CN106125299A - The encapsulation method for simplifying of a kind of 3D laser scanning module and module - Google Patents
The encapsulation method for simplifying of a kind of 3D laser scanning module and module Download PDFInfo
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- CN106125299A CN106125299A CN201610503094.3A CN201610503094A CN106125299A CN 106125299 A CN106125299 A CN 106125299A CN 201610503094 A CN201610503094 A CN 201610503094A CN 106125299 A CN106125299 A CN 106125299A
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- laser
- module
- bright finish
- casing
- lens
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
The invention discloses encapsulation method for simplifying and the module of a kind of 3D laser scanning module, use chip of laser as light source, being made into one casing, described integration casing includes optical window and battery of lens, chip of laser and scanning galvanometer are fixed on prefabricated pedestal, casing and pedestal are assembled and sealed the encapsulation i.e. completing 3D laser scanning module.The invention has the beneficial effects as follows: use the packaging technology of semiconductor laser chip integration, creative use has multiple function bright finish casing, it is greatly simplified the packaging technology of whole module, simultaneously with the obvious advantage in terms of reducing pollution and reducing cost and increase sealing.
Description
Technical field
The present invention relates to photoelectric field, particularly to encapsulation method for simplifying and the module of a kind of 3D laser scanning device.
Background technology
Specific pattern is irradiated on object under test, then the pattern modulated by body surface by shooting calculates object table
The range information in face, is the most conventional a kind of 3D scanning imaging technology.For increasingly pursuing the electronic product of miniaturization, sweep
Volume and the performance of retouching module have become the most important.Existing 3D laser scanning module mostly uses laser instrument TO to encapsulate,
Its assembly includes TO laser instrument, plus lens, dispersing lens, scanning galvanometer and control system.This encapsulation process has 3 problems,
The modular volume of the first use TO laser instrument is excessive；Second separates due to multi-part, and light path coupling process becomes sufficiently complex；
3rd module internal comprises multiple accurate device, and light path coupling process viscose glue repeatedly can cause device contamination to increase the weight of, affect whole
The performance of individual module.On this background, we have invented a kind of 3D using semiconductor laser chip integrative packaging to swash
Light scanning apparatus.
Summary of the invention
In order to realize foregoing invention purpose, the invention provides encapsulation method for simplifying and the mould of a kind of 3D laser scanning module
Group, it is possible to solve volume in existing scanning module excessive, isolation of components, coupling difficulty, viscose glue pollutes, and high a series of ask cost
Topic.
Technical scheme shows as, and uses semiconductor laser chip as light source, by plus lens, dispersing lens, goes out light
Window integrating casing, pedestal is installed chip of laser and scanning galvanometer, and chassis cover is buckled on pedestal.By with top
Formula decreases the volume that module needs.
The encapsulation method for simplifying of a kind of 3D laser scanning module, uses chip of laser as light source, being made into one machine
Shell, described integration casing includes optical window and battery of lens, chip of laser and scanning galvanometer is fixed on prefabricated pedestal
On, casing and pedestal are assembled and are sealed the encapsulation i.e. completing 3D laser scanning module.
The described battery of lens of described integration casing has convergence bright finish and scattering bright finish；Described integration casing uses phase
Same optical material is one-body molded to be made.
The mode that described integration casing can also use the bonding solidification of multiple minute surface to be made.
To described go out optical window face do anti-reflection process or additionally plate anti-reflection film, by change window size, control light
The angle that bundle is strafed, described angle includes the angle of horizontal and vertical directions.
The encapsulation of a kind of D laser scanning device simplifies module, including control system, scanning galvanometer and pedestal, described scanning
Galvanometer is fixed on described pedestal, also includes the chip of laser being fixed on described pedestal equally, and cover is buckled in described pedestal
On integrated casing, described casing is provided with battery of lens and goes out optical window face, described battery of lens is positioned at described chip of laser
And between described scanning galvanometer, described in go out optical window face and be positioned at the top of described scanning galvanometer, described battery of lens includes swashing with described
Light device chip just to convergence bright finish, and be positioned at the scattering bright finish of described convergence bright finish side.
Be preferably, described casing by described battery of lens with go out optical window face same optical material and produce once molding, institute
Stating out optical window face and be positioned at the side of described battery of lens, described battery of lens includes converging bright finish and being positioned at described convergence bright finish side
Scattering bright finish.
The optical lens group bright finish that described integration casing is comprised includes converging bright finish and scattering bright finish.Wherein converged light
The Gaussian beam that semiconductor laser chip is launched is pooled collimated light beam by face, and dispersing lens scatters after being converged by collimated light beam
Become line style light beam, be applied in combination so that point-like Gaussian spot originally diverges to uniform line by converging bright finish and scattering bright finish
Property light beam.
Being preferably, described casing uses the mode of injection moulding integrated molding, or uses by the bonding solidification of multiple minute surfaces
Mode.Its effect is all to be fixed by the position of battery of lens and casing, simplifies light path coupling process.
Being preferably, described convergence bright finish is aspherical mirror, and described convergence CD is had certain dissipating what laser instrument sent
It is high that the Gaussian beam of firing angle is modulated into mid portion Energy distribution, the collimated light beam that marginal distribution is weak；Described scattering bright finish is non-
Rule minute surface, the first convergence of the homogenizer by converging bright finish is dissipated by described scattering bright finish again.
It is preferably, described scanning galvanometer, is arranged on described scattering bright finish and first converges the place with a tight waist of the light dissipated again.
Being preferably, described laser instrument, its wavelength covering visible light and infrared band, this laser instrument emerging beam is Gauss
Light beam, size meets described convergence bright finish and the launching spot requirement of scattering bright finish.
Being preferably, what described integration casing was comprised goes out optical window face, and this position needs do anti-reflection process or additionally plate
Anti-reflection film, to increase light extraction efficiency.The angle of beam sweep, described angle can also be controlled by changing the size of window
Angle including horizontal and vertical directions.Independent going out optical window compared to general, this bright finish is not required in encapsulation process
The most bonding, during can reducing pollution.The sealing property simultaneously making whole casing is more superior.
Being preferably, described scanning galvanometer includes reflecting mirror, gyroaxis and pedestal.Reflecting mirror can direct reflection laser light
Bundle；Gyroaxis stationary mirror also enables reflecting mirror it does reciprocating rotary, in order to make the type laser beam reflected be scanned into
Two bit plane projections.Pedestal is fixed gyroaxis and provides support.
Described control system includes that laser control and scanning galvanometer control.Said two control system collaborative work, logical
Cross corresponding relation and can control the parameters such as the light and shade of scanning projection, shape, density.
The technical scheme that the embodiment of the present invention provides has the benefit that
First: use semiconductor laser chip to replace the laser instrument of tradition TO encapsulation so that whole modular structure has
Less volume.As a example by 830nm TO laser instrument, in the case of assembling same scan galvanometer, use 830nm TO laser instrument
The 3D scanning module thickness of encapsulation is at about 10mm, and the 3D scanning module thickness using semiconductor laser chip to encapsulate is permissible
Control at about 5mm.This size means that module can be embedded in the circuit board of movable equipment easily, is greatly improved this mould
The usage range of group.
Second: casing by battery of lens, is gone out optical window and is integrated into a device, integral packaging by this 3D scanning module.This design
Being advantageous in that, general 3D surface sweeping module should need to complete laser instrument in encapsulation process simultaneously, dispersing lens, converges thoroughly
Mirror, scanning galvanometer and the light path coupling going out 5 parts of optical window, production efficiency and yield rate are the most impacted.And existing optocoupler
Conjunction technology all parts needs repeatedly to bond, and this not only can affect the optical property of product, also can cause air-tightness and pollution etc.
Series of problems.
The method using injection mo(u)lding obtains integration casing, and this casing, dispersing lens, plus lens, goes out optical window and integrates
It is an entirety.The advantage of this design is, restrained the least of tolerance between one-body molded each optical surface, greatly reduces
The technological requirement of coupling, in using the 3D of this encapsulation technology to scan, module has only to fix laser instrument on pedestal and scanning is shaken
The position of mirror, then casing sealing just can be completed whole encapsulation process, it is advantageous to commercial production；Compared to individually processing thoroughly
Mirror group, goes out optical window, and protective housing uses integrated housing can be able to be greatly lowered when volume production: owing to being to be integrally machined
Molding completely solves the sealing problem of 3D surface sweeping module, further Simplified flowsheet, reduces cost.And owing to parts are whole
Closing, continuous print viscose glue pollutes and sealing problem also obtained good solution.
In sum, the novel 3D scanning means that the present invention provides, use the encapsulation of semiconductor laser chip integration
Technique, creative use has multiple function bright finish casing, is greatly simplified the packaging technology of whole module, is reducing dirt simultaneously
Dye reduces cost and increase sealing aspect is with the obvious advantage.
Accompanying drawing explanation
Fig. 1 is entirety module structural front view of the present invention.
Fig. 2 is entirety modular structure top view of the present invention.
Fig. 3 is integral machine shell structure schematic diagram of the present invention.
Fig. 4 is lens arrangement schematic diagram top view used by the present invention.
Fig. 5 is lens arrangement schematic diagram front view used by the present invention.
Fig. 6 is light channel structure schematic diagram top view of the present invention.
Fig. 7 is light channel structure schematic diagram front view of the present invention.
Fig. 8 is 3D scanning module principle schematic used in the present invention.
Wherein, reference is: 102, chip of laser；104, collimation minute surface；106, casing；108, pedestal；110, control
System processed；202, bright finish is converged；204, scattering bright finish；206, optical window is gone out.
Detailed description of the invention
Relatively big for tradition 3D laser scanning module packaging volume, limiting it provides in a lot of field questions, the present invention
The encapsulation method for simplifying of a kind of 3D laser scanning module and module.
Embodiment one:
Seeing Fig. 1 to Fig. 7, the present invention is encapsulation method for simplifying and the module of a kind of 3D laser scanning module:
The encapsulation method for simplifying of a kind of 3D laser scanning module, uses chip of laser as light source, being made into one machine
Shell, integration casing includes optical window and battery of lens, chip of laser and scanning galvanometer is fixed on prefabricated pedestal, will
Casing and pedestal assemble and are sealed the encapsulation i.e. completing 3D laser scanning module.
The battery of lens of integration casing has convergence bright finish and scattering bright finish；Integration casing uses identical optical material
One-body molded it is made.
Integration casing is made by the bonding solidification of multiple minute surfaces.
Do anti-reflection process to going out optical window face or additionally plate anti-reflection film, by changing the size of window, controlling light beam and sweep
The angle penetrated, angle includes the angle of horizontal and vertical directions.
The encapsulation method for simplifying of a kind of 3D laser scanning module and module, including laser instrument 102, scanning galvanometer 104, integrally
Change casing 106, pedestal 108, control system 110.
Wherein casing 106 comprises 3 different optical function faces, including converging bright finish 202, scatters bright finish 204, goes out optical window
Bright finish 206.
Sequence is, first semiconductor laser chip 102 and scanning galvanometer 104 is fixed on pedestal 108, then will
Pedestal 108 and casing 106 seal, and i.e. complete assembling.
Specific implementation process is:
Semiconductor laser chip 102 is incident upon battery of lens 202 incidence surface of casing after going out light, the effect of this bright finish be by
The high beam that semiconductor laser chip 102 is sent converges as collimated light beam.Then this collimated light beam goes out light through battery of lens
Face 204, the effect of this bright finish is will to be incident upon on scanning galvanometer 104, subsequently as the collimated light beam of dormitory converges and again dissipates
Light becomes scanning light beam through exiting surface 206 outgoing of casing 106.Control system 110 is bright by Collaborative Control laser instrument
Go out and the vibration of scanning galvanometer, finally make surface sweeping light beam, become and meet necessarily required structure light.
Described semiconductor laser chip 102, its wavelength can be visible ray, it is also possible to be infrared light.Make according to actual
Using environmental selection laser power, its emerging beam is Gaussian beam, and size meets the incident illumination of plus lens and dispersing lens
Speckle requirement.
Described casing 106, including three bright finish；Converge bright finish 202, scatter bright finish 204, go out optical window bright finish 206.This model
Can be integrated and in other examples this integration casing can not be integrated, but by multiple mirrors
The bonding solidification in face.Its effect is all to be fixed by the position of battery of lens and casing, simplifies light path coupling process.
Described casing 106 battery of lens converges 202, and for aspherical mirror, its purpose is had necessarily what laser instrument 102 sent
It is high that the Gaussian beam of angle of scattering is modulated into mid portion Energy distribution, the collimated light beam that marginal distribution is weak.
Described casing 106 battery of lens scattering bright finish 204 can be with right and wrong cylindrical mirror, it is also possible to be other irregular minute surfaces.Should
The effect of lens face is to be dissipated by the homogenizer of plus lens 202.
Described scanning galvanometer 104, the most in one direction can twisting vibration, it should not have object to hide in going out optical range
Gear, the angles of this example is 45 °, can also be configured to other angles by reflection or projecting light path in other examples
Degree.
Shown scanning galvanometer 104, its position is configured in the place with a tight waist first converging the light dissipated again through 204 bright finish.
Described casing 106 go out optical window face 206, can be to use same optical material one-body molded with casing.And
Using other materials in other examples, or do coating film treatment, its effect is all printing opacity.
Control system 110 is configured to finally to make with the flickering vibration with scanning galvanometer of Collaborative Control laser instrument
Surface sweeping light beam, becomes and meets necessarily required structure light.
And this integration casing can not be integrated in other examples, but bonding solid by multiple minute surfaces
Change.Its effect is all to be fixed by the position of battery of lens and casing, simplifies light path coupling process.
Also have in some examples, can by semiconductor laser chip and incident light plane or incident light plane and outgoing
Add other light paths between bright finish, and change laser instrument or the position of battery of lens bright finish or shape, but no more than this patent
Light is through the battery of lens with casing one, and scanning galvanometer eventually passes out the category of model of the last outgoing of optical window.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (10)
1. the encapsulation method for simplifying of a 3D laser scanning module, it is characterised in that use chip of laser as light source, make
Integration casing, described integration casing includes optical window and battery of lens, is fixed on prefabricated by chip of laser and scanning galvanometer
On good pedestal, casing and pedestal are assembled and are sealed the encapsulation i.e. completing 3D laser scanning module.
The encapsulation method for simplifying of 3D laser scanning module the most according to claim 1, it is characterised in that described integral machine
The described battery of lens of shell has convergence bright finish and scattering bright finish；Described integration casing uses identical optical material one-body molded
It is made.
The encapsulation method for simplifying of 3D laser scanning module the most according to claim 1, it is characterised in that described integral machine
Shell is made by the bonding solidification of multiple minute surfaces.
The encapsulation method for simplifying of 3D laser scanning device the most according to claim 1, it is characterised in that to described go out optical window
Face is done anti-reflection process or additionally plates anti-reflection film, by changing the size of window, controls the angle of beam sweep, described angle
Angle including horizontal and vertical directions.
5. the encapsulation of 3D laser scanning device simplifies a module, including control system (110), scanning galvanometer (104) and pedestal
(108), described scanning galvanometer (104) is fixed on described pedestal (108), it is characterised in that: also include being fixed on equally described
Chip of laser (102) on pedestal (108), and the integrated casing (106) that cover is buckled on described pedestal (108), described machine
Being provided with battery of lens on shell (106) and go out optical window face (206), described battery of lens is positioned at described chip of laser (102) with described
Between scanning galvanometer (104), described in go out optical window face (206) and be positioned at the top of described scanning galvanometer (104), described battery of lens includes
With described chip of laser (102) just to convergence bright finish (202), and be positioned at the scattered light of described convergence bright finish (202) side
Face (204).
6. the encapsulation of 3D laser scanning device as claimed in claim 5 simplifies module, it is characterised in that: described casing (106)
By described battery of lens with go out optical window face (206) same optical material and produce once molding, described in go out optical window face (206) and be positioned at
The side of described battery of lens, described battery of lens includes converging bright finish (202) and being positioned at the scattering of described convergence bright finish (202) side
Bright finish (204).
7. the encapsulation of 3D laser scanning device as claimed in claim 5 simplifies module, it is characterised in that: described convergence bright finish
(202) it is aspherical mirror, the Gauss light with certain angle of scattering that described convergence CD (202) is sent laser instrument (102)
It is high that bundle is modulated into mid portion Energy distribution, the collimated light beam that marginal distribution is weak；Described scattering bright finish (204) is irregular mirror
Face, the first convergence of the homogenizer by converging bright finish (202) is dissipated by described scattering bright finish (204) again.
8. the encapsulation of 3D laser scanning device as claimed in claim 7 simplifies module, it is characterised in that: described scanning galvanometer
(104), it is arranged on described scattering bright finish (204) and first converges the place with a tight waist of the light dissipated again.
The encapsulation of 3D laser scanning device the most according to claim 5 simplifies module, it is characterised in that described laser instrument
(102), its wavelength covering visible light and infrared band, this laser instrument emerging beam is Gaussian beam, and size meets described remittance
Caustic surface (202) and the launching spot requirement of scattering bright finish (204).
The encapsulation of 3D laser scanning device the most according to claim 5 simplifies module, it is characterised in that described in go out optical window
Antireflection coating is done in face (206).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610503094.3A CN106125299A (en) | 2016-06-30 | 2016-06-30 | The encapsulation method for simplifying of a kind of 3D laser scanning module and module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610503094.3A CN106125299A (en) | 2016-06-30 | 2016-06-30 | The encapsulation method for simplifying of a kind of 3D laser scanning module and module |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107037681A (en) * | 2017-06-05 | 2017-08-11 | 青岛小优智能科技有限公司 | One kind miniaturization projection module and its micro- galvanometer encapsulation base |
| CN108417596A (en) * | 2018-04-12 | 2018-08-17 | 重庆港宇高科技开发有限公司 | Take the device and technique of sensor optical window |
| CN109437088A (en) * | 2018-10-30 | 2019-03-08 | 苏州晶方半导体科技股份有限公司 | The encapsulating structure and packaging method of chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107037681A (en) * | 2017-06-05 | 2017-08-11 | 青岛小优智能科技有限公司 | One kind miniaturization projection module and its micro- galvanometer encapsulation base |
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| CN108417596A (en) * | 2018-04-12 | 2018-08-17 | 重庆港宇高科技开发有限公司 | Take the device and technique of sensor optical window |
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Application publication date: 20161116 |