CN107030401A - Micropore processing device - Google Patents
Micropore processing device Download PDFInfo
- Publication number
- CN107030401A CN107030401A CN201611120711.8A CN201611120711A CN107030401A CN 107030401 A CN107030401 A CN 107030401A CN 201611120711 A CN201611120711 A CN 201611120711A CN 107030401 A CN107030401 A CN 107030401A
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- China
- Prior art keywords
- laser
- module
- processing device
- plate body
- laser beam
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
Abstract
The invention discloses a kind of micropore processing device, for processing multiple micropores on a workpiece, it includes laser alignment module, laser beam expanding module, laser shaping module and Laser Focusing template.Laser alignment module is used to carry out collimation adjustment to a laser；Laser beam expanding module is used to the incident less laser beam of diameter is expanded to form the laser beam being relatively large in diameter；Laser shaping module is arranged at the light emission side of laser beam expanding module, the light distribution for adjusting incident light；Laser Focusing template-setup is in the light emission side of laser shaping module, including a plate body and the multiple lenticules being arranged on plate body, wherein plate body stops that incident light is passed through, lenticule can pass through and focus on incident light, and the face where multiple focuses of the incident light after multiple micro lens is consistent with the shape in the face to be processed of workpiece.Multiple micropores can be disposably processed using micropore processing device of the present invention, so that the processing efficiency of laser micropore processing is greatly improved.
Description
Technical field
The present invention relates to the capillary processing dress of technical field of laser processing, more particularly to a kind of utilization Laser microdrilling
Put.
Background technology
Laser processing technology be material is cut using the characteristic of laser beam and matter interaction, welded, surface
A special kind of skill of processing, punching, micro Process etc..Wherein, laser drilling has precision height, highly versatile, efficiency high, cost
The advantages of low and overall economics remarkable benefit, it has also become one of the key technology in modern manufacturing field.After laser line focus
Material is heated as high intensity thermal source, material melts or gasification in laser action area is then evaporated, and forms hole
Laser processing procedure.
Because laser beam can be focused to obtain very little, minimum can reach several microns.Therefore, can be with laser drilling
Diameter is easily processed in micron-sized micropore, and this can not be accomplished with traditional machining process.But pass
The laser processing technology of system, every time punching is typically only capable to process a hole, and operating efficiency is low, can not meet many industry
The need for application field, the antibody screening microwell plate that such as biological field is used, the micropore enormous amount above it, with traditional
Laser processing mode processing takes long enough, and quality is also difficult to control to.
Above- mentioned information is only used for strengthening the understanding of background of this disclosure disclosed in background section, therefore it can be with
Including not constituting the information to prior art known to persons of ordinary skill in the art.
The content of the invention
To solve above problem of the prior art, it is an object of the invention to provide a kind of capillary processing high in machining efficiency
Device.
According to an aspect of the present invention, a kind of micropore processing device, for processing multiple micropores on a workpiece.It is micro-
Hole processing device includes laser alignment module, laser beam expanding module, laser shaping module and Laser Focusing template.Laser alignment mould
Block is used to carry out collimation adjustment to a laser；Laser beam expanding module is arranged at the light emission side of the laser alignment module, for pair
The incident less laser beam of diameter expands the laser beam to be formed and be relatively large in diameter；Laser shaping module is arranged at the laser beam expanding
The light emission side of module, the light distribution for adjusting incident light；Laser Focusing template-setup goes out in the laser shaping module
Light side, including a plate body and the multiple lenticules being arranged on the plate body, wherein the plate body stops that incident light is passed through, it is described
Lenticule can pass through and focus on the incident light, and where multiple focuses of the incident light after multiple micro lens
Face it is consistent with the shape in the face to be processed of the workpiece.
According to an embodiment of the present invention, photomask is provided with the plate body, to stop plate body described in laser light.
According to an embodiment of the present invention, the plate body surface is rough surface, so that incident light is in the coarse table
Area scattering and the plate body can not be passed through.
According to an embodiment of the present invention, multiple lenticules formation microlens array of the Laser Focusing module.
According to an embodiment of the present invention, each lenticule in the microlens array is connected with each other.
According to an embodiment of the present invention, the light distribution of incident light is adjusted to uniform point by the laser shaping module
Cloth.
According to an embodiment of the present invention, the plate body of the Laser Focusing template is in tabular or curved surface tabular.
According to an embodiment of the present invention, the laser alignment module, the laser beam expanding module, the laser shaping
Relative position relation between module and the Laser Focusing template is fixed.
According to an embodiment of the present invention, wherein also including work piece platform, it is arranged at the Laser Focusing template
Light emission side, the workpiece is installed in the work piece platform.
According to an embodiment of the present invention, the work piece platform is three-dimension numerical controlled displacement platform.
As shown from the above technical solution, advantages of the present invention and advantageous effects are：Micropore processing device of the present invention
Including the less laser beam of a beam diameter can be expanded to the laser beam expanding module of the laser beam to be relatively large in diameter, and include plate
The Laser Focusing template of body, multiple lenticules, the quantity of lenticule and the arrangement form on plate body and the product machined
Or the quantity and arrangement form of a unit of the product are consistent, and plate body is light tight, and lenticule can make incident light beam splitting
And focus on, the multiple light beams of focusing can be processed to workpiece, therefore can produce qualified using micropore processing device of the present invention
Product, and the energy multiple micropores of time processing, so that the processing efficiency of laser micropore processing is greatly improved.
By description of a preferred embodiment referring to the drawings in the present invention, above-mentioned and other purpose of the invention,
Feature and advantage will be apparent from.
Brief description of the drawings
Fig. 1 is the schematic diagram of the embodiment of micropore processing device one of the present invention；
Fig. 2 is the structural representation of the flat Laser Focusing template in the micropore processing device shown in Fig. 1.
In figure：100th, workpiece；1st, laser alignment module；2nd, laser beam expanding module；3rd, laser shaping module；4th, Laser Focusing
Template；41st, plate body；42nd, lenticule；5th, work piece platform；10th, first laser beam；20th, second laser beam；30th, the 3rd laser beam；
40th, the 4th laser beam.
Embodiment
Example embodiment is described more fully with referring now to accompanying drawing.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, thesing embodiments are provided so that the disclosure will
Fully and completely, and by the design of example embodiment those skilled in the art is comprehensively conveyed to.Identical accompanying drawing in figure
Mark represents same or similar structure, thus will omit their detailed description.
Referring to Fig. 1, Fig. 1 is the schematic diagram of the embodiment of micropore processing device one of the present invention.As shown in figure 1, the present invention is micro-
The embodiment of hole processing device one, for processing multiple micropores on a workpiece 100, wherein described micropore can be logical
Hole or blind hole, micro-pore diameter can in 1-1000 micrometer ranges, for example micro-pore diameter be 1 micron, 10 microns, 20
Micron, 50 microns, 100 microns, 500 microns, 800 microns, 900 microns etc..The micropore processing device includes laser alignment module
1st, laser beam expanding module 2, laser shaping module 3 and Laser Focusing template 4.
Laser alignment module 1 is used to carry out collimation adjustment to a laser, exports directional light.Laser alignment module 1 can be adopted
Use existing structure.
Laser beam expanding module 2 is arranged at the light emission side of laser alignment module 1, for being expanded to incident laser beam,
The less laser beam of diameter is expanded into the less laser beam of diameter, can generally form the laser beam of specified spot size.Swash
Light, which expands module 2, can use existing structure.
Laser shaping module 3 is arranged at the light emission side of laser beam expanding module 2, the light distribution for adjusting incident light.Swash
Light shaping module 3 includes a beam shaping, and the beam shaping can use existing structure, and beam shaping can be by incidence
The uneven laser beam of Energy distribution be adjusted to the uniform laser beam of Energy distribution, for example, the entering for Gaussian Profile by light intensity
Penetrate laser beam and adjust the laser beam being evenly distributed to light intensity.
Referring to Fig. 1 and Fig. 2, Fig. 2 be the present invention micropore processing device in a flat Laser Focusing template 4 knot
Structure schematic diagram, it includes being provided with the lenticule battle array being made up of multiple lenticules 42 on a flat plate body 41, the plate body 41
Row.
Laser Focusing template 4 is arranged at the light emission side of laser shaping module 3, including a plate body 41 and is arranged on plate body 41
Multiple lenticules 42, in the embodiment shown in figure 2, multiple lenticules 42 formation microlens arrays.Further, this is micro-
Each lenticule 42 in lens array is connected with each other, i.e., all around, lenticule adjacent on any direction is connected to one
Rise, so that in Laser Focusing template 4 lenticule 42 be concentrated setting in a region, and other regions (i.e. plate body 41) are no
Lenticule is set.Not limited to this in other embodiments, multiple lenticules 42 can form display arrangement or non-battle array
It can be connected with each other between row arrangement, adjacent lenticule, can also spaced certain distance.Laser Focusing template 4 in a word
In multiple lenticules quantity and arrangement mode regard specific workpiece to be processed design requirement determine.
Plate body 41 can stop laser light, and lenticule 42 can pass through and focus on incident light, and the laser beam warp being relatively large in diameter
The face where multiple focuses after multiple micro lens is consistent with the shape in the face to be processed of workpiece 100 for example in a plane
Or on a curved surface, during processing, workpiece to be processed 100 is placed on the face where multiple focuses.
Laser Focusing template 4 is overall can be by that can be made through the material of laser such as optical glass, plastics；Then fill
The plate body 41 (other parts of the removing microlens array 42 of Laser Focusing template 4) of Laser Focusing template 4 can be processed into not
The structure of printing opacity, so as to avoid or reduce the light quantity passed through by plate body 41 as far as possible.
The shape of the plate body 41 of Laser Focusing template 4 can be consistent with the shape of workpiece to be processed, particularly with it is to be processed
The shape in the face to be processed of workpiece is consistent, such as when workpiece to be processed or its face to be processed are flat shapes, then plate body 41 can
To be tabular；When workpiece to be processed or its face to be processed are curve forms, then plate body 41 can be curved surface tabular.Certainly originally
Invention is not limited thereto.
In the present invention, the plate body 41 of Laser Focusing template 4 can be caused to stop laser light in several ways, it is real one
Apply in mode, photomask can be set on plate body 41, for example, one layer of golden film being made of gold can be plated on plate body 41, with
Stop laser light plate body 41.In another embodiment, plate body 41 is surface-treated as rough surface, such as roughness value exists
Between 1~10 micron, so that laser occurs to scatter and be unable to transmitting plate body 41 when inciding 41 rough surface of plate body.It should manage
Solution, prevents or reduces the printing opacity scheme of plate body 41 and be not limited to two kinds of concrete modes recited above, other existing energy shadings, keeps away
The design method of light can also be applied in the present invention.When the formation microlens array of multiple lenticules 42 in Laser Focusing template 4,
Particularly when adjacent microlens array is connected to each other, because lenticule arrangement is relatively concentrated, then plate body 41 is processed into impermeable
Tabula rasa body is more convenient.
In one embodiment, laser alignment module 1, laser beam expanding module 2, laser shaping module 3 and Laser Focusing mould
Relative position relation between plate 4 is fixed, such as by laser alignment module 1, laser beam expanding module 2, laser shaping module 3
It is fixedly installed in Laser Focusing template 4 on same support (not going out in figure).So, processed after once debugging is completed
Avoid the need for frequently being adjusted again in journey, and only need to move workpiece to be processed, therefore, operation easier using operating
It is more reliable.
In other embodiments, laser alignment module 1, laser beam expanding module 2, laser shaping module 3 and Laser Focusing
It is fixed, and the relative position between miscellaneous part that can also there was only the relative position relation between section components in template 4
Relation is adjustable, such as the relative position relation between laser shaping module 3 and Laser Focusing template 4 is fixed, and is swashed
Light collimating module 1, laser beam expanding module 2 and laser shaping module 3 can be moved along optical axis direction and form adjustable position
Put；Even in some embodiments, the relative position between all parts is all adjustable.
In some embodiments, micropore processing device of the invention also includes work piece platform 5, and it is arranged at Laser Focusing
The light emission side of template 4, treats that the workpiece 100 that work adds is installed in work piece platform 5.Further, the platform of workpiece 100 can be three-dimensional
Numerical control displacement platform, three-dimension numerical controlled displacement platform can be moved up by computer control in tri- sides of X, Y, Z, or even can also be
All directions rotate an angle, therefore as three-dimension numerical controlled displacement platform is acted, treat that the workpiece 100 that work adds can be accurately arranged at
On face where each focus, so as to realize the automatic high-efficiency digital control processing of micropore.
The micropore processing device of the present invention can process multiple micropores simultaneously, wherein the micropore quantity of performance processing with
The quantity of lenticule 42 of Laser Focusing template 4 is identical, and the multiple micropores processed arrangement mode also with multiple lenticules
42 arrangement mode on plate body 41 matches.Therefore, the quantity and arrangement form of multiple lenticules 42 of Laser Focusing template 4
It can design as needed, specifically, depending on micropore quantity and arrangement mode required for workpiece to be processed.In detail
For, when needing that multiple micropores are processed on a workpiece to be processed, Ultraprecision Machining can be first passed through and process one
Laser Focusing template 4, i.e., process multiple lenticules 42 on a plate body 41, the quantity of these lenticules 42 and in plate body 41
Arrangement form of the arrangement form with the quantity of micropore that is designed on workpiece to be processed and on workpiece is completely the same, that is, with
The quantity and arrangement form of the micropore on final products machined are completely the same, then, use the lenticule eyeglass (laser
Focus on template 4) it can rapidly process qualified product.
In some embodiments, the laser that micropore processing device of the invention also includes being used to produce laser (is schemed not
Show), it can be continuous wave laser or pulse laser etc..
Referring to Fig. 1, below exemplified by processing microwell array on a flat workpiece to be processed 100, illustrate this hair
The process of bright micropore processing device：
Laser sends a first laser beam 10, the first laser beam 10 as incident light beam strikes to laser alignment module 1,
Output second laser beam 20 after being collimated through laser alignment module 1, the second laser beam 20 is used as incident light beam strikes to laser beam expanding
Module 2, forms the diameter of the 3rd laser beam 30, such as the 3rd laser beam 30 that are relatively large in diameter after being expanded through laser beam expanding module 2
For 2-10 times of second laser beam 20, the 3rd laser beam 30 as incident light beam strikes to laser shaping module 3, as shown in figure 1, swashing
Energy distribution as the equally distributed flat top beam of energy is by light shaping module 3 for the shaping of the 3rd laser beam 30 of Gaussian Profile
4th laser beam 40；Then the 4th laser beam 40 incides Laser Focusing template 4, the microlens array of Laser Focusing template 4
The beam splitting of 4th laser beam 40 is focused on, because the focal length of each lenticule 42 of microlens array is identical, so the 4th laser beam
Multiple focuses after 40 focusing are on same focal plane；Workpiece to be processed 100 is arranged at the focal plane, such as by moving
Dynamic work piece platform 5, drives workpiece to be processed 100 to move to the focal plane by work piece platform 5, then these laser beams focused on are
Microwell array can be processed on workpiece to be processed 100.
The micropore processing device of the present invention, after being split and being focused on respectively to laser beam through Laser Focusing template 4, energy one
Secondary property processes multiple micropores, therefore the processing that laser micropore is processed can be greatly improved using micropore processing device of the present invention
Efficiency.
The micropore processing device of the present invention can be widely applied to the fields such as aviation, biology, micro code-lock, such as giving birth to
The functional membrane material with microwell array in thing field such as antibody screening microwell plate；Or be applied to
Aviation field improves the microwell array on the microwell array such as aircraft wing of aerodynamic quality；Or applied to micro-
The microwell array filter of machinery and microfluidic field.
Although use the term of relativity in this specification, such as " on " " under " describes a component of icon for another
The relativeness of one component, but these terms are used in this specification merely for convenient, for example with reference to the accompanying drawings in example
Direction.Be appreciated that, if making it turn upside down the upset of the device of icon, describe " on " component will turn into
" under " component.When certain structure other structures " on " when, it is possible to refer to that certain structural integrity is formed in other structures, or
Refer to certain structure " direct " to be arranged in other structures, or refer to certain structure and be arranged on by another structure " indirect " in other structures.
Term " first ", " second " etc. are only used as mark, are not the quantity limitations to its object.
In the claims, term " one ", " one ", " " and " at least one " to represent to exist it is one or more will
Element/part/etc.；Term "comprising", " comprising " and " having " are to represent the open meaning being included and be
Refer to except the key element listed/part/also may be present in addition to waiting other key element/part/etc..
It should be appreciated that the present invention is not limited in its application to the detailed construction and arrangement of the part of this specification proposition
Mode.The present invention can have other embodiment, and can realize and perform in many ways.Aforesaid deformation form and
Modification is fallen within the scope of the present invention.It should be appreciated that this disclosure and the present invention limited are extended in text
And/or mentioned in accompanying drawing or significantly all alternative combinations of two or more independent features.It is all these different
Combination constitutes multiple alternative aspects of the present invention.The embodiment of this specification illustrates to become known for realizing the present invention most
Good mode, and those skilled in the art will be enable using the present invention.
Claims (10)
1. a kind of micropore processing device, for processing multiple micropores on a workpiece, it is characterised in that micropore processing device bag
Include：
Laser alignment module, it is used to carry out collimation adjustment to a laser；
Laser beam expanding module, it is arranged at the light emission side of the laser alignment module, for the incident less laser of diameter
Beam expands the laser beam to be formed and be relatively large in diameter；
Laser shaping module, it is arranged at the light emission side of the laser beam expanding module, the light distribution for adjusting incident light；
Laser Focusing template, it is arranged at the light emission side of the laser shaping module, including a plate body and is arranged at the plate body
On multiple lenticules, wherein the plate body stops that incident light is passed through, the lenticule can pass through and focus on the incident light, and
The shape in face and the face to be processed of the workpiece where multiple focuses of the incident light after multiple micro lens
Unanimously.
2. micropore processing device as claimed in claim 1, it is characterised in that be provided with photomask on the plate body, to stop
Plate body described in laser light.
3. micropore processing device as claimed in claim 1, it is characterised in that the plate body surface is rough surface, so as to enter
Light is penetrated to scatter in the rough surface and the plate body can not be passed through.
4. micropore processing device as claimed in claim 1, it is characterised in that multiple lenticule shapes of the Laser Focusing module
Into microlens array.
5. micropore processing device as claimed in claim 4, it is characterised in that each lenticule phase in the microlens array
Connect.
6. micropore processing device as claimed in claim 1, it is characterised in that the laser shaping module is by the light intensity of incident light
Distribution is adjusted to be uniformly distributed.
7. micropore processing device as claimed in claim 1, it is characterised in that the plate body of the Laser Focusing template is in tabular
Or curved surface tabular.
8. micropore processing device as claimed in claim 3, it is characterised in that the laser alignment module, the laser beam expanding
Relative position relation between module, the laser shaping module and the Laser Focusing template is fixed.
9. the micropore processing device as described in claim any one of 1-8, it is characterised in that also include：
Work piece platform, it is arranged at the light emission side of the Laser Focusing template, and the workpiece is installed in the work piece platform.
10. micropore processing device as claimed in claim 9, it is characterised in that the work piece platform is that three-dimension numerical controlled displacement is put down
Platform.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562269114P | 2015-12-18 | 2015-12-18 | |
| US62/269,114 | 2015-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107030401A true CN107030401A (en) | 2017-08-11 |
Family
ID=59531182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611120711.8A Pending CN107030401A (en) | 2015-12-18 | 2016-12-08 | Micropore processing device |
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| Country | Link |
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| CN (1) | CN107030401A (en) |
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| CN107457482A (en) * | 2017-09-13 | 2017-12-12 | 华中科技大学 | A kind of array type optical waveguide liquid jet device and method |
| CN109029719A (en) * | 2018-06-25 | 2018-12-18 | 南京理工大学 | Ultraviolet photic-energy transfer detection system and its detection method based on Shack Hartmann method |
| CN109277701A (en) * | 2018-11-27 | 2019-01-29 | 王洲 | A kind of laser fast and dense punching marking device |
| CN110560936A (en) * | 2019-07-26 | 2019-12-13 | 青岛理工大学 | Laser parallel processing device and processing method for leather product array air holes |
| WO2020098660A1 (en) * | 2018-11-13 | 2020-05-22 | Vertiled Co. Ltd. | Laser based system for cutting transparent and semi-transparent substrates |
| CN111843192A (en) * | 2019-04-18 | 2020-10-30 | 三星显示有限公司 | Lens module and substrate cutting apparatus including the same |
| CN112108775A (en) * | 2020-09-09 | 2020-12-22 | 湖南鼎一致远科技发展有限公司 | Device and method for controlling lasers in parallel and laser marking machine |
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| CN107457482A (en) * | 2017-09-13 | 2017-12-12 | 华中科技大学 | A kind of array type optical waveguide liquid jet device and method |
| CN109029719A (en) * | 2018-06-25 | 2018-12-18 | 南京理工大学 | Ultraviolet photic-energy transfer detection system and its detection method based on Shack Hartmann method |
| WO2020098660A1 (en) * | 2018-11-13 | 2020-05-22 | Vertiled Co. Ltd. | Laser based system for cutting transparent and semi-transparent substrates |
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| CN110560936B (en) * | 2019-07-26 | 2022-01-07 | 青岛理工大学 | Laser parallel processing device and processing method for leather product array air holes |
| JP7450062B2 (en) | 2020-07-31 | 2024-03-14 | 西安炬光科技股▲フン▼有限公司 | Optical module and medical laser equipment |
| CN112108775A (en) * | 2020-09-09 | 2020-12-22 | 湖南鼎一致远科技发展有限公司 | Device and method for controlling lasers in parallel and laser marking machine |
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