation projective module group and its micro- galvanometer encapsulation bases, including the mounting platform for installing micro- galvanometer, mounting platform is provided with multiple positioning datum structures for realizing the positioning of micro- galvanometer, micro- galvanometer three-dimensional surface is supported by multiple positioning datum structure respectively and realizes that micro- galvanometer is positioned in the entirety of mounting platform.The present invention provides a kind of micromation projective module group and its micro- galvanometer encapsulation base, accurate positionin of the galvanometer mirror surface in total is realized using special positioning datum structure, and then it can reduce required galvanometer size, the encapsulation volume of entire mould group is greatly reduced, realizes the high-precision encapsulation of micromation projective module group galvanometer.
Description
Technical field
The present invention relates to structure light scan imaging fields, and in particular to a kind of micromation projective module group and its encapsulation of micro- galvanometer
Pedestal.
Background technique
Specific pattern is irradiated on object under test, then body surface is calculated by the pattern of shooting body surface modulation
Range information, be a kind of currently used 3D scanning imaging technology.For increasingly pursuing the electronic product of micromation, scan
The volume and performance of mould group have become more important.The existing scan module using micro- galvanometer, galvanometer determining in the module
Position is inaccurate, not only limits the volume of entire micro- galvanometer module, and the volume of entire galvanometer mirror surface and the stability of performance are negative
Correlation, its stability of the galvanometer of large volume and reliability all cannot be guaranteed.These problems seriously restrict entire projective module group mould
Block is towards miniaturization.
Therefore, the prior art also requires further improvement and develops.
Summary of the invention
The purpose of the invention is to provide a kind of micromation projective module group and its micro- galvanometer encapsulation base, it is intended to solve micro-
Galvanometer stability and the problem of reliability is high, position inaccurate.
Used technical solution are as follows:
It is a kind of be miniaturized projective module group micro- galvanometer encapsulation base surrounded including the mounting platform for installing micro- galvanometer
Multiple positioning datum structures that mounting platform is provided with for realizing the positioning of micro- galvanometer, pass through multiple positioning datum structure respectively
It supports micro- galvanometer three-dimensional surface and realizes that micro- galvanometer is positioned in the entirety of mounting platform.
Multiple positioning datum structures are multiple positioning protrusion of corresponding micro- galvanometer three-dimensional surface setting, multiple positioning protrusion
It is point contact with micro- galvanometer surface, multiple positioning protrusion is distributed in three orthogonal planes.
Multiple positioning protrusion include the first positioning protrusion of corresponding micro- galvanometer bottom surface setting, which is set as
At least three.
First positioning protrusion is distributed in the left and right sides of mounting platform.
Multiple positioning protrusion include the second positioning protrusion of corresponding micro- galvanometer left side or right side setting, second positioning
Protrusion is set as at least two.
Multiple positioning protrusion include the third positioning protrusion of corresponding micro- galvanometer leading flank setting, third positioning protrusion setting
For at least one.
Mounting platform surface forms the bonding plane that micro- galvanometer is bonded by bonding agent, is provided on bonding plane and leads glue groove, glues
Junction and encapsulation base bottom plane are in 45 ° of angles.
Bonding plane is parallel with plane where the vertex of first positioning protrusion, and the distance between two planes are equal to bonding agent
The partial size of middle conductive filler.
Multiple positioning datum structures are three positioning surfaces of corresponding micro- galvanometer three-dimensional surface setting, are put down where three positioning surfaces
Face is mutually perpendicular to.
Being miniaturized includes micro- galvanometer encapsulation base in projective module group.
The utility model has the advantages that the present invention provides a kind of micromation projective module group and its micro- galvanometer encapsulation base, determined using special
Position benchmark architecture realizes accurate positionin of micro- galvanometer mirror surface in total, and then can reduce required galvanometer size, greatly
Width reduces the encapsulation volume of entire mould group, realizes the high-precision encapsulation of micromation projective module group galvanometer.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of micro- galvanometer encapsulation base in the specific embodiment of the invention.
Fig. 2 is the structural schematic diagram that scanning module is miniaturized in the specific embodiment of the invention.
Fig. 3 is the structure top view of micro- galvanometer encapsulation base in the specific embodiment of the invention.
Fig. 4 be in the specific embodiment of the invention micro- galvanometer encapsulation base to the positioning method schematic diagram of micro- galvanometer.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer and more explicit, right as follows in conjunction with drawings and embodiments
The present invention is further described.
A kind of micro- galvanometer encapsulation base 102 of micromation projective module group as shown in Figure 1, including for installing micro- galvanometer
108 mounting platform is provided with multiple positioning datum structures for realizing the positioning of micro- galvanometer 108 around mounting platform, respectively
Micro- 108 three-dimensional surface of galvanometer, which is supported, by multiple positioning datum structure realizes that micro- galvanometer 108 is positioned in the entirety of mounting platform.
It include micro- galvanometer encapsulation base 102, laser 104,106 and of optical lens in a kind of micromation projective module group as shown in Figure 2
Micro- galvanometer 108.
In preferred embodiment 1, multiple positioning datum structures are multiple positioning of corresponding micro- 108 three-dimensional surface of galvanometer setting
Protrusion, multiple positioning protrusion and micro- 108 surface of galvanometer are point contact, and multiple positioning protrusion is distributed in three and is mutually perpendicular to
Plane on.Multiple positioning protrusion include the first positioning protrusion of corresponding micro- 108 bottom surface of galvanometer setting, the second positioning protrusion, the
Three positioning protrusion.First positioning protrusion is set as three, is distributed in the left and right sides of mounting platform, belongs to three different peaces
Plane is filled, the side of mounting platform is arranged in the first positioning protrusion of two of them, and the setting of another first positioning protrusion is being installed
The other side of platform determines position of micro- galvanometer 108 on the face with three positioning protrusion.Second positioning protrusion is set as two
It is a, position of micro- galvanometer 108 on the face is determined with two positioning protrusion.Third positioning protrusion is set as one, fixed with one
Position protrusion determines position of micro- galvanometer 108 on the face.
First positioning protrusion limits three degree of freedom, and respectively X-axis rotation, Y-axis rotation, Z axis is mobile.Second positioning protrusion
Vertical with the first positioning protrusion, the second positioning protrusion is arranged two, limits two freedom degrees, X-axis is mobile, Z axis rotates.Third is fixed
Position protrusion is vertical with the first positioning protrusion, the second positioning protrusion, and third positioning protrusion is arranged one, limits one degree of freedom Y-axis
It is mobile.The six-freedom degree that micro- galvanometer 108 is limited by three positioning protrusion makes micro- galvanometer 108 be in fixed state, improves
The precision of positioning.
Mounting platform surface forms the bonding plane 302 that micro- galvanometer 108 is bonded by bonding agent, is provided on bonding plane 302
Glue groove 304 is led, glue groove 304 is led for accommodating the extra excessive glue generated in bonding process, guarantees that bondline thickness is precisely controlled.Bonding
Face 302 and 102 bottom plane of encapsulation base are in 45 ° of angles, when this angle can guarantee that optical lens 106 does not work, are passed through
The linear type beam orthogonal of optical lens 106 goes out light.Plane is flat where the vertex of bonding plane 302 and first positioning protrusion
Row, the distance between two planes are equal to the partial size of conductive filler in bonding agent, specifically, bonding agent is conductive silver glue, when two flat
When the distance between face is equal to the partial size of particle in conductive silver glue, one layer of conductive silver glue can only be filled between two planes, will not be gone out
The case where now expanding with heat and contract with cold and making position inaccurate improves positioning accuracy.
When the invention works, laser 104 emits Gaussian beam under control system control, dissipates by optical lens 106
The focal word light beam of tool is penetrated into, micro- galvanometer 108 does twist motion under control of the control system.By control system to sharp
The control of the precise synchronization of light device 104 and micro- galvanometer 108 adjusts the power of laser 104 according to certain rule, in micro- galvanometer
In 108 scan period, the illuminating effect of certain bar-shaped zones can be realized in rectangle light curtain region.
As shown in figure 3, multiple positioning datum structures are corresponding micro- 108 three-dimensional surface of galvanometer setting in preferred embodiment 2
Multiple positioning surfaces, multiple positioning surface and micro- 108 surface of galvanometer are face contact.Multiple positioning surfaces include corresponding micro- galvanometer
The first positioning surface 201, the second positioning surface 203, third positioning surface 205 of 108 bottom surfaces setting.First positioning surface 201 is set as three
It is a, it is distributed in the left and right sides of mounting platform, the side of mounting platform is arranged in the first positioning surface of two of them 201, another
The other side of mounting platform is arranged in first positioning surface 201, determines position of micro- galvanometer 108 on the face with three positioning surfaces.
Second positioning surface 203 is set as two, determines position of micro- galvanometer 108 on the face with two positioning surfaces.Third positioning surface 205
It is set as one, position of micro- galvanometer 108 on the face is determined with a positioning surface.
First positioning surface 201 as shown in Figure 4 limits three degree of freedom, and respectively X-axis rotation, Y-axis rotation, Z axis is mobile.The
Two positioning surfaces 203 are vertical with the first positioning surface 201, and the second positioning surface 203 is arranged two, limit two freedom degrees, X-axis movement, Z
Axis rotation.Third positioning surface 205 is vertical with the first positioning surface 201, the second positioning surface 203, and third positioning surface 205 is arranged one,
It is mobile to limit one degree of freedom Y-axis.The six-freedom degree that micro- galvanometer 108 is limited by three positioning surfaces is in micro- galvanometer 108
Fixed state improves the precision of positioning.
Mounting platform surface forms the bonding plane 302 that micro- galvanometer 108 is bonded by bonding agent, is provided on bonding plane 302
Glue groove 304 is led, glue groove 304 is led for accommodating the extra excessive glue generated in bonding process, guarantees that bondline thickness is precisely controlled.Bonding
Face 302 and 102 bottom plane of encapsulation base are in 45 ° of angles, when this angle can guarantee that optical lens 106 does not work, are passed through
The linear type beam orthogonal of optical lens 106 goes out light.Bonding plane 302 is parallel with 201 plane of the first positioning surface, two planes it
Between distance be equal to bonding agent in conductive filler partial size, specifically, bonding agent be conductive silver glue, when the distance between two planes
Equal to one layer of conductive silver glue can only be filled in conductive silver glue when the partial size of particle, between two planes, be not in expand with heat and contract with cold and
The case where making position inaccurate, improves positioning accuracy.
When the invention works, laser 104 emits Gaussian beam under control system control, dissipates by optical lens 106
The focal word light beam of tool is penetrated into, micro- galvanometer 108 does twist motion under control of the control system.By control system to sharp
The control of the precise synchronization of light device 104 and micro- galvanometer 108 adjusts the power of laser 104 according to certain rule, in micro- galvanometer
In 108 scan period, the illuminating effect of certain bar-shaped zones can be realized in rectangle light curtain region.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (3)
1. a kind of micro- galvanometer encapsulation base that projective module group is miniaturized, which is characterized in that including the installation for installing micro- galvanometer
Platform is provided with multiple positioning datum structures for realizing the positioning of micro- galvanometer around mounting platform, respectively by multiple fixed
Position benchmark architecture supports micro- galvanometer three-dimensional surface and realizes that micro- galvanometer is positioned in the entirety of mounting platform；The multiple positioning datum knot
Structure is multiple positioning protrusion of corresponding micro- galvanometer three-dimensional surface setting, and multiple positioning protrusion is that point connects with micro- galvanometer surface
Touching, multiple positioning protrusion are distributed in three orthogonal planes；The multiple positioning protrusion includes corresponding micro- galvanometer bottom
First positioning protrusion of face setting, first positioning protrusion are set as at least three；First positioning protrusion is distributed in installation
The left and right sides of platform；The multiple positioning protrusion includes the second convex of corresponding micro- galvanometer left side or right side setting
It rises, which is set as at least two；The multiple positioning protrusion includes the of corresponding micro- galvanometer leading flank setting
Three positioning protrusion, the third positioning protrusion are set as at least one；The mounting platform surface formation is bonded micro- by bonding agent
The bonding plane of galvanometer is provided on the bonding plane and leads glue groove, and the bonding plane and encapsulation base bottom plane are in 45 ° of angles；
The bonding plane is parallel with plane where the vertex of first positioning protrusion, and the distance between two planes, which are equal in bonding agent, to be led
The partial size of electric filler.
2. micro- galvanometer encapsulation base of micromation projective module group according to claim 1, which is characterized in that the multiple fixed
Position benchmark architecture is three positioning surfaces of corresponding micro- galvanometer three-dimensional surface setting, and plane where three positioning surfaces is mutually perpendicular to.
3. a kind of micromation projective module group, which is characterized in that include any one of claim 1-2 in the micromation projective module group
Micro- galvanometer encapsulation base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710411898.5A CN107037681B (en) | 2017-06-05 | 2017-06-05 | A kind of micromation projective module group and its micro- galvanometer encapsulation base |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710411898.5A CN107037681B (en) | 2017-06-05 | 2017-06-05 | A kind of micromation projective module group and its micro- galvanometer encapsulation base |
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| CN107037681A CN107037681A (en) | 2017-08-11 |
| CN107037681B true CN107037681B (en) | 2018-12-21 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201046526Y (en) * | 2007-04-19 | 2008-04-16 | 深圳市大族激光科技股份有限公司 | Vibrating mirror scanning modular fixing apparatus |
| CN103676146A (en) * | 2013-11-28 | 2014-03-26 | 成都位时通科技有限公司 | Galvanometer device used for scanning head |
| CN106125299A (en) * | 2016-06-30 | 2016-11-16 | 青岛瑞优德智能科技有限公司 | The encapsulation method for simplifying of a kind of 3D laser scanning module and module |
| CN206178242U (en) * | 2016-11-23 | 2017-05-17 | 青岛小优智能科技有限公司 | Electric -heating type MEMS galvanometer scanning module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014235351A (en) * | 2013-06-04 | 2014-12-15 | 富士フイルム株式会社 | Scanning optical system, optical scanner, and radiation image reading device |
-
2017
- 2017-06-05 CN CN201710411898.5A patent/CN107037681B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201046526Y (en) * | 2007-04-19 | 2008-04-16 | 深圳市大族激光科技股份有限公司 | Vibrating mirror scanning modular fixing apparatus |
| CN103676146A (en) * | 2013-11-28 | 2014-03-26 | 成都位时通科技有限公司 | Galvanometer device used for scanning head |
| CN106125299A (en) * | 2016-06-30 | 2016-11-16 | 青岛瑞优德智能科技有限公司 | The encapsulation method for simplifying of a kind of 3D laser scanning module and module |
| CN206178242U (en) * | 2016-11-23 | 2017-05-17 | 青岛小优智能科技有限公司 | Electric -heating type MEMS galvanometer scanning module |
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| Publication number | Publication date |
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| CN107037681A (en) | 2017-08-11 |
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